PHILIPS SZA1010T

INTEGRATED CIRCUITS
DATA SHEET
SZA1010
Digital Servo Driver 3 (DSD-3)
Preliminary specification
File under Integrated Circuits, IC01
1997 Apr 07
Philips Semiconductors
Preliminary specification
Digital Servo Driver 3 (DSD-3)
SZA1010
FEATURES
GENERAL DESCRIPTION
Servo functions
The SZA1010 or Digital Servo Driver 3 (DSD-3) consists of
1-bit class-D power drivers, which are specially designed
for digital servo applications. Three such amplifiers are
integrated in one chip, to drive the focus and radial
actuators and the sledge motor of a compact disc optical
system.
• 1-bit class-D focus actuator driver (4 Ω)
• 1-bit class-D radial actuator driver (4 Ω)
• 1-bit class-D sledge motor driver (2 Ω).
Other features
The main benefits of using this principle are its higher
efficiency grade compared to conventional analog power
amplifiers, its higher integration level, its differential output
and the fact that only a few external components are
needed. When using these digital power drivers in a digital
servo application, the statement ‘complete digital servo
loop’ becomes more realistic.
• Supply voltage 5 V only
• Small package (SOT163-1)
• Higher efficiency, compared with conventional drivers,
due to the class-D principle
• Built-in digital notch filters for higher efficiency
• Enable input for focus and radial driver
• Enable input for sledge driver
• 3-state input for radial driver
• Doubled clock frequency
• Differential outputs for all drivers
• Separate power supply pins for all drivers.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
VDDD
digital supply voltage
4.5
−
5.5
V
VDDA(F)
analog supply voltage focus actuator
4.5
−
5.5
V
VDDA(R)
analog supply voltage radial actuator
4.5
−
5.5
V
VDDA(S)
analog supply voltage sledge actuator
4.5
−
5.5
V
IDDDq
quiescent digital supply current
−
−
10
µA
IDDA(F)
analog supply current focus actuator
−
126
250
mA
IDDA(R)
analog supply current radial actuator
−
20
250
mA
IDDA(S)
analog supply current sledge actuator
−
150
560
mA
fi(clk)
input clock frequency
−
8.4672
10
MHz
Ptot
total power dissipation
−
tbf
−
mW
Tamb
operating ambient temperature
−40
−
+85
°C
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
SZA1010T
SO20
1997 Apr 07
DESCRIPTION
plastic small outline package; 20 leads; body width 7.5 mm
2
VERSION
SOT163-1
Philips Semiconductors
Preliminary specification
Digital Servo Driver 3 (DSD-3)
SZA1010
BLOCK DIAGRAM
VDDD
dbook, full pagewidth
VDDA(R) VDDA(F) VDDA(S)
6
RAC
4
13
14
1
DIGITAL
NOTCH FILTER
END STAGE
H−BRIDGE
DIGITAL
NOTCH FILTER
END STAGE
H−BRIDGE
DIGITAL
NOTCH FILTER
END STAGE
H−BRIDGE
11
12
RA+
RA−
SZA1010
FOC
SLC
CLI
EN1
EN2
3
2
16
19
20
7
8
FO+
FO−
SL+
SL−
CONTROL
9
5
10
17
VSSD VSSA(R) 3-STATE
Fig.1 Block diagram.
1997 Apr 07
15
3
18
VSSA(S)/VSSA(F)
MBK013
Philips Semiconductors
Preliminary specification
Digital Servo Driver 3 (DSD-3)
SZA1010
PINNING
SYMBOL
PIN
DESCRIPTION
VDDA(S)
1
analog supply voltage for sledge
motor driver
SLC
2
PDM input for sledge driver
FOC
3
PDM input for focus driver
RAC
4
PDM input for radial driver
VSSD
5
digital ground
VDDD
6
digital supply voltage
CLI
7
clock input
EN1
8
enable input 1
EN2
9
enable input 2
VSSA(R)
10
analog ground for radial driver
RA+
11
radial driver (positive output)
RA−
12
radial driver (negative output)
VDDA(R)
13
analog supply voltage for radial
driver
VDDA(F)
14
analog supply voltage for focus
FO+
15
focus driver (positive output)
FO−
16
focus driver (negative output)
3-STATE
17
radial 3-state input
VSSA(S)/
VSSA(F)
18
analog ground for sledge
driver/focus
SL+
19
sledge driver (positive output)
SL−
20
sledge driver (negative output)
1997 Apr 07
handbook, halfpage
VDDA(S)
1
20 SL−
SLC
2
19 SL+
FOC
3
18 VSSA(S)/VSSA(F)
RAC
4
17 3-STATE
VSSD
5
16 FO−
SZA1010
VDDD
6
15 FO+
CLI
7
14 VDDA(F)
EN1
8
13 VDDA(R)
EN2
9
12 RA−
VSSA(R) 10
11 RA+
MBK012
Fig.2 Pin configuration.
4
Philips Semiconductors
Preliminary specification
Digital Servo Driver 3 (DSD-3)
SZA1010
The amplitude transfer as a function of frequency is given
in Fig.7.
FUNCTIONAL DESCRIPTION
Principle of a class-D digital power driver
Figure 7 shows that the filter has a zero on 1⁄2fs, thereby
filtering out the Idle pattern (101010). The output of this
filter is a three-level code (1.5-bit). For the control of the
switches three states (1.5-bit) can be distinguished: the
two states as described earlier and a third one. This state
is used when an idling pattern is supplied.
Figure 3 shows the block diagram of one of the digital
drivers integrated in the DSD-3. It consists of a timing
block and four CMOS switches. The input signal is a 1-bit
Pulse Density Modulated (PDM) signal, the output of the
digital servo ICs.
The maximum operating clock frequency of the device is
10 MHz. In combination with most frequently used Philips
digital servo ICs, the operating frequency of the digital
drivers is 8.4672 MHz (192 × 44.1 kHz). The sampling
frequency of the 1-bit code however is 2.1168 MHz, so
internally in the DSD-3 the clock speed of the switches will
be 2.1168 MHz.
The higher input clock frequency is used to make
non-overlapping pulses to prevent short-circuits between
the supply voltages. For the control of the switches, two
states can be distinguished. If the 1-bit code contains a
logic 1, switches A and D are closed and current will flow
in the direction as shown in Fig.4.
Switches C and D are closed (see Fig.8). In this Idle mode,
no current will flow and thus the efficiency will be improved.
This mode is also used to short-circuit the inductive
actuator/motor. In this way, high induction voltages are
prevented because the current can commutate via the
filter and the short-circuit in the switches. All three drivers
(radial, focus and sledge) contain a digital notch filter as
described (see Fig.6). Each driver has its own power
supply pins to reduce crosstalk due to of the relative high
current flowing through the pins.
Compared to the DSD-2, the DSD-3 has a 3-state mode
for the radial output, which is useful when active damping
of the radial actuator is needed. When fast access times
are required, the sledge has to move with high
accelerations. To prevent the radial actuator from moving
too far from its centre position due to the acceleration,
active damping is applied. In order to measure the
displacement of the radial actuator, the voltage induced by
the actuator itself is measured, which is proportional to its
speed. The damping consists of a sequence of controlling,
waiting, measuring and controlling etc. To be able to
measure the induced voltage properly, the influence of the
DSD-3 is eliminated by switching it into 3-state mode.
If the 1-bit code contains a logic 0, switches B and C are
closed and current will flow in the opposite direction, as
shown in Fig.5.
This indicates that the difference between the mean
number of ones and zeros in the PDM signal determines
the direction in which the actuator or motor will rotate.
If the mean number of ones and zeros is equal (Idle mode)
the current through the motor or actuator is alternated
between the positive and negative direction at a speed of
half the sample frequency of 2.1168 MHz. This results in a
high dissipation and the motor does not move.
To improve the efficiency, a digital notch filter is added at
the input of the digital drivers. This filters the Idle mode
pattern (1010101010 etc.) see Fig.6.
1997 Apr 07
5
Philips Semiconductors
Preliminary specification
Digital Servo Driver 3 (DSD-3)
SZA1010
VDD
VDD
Ipos
A
B
1-bit
code
'1'
1-bit
code
(1)
TIMING
(1)
M
TIMING
M
clock
clock
C
MBG786
MBG787
VSS
(1) Sledge motor; focus/radial motor.
D
VSS
(1) Sledge motor; focus/radial motor.
Fig.3 One of the digital drivers.
Fig.4 1-bit code is logic 1.
VDD
Ineg
A
B
1-bit
code
'0'
1-bit
(1)
clock
MBG789
C
MBG788
D
VSS
The filter consists of a simple delay element (flip-flop) and an adder.
The transfer from input-to-output is: H(z) = 1 + z−1.
(1) Sledge motor; focus/radial motor.
Fig.5 1-bit code is logic 0.
1997 Apr 07
1.5-bit
1/Z
M
TIMING
Fig.6 Notch filter at input of digital drivers.
6
Philips Semiconductors
Preliminary specification
Digital Servo Driver 3 (DSD-3)
SZA1010
MBG790
VDD
|H|
A
B
1-bit
code
'idle'
(1)
M
TIMING
clock
C
D
Iidle
MBG791
1/2fs
VSS
(1) Sledge motor; focus/radial motor.
Fig.7 Amplitude transfer.
Fig.8 Idling pattern.
Switches
Timing of input and output signals
The digital part of the power drivers consists of standard
cells. The power switches are specifically designed for CD
applications. The most important feature is their
on-resistance. In the applications, they have to drive very
low-ohmic actuators and/or motors. The switches are
designed to have an on-resistance of 2 Ω for the actuator
drivers and 1 Ω for the sledge motor driver. In any mode,
there are always two switches in series with the
actuator/motor. The total loss due to the switches is 4 Ω for
the actuators and 2 Ω for the sledge motor.
All internal timing signals are derived from the externally
supplied CLI signal.
Sampling of the data inputs (SLC, FOC and RAC) occurs
at a frequency of 1⁄4CL. For each channel, the clocking-in
occurs at a different positive edge of CLI. Because there
are only 3 channels, and the clock frequency CLI is
divided-by-4, only 3 out of 4 positive edges are effective for
sampling one of the inputs.
The switching of the outputs occurs in a similar way,
except that in this event the negative edge of CLI is used.
In this way, the input signals are immune to the noise
radiated by the switching of the outputs. It is possible that
an output transition will have a noticeable effect on the
power supply voltage or the ground voltage. To avoid
simultaneous transitions of all outputs, the outputs of each
bridge are also clocked at a different phase of CLI.
Consequently there are only 3 out of 4 negative edges
effective.
3-state input
When the 3-STATE input (pin 17) is made HIGH, the four
CMOS switches of the radial driver are opened.
Consequently, the radial output pins RA+ (pin 11) and RA−
(pin 12) switch into a high impedance state.
To set the circuit into 3-state mode, the clock signal (CLI)
is not required; the 3-STATE input is a direct,
asynchronous input. It has an internal pull-down resistor.
1997 Apr 07
To reset the circuit, both the reset condition and the clock
should be present, because all flip-flops are reset
synchronously. The clock signal is also required to obtain
one of the possible modes of operation indicated in
Table 1.
7
Philips Semiconductors
Preliminary specification
Digital Servo Driver 3 (DSD-3)
Table 1
SZA1010
Possible modes of operation
EN1
EN2
SLEDGE DRIVER
FOCUS/RADIAL
DRIVER
0
0
off
off
standby
0
1
off
on
partly operating
1
0
off
off
reset
1
1
on
on
operating
MODE
The timing diagram as shown in Fig.9 gives the relationship between the different clocks.
The negative edge of the signals called ncl0 to ncl2 is used to process the incoming data (see Table 2).
The negative edge of all signals called cl0s to cl2s is used to trigger the outputs (see Table 2).
Table 2
Signals ncl0 to ncl2 and cl0s to cl2s
SIGNAL
DESCRIPTION
ncl0
sledge input sampling clock
ncl1
focus input sampling clock
ncl2
radial input sampling clock
cl0s
sledge output trigger clock
cl1s
focus output trigger clock
cl2s
radial output trigger clock
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VDDD
digital supply voltage
−0.5
+6.5
V
VDDA(x)
analog supply voltage
−0.5
+6.5
V
VSSD − VSSA(x)
ground supply voltage difference
−5
+5
mV
Ptot
total power dissipation
−
tbf
mW
Tstg
storage temperature
−55
+150
°C
Tamb
operating ambient temperature
−40
+85
°C
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
1997 Apr 07
PARAMETER
thermal resistance from junction to ambient in free air
8
VALUE
UNIT
75
K/W
Philips Semiconductors
Preliminary specification
Digital Servo Driver 3 (DSD-3)
SZA1010
CHARACTERISTICS
VDDD = VDDA(x) = 5 V; VSSD = VSSA(x) = 0 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
General
VDDD
digital supply voltage
4.5
−
5.5
V
VDDA(x)
analog supply voltage
4.5
−
5.5
V
IDDDq
quiescent digital supply current
−
−
tbf
µA
IDDA(F)(max) maximum analog supply current
focus actuator
note 1
−
126
250
mA
IDDA(R)(max) maximum analog supply current
radial actuator
note 1
−
20
250
mA
IDDA(S)(max) maximum analog supply current
sledge actuator
note 1
−
150
560
mA
fi(clk)
input clock frequency
−
8.4672
10
MHz
Ptot
total power dissipation
−
tbf
−
mW
Tamb
operating ambient temperature
−40
−
+85
°C
Digital inputs; SLC, FOC, RAC, CLI, 3-STATE, EN1 and EN2
VIL
LOW level input voltage
Tamb = −40 to +85 °C
−
−
0.2VDDD
V
VIH
HIGH level input voltage
Tamb = −40 to +85 °C
0.8VDDD
−
−
V
ILI
input leakage current
−
−
1
µA
−
8.4672
10
MHz
−
−
250
mA
−
tbf
4
Ω
−
−
250
mA
−
tbf
4
Ω
−
−
560
mA
−
tbf
2
Ω
Clock input; CLI
fclk
clock frequency
Analog outputs; FO+ and FO−
IO
output current
RO
output resistance
note 2
Analog outputs; RA+ and RA−
IO
output current
RO
output resistance
note 2
Analog outputs; SL+ and SL−
IO
output current
RO
output resistance
note 2
Notes
V DDA(x)(max)
1. Maximum supply current depends on the value of RL: I max = ----------------------------( RO + RL)
2. Output resistance is defined as the series resistance of the complete bridge.
1997 Apr 07
9
1997 Apr 07
10
k, full pagewidth
Fig.9 Timing diagram.
MBG792
RA−
RA+
FO−
FO+
SL−
SL+
cI2s
cI1s
cI0s
ncI2
ncI1
ncI0
RAC
FOC
SLC
Digital Servo Driver 3 (DSD-3)
Sampling of the incoming data is marked by a ‘∗’.
outputs
inputs
CLI
Philips Semiconductors
Preliminary specification
SZA1010
Timing diagram
Philips Semiconductors
Preliminary specification
Digital Servo Driver 3 (DSD-3)
SZA1010
APPLICATION INFORMATION
Figure 10 shows an application example.
An LC filter is connected to each output of the SZA1010 in
order to remove the PDM square wave signal at the clock
frequency. This is done to prevent the relatively long wires
to the actuators and motor from radiating and thereby
disturbing other circuitry. Therefore it is recommended to
place the coils as close as possible to the IC. The LC filter
bandwidth has been chosen as high as 20 kHz to ensure
that the filter’s poles are far enough outside the relevant
loop bandwidth, which in this application is approximately
1 kHz. In this way their influence on the closed loop
performance is kept to a minimum. Furthermore, the
corner frequency has not been chosen higher in order to
filter out noise and spurious products as much as possible,
because they enlarge the dissipation.
The various power supply and ground pins are all
connected together in the schematic, but if desired, the
focus, radial and sledge power pins can be connected to a
separate power supply.
The three ground pins are internally connected and
therefore should not be separated.
1997 Apr 07
11
1997 Apr 07
12
(1) See Table 1.
M
2.2 µF
(2×)
radial actuator
M
focus actuator
M
sledge motor
1 µF
(2×)
1 µF
(2×)
12
11
16
15
20
19
14
18
VSSA(S)/VSSA(F)
RA−
RA+
FO−
FO+
SL−
SL+
1
5
6
4
3
2
EN2
EN1
CLI
3-STATE
RAC
FOC
SLC
CLKO
RA
FO
SL
from microcontroller (1)
9
8
7
17
VSSA(R) VSSD
10
SZA1010
13
VDDA(F) VDDA(R) VDDA(S) VDDD
+5 V
28
31
32
33
MBK014
SERVO
CONTROLLER
(OQ8868)
Digital Servo Driver 3 (DSD-3)
Fig.10 Application diagram.
100 µH
100 µH
100 µH
100 µH
100 µH
100 µH
100 nF
handbook, full pagewidth
Philips Semiconductors
Preliminary specification
SZA1010
Philips Semiconductors
Preliminary specification
Digital Servo Driver 3 (DSD-3)
SZA1010
PACKAGE OUTLINE
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
11
20
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
10
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.050
0.42
0.39
0.055
0.043
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
inches
0.10
Z
(1)
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013AC
1997 Apr 07
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-24
13
o
8
0o
Philips Semiconductors
Preliminary specification
Digital Servo Driver 3 (DSD-3)
SZA1010
SOLDERING
Wave soldering
Introduction
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1997 Apr 07
14
Philips Semiconductors
Preliminary specification
Digital Servo Driver 3 (DSD-3)
SZA1010
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Apr 07
15
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Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1997
SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547027/00/01/pp16
Date of release: 1997 Apr 07
Document order number:
9397 750 01953