INTEGRATED CIRCUITS DATA SHEET TDA1541 Dual 16-bit DAC Product specification File under Integrated Circuits, IC01 November 1985 Philips Semiconductors Product specification Dual 16-bit DAC TDA1541 GENERAL DESCRIPTION The TDA1541 is a monolithic integrated dual 16-bit digital-to-analogue converter (DAC) designed for use in hi-fi digital audio equipment such as Compact Disc players, digital tape or cassette recorders. Features • Selectable two-channel input format: offset binary or two’s complement • Internal timing and control circuit • TTL compatible digital inputs • High maximum input bit-rate and fast settling time. QUICK REFERENCE DATA Supply voltages VDD typ. 5 V pin 26 VDD1 typ. −5 V pin 15 VDD2 typ. −15 V pin 28 IDD typ. 45 mA pin 26 IDD1 typ. 45 mA pin 15 IDD2 typ. 25 mA S/N typ. 95 dB typ. 1⁄ LSB tcs typ. 1 µs BRmax min. 6 Mbits/s at clock input (pin 2) fBCKmax min. 6 MHz at clock input (pin 4) fSCKmax min. 12 MHz at analogue outputs (AOL; AOR) TCFS typ. ± 200 × 10−6 K−1 Operating ambient temperature range Tamb −20 to +70 °C Total power dissipation Ptot typ. 850 mW pin 28 Supply currents Signal-to-noise ratio (full scale sine-wave) at analogue outputs (AOL; AOR) Non-linearity at Tamb = −20 to +70 °C Current settling time to ± 1 LSB 2 Maximum input bit rate at data input (pin 3) Maximum clock frequency Full scale temperature coefficient PACKAGE OUTLINE 28-lead DIL; plastic (with internal heat spreader) (SOT-117); SOT117-1; 1996 August 14. November 1985 2 Philips Semiconductors Product specification TDA1541 Fig.1 Block diagram. Dual 16-bit DAC November 1985 3 Philips Semiconductors Product specification Dual 16-bit DAC TDA1541 PINNING 1 LE/WS* 2 BCK* latch enable input word select input bit clock input data left channel input 3 DATA L/DATA* 4 DATA R/SYS* 5 GND (A) analogue ground 6 AOR right channel output 7 DECOU 8 DECOU 9 DECOU 10 DECOU 11 DECOU 12 DECOU 13 DECOU 14 GND (D) digital ground 15 VDD2 −15 V supply voltage 16 n.c. 17 n.c. 18 DECOU 19 DECOU 20 DECOU 21 DECOU 22 DECOU 23 DECOU 24 DECOU 25 AOL left channel output 26 VDD1 −5 V supply voltage 27 OB/TWC* mode selection input 28 VDD +5 V supply voltage data input (selected format) data right channel input system clock input decoupling Fig.2 Pinning diagram. not connected decoupling * See Table 1 data selection input. November 1985 4 Philips Semiconductors Product specification Dual 16-bit DAC TDA1541 FUNCTIONAL DESCRIPTION The TDA1541 accepts input sample formats in time multiplexed mode or simultaneous mode with any bit length. The most significant bit (MSB) must always be first. This flexible input data format allows easy interfacing with signal processing chips such as interpolation filters, error correction circuits, pulse code modulation adaptors and audio signal processors (ASP). The high maximum input bit-rate and fast settling time facilitates application in 4 × oversampling systems (44,1 kHz to 176,4 kHz) with the associated simple analogue filtering function (low order, linear phase filter). Input data selection (see also Table 1) With input OB/TWC connected to ground, data input (offset binary format) must be in time multiplexed mode. It is accompanied with a word select (WS) and a bit clock input (BCK) signal. A separate system clock input (SCK) is provided for accurate, jitter-free timing of the analogue outputs AOL and AOR. With OB/TWC connected to VDD the mode is the same but data format must be in two’s complement. When input OB/TWC is connected to (VDD1) the two channels of data (L/R) are input simultaneously via (DATA L) and (DATA R), accompanied with BCK and a latch-enable input (LE). With this mode selected the data must be in offset binary. The format of data input signals is shown in figures 3, 4 and 5. True 16-bit performance is achieved by each channel using three 2-bit active dividers, operating on the dynamic element matching principle, in combination with a 10-bit passive current-divider, based on emitter scaling. All digital inputs are TTL compatible. Input data selection OB/TWC MODE PIN 1 PIN 2 PIN 3 PIN 4 −5 V simultaneous LE BCK DATA L DATA R 0V time MUX OB WS BCK DATA OB SCK +5 V time MUX TWC WS BCK DATA TWC SCK Where: LE = latch enable WS = word select BCK = bit clock DATA L = data left DATA R = data right DATA OB = data offset binary DATA TWC = data two’s complement MUX OB = multiplexed offset binary MUX TWC = multiplexed two’s complement November 1985 5 Philips Semiconductors Product specification Dual 16-bit DAC TDA1541 RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage ranges VDD 0 to +7 V pin 26 VDD1 0 to −7 V pin 15 VDD2 0 to −17 V Crystal temperature range TXTAL −55 to +150 °C Storage temperature range Tstg −55 to +150 °C Operating ambient temperature range Tamb −20 to +70 °C Ves −1000 to +1000 V = K/W pin 28 Electrostatic handling(1) Note 1. Discharging a 250 pF capacitor through a 1 kΩ series resistor. THERMAL RESISTANCE From junction to ambient November 1985 Rth 6 j-a 35 Philips Semiconductors Product specification Dual 16-bit DAC TDA1541 CHARACTERISTICS VDD = + 5 V; VDD1 = −5 V; VDD2 = −12 V; Tamb = + 25 °C; measured in Fig. 1; unless otherwise specified. PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply Supply voltage ranges pin 28 VDD 4,0 5,0 6,0 V pin 26 −VDD1 4,5 5,0 6,0 V pin 15 −VDD2 14 15 16 V pin 28 IDD − 45 tbf mA pin 26 −IDDI − 45 tbf mA pin 15 −IDD2 − 25 tbf mA Resolution Res − 16 − bits digital inputs LOW (< 0,8 V) IIL − − tbf mA digital inputs HIGH (> 2,0 V) IIH − − tbf µA at clock input (pin 4) fSCK − − 12 MHz at clock input (pin 2) fBCK − − 6 MHz at data inputs (pin 3 and pin 4) fDAT − − 6 MHz at word select input (pin 1) fWS − − 200 kHz CI − 12 − pF fosc 150 200 250 kHz Output voltage compliance VOC tbf − tbf mV Full scale current IFS 3,4 4,0 4,6 mA Zero scale current ± IZS − tbf − nA TCFS − ± 200 × 10-6 − K−1 at Tamb = 25 °C E1 − 0,5 − LSB at Tamb = −20 to +70 °C E1 − tbf − LSB at Tamb = 25 °C Ed1 − 0,5 1 LSB at Tamb = −20 to +70 °C Ed1 − tbf − LSB Supply currents Inputs Input current (pin 3 and pin 4) Input frequency Input capacitance of digital inputs Oscillator Oscillator frequency with internal capacitor Analogue outputs (AOL; AOR) Full scale temperature coefficient Tamb = −20 to +70 °C Linearity error integral Linearity error differential November 1985 7 Philips Semiconductors Product specification Dual 16-bit DAC TDA1541 PARAMETER SYMBOL MIN. TYP. MAX. UNIT Signal -to-noise ratio + THD* S/N 90 95 − dB Settling time to ± 1 LSB tcs − 1 − µs Channel separation α 80 tbf − dB Unbalance between outputs ∆IFS − 0,1 0,2 dB Time delay between outputs td − − 1 µs VDD = +5 V RR − tbf − dB VDD1 = −5 V RR − tbf − dB VDD2 = −15 V RR − tbf − dB S/N − −100 − dB Rise time tr − − 35 ns Fall time tf − − 35 ns Bit clock cycle time tCY 160 − − ns Bit clock HIGH time tHB 48 − − ns Bit clock LOW time tLB 48 − − ns Bit clock fall time to latch rise time tFBRL 0 − − ns Bit clock rise time to latch fall time tRBFL 0 − − ns Data set-up time to bit clock tSDB 32 − − ns Data hold time to bit clock tHDB 0 − − ns Data set-up time to system clock tSDS 32 − − ns Word select hold time to system clock tHWS 0 − − ns Word select set-up time to system clock tSWS 32 − − ns Bit clock fall time to system clock rise time tFBRS 32 − − ns System clock rise time to bit clock fall time tRSFB 32 − − ns System clock fall time to bit clock rise time tFSRB 50 − − ns Bit clock rise time to system clock fall time tRBFS 0 − − ns Latch enable LOW time tLLE 20 − − ns Latch enable HIGH time tHLE 32 − − ns Power supply ripple rejection** Signal-to-noise ratio at bipolar zero Timing (see Figs 3, 4 and 5) * Signal-to-noise ratio + THD with 1 kHz full scale sinewave generated at a sampling rate of 176,4 kHz. ** Vripple = 1% of supply voltage and fripple = 100 Hz. November 1985 8 Philips Semiconductors Product specification Dual 16-bit DAC TDA1541 Fig.3 Format of input signals; time multiplexed at fSCK = fBCK (I2S format). Fig.4 Format of input signals; time multiplexed at fSCK = 2 × fBCK. November 1985 9 Philips Semiconductors Product specification Dual 16-bit DAC TDA1541 Fig.5 Format of input signals; simultaneous data. November 1985 10 Philips Semiconductors Product specification Dual 16-bit DAC TDA1541 PACKAGE OUTLINE seating plane handbook, full pagewidthdual in-line package; 28 leads (600 mil) DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 1.7 inches 0.20 0.020 0.16 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.067 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT117-1 051G05 MO-015AH November 1985 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 11 Philips Semiconductors Product specification Dual 16-bit DAC TDA1541 The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. November 1985 12