STPS16H100CT/CG/CFP/CR ® HIGH VOLTAGE POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS A1 IF(AV) 2x8A VRRM 100 V Tj (max) 175 °C VF (max) 0.64 V K A2 K A2 FEATURES AND BENEFITS ■ ■ ■ ■ ■ K A1 NEGLIGIBLE SWITCHING LOSSES HIGH JUNCTION TEMPERATURE CAPABILITY LOW LEAKAGE CURRENT GOOD TRADE OFF BETWEEN LEAKAGE CURRENT AND FORWARD VOLTAGE DROP AVALANCHE CAPABILITY SPECIFIED A2 TO-220AB STPS16H100CT DESCRIPTION Dual center tap Schottky rectifier designed for high frequency miniature Switch Mode Power Supplies such as adaptators and on board DC/DC converters. A1 D2PAK STPS16H100CG A2 K A1 TO-220FPAB STPS16H100CFP K A1 A2 I2PAK STPS16H100CR ABSOLUTE RATINGS (limiting values, per diode) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 100 V IF(RMS) RMS forward current 30 A A IF(AV) TO-220AB D2PAK / I2PAK Tc = 165°C Per diode 8 TO-220FPAB Tc = 150°C Per device 16 IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 200 A IRRM Repetitive peak reverse current tp = 2 µs square F = 1kHz 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 2 A PARM Repetitive peak avalanche power tp = 1µs 8700 W - 65 to + 175 °C 175 °C 10000 V/µs Tstg Tj dV/dt * : Average forward current δ = 0.5 Tj = 25°C Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) July 2003 - Ed: 2A 1/7 STPS16H100CT/CG/CFP/CR THERMAL RESISTANCES Symbol Rth (j-c) Parameter Junction to ambient 2 2 2 2 2 2 TO-220AB / D PAK / I PAK Per diode TO-220FPAB Unit 1.6 °C/W 4 TO-220AB / D PAK / I PAK Total 1.1 TO-220FPAB Rth (c) Value °C/W 3.5 TO-220AB / D PAK / I PAK 0.6 Coupling TO-220FPAB °C/W 3 When the diodes 1 and 2 are used simultaneously : ∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol Parameter Tests Conditions IR * Reverse leakage Current Tj = 25°C Min. VR = VRRM Tj = 125°C VF** Forward Voltage drop Typ. 1.6 Tj = 25°C IF = 8 A Tj = 125°C IF = 8 A Tj = 25°C IF = 16 A Tj = 125°C IF = 16 A 0.59 Max. Unit 3.6 µA 5 mA 0.77 V 0.64 0.88 0.67 0.73 * tp = 5 ms, δ < 2% ** tp = 380 µs, δ < 2% Pulse test : To evaluate the conduction losses use the following equation : P = 0.55 x IF(AV) + 0.011 x IF2(RMS) Fig. 1: Conduction losses versus average current. Fig. 2: Average forward current versus ambient temperature (δ=0.5). IF(AV)(A) PF(AV)(W) 7 9 δ = 0.1 δ = 0.05 6 δ = 0.2 TO-220AB/D²PAK/I²PAK Rth(j-a)=Rth(j-c) δ = 0.5 8 7 5 δ=1 6 4 5 3 4 Rth(j-a)=50°C/W 3 2 T 1 IF(AV)(A) δ=tp/T 0 0 2/7 1 2 3 4 5 T 2 1 6 7 8 tp 9 δ=tp/T 0 10 0 Tamb(°C) tp 25 50 75 100 125 150 175 STPS16H100CT/CG/CFP/CR Fig. 3: Normalized avalanche power derating versus pulse duration. Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(1µs) 1 1.2 PARM(tp) PARM(25°C) 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 1 0 10 100 0 1000 Fig. 5-1: Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220AB, D²PAK, I²PAK). 25 50 75 100 125 150 Fig. 5-2: Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220FPAB). IM(A) IM(A) 200 120 180 110 100 160 90 140 80 120 TC=25°C 100 TC=75°C TC=25°C 70 60 TC=75°C 50 80 TC=125°C 60 40 TC=125°C 30 40 IM 20 20 t δ=0.5 0 t(s) t δ=0.5 0 1.E-03 1.E-02 1.E-01 1.E+00 Fig. 6-1: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB, D²PAK & I²PAK). 1.E-03 1.E-02 1.E-01 1.E+00 Fig. 6-2: Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB). Zth(j-c) / Rth(j-c) Zth(j-c) / Rth(j-c) 1.0 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 IM 10 t(s) δ = 0.5 0.6 δ = 0.5 0.5 0.5 0.4 δ = 0.2 0.3 δ = 0.1 0.4 0.3 T 0.2 0.2 δ = 0.2 T δ = 0.1 Single pulse 0.1 tP(s) δ=tp/T 0.0 1.E-03 1.E-02 1.E-01 0.1 tP(s) Single pulse tp 0.0 1.E+00 1.E-03 1.E-02 1.E-01 δ=tp/T 1.E+00 tp 1.E+01 3/7 STPS16H100CT/CG/CFP/CR Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). Fig. 8: Junction capacitance versus reverse voltage applied (typical values). IR(mA) C(nF) 1.00 1.E+01 Tj=150°C 1.E+00 F=1MHz Vosc=30mV Tj=25°C Tj=125°C Tj=100°C 1.E-01 0.10 Tj=75°C 1.E-02 Tj=50°C 1.E-03 Tj=25°C VR(V) VR(V) 0.01 1.E-04 0 Fig. 9: current. 10 20 30 40 50 60 70 80 90 1 100 Forward voltage drop versus forward 10 100 Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35µm). Rth(j-a)(°C/W) IFM(A) 80 100 D²PAK 70 Tj=125°C (Maximum values) 60 50 Tj=125°C (Typical values) 10 Tj=25°C (Maximum values) 40 30 20 VFM(V) 10 1 S(cm²) 0 0.0 4/7 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 5 10 15 20 25 30 35 40 STPS16H100CT/CG/CFP/CR PACKAGE MECHANICAL DATA TO-220FPAB REF. A B H Dia L6 L2 L7 L3 L5 D F1 L4 F2 F E G1 G A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 Dia. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.4 4.6 0.173 0.181 2.5 2.7 0.098 0.106 2.5 2.75 0.098 0.108 0.45 0.70 0.018 0.027 0.75 1 0.030 0.039 1.15 1.70 0.045 0.067 1.15 1.70 0.045 0.067 4.95 5.20 0.195 0.205 2.4 2.7 0.094 0.106 10 10.4 0.393 0.409 16 Typ. 0.63 Typ. 28.6 30.6 1.126 1.205 9.8 10.6 0.386 0.417 2.9 3.6 0.114 0.142 15.9 16.4 0.626 0.646 9.00 9.30 0.354 0.366 3.00 3.20 0.118 0.126 PACKAGE MECHANICAL DATA I2PAK DIMENSIONS REF. A E c2 L2 D L1 A1 b2 L b1 b e c Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.14 1.17 0.044 0.046 b2 1.14 1.17 0.044 0.046 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 E 10.0 10.4 0.394 0.409 L 13.1 13.6 0.516 0.535 L1 3.48 3.78 0.137 0.149 L2 1.27 1.40 0.050 0.055 5/7 STPS16H100CT/CG/CFP/CR PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. E C2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R V2 FOOTPRINT 16.90 10.30 5.08 1.30 3.70 8.90 6/7 Inches Min. A L2 Millimeters 0.40 typ. 0° 8° 0.016 typ. 0° 8° STPS16H100CT/CG/CFP/CR PACKAGE MECHANICAL DATA TO-220AB DIMENSIONS REF. A H2 Dia C L5 L7 L6 L2 F2 F1 D L9 L4 M G1 E G Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 0.645 typ. 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 Diam. ■ 16.4 typ. L4 M Ordering type Marking STPS16H100CT STPS16H100CT STPS16H100CFP STPS16H100CFP STPS16H100CG STPS16H100CG STPS16H100CG-TR STPS16H100CG STPS16H100CR STPS16H100CR EPOXY MEETS UL94,V0 Inches Min. L2 F Millimeters Package TO-220AB TO-220FPAB D2PAK D2PAK I2PAK 2.6 typ. 3.75 Weight 2.20 g 2.0 g 1.48 g 1.48 g 1.9 g 3.85 0.102 typ. 0.147 Base qty 50 50 50 1000 50 0.151 Delivery mode Tube Tube Tube Tape & reel Tube Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 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