STTH3R02 Ultrafast recovery diode Main product characteristics IF(AV) 3A VRRM 200 V Tj (max) 175° C VF (typ) 0.7 V trr (typ) 16 ns A K ■ Very low conduction losses ■ Negligible switching losses ■ Low forward and reverse recovery times ■ High junction temperature A A Features and benefits K DO-201AD STTH3R02 K DO-15 STTH3R02Q A Description The STTH3R02 uses ST's new 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. K SMC STTH3R02S Packaged in DO-201AD, DO-15, and SMC, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. Order codes October 2006 Part Number Marking STTH3R02 STTH3R02 STTH3R02RL STTH3R02 STTH3R02Q STTH3R02 STTH3R02QRL STTH3R02 STTH3R02S 3R2S Rev 2 1/9 www.st.com Characteristics STTH3R02 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Symbol VRRM IFRM IF(RMS) Parameter Value Unit 200 V tp = 5 µs, F = 5 kHz 110 A DO-201AD / DO-15 70 SMC 70 Repetitive peak reverse voltage Repetitive peak forward current(1) RMS forward current A DO-15 Tlead = 50° C IF(AV) Average forward current, δ = 0.5 DO-201AD Tlead = 90° C 3 A 75 A -65 to + 175 °C SMC Tc = 110° C IFSM Surge non repetitive forward current Tstg Storage temperature range tp = 10 ms Sinusoidal Tj Maximum operating junction temperature(1) 175 °C TL Maximum lead temperature for soldering during 10 s at 4 mm from case 230 °C Value Unit 1. On infinite heatsink with 10 mm lead length Table 2. Thermal parameters Symbol Parameter Rth(j-l) Junction to lead Rth(j-c) Junction to case Table 3. Symbol IR(1) 45 DO-201AD 30 SMC 20 Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Forward voltage drop Typ Max. Unit µA 3 IF = 9 A Tj = 25° C Tj = 100° C Min. 3 VR = VRRM 30 1.20 0.89 1.0 0.76 0.85 0.70 0.80 V IF = 3 A Tj = 150° C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 0.68 x IF(AV) + 0.04 IF2(RMS) 2/9 ° C/W Static electrical characteristics Tj = 25° C VF(2) DO-15 Lead Length = 10 mm on infinite heatsink STTH3R02 Characteristics Table 4. Dynamic characteristics Symbol Parameter trr Test conditions Typ Max. IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25° C 24 30 IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25° C 16 20 Reverse recovery current IF = 3 A, dIF/dt = -200 A/µs, VR = 160 V, Tj = 125° C 3.5 4.5 Forward recovery time IF = 3 A, dIF/dt = 100 A/µs VFR = 1.1 x VFmax, Tj = 25° C 40 ns Forward recovery voltage IF = 3 A, dIF/dt = 100 A/µs, Tj = 25° C 1.9 V Reverse recovery time IRM tfr VFP Figure 1. peak current versus duty cycle Figure 2. Min. Unit ns A Forward voltage drop versus forward current (typical values) IM(A) IFM(A) 100 50 T IM δd=tp/T 80 tp 40 60 30 P = 10 W 40 20 P=5W P=3W Tj=150°C 10 20 Tj=25°C δ 0 0.0 Figure 3. 0.1 VFM(V) 0 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.0 1.0 Forward voltage drop versus forward current (maximum values) 0.5 Figure 4. IFM(A) 1.0 1.5 2.0 Relative variation of thermal impedance junction to ambient versus pulse duration - DO-201AD (Epoxy printed circuit board FR4, eCU = 35 µm) Zth(j-a) /Rth(j-a) 50 1.0 0.9 40 DO-201AD Lleads=10mm 0.8 0.7 30 0.6 0.5 0.4 20 Tj=150°C 0.3 Tj=25°C 10 0.2 0.1 VFM(V) 0 0.0 0.5 1.0 1.5 2.0 0.0 1.E-01 Single pulse tP(s) 1.E+00 1.E+01 1.E+02 1.E+03 3/9 Characteristics Figure 5. STTH3R02 Relative variation of thermal impedance junction to ambient versus pulse duration - DO-15 (Epoxy printed circuit board FR4, eCU = 35 µm) Figure 6. Zth(j-a) /Rth(j-a) Relative variation of thermal impedance junction to ambient versus pulse duration - SMC (Epoxy printed circuit board FR4, eCU = 35 µm) Zth(j-a) /Rth(j-a) 1.0 1.0 DO-15 Lleads=10mm 0.9 SMC Scu=1cm² 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 Single pulse 0.1 0.0 1.E-01 Figure 7. Single pulse 0.1 tP(s) tP(s) 0.0 1.E+00 1.E+01 1.E+02 1.E-03 1.E+03 Junction capacitance versus reverse applied voltage (typical values) 1.E-02 Figure 8. C(pF) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Reverse recovery charges versus dIF/dt (typical values) QRR(nC) 80 100 F=1MHz Vosc=30mVRMS Tj=25°C IF=3A VR=160V 70 60 50 Tj=125°C 40 10 30 20 Tj=25°C 10 dIF/dt(A/µs) VR(V) 1 0 1 Figure 9. 10 100 1000 10 100 1000 Reverse recovery time versus dIF/dt Figure 10. Peak reverse recovery current (typical values) versus dIF/dt (typical values) IRM(A) tRR(ns) 60 8 IF=3A VR=160V IF=3A VR=160V 7 50 6 40 5 Tj=125°C 30 4 Tj=125°C 3 Tj=25°C 20 2 10 Tj=25°C 1 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 10 4/9 100 1000 10 100 1000 STTH3R02 Ordering information scheme Figure 11. Dynamic parameters versus junction temperature Figure 12. Thermal resistance junction to ambient versus copper surface under each lead for DO-15 and DO-201AD (Epoxy printed circuit board FR4, eCU = 35µm) QRR; IRM [T j] / Q RR; IRM [T j=125°C] Rth(j-a) (°C/W) 100 1.4 IF=3A VR=160V 1.2 90 80 1.0 70 0.8 DO-15 60 IRM 50 DO-201AD 0.6 40 QRR 30 0.4 20 0.2 10 Tj(°C) SCu(cm²) 0 0.0 25 50 75 100 125 0.0 150 Figure 13. Thermal resistance versus copper surface under each lead for SMC (Epoxy printed circuit board FR4, eCU = 35µm) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 14. Thermal resistance versus lead length for DO-201AD package Rth(°C/W) Rth(j-a) (°C/W) 100 100 SMC DO-201AD 90 80 Rth(j-a) 80 70 60 60 50 40 40 Rth(j-l) 30 20 20 10 SCU(cm²) 0 0.0 2 Lleads(mm) 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5 10 15 20 25 Ordering information scheme STTH 3 R 02 XXX Ultrafast switching diode Average forward current 3=3A Model R Repetitive peak reverse voltage 02 = 200 V Package Blank = DO-201 in Ammopack RL = DO-201 in Tape and reel Q = DO-15 in Ammopack QRL = DO-15 in Tape and reel S= SMC in Tape and reel 5/9 Package information 3 STTH3R02 Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) Table 5. DO-201AD Dimensions Dimensions Ref. Millimeters Min. B E Min. Max. B A Note 1 Max. Inches E A Note 1 B 9.50 25.40 0.374 1.000 ØD Note 2 ØC C 5.30 0.209 D 1.30 0.051 E 1.25 0.049 Notes Table 6. 1 - The lead diameter ø D is not controlled over zone E 2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15mm) DO-15 dimensions Dimensions C C A D B 6/9 Ref. Millimeters Inches Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035 STTH3R02 Package information Table 7. SMC dimensions Dimensions Ref. Millimeters E1 D E A1 A2 C E2 L b Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.60 0.030 0.063 Figure 15. SMC footprint (dimensions in mm) 2.20 4.25 2.20 3.30 8.65 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering information 4 5 8/9 STTH3R02 Ordering information Part Number Marking Package Weight Base qty Delivery mode STTH3R02 STTH3R02 DO-201AD 1.16 g 600 Ammopack STTH3R02RL STTH3R02 DO-201AD 1.16 g 1900 Tape and reel STTH3R02Q STTH3R02 DO-15 0.4 g 1000 Ammopack STTH3R02QRL STTH3R02 DO-15 0.4 g 6000 Tape and reel STTH3R02S 3R2S SMC 0.243 g 2500 Tape and reel Revision history Date Revision Description of Changes 03-May-2006 1 First issue 10-Oct-2006 2 Added SMC package STTH3R02 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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