STMICROELECTRONICS STTH2R06A

STTH2R06
®
HIGH EFFICIENCY ULTRAFAST DIODE
Table 1: Main Product Characteristics
IF(AV)
2A
VRRM
600 V
Tj
175°C
VF (typ)
1V
trr (typ)
35 ns
A
FEATURES AND BENEFITS
■
■
■
■
Very low conduction losses
Negligible switching losses
Low forward and reverse recovery times
High junction temperature
K
DO-41
STTH2R06
SMA
STTH2R06A
SMB
STTH2R06U
SMC
STTH2R06S
DESCRIPTION
The STTH2R06 is using ST Turbo 2 600V planar
Pt doping technology. It is specially suited for
switching mode base drive & transistor circuits.
Packaged in axial, SMA, SMB and SMC, this device is intended for use in high frequency inverters,
free wheeling and polarity protection.
Table 2: Order Codes
Part Number
STTH2R06
STTH2R06RL
STTH2R06A
STTH2R06U
STTH2R06S
Marking
STTH2R06
STTH2R06
R6A
R6U
R62
Table 3: Absolute Ratings (limiting values)
Symbol
VRRM
IF(RMS)
IF(AV)
Parameter
Repetitive peak reverse voltage
RMS forward voltage
Average forward current
δ = 0.5
DO-41
TL = 70°C
SMA
TL = 85°C
SMB
TL = 100°C
SMC
TL = 115°C
DO-41
tp = 10ms
sinusoidal
Value
Unit
600
V
7
A
2
A
40
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
-65 to + 175
°C
Operating junction temperature range
-40 to + 175
°C
Tj
June 2005
SMA / SMB / SMC
REV. 2
30
A
1/9
STTH2R06
Table 4: Thermal Resistance
Symbol
Parameter
DO-41
Rth(j-l)
Junction to lead
Value (max).
L = 5 mm
Unit
35
SMA
30
SMB
25
SMC
20
°C/W
Table 5: Static Electrical Characteristics
Symbol
Parameter
IR *
Reverse leakage current
VF **
Pulse test:
Test conditions
Forward voltage drop
Tj = 25°C
Tj = 150°C
Tj = 25°C
Tj = 150°C
Min.
Typ
Max.
Unit
2
VR = VRRM
µA
12
85
1.7
IF = 2A
V
1.0
1.25
* tp = 5 ms, δ < 2%
** tp = 380 µs, δ < 2%
2
To evaluate the conduction losses use the following equation: P = 1 x IF(AV) + 0.125 IF (RMS)
Table 6: Dynamic Characteristics
Symbol
Parameter
trr
Reverse recovery
time
tfr
Forward recovery
time
VFP
2/9
Forward recovery
voltage
Test conditions
Tj = 25°C
Tj = 25°C
Min. Typ Max. Unit
IF = 0.5A Irr = 0.25A IR =1A
IF = 1A dIF/dt = -50 A/µs VR =30V
IF = 2A
dIF/dt = 100 A/µs
VFR = 1.1 x VFmax
30
ns
35
50
100
ns
10
V
STTH2R06
Figure 1: Conduction losses versus average
forward current
Figure 2: Forward voltage drop versus forward
current
IFM(A)
P(W)
3.0
δ = 0.1
δ = 0.05
10
δ = 0.5
δ = 0.2
Tj=150°C
(maximum values)
9
2.5
8
7
δ=1
2.0
Tj=150°C
(typical values)
6
5
1.5
4
1.0
Tj=25°C
(maximum values)
3
T
2
0.5
δ=tp/T
IF(AV)(A)
1
tp
0.0
VFM(V)
0
0.0
0.5
1.0
1.5
2.0
2.5
Figure 3: Relative variation of thermal
impedance junction to case versus pulse
duration (SMA/SMB/SMC: SCU = 1cm2)
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
2.75
3.00
Figure 4: Peak reverse recovery current
versus dIF/dt (typical values)
IRM(A)
Zth(j-a)/Rth(j-a)
1.0
9
0.9
8
0.8
7
VR=400V
Tj=125°C
IF=2 x IF(AV)
SMA
0.7
IF=IF(AV)
6
0.6
IF=0.5 x IF(AV)
5
SMC
0.5
DO-41
4
0.4
3
0.3
SMB
2
0.2
1
Single pulse
0.1
tp(s)
0.0
dIF/dt(A/µs)
0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 5: Reverse recovery time versus dIF/dt
(typical values)
0
50
100
150
200
250
300
350
400
450
500
Figure 6: Reverse recovery charges versus
dIF/dt (typical values)
trr(ns)
Qrr(nC)
400
300
VR=400V
Tj=125°C
VR=400V
Tj=125°C
350
250
IF=2 x IF(AV)
300
200
250
IF=2 x IF(AV)
150
IF=IF(AV)
200
IF=IF(AV)
IF=0.5 x IF(AV)
IF=0.5 x IF(AV)
150
100
100
50
50
dIF/dt(A/µs)
dIF/dt(A/µs)
0
0
0
50
100
150
200
250
300
350
400
450
500
0
100
200
300
400
500
3/9
STTH2R06
Figure 7: Relative variations of dynamic
parameters versus junction temperature
Figure 8: Transient peak forward voltage
versus dIF/dt (typical values)
VFP(V)
1.2
30
IF=IF(AV)
Tj=125°C
1.0
25
0.8
20
trr
IRM
0.6
QRR
15
IF=IF(AV)
VR=400V
Reference: Tj=125°C
0.4
10
0.2
5
Tj(°C)
dIF/dt(A/µs)
0.0
25
50
75
100
125
0
0
Figure 9: Forward recovery time versus dIF/dt
(typical values)
50
100
150
200
250
Figure 10: Junction capacitance versus
reverse voltage applied (typical values)
C(pF)
tfr(ns)
300
100
IF=IF(AV)
VFR=1.1 x VF max.
Tj=125°C
F=1MHz
VOSC=30mVRMS
Tj=25°C
250
200
150
10
100
50
dIF/dt(A/µs)
VR(V)
0
1
0
50
100
150
200
250
Figure 11: Thermal resistance junction to
ambient versus copper surface under each
lead (epoxy FR4, eCU=35µm) (SMA/SMB/SMC)
1
10
100
1000
Figure 12: Thermal resistance versus lead
length (DO-41)
Rth(j-a)(°C/W)
Rth(°C/W)
120
120
Rth(j-a)
100
100
SMA
SMB
80
80
60
60
SMB
40
Rth(j-l)
40
20
20
Llead(mm)
SCU(cm²)
0
0
0.0
4/9
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5
10
15
20
25
STTH2R06
Figure 13: SMA Package Mechanical Data
DIMENSIONS
E1
REF.
D
E
A1
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.03
0.075
0.080
A2
0.05
0.20
0.002
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.41
0.006
0.016
E
4.80
5.60
0.189
0.220
E1
3.95
4.60
0.156
0.181
D
2.25
2.95
0.089
0.116
L
0.75
1.60
0.030
0.063
A2
C
L
b
Figure 14: SMA Foot Print Dimensions
(in millimeters)
2.30
1.50
2.30
1.75
6.10
5/9
STTH2R06
Figure 15: SMB Package Mechanical Data
DIMENSIONS
REF.
E1
D
E
A1
A2
C
L
b
Figure 16: SMB Foot Print Dimensions
(in millimeters)
2.23
1.64
2.23
2.30
6.10
6/9
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.41
0.006
0.016
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
D
3.30
3.95
0.130
0.156
L
0.75
1.60
0.030
0.063
STTH2R06
Figure 17: SMC Package Mechanical Data
DIMENSIONS
REF.
E1
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
2.90
3.2
0.114
0.126
c
0.15
0.41
0.006
0.016
E
7.75
8.15
0.305
0.321
E1
6.60
7.15
0.260
0.281
E2
4.40
4.70
0.173
0.185
D
5.55
6.25
0.218
0.246
L
0.75
1.60
0.030
0.063
D
E
A1
A2
C
E2
L
b
Figure 18: SMC Foot Print Dimensions
(in millimeters)
2.20
4.25
2.20
3.30
8.65
7/9
STTH2R06
Figure 19: DO-41 Package Mechanical Data
DIMENSIONS
C
A
O
/D
C
REF.
O
/ B
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.07
5.20
0.160
0.205
B
2.04
2.71
0.080
0.107
C
28
D
0.712
O
/D
1.102
0.863
0.028
0.034
Table 7: Ordering Information
Part Number
Marking
Package
Weight
Base qty
Delivery mode
STTH2R06
STTH2R06
DO-41
0.34 g
2000
Ammopack
STTH2R06RL
STTH2R06
DO-41
0.34 g
5000
Tape & reel
STTH2R06A
R6A
SMA
0.068 g
5000
Tape & reel
STTH2R06U
R6U
SMB
0.11 g
2500
Tape & reel
STTH2R06S
R62
SMC
0.243 g
2500
Tape & reel
Table 8: Revision History
8/9
Date
Revision
Description of Changes
07-Sep-2004
1
First issue.
1-Jun-2005
2
SMC package addition.
STTH2R06
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2005 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
9/9