STMICROELECTRONICS STTH802CFP

STTH802CT/CB/CFP
®
HIGH EFFICIENCY ULTRAFAST DIODE
MAIN PRODUCT CHARACTERISTICS
IF(AV)
2 x 4A
A1
VRRM
200 V
A2
Tj (max)
175 °C
VF (max)
0.95 V
trr (max)
20 ns
K
FEATURES AND BENEFITS
■
■
■
■
■
■
Suited for SMPS
Low losses
Low forward and reverse recovery times
High surge current capability
High junction temperature
Insulated package: TO-220FPAB
K
A1
A2
A2
K
A1
TO-220AB
STTH802CT
TO-220FPAB
STTH802CFP
K
DESCRIPTION
Dual center tap rectifier suited for Switch Mode
Power Supplies and High frequency DC to DC
converters.
Packaged in DPAK, TO-220AB or TO-220FPAB.
This device is intended for use in low voltage, high
frequency inverters, free wheeling and polarity
protection applications.
K
A2
A1
DPAK
STTH802CB
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
200
V
IF(RMS)
RMS forward current
TO-220AB / TO-220FPAB / DPAK
10
A
Average forward
current δ =0.5
TO-220AB / DPAK
Tc = 155°C
Per diode
4
A
TO-220FPAB
Tc = 145°C
TO-220AB / DPAK
Tc = 150°C
Per device
8
A
TO-220FPAB
Tc = 130°C
50
A
- 65 + 175
°C
175
°C
IF(AV)
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
Tj
Maximum operating junction temperature
April 2002 - Ed: 1A
tp = 10 ms Sinusoidal
1/8
STTH802/CT/CB/CFP
THERMAL PARAMETERS
Symbol
Parameter
Rth (j-c)
Junction to case
TO-220AB / DPAK
Maximum
Unit
4.0
°C/W
Per diode
TO-220FPAB
TO-220AB / DPAK
Coupling
Rth (j-c)
6.5
Total
2.5
TO-220FPAB
5
TO-220AB / DPAK
1
TO-220FPAB
°C/W
3.5
When the diodes 1 and 2 are used simultaneously:
∆ Tj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c)
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
IR*
Tests conditions
Reverse leakage
current
VF**
Tj = 25°C
Min.
VR = VRRM
Tj = 125°C
Forward voltage drop
Typ.
2
Tj = 25°C
IF = 4 A
Tj = 125°C
IF = 4 A
Tj = 25°C
IF = 8 A
Tj = 125°C
IF = 8 A
Max.
Unit
4
µA
40
1.1
0.81
V
0.95
1.25
0.95
1.1
Pulse test: * tp = 5ms, δ < 2%
** tp = 380µs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.80 x IF(AV) + 0.037 IF2(RMS)
DYNAMIC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
trr
Reverse recovery
time
Tj = 25°C
tfr
Forward recovery
time
VFP
Forward recovery
voltage
2/8
Tests conditions
Min.
Typ.
Max.
Unit
IF = 0.5 A Irr = 0.25 A
IR = 1A
13
20
ns
Tj = 25°C
IF = 4 A dIF/dt = 100 A/µs
VFR = 1.1 x VFmax
50
ns
Tj = 25°C
IF = 4 A dIF/dt = 100 A/µs
2.4
V
STTH802/CT/CB/CFP
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
Fig. 2: Peak current versus form factor (per diode).
IM(A)
PF(av)(W)
60
5
δ = 0.05
δ = 0.2
δ = 0.1
T
δ = 0.5
50
4
P = 5W
δ=tp/T
δ=1
tp
40
3
30
2
20
T
1
P = 10W
10
IF(av)(A)
δ=tp/T
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
tp
4.0
4.5
5.0
P = 2W
δ
0.1
0.2
0
0.0
Fig. 3: Forward voltage drop versus forward
current (per diode).
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Fig. 4-1: Relative variation of thermal impedance
junction to case versus pulse duration (TO-220AB,
DPAK).
Zth(j-c) / Rth(j-c)
IFM(A)
1.0
100.0
Tj=125°C
Typical values
10.0
0.3
δ = 0.5
Tj=125°C
Maximum values
δ = 0.2
Tj=25°C
Maximum values
δ = 0.1
1.0
T
Single pulse
tp(s)
VFM(V)
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
Fig. 4-2: Relative variation of thermal impedance
junction to case versus duration (TO-220FPAB).
0.1
1.E-03
1.E-02
δ=tp/T
1.E-01
tp
1.E+00
Fig. 5-1: Non repetitive surge peak forward
current versus overload duration per diode
(TO-220AB, DPAK).
Zth(j-c) / Rth(j-c)
IM(A)
1.0
70
δ = 0.5
60
δ = 0.2
50
δ = 0.1
40
Tc=25°C
30
Tc=75°C
0.1
Single pulse
10
tp(s)
δ=tp/T
0.0
1.E-03
1.E-02
1.E-01
1.E+00
Tc=125°C
20
T
IM
t
tp
1.E+01
t(s)
δ=0.5
0
1.E-03
1.E-02
1.E-01
1.E+00
3/8
STTH802/CT/CB/CFP
Fig. 5-2: Non repetitive surge peak forward
current versus overload duration per diode
(TO-220FPAB).
Fig. 6: Average forward current versus ambient
temperature (δ = 0.5, per diode).
IM(A)
IF(av)(A)
60
5.0
4.5
50
TO-220AB/DPAK
Rth(j-a)=Rth(j-c)
4.0
3.5
40
3.0
Tc=25°C
30
TO-220FPAB
2.5
Tc=75°C
2.0
20
1.5
Tc=125°C
10
DPAK (S=0.5cm²)
Rth(j-a)=70°C:W
1.0
IM
t
0.5
t(s)
δ=0.5
0
1.E-03
Tamb(°C)
0.0
1.E-02
1.E-01
0
1.E+00
Fig. 7: Junction capacitance versus reverse
voltage applied (typical values, per diode).
25
50
75
100
125
150
175
Fig. 8: Reverse recovery charges versus dIF/dt
(90% confidence, per diode).
QRR(nC)
C(pF)
1000
100
IF=4A
VR=200V
Tj=125°C
F=1MHz
Vosc=30mVRMS
Tj=25°C
100
dIF/dt(A/µs)
VR(V)
10
10
1
10
100
10
1000
Fig. 9: Peak reverse recovery current versus
dIF/dt (90% confidence, per diode).
100
1000
Fig. 10: Dynamic parameters versus junction
temperature.
IRM(A)
QRR; IRM [Tj] / QRR; IRM [Tj = 125°C]
100.0
1.4
IF=4A
VR=200V
Tj=125°C
IF=4A
VR=200V
1.2
1.0
10.0
0.8
IRM
0.6
1.0
QRR
0.4
0.2
dIF/dt(A/µs)
Tj(°C)
0.1
0.0
10
4/8
100
1000
0
25
50
75
100
125
150
STTH802CT/CB/CFP
Fig. 11: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35µm) for
DPAK.
Rth(j-a)(°CW)
100
90
80
70
60
50
40
30
20
10
S(cm²)
0
0
2
4
6
8
10
12
14
16
18
20
PACKAGE MECHANICAL DATA
TO-220AB
DIMENSIONS
REF.
A
H2
Dia
C
L5
L7
L6
L2
F2
F1
D
L9
L4
M
G1
E
G
Inches
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
F2
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
G1
2.40
2.70
0.094
0.106
H2
10
10.40
0.393
0.409
L2
F
Millimeters
Min.
16.4 typ.
0.645 typ.
L4
13
14
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
M
Diam.
2.6 typ.
3.75
3.85
0.102 typ.
0.147
0.151
5/8
STTH802CT/CB/CFP
PACKAGE MECHANICAL DATA
DPAK
DIMENSIONS
REF.
6.7
6.7
3
3
1.6
1.6
2.3
6/8
2.3
Inches
Min.
Max
Min.
Max.
A
2.20
2.40
0.086
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.90
0.025
0.035
B2
5.20
5.40
0.204
0.212
C
0.45
0.60
0.017
0.023
C2
0.48
0.60
0.018
0.023
D
6.00
6.20
0.236
0.244
E
6.40
6.60
0.251
0.259
G
4.40
4.60
0.173
0.181
H
9.35
10.10
0.368
0.397
L2
FOOTPRINT
Millimeters
0.80 typ.
0.031 typ.
L4
0.60
1.00
0.023
0.039
V2
0°
8°
0°
8°
STTH802/CT/CB/CFP
PACKAGE MECHANICAL DATA
TO-220FPAB
DIMENSIONS
REF.
A
B
H
Dia
L6
L2
L7
L3
L5
D
F1
F2
F
E
G1
G
■
■
■
■
■
Inches
Min.
Max.
Min.
Max.
A
4.4
4.6
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.70
0.018
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.70
0.045
0.067
F2
1.15
1.70
0.045
0.067
G
4.95
5.20
0.195
0.205
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
L2
L4
■
Millimeters
16 Typ.
0.63 Typ.
L3
28.6
30.6
1.126
1.205
L4
9.8
10.6
0.386
0.417
L5
2.9
3.6
0.114
0.142
L6
15.9
16.4
0.626
0.646
L7
9.00
9.30
0.354
0.366
Dia.
3.00
3.20
0.118
0.126
Ordering code
Marking
Package
Weight
Base qty
Delivery mode
STTH802CT
STTH802CT
TO-220AB
2.23 g
50
Tube
STTH802CB
STTH802CB
DPAK
0.3 g
75
Tube
STTH802CB-TR
STTH802CB
DPAK
0.3 g
2500
Tape & reel
STTH802CFP
STTH802CFP
TO-220FPAB
2.0 g
50
Tube
Cooling method: by conduction (method C)
Recommended torque value (TO-220AB): 0.8 N.m
Maximum torque value (TO-220AB): 1.0 N.m
Recommended torque value (TO-220FPAB): 0.55 N.m
Maximum torque value (TO-220FPAB): 0.7 N.m
Epoxy meets UL 94,V0
7/8
STTH802CT/CB/CFP
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
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