INTEGRATED CIRCUITS DATA SHEET TDA8822 Universal I2C-bus programmable RF modulator Preliminary specification File under Integrated Circuits, IC02 1997 Jan 08 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 FEATURES • 5 V power supply • Video amplifier with clamp and white clip circuits • Programmable video modulation depth • FM sound modulator (4.5, 5.5, 6.0 and 6.5 MHz) • Programmable picture-to-sound ratio GENERAL DESCRIPTION • Programmable deviation of the sound subcarrier The TDA8822 is a programmable modulator which generates an RF TV channel from a baseband video signal and a baseband audio signal in the event of negative video and FM sound standards (B/G, I, D/K, M and N standards). • Input for modulated NICAM sound subcarrier or second frequency modulated sound subcarrier • Asymmetrical or symmetrical RF output buffer • Symmetrical RF oscillator for UHF or VHF band according to the application • On-chip Phase-Locked Loop (PLL) frequency synthesizer for the RF carrier Two PLL frequency-synthesizers set the picture carrier frequency and the sound subcarrier frequency to the required frequencies. These PLL frequency-synthesizers are programmed via the I2C-bus. • On-chip PLL frequency synthesizer for the sound carrier The I2C-bus controls these features: • On-chip power supply regulator • Video modulation depth and/or hardware controlled Test • On-chip Pattern Signal Generator (TPSG) with LED driver • Sound subcarrier modulation deviation • One I2C-bus programmable output port I2C-bus • Picture-to-sound ratio. • RF output switch-off during tuning. This makes the IC suitable for multistandard applications without any adjustment into the application. APPLICATIONS Additional features are provided like an input for the NICAM or second FM carrier, a test pattern signal generator with a LED driver and a general purpose output port. • Video recorders • Cable converters • Satellite receivers • Set top boxes. ORDERING INFORMATION TYPE NUMBER PACKAGE NAME TDA8822T SO24 TDA8822M SSOP24 1997 Jan 08 DESCRIPTION VERSION plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 2 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 QUICK REFERENCE DATA VCCA = VCCD = 5 V; Tamb = 25 °C; in PAL B/G, PAL I, PAL D/K or NTSC; MD setting = 4; DEV setting = 2; PS setting = 1; video input signal = 500 mV (p-p) EBU colour bars; audio input signal = 45 mV (p-p); 1 kHz sine wave; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCCA analog supply voltage 4.5 5.0 5.5 V VCCD digital supply voltage 4.5 5.0 5.5 V ICC(tot) total supply current − 60 72 mA md modulation depth adjustment range typical value for MD setting between 0 and 7 72.5 − 90.0 % P/S picture-to-sound ratio adjustment range typical value for PS setting between 0 and 7 −18 − −11 dB VRF RF output voltage level asymmetrical on a 75 Ω load frequency between 45 and 860 MHz 77 80 83 dBµV fsc sound subcarrier frequency 4.5 − 6.5 MHz ∆fsc sound subcarrier frequency deviation range for B/G, I, D/K, SC setting = 1, 2 or 3; 20 typical value for DEV setting between 0 and 7 − 45 kHz for M, N, SC setting = 0; typical value 10 for DEV setting between 0 and 7 − 22.5 kHz 1997 Jan 08 3 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 BLOCK DIAGRAM handbook, full pagewidth VIDEO AGND 24 23 VCCA 1 VOLTAGE REGULATOR CLAMP RFA RFB 19 18 OUTPUT BUFFER TPSG SWITCH VIDEO AMP. CLIP TPSG ON/OFF MD setting NICAM 21 NICAM AMP. ADDER MIXER 20 RFGND SND-IF AMP. AUDIO 22 AUDIO AMP. VCO DEV setting PREEMPH 3 test ACP 2 AUDIO CHARGE PUMP PS setting TDA8822 sound oscillator ON/OFF RF oscillator ON/OFF test PROG. DIVIDER AUDIO PHASE DETECTOR 14 BITS PROG. DIVIDER frequency setting frequency setting 4 5 RF OSCILLATOR 6 7 PRESCALER DIVIDE-BY-8 8 10 SCL SDA P0 TPSG I2C-bus control 14 fdiv(audio) 15 I2C-BUS 16 17 RECEIVER AND LOGIC test fdiv(video) VIDEO PHASE DETECTOR in-lock flag test VIDEO CHARGE PUMP RFOSCB OGND RFOSCC RFOSCD VCP test LOOP AMP. 9 VVT fref(video) fref(audio) REFERENCE DIVIDER 11 13 VCCD DGND CRYSTAL OSCILLATOR 12 MGE674 Fig.1 Block diagram. 1997 Jan 08 RFOSCA 4 XTAL Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 PINNING SYMBOL PIN DESCRIPTION VCCA 1 analog power supply ACP 2 audio charge pump output PREEMPH 3 audio pre-emphasis network RFOSCA 4 RF oscillator A (collector) output RFOSCB 5 RF oscillator B (base) input OGND 6 RF oscillator ground RFOSCC 7 RF oscillator C (base) input handbook, halfpage VCCA 1 24 VIDEO ACP 2 23 AGND PREEMPH 3 22 AUDIO RFOSCA 4 21 NICAM RFOSCB 5 20 RFGND OGND 6 RFOSCD 8 RF oscillator D (collector) output VVT 9 video tuning voltage output VCP 10 video charge pump output VCCD 11 digital power supply XTAL 12 crystal oscillator input DGND 13 digital ground RFOSCC 7 18 RFB SCL 14 serial clock (I2C-bus) input RFOSCD 8 17 TPSG SDA 15 serial data (I2C-bus) input/output VVT 9 16 P0 P0 16 general purpose output TPSG 17 test pattern signal generator input/output pin RFB 18 RF output B RFA 19 RF output A RFGND 20 ground for the RF outputs NICAM 21 NICAM input AUDIO 22 audio input AGND 23 analog ground VIDEO 24 video input 1997 Jan 08 19 RFA TDA8822 VCP 10 15 SDA VCCD 11 14 SCL XTAL 12 13 DGND MGE673 Fig.2 Pin configuration. 5 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 FUNCTIONAL DESCRIPTION The TPSG is activated in two ways: The TDA8822 is a programmable RF modulator which can be divided into the following parts: – Forcing the pin TPSG to DGND in the application (see Fig.8) • Video part – Setting the TPSG bit to 1 via the I2C-bus, then the TPSG pin acts as an output port, sinking current to allow the indication of the use of the TPSG in the application e.g. with an LED (see Fig.9). • Audio part • RF part. Video part Table 1 The video part provides the following: • The video part includes a clamping circuit which sets the internal reference voltage to the bottom of the synchronizing pulse. The modulation depth is adjusted using 3 bits of the I2C-bus programming, called MD2, MD1 and MD0. These 3 bits make 8 different values for the modulation depth possible (see Table 1). Modulation depth setting (typical values) BIT MD SETTING MD2 MD1 MD0 MODULATION DEPTH (%) 0 0 0 0 72.5 1 0 0 1 75.0 2 0 1 0 77.5 3 0 1 1 80.0 4 1 0 0 82.5 5 1 0 1 85.0 6 1 1 0 87.5 7 1 1 1 90.0 • After the modulation depth is set, the signal is fed through a clip control circuit that clips the video signal to avoid that the modulation depth becomes higher than 100%. • The video part also contains a TPSG. This TPSG generates a pattern that helps to tune the TV set to the programmed channel of the modulator. The pattern consists of a sync pulse and two vertical white bars on the screen (see Fig.3) MGE675 handbook, full pagewidth 0 5 10 15 20 25 30 35 40 45 Fig.3 Test pattern signal. 1997 Jan 08 6 50 55 60 65 t (µs) Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 • fref(audio) and fdiv(audio) can be monitored on the general purpose output port during a special test mode. Audio part The audio part provides the following: • The frequency deviation of the sound subcarrier is set using 3 bits DEV2, DEV1 and DEV0 of the I2C-bus programming (see Table 3), when a signal of 1 kHz with a level of 50 mV (p-p) is applied on the audio input pin. • The sound subcarrier is created in an integrated VCO. The signal at the output of this VCO is fed to a stage that adjusts the picture-to-sound ratio and to the audio programmable divider. • The difference between the picture carrier level and the sound subcarrier level is adjusted using 3 bits PS2, PS1 and PS0 (see Table 4). • The frequency of the sound subcarrier is set by programming the bits SC1 and SC0 of the I2C-bus (see Table 2). These two bits set the dividing ratio of the audio programmable divider to get the divided frequency fdiv(audio). • The NICAM amplifier has a constant gain, and is designed for adding a second sound subcarrier in the TV channel. This subcarrier can be either a second FM carrier for dual-sound/stereo system used in PAL B/G or a modulated NICAM carrier. The level between the picture carrier and the NICAM carrier (P/N) will depend on the input level on the NICAM input. • The audio phase detector compares the phase/frequency of the divided audio frequency fdiv(audio) and the reference frequency for the audio, fref(audio) and drives the Charge Pump (CP) that charges or discharges the audio loop filter connected between pins ACP and AGND to get the VCO oscillating to the programmed frequency. Table 2 Sound subcarrier frequency setting BIT SC1 SC0 SOUND SUBCARRIER FREQUENCY (MHz) 0 0 0 4.5 M, N 1 0 1 5.5 B, G 2 1 0 6.0 I 3 1 1 6.5 D, K SC SETTING Table 3 STANDARD Sound subcarrier frequency deviation setting (typical values) BIT DEVIATION (kHz) DEV2 DEV1 DEV0 DEVIATION (%) 0 0 0 0 40.0 20.0 10.0 1 0 0 1 45.0 22.5 11.3 2 0 1 0 50.5 25.3 12.6 3 0 1 1 56.5 28.3 14.1 4 1 0 0 63.5 31.8 15.9 5 1 0 1 71.5 35.8 17.9 6 1 1 0 80.0 40.0 20.0 7 1 1 1 90.0 45.0 22.5 DEV SETTING 1997 Jan 08 7 B, G, I, D, K M, N Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator Table 4 TDA8822 Picture-to-sound ratio setting (typical values) BIT PS2 PS1 PS0 P/S RATIO (dB) 0 0 0 −11 PS SETTING 0 1 0 0 1 −12 2 0 1 0 −13 3 0 1 1 −14 4 1 0 0 −15 5 1 0 1 −16 6 1 1 0 −17 7 1 1 1 −18 • fref(video) and fdiv(video) can also be monitored on the output port during a special test mode. RF part The RF part provides the following: • The I2C-bus receiver and control logic includes the control of: • The RF oscillator can produce any frequency used for TV transmission, from 35 to 890 MHz. The frequency range depends on the components used in the application (see Table 11). – Picture carrier frequency – Sound subcarrier frequency • The RF mixer combines the video signal, the sound subcarrier and the carrier from the NICAM input to build a baseband TV channel. This baseband signal is then mixed with the RF oscillator signal to get the RF TV channel. – Sound subcarrier frequency deviation • The two signals from the RF mixer are sent to the output buffer. This output buffer can be used either as two asymmetrical outputs or as one symmetrical output. – RF oscillator on/off – Video modulation depth – Picture-to-sound ratio – TPSG on/off and LED drive control – Sound oscillator on/off – General purpose output port on/off • The output buffer is switched-off while the PLL is not in-lock, to avoid parasitic output signal during the tuning of the RF oscillator. The in-lock information is given by the phase detector of the loop. – Test modes setting. Software information The transmission is made using 4 words in I2C-bus format. First the address CA has to be sent, then at least two consecutive words have to be sent, either the two words F1 and F0, or the two words C1 and C0. • The signal from the RF oscillator is fed to the PLL which controls the picture carrier frequency. The RF signal is first divided by 8 in the prescaler, and then divided in the programmable 14-bits divider. The dividing ratio of this divider is programmed via the I2C-bus. The minimum frequency that can be synthesized is 16 MHz, and the maximum frequency is 1023.9375 MHz. The two words C1 and F1 are differentiated inside the IC by the first bit being logic 1 or logic 0 respectively. The contents of the 4 bytes is shown in Table 5. • The divided frequency called fdiv(video) is compared to the reference frequency called fref(video) coming from the crystal oscillator and divided in the reference divider. The crystal oscillator is intended to be used with a crystal of 4 MHz. At the power-up of the TDA8822, the I2C-bus state is the following: • N13 to N0 are not fixed • SC setting = 1: the sound carrier is fixed to 5.5 MHz • The comparison between fref(video) and fdiv(video) is done in the video phase detector. The resulting signal is fed via the video charge pump to the loop amplifier, including the tuning voltage drive (33 V) inside the IC. 1997 Jan 08 • MD is set to 4 (82.5%), PS is set to 1 (−12 dB) and DEV is set to 2 (50.5%) 8 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 • T0 is set to logic 1, RF0 is set to logic 1, TPSG is set to logic 1 and P0 is set to logic 0 to select the video high impedance test mode because it is in this mode that the RF oscillator starts in the best conditions. • N is the programmable divider ratio: N = N13 × 213 + N12 × 212 + ... + N1 × 2 + N0 • fosc is the RF oscillator frequency. DEV2, DEV1 and DEV0 are the bits to set the sound subcarrier frequency deviation (see Table 3). The TPSG bit is used to switch on or off the TPSG using the I2C-bus. It is also possible to switch the TPSG on in the application, connecting the pin TPSG to DGND. This pin TPSG has a double function and acts as an input or as an output. PS2, PS1 and PS0 are the bits to set the picture-to-sound ratio (see Table 4). MD2, MD1 and MD0 are the bits to set the modulation depth (see Table 1). These are the two functions: • Output: if the TPSG is set using the I2C-bus, the pin TPSG is used as an output open collector NPN port. This port can be used to indicate with an LED that the TPSG is on. This is especially useful in systems using an on-screen display. If the TV set is not tuned to the right channel there is an alternate indication that the TPSG is on (see Fig.9). SC1 and SC0 are the bits to set the sound subcarrier frequency according to Table 2. RF0 is a bit that controls the RF oscillator on/off. In normal mode, it should be set to logic 1. If the modulator is not used and may create some interferences with other signals in the application, it should be set to logic 0 (see Table 6). • Input: if the TPSG is set with an hardware switch in the application, the TPSG pin is used as one of the inputs to select the TPSG mode (see Fig.8). Notice that if the bit RF0 is logic 0 while the bit TPSG is logic 1, then the RF oscillator is still running, but the sound oscillator is off, and the TPSG is also off (see Table 8). Notice that if the TPSG bit is set to logic 1 while the RF0 bit is set to logic 0, the TPSG is turned off, and the sound oscillator is off (see Table 8). The bit P0 controls the output port P0, which is an open collector NPN port, able to drive up to 10 mA (see Table 7). N13 to N0 are the 14 bits to set the video programmable divider ratio and then to set the picture carrier frequency following the formula: fosc = fref(video) × 8 × N, T0 is a bit used for test purposes. If this bit is set to logic 0, the IC operates in normal configuration. If it is set to logic 1, then the use of bits TPSG, RF0 and P0 is changed to select 1 of the 8 test modes as explained in Table 9. where: • fref(video) is the frequency on pin XTAL divided by the reference divider ratio. For example, with a 4 MHz crystal connected to 4 000 000 pin XTAL, f ref ( video ) = ------------------------ = 7812.5 Hz 512 Table 5 Contents of programming words MSB LSB BYTE ACKNOWLEDGE BIT BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Address byte CA 1 1 0 0 1 0 1 0 ACK F1: frequency byte 1 0 TPSG N13 N12 N11 N10 N9 N8 ACK F0: frequency byte 0 N7 N6 N5 N4 N3 N2 N1 N0 ACK C1: control byte 1 1 DEV2 DEV1 DEV0 PS2 PS1 PS0 0 ACK C0: control byte 0 MD2 MD1 MD0 SC1 SC0 RF0 P0 T0 ACK 1997 Jan 08 9 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator Table 6 TDA8822 RF oscillator on/off setting (see note 1) STATE OF RF0 ACTION ON RF OSCILLATOR 0 stopped; no RF carrier 1 operating; normal use Note 1. This table is valid only if bit TPSG is set to logic 0. Table 7 Output port programming STATE OF P0 Table 8 VOLTAGE ON PORT (with a pull-up resistor to VCCD) PORT STATE 0 high impedance close to VCCD 1 sinking current close to 0 V Overview of the normal modes T0 RF0 TPSG P0 0 1 0 X(1) input: open RF on; TPSG off 0 1 0 X(1) input: to DGND RF on; TPSG on 1 X(1) output: sinking current RF on; TPSG on 0 1 PIN TPSG MODE 0 0 0 X(1) input: open or to DGND RF off 0 0 1 X(1) input: open RF on; TPSG off; sound oscillator off 0 0 1 X(1) input: to DGND RF on; TPSG on; sound oscillator off 0 X(1) X(1) 0 X(1) Port P0 off (high impedance) 0 X(1) X(1) 1 X(1) Port P0 on (sinking current) Note 1. X means logic 0 or logic 1, don’t care. 1997 Jan 08 10 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator Table 9 TDA8822 Overview of the test modes T0 RF0 TPSG P0 PIN(1) TPSG 1 0 0 0 X fref(audio) on P0; both CP sinking current; notes 2 and 6 1 0 0 1 X fdiv(audio) on P0; note 3 1 0 1 0 X fref(video) on P0; both CP sourcing current; notes 4 and 6 1 0 1 1 X fdiv(video) on P0; note 5 1 1 0 0 X video charge pump off; note 7 1 1 0 1 X audio charge pump off and balance test; notes 8 and 11 1 1 1 0 X video high impedance test; note 9 1 1 1 1 X baseband signal on RF outputs; note 10 TEST MODES Notes 1. During the test mode (bit T0 set to logic 1), the pin TPSG is unused, meaning that the input information does not have any effect, and that the output port does not sink any current. 2. In ‘fref(audio) on P0’ mode, the reference frequency of the audio PLL is available on the port P0. f div ( audio ) 3. In ‘fdiv(audio) on P0’ mode, -------------------------- is available on the port P0 (fdiv(audio) is the frequency from the sound oscillator 2 divided by the dividing ratio of the audio programmable divider). 4. In ‘fref(video) on P0’ mode, the reference frequency of the video PLL is available on the port P0. f div ( video ) 5. In ‘fdiv(video) on P0’ mode, ------------------------- is available on the port P0 (fdiv(video) is the frequency of the RF oscillator divided 2 by the dividing ratio of the video programmable divider). 6. In ‘both CP sinking or sourcing current’ modes, the charge pump of the audio PLL and the one of the video PLL are sinking or sourcing their nominal current. 7. The ‘video charge pump off’ mode allows to measure the leakage current on the video PLL charge pump. 8. The ‘audio charge pump off’ mode allows to measure the leakage current on the audio PLL charge pump. 9. In the ‘video high-impedance’ mode, it is possible to inject an external tuning voltage for the RF carrier setting. In this mode, the video PLL is off. 10. In the ‘baseband signal on RF outputs’ mode, the RF oscillator is off, and it is possible to measure the baseband video and audio subcarrier signals on the RF output pins. 11. During the ‘balance test’ mode the picture carrier is over-modulated allowing the measurement of the residual carrier. 1997 Jan 08 11 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 Example of programming We want to program the TDA8822 in a UHF application, on channel 21 (picture carrier at 471.25 MHz) in a B/G standard (sound carrier at 5.5 MHz from the picture carrier) with a Picture-to-Sound ratio of −12 dB, a modulation depth of 82.5% and a deviation set to 50.5% in normal mode, without TPSG, output port on. These are the values of the bits that must be programmed: f osc 471 250 000 • The video dividing ratio will be N = ---------------- = ------------------------------ = 7540 = 01110101110100 f ref × 8 7 812.5 × 8 • TPSG bit will be set to logic 0 • DEV2 will be set to logic 0, DEV1 to logic 1 and DEV0 to logic 0 • PS2 will be set to logic 0, PS1 to logic 0 and PS0 to logic 1 • MD2 will be set to logic 1, MD1 to logic 0 and MD0 to logic 0 • SC1 will be set to logic 0 and SC0 to logic 1 • P0 will be set to logic 1 • RF0 will be set to logic 1 • T0 will be set to logic 0. The protocol to the TDA8822 is illustrated in Table 10. Table 10 Example of programming for the TDA8822. MSB LSB BYTE ACKNOWLEDGE BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Address byte CA 1 1 0 0 1 0 1 0 ACK F1: frequency byte 1 0 0 0 1 1 1 0 1 ACK F0: frequency byte 0 0 1 1 1 0 1 0 0 ACK C1: control byte 1 1 0 1 0 0 0 1 0 ACK C0: Control byte 0 1 0 0 0 1 1 1 0 ACK 1997 Jan 08 12 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VCCA analog supply voltage −0.3 +7.0 V VCCD digital supply voltage −0.3 +7.0 V VCC operating supply voltage 4.5 5.5 V Vmax maximum voltage on all pins except SCL, SDA and VVT −0.3 VCC V VBUS(max) maximum voltage on SCL and SDA pins −0.3 +7.0 V VVVT(max) maximum voltage on VVT pin −0.3 +35.0 V Tstg storage temperature −40 +125 °C Tamb operating ambient temperature −20 +85 °C HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it is desirable to take normal precautions appropriate to handling integrated circuits. The IC withstands the ESD test in accordance with the “UZW-B0/FQ-A302” specification equivalent to the “MIL-STD-883C category B” (2000 V). The IC withstands the ESD test in accordance with Philips Semiconductors Machine Model (MM), specification “UZW-B0/FQ-B302”, issue date November 6th, 1990,(0 Ω, 200 pF, 200 V). THERMAL CHARACTERISTICS SYMBOL Rth j-a 1997 Jan 08 PARAMETER VALUE UNIT SO24; SOT137-1 74 K/W SSOP24; SOT340-1 120 K/W thermal resistance from junction to ambient in free air 13 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 CHARACTERISTICS VCCA = VCCD = 5 V; Tamb = 25 °C; in PAL B/G, PAL I, PAL D/K, or NTSC; MD setting = 4; DEV setting = 2; PS setting = 1; video input signal = 500 mV (p-p) EBU colour bars; audio input signal = 45 mV (p-p) 1 kHz sine wave; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply IP power supply current analog and digital parts − 60 72 mA Video characteristics IVIDEO video input current − 0.5 2.0 µA zVIDEO video input impedance 30 − − kΩ md modulation depth part-to-part variation; MD setting = 4 77.5 82.5 87.5 % md(clip) modulation depth during clipping condition video input level lower than 1 V (p-p) − − 99 % md(TPSG) modulation depth when TPSG mode on part to part variation, MD setting = 4 72.5 82.5 92.5 % md(APL) variation of the modulation depth with change of APL between 10 and 90% reference for APL = 50% −2 0 +2 % S/N video signal-to-noise ratio note 1 48 52 − dB Gdiff differential gain note 2 − 3 6 % ϕdiff differential phase note 2 − 3 6 deg V/S video-to-sync ratio input signal: V/S = 7 : 3 6.9 : 3.1 7 : 3 7.1 : 2.9 fvideo frequency response for the video signal note 3 −1 − +1 dB Audio characteristics ZAUDIO audio input impedance without any resistor between AUDIO and AGND 30 − − kΩ ∆fm modulation deviation SC setting = 1, 2 or 3; DEV setting = 2 20 25 30 kHz SC setting = 0; DEV setting = 2 10 12.5 15 kHz ∆fm(max) maximum modulation deviation VAUDIO = 500 mV (p-p); note 4 180 250 − kHz THD total harmonic distortion 50 mV (p-p) sine wave at 1 kHz on AUDIO pin − 0.4 1.0 % S/N audio signal-to-noise ratio note 5 44 47 − dB fAUDIO frequency response of the audio signal note 6 −1 − +1 dB ∆fsc(acc) sound subcarrier accuracy note 7 −1 0 +1 kHz P/S picture-to-sound ratio no audio signal; no video signal; PS setting = 1 −15 −12 −9 dB 1997 Jan 08 14 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator SYMBOL PARAMETER TDA8822 CONDITIONS MIN. TYP. MAX. UNIT NICAM characteristics 10 − − kΩ −23 −20 −17 dB − +1 dB ZNICAM NICAM input impedance P/N level between picture carrier and NICAM carrier NICAM input level = 150 mV (p-p); no video signal fNICAM frequency response of the NICAM input for frequencies between 5 −1 and 8 MHz; reference for 6.5 MHz BER bit error rate note 11 − 10−6 − EHD eye-height degradation note 11 − 4 − % with application VHF 1 47 − 88 MHz with application VHF 3 174 − 230 MHz with application UHF 470 − 860 MHz note 7 −75 − +75 kHz 80 83 dBµV 0 2 dB Channel characteristics fRF RF frequency range fRF(acc) picture carrier accuracy VRF output level on RF outputs during sync. between 45 and 860 MHz 77 pulse, loaded with 75 Ω VRF(flat) flatness of the RF output level across each band reference is centre of each band −2 Zo(RF) RF output impedance single ended − 75 − Ω SPUo spurious outside channel note 8 − − −40 dBc SPU2PC RF second harmonic level on asymmetrical output at − low end of UHF band − −10 dBc SPU2SC sound carrier second harmonic level − −65 −60 dBc SPU3SC sound carrier third harmonic level − −65 −60 dBc SPUfref reference frequency spurious measured with Philips application board − − −40 dBc CHRBEAT chroma beat note 9 − − −63 dBc NICBEAT NICAM beat note 10 − − −63 dBc Video charge pump output and video tuning amplifier: VCP and VVT IVCP output current − 50 − µA IVCP(lk) off-state leakage current −10 − 10 nA VVVT(min) minimum tuning voltage on pin VVT 27 kΩ resistor between pin VVT and +33 V − − 0.2 V IVVT(lk) leakage current on pin VVT 27 kΩ resistor between pin VVT and +33 V; high impedance test mode − − 10 µA Audio charge pump output: ACP IACP output current − 3 − µA IACP(lk) off-state leakage current −10 − 10 nA VACP tuning voltage range for the audio PLL, on pin ACP 1.5 − 4.5 V 1997 Jan 08 15 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator SYMBOL PARAMETER TDA8822 CONDITIONS MIN. TYP. MAX. UNIT XTAL characteristics |ZXTAL| XTAL input impedance absolute value; with a 4 MHz crystal 600 1200 − Ω 150 400 mV Output Port characteristics VPORT low voltage port on; IPORT = 10 mA − IPORT(lk) off-state leakage current port off; VCCD = 5.5 V − − 10 µA IPORT(sink) sinking current in the port port on 10 − − mA TPSG pin characteristics VTPSG(on) voltage on pin TPSG to switch the TPSG on 0 − 1.5 V VTPSG(off) voltage on pin TPSG to switch the TPSG off 3.0 − VCCD V ITPSGL LOW input current in pin TPSG TPSG to DGND −100 − − µA ITPSGH HIGH input current in pin TPSG TPSG to VCCD − − 100 µA ITPSG(sink) output sinking current in pin TPSG TPSG set on using I2C-bus 10 − − mA VTPSG(sink) voltage on pin TPSG used as output TPSG set on using I2C-bus − 150 400 mV I2C-bus receiver characteristics, pins SCL and SDA fSCL frequency on SCL line − − 100 kHz VIH HIGH level input voltage 3 − 5.5 V VIL LOW level input voltage 0 − 1.5 V IIH HIGH level input current VIH = 5 V; VCCD = 0 or 5 V − − 10 µA IIL LOW level input current VIL = 0 V; VCCD = 0 or 5 V −10 − − µA VSDA(ack) acknowledge output voltage on SDA during acknowledge pulse; IIL = 3 mA − 0.4 V − Notes 1. Ratio between the CCIR 17-line bar amplitude (corresponding to the level difference between black and white; see Fig.4) and the RMS value of the noise on a black line (line 22 or 335) measured on the video signal after demodulation. Measurement is done for frequencies between 200 kHz and 5 MHz. Measurement is unweighted. 2. Measured on CCIR 330 line, corresponding to a 5-step staircase with a chroma carrier of amplitude equal to 0.3 times the voltage between sync pulse and white (see Fig.5). The video signal is 500 mV (p-p). The modulation depth is adjusted using the I2C-bus to MD setting = 4 (82.5% typical modulation depth). 3. Measured with a spectrum analyser with ‘peak hold’ function, applying a 500 mV (p-p) sine wave at the video input of the IC, with a sweeping frequency between 0.5 and 6.0 MHz. The reference is the value measured at 1.0 MHz. 4. To have a deviation between 50 and 250 kHz, the audio frequency must be higher than 100 Hz. 5. Measured with an audio frequency of 1 kHz with a level adjusted to get a deviation of 50 kHz with DEV setting = 2, using CCIR 468-3 weighting filter, with a quasi-peak detection. The input signal has pre-emphasis and the receiver has de-emphasis. Video signal is 500 mV (p-p) EBU colour bars on pin VIDEO. 1997 Jan 08 16 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 6. Measured with no pre-emphasis on the audio input and no de-emphasis in the receiver. Measurement is done for frequencies between 50 Hz and 15 kHz, reference is the level measured at 1 kHz. 7. The accuracy only depends on the accuracy of the reference frequency (accuracy of the crystal). Notice that the value of the capacitor in series with the crystal must be chosen to be as close as possible to the load capacitance of the crystal. 8. Except for the harmonics of the RF oscillator frequency and for the combinations between the RF oscillator frequency and the sound oscillator frequency (fRF + 2fs, 2fRF + fs, etc.). This measurement includes the spurious at the 1⁄4fRF, 1⁄2fRF and 3⁄4fRF. 9. Chroma beat a) For PAL: measured applying a 4.43 MHz sine wave of 200 mV (p-p) at the video input. Measurement is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency of the picture carrier plus 1.07 MHz for PAL B/G, 1.57 MHz for PAL I and 2.07 MHz for PAL D/K. b) For NTSC: measured applying a 3.58 MHz sine wave of 200 mV (p-p) at the video input. Measurement is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency of the picture carrier plus 920 kHz. 10. NICAM beat a) For PAL B/G: measured applying a sine wave of 150 mV (p-p) at 5.85 MHz on the NICAM input. Measurement is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency of the picture carrier plus 350 kHz or 5.15 MHz. b) For PAL I: measured applying a sine wave of 150 mV (p-p) at 6.552 MHz on the NICAM input. Measurement is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency of the picture carrier plus 552 kHz or 5.448 MHz. 11. NICAM eye height and Bit Error Rate measurement conditions: a) A NICAM frame is applied from a Textronix 728E in B/G mode on the NICAM input of the TDA8822 through an attenuator to get 150 mV (p-p). The sound subcarrier is set to 5.5 MHz (SC = 1) and the picture to sound ratio is set to -12 dB (PS = 1). There is no video signal applied to the video input and no audio signal on the audio input. b) The RF carrier is demodulated with a Rohde & Schwartz EMFP demodulator for PAL B/G, the sound trap filter is set off, and the video signal is fed to a Textronix 728D NICAM demodulator for B/G. Measurements of the eye height and bit error rate are done on the 728D. 1997 Jan 08 17 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 MBE396 handbook, full pagewidth 1V 0.3 V 0V 0 10 20 30 40 50 60 70 64 t (µs) Fig.4 CCIR insertion line 17. MBE397 handbook, full pagewidth 1V 0.3 V 0V 0 10 20 30 40 50 60 t (µs) Fig.5 CCIR insertion line 330. 1997 Jan 08 18 70 64 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 INTERNAL PIN CONFIGURATION handbook, full pagewidth VCCA 1 VOLTAGE REGULATOR VCCA VCCA ACP 24 regulated voltage 2 VIDEO AGND 23 AGND regulator voltage AGND 22 VCCD AUDIO AGND VCCA 21 NICAM DGND VCCA regulated voltage AGND 20 PREEMPH 19 18 AGND regulated voltage RFOSCA RFOSCB RFGND VCCA 3 RFA RFB 4 5 VCCD OGND RFOSCC RFOSCD VVT 17 6 7 8 TPSG 9 DGND VCCD DGND 16 VCCD P0 DGND VCP 10 VCCD 15 VCCD SDA DGND 11 DGND VCCD VCCD 14 XTAL SCL 12 DGND 13 DGND MGE681 Fig.6 Pin equivalent circuit for each pin. 1997 Jan 08 19 DGND Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 APPLICATION INFORMATION handbook, full pagewidth R14 SCL 270 Ω R15 SDA 270 Ω C21 RFB NICAM R21 51 Ω 1 nF C22 RFA 220 pF R27 AUDIO 220 kΩ VIDEO R24 C24 470 Ω 100 nF R26 82 Ω R22 12 kΩ C18 100 pF C19 100 pF R18 1 kΩ P0 R25 470 Ω VIDEO 24 AGND AUDIO 22 23 NICAM RFGND 20 21 RFA 19 RFB 18 TPSG P0 SCL DGND 17 16 SDA 15 14 13 8 9 10 11 12 TDA8822 1 2 VCCA 3 ACP 4 PRE EMPH C4 C2 2.2 µF C1 100 nF 5 6 RFOSCA RFOSCB OGND (1) RFOSCC RFOSCD VVT C7 C5 (1) (1) VCP VCCD XTAL C8 C10 4.7 nF (1) L1 (1) R10 33 kΩ XTAL1 4 MHz C6 (1) R2 4.7 kΩ C25 10 nF 7 C26 68 nF D1 R5 22 kΩ (1) R7 R8 22 kΩ 15 kΩ C9 10 nF C27 100 nF R9 27 kΩ C12 18 pF C11 10 nF VCC = 5 V MGE678 VVT = 33 V (1) The components marked: C4, C5, C6, C7, C8, L1 and D1 must be chosen from Table 11 to get the desired frequency range. Fig.7 Reference application. 1997 Jan 08 20 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 Application design In the design of the application, it is highly recommended to separate the part of the RF oscillator as much as possible from the part of the RF outputs in order to avoid parasitic coupling between these two parts. A good solution is shielding the RF oscillator part to avoid radiation from and to this part. The pin OGND must be connected to the shielding box and to ground. The frequency range the IC covers is fixed by the choice of the components marked with a note (1) in Fig.7. For these components, it is recommended to use the values indicated in Table 11. Table 11 Components to be used for the RF oscillator FREQUENCY RANGE BAND VALUE FOR C4, C5, C7, C8 VALUE FOR C6 D1 L1: NUMBER OF TURNS L1:COIL DIAMETER L1: WIRE DIAMETER VHF1 47 to 130 MHz 5.6 pF 100 pF BB132 14.5 3.0 mm 0.3 mm VHF3 130 to 350 MHz 4.7 pF 150 pF BB133 4.5 3.0 mm 0.4 mm UHF 470 to 860 MHz 1.8 pF 22 pF BB134 1.5 2.5 mm 0.5 mm Video input (pin 24) Audio input (pin 22) The video input level on the IC is of 500 mV (p-p). In most of the cases, the available video signals are of 1 V (p-p) with a source impedance of 75 Ω. The IC is sensitive to 45 mV (p-p) on pin AUDIO and the DC voltage on this pin is close to 0 V. This pin needs to be grounded through a 12 kΩ resistor (R22 in Fig.7). Care must then be taken if a coupling capacitor needs to be implemented on the audio path to connect it between the signal source and the input, with the resistor of 12 kΩ still connected to the AUDIO pin. To handle this kind of signal, we use a resistive divider with two 470 Ω resistors (R24 and R25 in Fig.7) to divide the 1 V (p-p) signal down to 500 mV (p-p). In order to get an input impedance of 75 Ω, a resistor of 82 Ω is implemented in parallel to the divider (R26 in Fig.7). NICAM input (pin 21) Audio pre-emphasis The NICAM pin is sensitive to 150 mV (p-p) to reach a level between picture carrier and NICAM carrier of typical −20 dBc. The capacitor C22 connected in parallel with R27 is defining the time constant for the pre-emphasis following Table 12. It is possible to put on this pin either a NICAM modulated carrier for a NICAM application or a frequency modulated carrier for the stereo system with a second FM carrier used e.g. in Germany. Table 12 Choice of the pre-emphasis constant STANDARD CAPACITOR C22 TIME CONSTANT NTSC 330 pF 75 µs PAL 220 pF 50 µs special; note 1 no capacitor − In a specific application where the main sound subcarrier would be generated outside the IC, it is also possible to inject the main sound carrier to this pin, with a level depending on the wanted P/S. In this event, it is necessary to stop the internal sound oscillator by setting RF0 to logic 0 and TPSG to logic 1 (see Table 8). Note 1. This mode has to be considered if the pre-emphasis is applied else-where on the path of the audio signal, or if there is no need for pre-emphasis in specific applications. Note also that the pre-emphasis can be done by connecting a capacitor between pin PREEMPH (pin 3) and ground. The value for this capacitor is 10 nF for PAL and 15 nF for NTSC. 1997 Jan 08 21 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 If a cutoff frequency slightly higher than 20 Hz can be accepted, it is possible to reduce the value of the 2.2 µF capacitor (C2) to 220 nF. In this case C26 needs to be changed from 68 nf to 22 nF and R3 needs to be changed from 4.7 kΩ to 33 kΩ. TPSG input/output (pin 17) As already mentioned, this pin can be used either as an input or as an output. • As an input, it allows to turn on the TPSG, without changing anything to the word the TDA8822 is programmed through the I2C-bus. RF outputs (pins 18 and 19) In this mode, it is simply necessary to connect a switch between the pin TPSG and DGND (see Fig.8). If the switch is open, then the TPSG is selected corresponding to the I2C-bus programming; if the switch is closed, then the TPSG is on. For inexpensive applications, it is possible to use the IC with an asymmetrical output. In an asymmetrical application, the unused output pin must be loaded with a load as close as possible to the load connected to the used pin. • As an output, it allows to indicate e.g. with an LED that the TPSG has been programmed on using the I2C-bus. A good improvement in performance is obtained using a symmetrical to asymmetrical transformer (balun; balance-to-unbalance) connected between the two outputs. In this event both outputs have their loads matched. The level of the RF second harmonic, and the spurious outside channel is decreasing. The parasitic coupling between RF outputs and RF oscillator is also reduced. In this mode, the pin acts as an open-collector output port, it is possible to connect a LED to the 5 V power supply with a series resistor to limit the current to about 10 mA (see Fig.9). XTAL pin (pin 12) This pin is connected to a 4 MHz crystal in series with a capacitor. The value of this capacitor has to be as close as possible to the load capacitance of the crystal. RF harmonics This IC has been designed to have the lowest level of unwanted RF harmonics at the frequencies where these are the hardest to be filtered out, especially for the second harmonic of the RF carrier at the lowest frequencies of the UHF band. It is also possible to drive the IC with an external 4 MHz signal from a voltage source. A level of 50 mV(RMS) insures stable operation. A capacitor of about 18 pF and a resistor of 680 Ω needs to be placed in series with the voltage source. It is possible to reduce the level of the second harmonic by using a wide-band transformer at the output of the IC and create a symmetrical application. ACP pin (pin 2) This pin is the charge pump output for the sound subcarrier PLL as well as the input of the sound subcarrier VCO. To reduce the out-of-band harmonics and especially the third one, it is necessary to use a low-pass filter at the output of the IC. It is necessary to connect the loop filter between this pin and ground. The loop filter indicated in Fig.7 gives a cut-off frequency lower than 20 Hz. 1997 Jan 08 22 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator handbook, halfpage 20 19 handbook, halfpage RFGND 20 C19 RFA RFA VCC = 5 V 100 pF 18 TDA8822 C18 RFB 19 RFGND 16 15 R15 1 kΩ RFB 18 14 13 17 P0 P0 SCL 16 R15 270 Ω SDA 15 SCL 14 DGND 13 MGE679 R15 1 kΩ R17 330 Ω TPSG P0 SDA P0 R15 270 Ω SCL SDA R14 270 Ω SCL DGND MGE680 Fig.8 Use of the pin TPSG as an input. 1997 Jan 08 VCC = 5 V RFB S1 R14 270 Ω C18 RFB 100 pF TPSG SDA RFA 100 pF 100 pF 17 C19 RFA Fig.9 Use of the pin TPSG as an output. 23 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 PACKAGE OUTLINES SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 13 24 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013AD 1997 Jan 08 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 24 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm D SOT340-1 E A X c HE y v M A Z 24 13 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.8 0.4 8 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT340-1 1997 Jan 08 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-09-08 95-02-04 MO-150AG 25 o Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 SOLDERING SSOP Introduction Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. If wave soldering cannot be avoided, the following conditions must be observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). • The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Reflow soldering Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). Reflow soldering techniques are suitable for all SO and SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. METHOD (SO AND SSOP) During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering SO Repairing soldered joints Wave soldering techniques can be used for all SO packages if the following conditions are observed: Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. 1997 Jan 08 26 Philips Semiconductors Preliminary specification Universal I2C-bus programmable RF modulator TDA8822 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1997 Jan 08 27 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 537021/50/01/pp28 Date of release: 1997 Jan 08 Document order number: 9397 750 01601