STTH1512 Ultrafast recovery - 1200 V diode Main product characteristics A IF(AV) 15 A VRRM 1200 V Tj 175° C VF (typ) 1.20 V trr (typ) 53 ns Ultrafast, soft recovery ■ Very low conduction and switching losses ■ High frequency and/or high pulsed current operation ■ High reverse voltage capability ■ High junction temperature ■ Insulated packages: DOP3I Electrical insulation = 2500 VRMS Capacitance = 12 pF K A A K K DO247 STTH1512W DOP3I STTH1512PI Features and benefits ■ K K A A A D2PAK STTH1512G K TO-220AC STTH1512D Order codes Description The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. Part Number Marking STTH1512D STTH1512D STTH1512G STTH1512G STTH1512G-TR STTH1512G STTH1512W STTH1512W STTH1512PI STTH1512PI The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. March 2006 Rev 1 1/11 www.st.com 11 Characteristics STTH1512 1 Characteristics Table 1. Absolute ratings (limiting values at 25° C, unless otherwise specified) Symbol VRRM IF(RMS) Parameter Value Unit 1200 V 50 A 15 A Repetitive peak reverse voltage RMS forward current 2 TO-220AC / DO247 / DOP3I / D PAK TO-220AC / D2 PAK / DO247 Tc = 130° C IF(AV) Average forward current, δ = 0.5 IFRM Repetitive peak forward current tp = 5 µs, F = 5 kHz square 200 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 150 A Tstg Storage temperature range -65 to + 175 °C 175 °C Tj Table 2. Tc = 105° C DOP3I Maximum operating junction temperature Thermal parameters Symbol Parameter TO-220AC / D2PAK / DO247 Rth(j-c) Table 3. Symbol IR(1) Value Unit 1.3 °C/W 2 °C/W Junction to case DOP3I Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Min. Typ Forward voltage drop Tj = 125° C µA 10 100 2.10 IF = 15 A Tj = 150° C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 1.4 x IF(AV) + 0.027 IF2(RMS) 2/11 Unit 15 VR = VRRM Tj = 25° C VF(2) Max. 1.25 1.90 1.20 1.80 V STTH1512 Characteristics Table 4. Dynamic characteristics Symbol Parameter trr Test conditions Min. Typ Max. IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25° C Reverse recovery time Unit 105 ns IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25° C 53 75 Reverse recovery current IF = 15 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125° C 20 28 A S Softness factor IF = 15 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125° C 1.5 tfr Forward recovery time dIF/dt = 50 A/µs IF = 15 A VFR = 1.5 x VFmax, Tj = 25° C 600 ns Forward recovery voltage IF = 15 A, dIF/dt = 50 A/µs, Tj = 25° C IRM VFP Figure 1. Conduction losses versus average current Figure 2. 5.5 V Forward voltage drop versus forward current IFM(A) P(W) 150 35 δ = 0.1 30 δ = 0.5 δ = 0.2 140 130 δ = 0.05 Tj=150°C (typical values) 120 25 110 δ=1 100 90 20 80 70 15 60 50 10 Tj=25°C (maximum values) Tj=150°C (maximum values) 40 T 30 5 20 IF(AV)(A) δ=tp/T tp 10 0 VFM(V) 0 0 2 4 6 8 10 12 14 16 18 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 3/11 Characteristics Figure 3. STTH1512 Relative variation of thermal impedance junction to case versus pulse duration Figure 4. IRM(A) Zth(j-c)/Rth(j-c) 1.0 50 0.9 45 0.8 40 0.7 35 0.6 30 0.5 25 0.4 20 0.3 Peak reverse recovery current versus dIF/dt (typical values) VR=600V Tj=125°C IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) 15 Single pulse 0.2 10 0.1 5 tp(s) 0.0 dIF/dt(A/µs) 0 1.E-03 1.E-02 Figure 5. 1.E-01 1.E+00 Reverse recovery time versus dIF/dt (typical values) 0 50 Figure 6. 100 150 200 250 300 350 400 450 500 Reverse recovery charges versus dIF/dt (typical values) Qrr(µC) trr(ns) 5.5 600 VR=600V Tj=125°C 550 VR=600V Tj=125°C 5.0 4.5 500 IF=2 x IF(AV) IF=2 x IF(AV) 4.0 450 3.5 IF=IF(AV) 400 IF=IF(AV) 3.0 IF=0.5 x IF(AV) 350 2.5 300 2.0 250 1.5 200 1.0 IF=0.5 x IF(AV) 0.5 150 dIF/dt(A/µs) 0 50 Figure 7. 100 150 200 250 300 dIF/dt(A/µs) 0.0 100 350 400 450 0 500 Softness factor versus dIF/dt (typical values) 50 Figure 8. S factor 100 150 200 250 300 350 400 450 500 Relative variations of dynamic parameters versus junction temperature 2.25 3.0 IF ≤ 2xIF(AV) VR=600V Tj=125°C IF=IF(AV) VR=600V Reference: Tj=125°C 2.00 1.75 2.5 S factor 1.50 2.0 1.25 1.00 trr 1.5 0.75 IRM 0.50 1.0 Tj(°C) dIF/dt(A/µs) 0.5 0.00 25 0 4/11 QRR 0.25 50 100 150 200 250 300 350 400 450 500 50 75 100 125 STTH1512 Figure 9. Characteristics Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) tfr(ns) VFP(V) 800 40 IF=IF(AV) Tj=125°C 35 IF=IF(AV) VFR=1.5 x VF max. Tj=125°C 700 30 600 25 500 20 400 15 300 10 200 100 5 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 100 200 300 400 500 Figure 11. Junction capacitance versus reverse voltage applied (typical values) 0 100 200 300 400 500 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, ecu = 35 µm) C(pF) Rth(j-a)(°C/W) 1000 80 F=1MHz VOSC=30mVRMS Tj=25°C 70 60 50 100 40 30 20 10 VR(V) SCU(cm²) 10 0 1 10 100 1000 0 5 10 15 20 25 30 35 40 5/11 Package information 2 STTH1512 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC) Recommended torque value: 0.80 Nm (DOP3I) Maximum torque value: 0.7 Nm (TO-220AC) Maximum torque value: 1.0 Nm (DOP3I) Table 5. T0-220AC dimensions DIMENSIONS REF. A H2 ØI C L5 L7 L6 L2 F1 D L9 L4 M E G Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. I 6/11 Inches Min. L2 F Millimeters 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 STTH1512 Package information Table 6. DO-247 dimensions DIMENSIONS REF. V Dia V Millimeters Min. Max Min. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 F2 F3 A H 2.00 2.00 G L5 L L2 L4 F2 L3 L1 D V2 M 2.40 0.078 0.094 0.429 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.169 L3 F G 0.078 10.90 L2 F3 Inches 0.145 18.50 14.20 0.728 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216 E M 2.00 3.00 0.078 0.118 V 5° 5° V2 60° 60° Dia. 3.55 3.65 0.139 0.143 7/11 Package information STTH1512 D2PAK dimensions Table 7. DIMENSIONS REF. Millimeters Inches Min. Max Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R 0.40 typ. V2 0° 0.016 typ. 8° Figure 13. D2PAK footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 8/11 3.70 0° 8° STTH1512 Package information Table 8. DOP3I dimensions DIMENSIONS REF. E A Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 b 1.20 1.40 0.047 0.055 c 1.45 1.55 0.057 0.061 c1 0.50 0.70 0.020 0.028 D 12.15 13.10 0.474 0.516 E 15.10 15.50 0.594 0.610 E1 7.55 7.75 0.297 0.305 e 10.80 11.30 0.425 0.445 G 20.4 21.10 0.815 0.831 L 14.35 15.60 0.565 0.614 P 4.08 4.17 0.161 0.164 Q 2.70 2.90 0.106 0.114 E1 R c ØP G Y D L c1 b Q e R Y 4.60 typ. 15.80 16.50 0.181 typ. 0.622 0.650 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 Ordering information 3 Ordering information Part Number Marking Package Weight Base qty Delivery mode STTH1512D STTH1512D TO-220AC 1.86g 50 Tube STTH1512PI STTH1512PI DOP3I 4.46 g 30 Tube STTH1512W STTH1512W DO-247 4.4 g 30 Tube STTH1512G D2 1.48 g 50 Tube STTH1512G 2 1.48 g 1000 Tape and reel STTH1512G STTH1512G-TR 4 10/11 STTH1512 PAK D PAK Revision history Date Revision 02-Mar-2006 1 Description of Changes First issue. STTH1512 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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