PHILIPS TDA8822M

INTEGRATED CIRCUITS
DATA SHEET
TDA8822
Universal I2C-bus programmable
RF modulator
Preliminary specification
File under Integrated Circuits, IC02
1997 Jan 08
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
FEATURES
• 5 V power supply
• Video amplifier with clamp and white clip circuits
• Programmable video modulation depth
• FM sound modulator (4.5, 5.5, 6.0 and 6.5 MHz)
• Programmable picture-to-sound ratio
GENERAL DESCRIPTION
• Programmable deviation of the sound subcarrier
The TDA8822 is a programmable modulator which
generates an RF TV channel from a baseband video
signal and a baseband audio signal in the event of
negative video and FM sound standards (B/G, I, D/K, M
and N standards).
• Input for modulated NICAM sound subcarrier or second
frequency modulated sound subcarrier
• Asymmetrical or symmetrical RF output buffer
• Symmetrical RF oscillator for UHF or VHF band
according to the application
• On-chip Phase-Locked Loop (PLL) frequency
synthesizer for the RF carrier
Two PLL frequency-synthesizers set the picture carrier
frequency and the sound subcarrier frequency to the
required frequencies. These PLL frequency-synthesizers
are programmed via the I2C-bus.
• On-chip PLL frequency synthesizer for the sound carrier
The I2C-bus controls these features:
• On-chip power supply regulator
• Video modulation depth
and/or hardware controlled Test
• On-chip
Pattern Signal Generator (TPSG) with LED driver
• Sound subcarrier modulation deviation
• One I2C-bus programmable output port
I2C-bus
• Picture-to-sound ratio.
• RF output switch-off during tuning.
This makes the IC suitable for multistandard applications
without any adjustment into the application.
APPLICATIONS
Additional features are provided like an input for the
NICAM or second FM carrier, a test pattern signal
generator with a LED driver and a general purpose
output port.
• Video recorders
• Cable converters
• Satellite receivers
• Set top boxes.
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
TDA8822T
SO24
TDA8822M
SSOP24
1997 Jan 08
DESCRIPTION
VERSION
plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
2
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
QUICK REFERENCE DATA
VCCA = VCCD = 5 V; Tamb = 25 °C; in PAL B/G, PAL I, PAL D/K or NTSC; MD setting = 4; DEV setting = 2;
PS setting = 1; video input signal = 500 mV (p-p) EBU colour bars; audio input signal = 45 mV (p-p); 1 kHz sine wave;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VCCA
analog supply voltage
4.5
5.0
5.5
V
VCCD
digital supply voltage
4.5
5.0
5.5
V
ICC(tot)
total supply current
−
60
72
mA
md
modulation depth adjustment
range
typical value for MD setting between
0 and 7
72.5
−
90.0
%
P/S
picture-to-sound ratio
adjustment range
typical value for PS setting between
0 and 7
−18
−
−11
dB
VRF
RF output voltage level
asymmetrical on a 75 Ω load
frequency between 45 and 860 MHz
77
80
83
dBµV
fsc
sound subcarrier frequency
4.5
−
6.5
MHz
∆fsc
sound subcarrier frequency
deviation range
for B/G, I, D/K, SC setting = 1, 2 or 3; 20
typical value for DEV setting between
0 and 7
−
45
kHz
for M, N, SC setting = 0; typical value 10
for DEV setting between 0 and 7
−
22.5
kHz
1997 Jan 08
3
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
BLOCK DIAGRAM
handbook, full pagewidth
VIDEO
AGND
24
23
VCCA
1
VOLTAGE
REGULATOR
CLAMP
RFA
RFB
19
18
OUTPUT
BUFFER
TPSG
SWITCH
VIDEO
AMP.
CLIP
TPSG
ON/OFF
MD setting
NICAM
21
NICAM
AMP.
ADDER
MIXER
20
RFGND
SND-IF
AMP.
AUDIO
22
AUDIO
AMP.
VCO
DEV
setting
PREEMPH
3
test
ACP
2
AUDIO
CHARGE
PUMP
PS
setting
TDA8822
sound oscillator
ON/OFF
RF oscillator
ON/OFF
test
PROG.
DIVIDER
AUDIO
PHASE
DETECTOR
14 BITS
PROG.
DIVIDER
frequency
setting
frequency
setting
4
5
RF
OSCILLATOR
6
7
PRESCALER
DIVIDE-BY-8
8
10
SCL
SDA
P0
TPSG
I2C-bus control
14
fdiv(audio)
15
I2C-BUS
16
17
RECEIVER
AND
LOGIC
test
fdiv(video)
VIDEO
PHASE
DETECTOR
in-lock flag
test
VIDEO
CHARGE
PUMP
RFOSCB
OGND
RFOSCC
RFOSCD
VCP
test
LOOP
AMP.
9
VVT
fref(video)
fref(audio)
REFERENCE
DIVIDER
11
13
VCCD
DGND
CRYSTAL
OSCILLATOR
12
MGE674
Fig.1 Block diagram.
1997 Jan 08
RFOSCA
4
XTAL
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
PINNING
SYMBOL
PIN
DESCRIPTION
VCCA
1
analog power supply
ACP
2
audio charge pump output
PREEMPH
3
audio pre-emphasis network
RFOSCA
4
RF oscillator A (collector) output
RFOSCB
5
RF oscillator B (base) input
OGND
6
RF oscillator ground
RFOSCC
7
RF oscillator C (base) input
handbook, halfpage
VCCA
1
24 VIDEO
ACP
2
23 AGND
PREEMPH
3
22 AUDIO
RFOSCA
4
21 NICAM
RFOSCB
5
20 RFGND
OGND
6
RFOSCD
8
RF oscillator D (collector) output
VVT
9
video tuning voltage output
VCP
10
video charge pump output
VCCD
11
digital power supply
XTAL
12
crystal oscillator input
DGND
13
digital ground
RFOSCC
7
18 RFB
SCL
14
serial clock (I2C-bus) input
RFOSCD
8
17 TPSG
SDA
15
serial data (I2C-bus) input/output
VVT
9
16 P0
P0
16
general purpose output
TPSG
17
test pattern signal generator
input/output pin
RFB
18
RF output B
RFA
19
RF output A
RFGND
20
ground for the RF outputs
NICAM
21
NICAM input
AUDIO
22
audio input
AGND
23
analog ground
VIDEO
24
video input
1997 Jan 08
19 RFA
TDA8822
VCP 10
15 SDA
VCCD 11
14 SCL
XTAL 12
13 DGND
MGE673
Fig.2 Pin configuration.
5
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
FUNCTIONAL DESCRIPTION
The TPSG is activated in two ways:
The TDA8822 is a programmable RF modulator which can
be divided into the following parts:
– Forcing the pin TPSG to DGND in the application
(see Fig.8)
• Video part
– Setting the TPSG bit to 1 via the I2C-bus, then the
TPSG pin acts as an output port, sinking current to
allow the indication of the use of the TPSG in the
application e.g. with an LED (see Fig.9).
• Audio part
• RF part.
Video part
Table 1
The video part provides the following:
• The video part includes a clamping circuit which sets the
internal reference voltage to the bottom of the
synchronizing pulse. The modulation depth is adjusted
using 3 bits of the I2C-bus programming, called MD2,
MD1 and MD0. These 3 bits make 8 different values for
the modulation depth possible (see Table 1).
Modulation depth setting (typical values)
BIT
MD
SETTING
MD2
MD1
MD0
MODULATION
DEPTH (%)
0
0
0
0
72.5
1
0
0
1
75.0
2
0
1
0
77.5
3
0
1
1
80.0
4
1
0
0
82.5
5
1
0
1
85.0
6
1
1
0
87.5
7
1
1
1
90.0
• After the modulation depth is set, the signal is fed
through a clip control circuit that clips the video signal to
avoid that the modulation depth becomes higher than
100%.
• The video part also contains a TPSG. This TPSG
generates a pattern that helps to tune the TV set to the
programmed channel of the modulator. The pattern
consists of a sync pulse and two vertical white bars on
the screen (see Fig.3)
MGE675
handbook, full pagewidth
0
5
10
15
20
25
30
35
40
45
Fig.3 Test pattern signal.
1997 Jan 08
6
50
55
60
65
t (µs)
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
• fref(audio) and fdiv(audio) can be monitored on the general
purpose output port during a special test mode.
Audio part
The audio part provides the following:
• The frequency deviation of the sound subcarrier is set
using 3 bits DEV2, DEV1 and DEV0 of the I2C-bus
programming (see Table 3), when a signal of 1 kHz with
a level of 50 mV (p-p) is applied on the audio input pin.
• The sound subcarrier is created in an integrated VCO.
The signal at the output of this VCO is fed to a stage that
adjusts the picture-to-sound ratio and to the audio
programmable divider.
• The difference between the picture carrier level and the
sound subcarrier level is adjusted using 3 bits PS2, PS1
and PS0 (see Table 4).
• The frequency of the sound subcarrier is set by
programming the bits SC1 and SC0 of the I2C-bus (see
Table 2). These two bits set the dividing ratio of the
audio programmable divider to get the divided frequency
fdiv(audio).
• The NICAM amplifier has a constant gain, and is
designed for adding a second sound subcarrier in the TV
channel. This subcarrier can be either a second FM
carrier for dual-sound/stereo system used in PAL B/G or
a modulated NICAM carrier. The level between the
picture carrier and the NICAM carrier (P/N) will depend
on the input level on the NICAM input.
• The audio phase detector compares the
phase/frequency of the divided audio frequency fdiv(audio)
and the reference frequency for the audio, fref(audio) and
drives the Charge Pump (CP) that charges or
discharges the audio loop filter connected between
pins ACP and AGND to get the VCO oscillating to the
programmed frequency.
Table 2
Sound subcarrier frequency setting
BIT
SC1
SC0
SOUND SUBCARRIER
FREQUENCY (MHz)
0
0
0
4.5
M, N
1
0
1
5.5
B, G
2
1
0
6.0
I
3
1
1
6.5
D, K
SC SETTING
Table 3
STANDARD
Sound subcarrier frequency deviation setting (typical values)
BIT
DEVIATION (kHz)
DEV2
DEV1
DEV0
DEVIATION
(%)
0
0
0
0
40.0
20.0
10.0
1
0
0
1
45.0
22.5
11.3
2
0
1
0
50.5
25.3
12.6
3
0
1
1
56.5
28.3
14.1
4
1
0
0
63.5
31.8
15.9
5
1
0
1
71.5
35.8
17.9
6
1
1
0
80.0
40.0
20.0
7
1
1
1
90.0
45.0
22.5
DEV SETTING
1997 Jan 08
7
B, G, I, D, K
M, N
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
Table 4
TDA8822
Picture-to-sound ratio setting (typical values)
BIT
PS2
PS1
PS0
P/S RATIO
(dB)
0
0
0
−11
PS SETTING
0
1
0
0
1
−12
2
0
1
0
−13
3
0
1
1
−14
4
1
0
0
−15
5
1
0
1
−16
6
1
1
0
−17
7
1
1
1
−18
• fref(video) and fdiv(video) can also be monitored on the
output port during a special test mode.
RF part
The RF part provides the following:
• The I2C-bus receiver and control logic includes the
control of:
• The RF oscillator can produce any frequency used for
TV transmission, from 35 to 890 MHz. The frequency
range depends on the components used in the
application (see Table 11).
– Picture carrier frequency
– Sound subcarrier frequency
• The RF mixer combines the video signal, the sound
subcarrier and the carrier from the NICAM input to build
a baseband TV channel. This baseband signal is then
mixed with the RF oscillator signal to get the RF TV
channel.
– Sound subcarrier frequency deviation
• The two signals from the RF mixer are sent to the output
buffer. This output buffer can be used either as two
asymmetrical outputs or as one symmetrical output.
– RF oscillator on/off
– Video modulation depth
– Picture-to-sound ratio
– TPSG on/off and LED drive control
– Sound oscillator on/off
– General purpose output port on/off
• The output buffer is switched-off while the PLL is not
in-lock, to avoid parasitic output signal during the tuning
of the RF oscillator. The in-lock information is given by
the phase detector of the loop.
– Test modes setting.
Software information
The transmission is made using 4 words in I2C-bus format.
First the address CA has to be sent, then at least two
consecutive words have to be sent, either the two words
F1 and F0, or the two words C1 and C0.
• The signal from the RF oscillator is fed to the PLL which
controls the picture carrier frequency. The RF signal is
first divided by 8 in the prescaler, and then divided in the
programmable 14-bits divider. The dividing ratio of this
divider is programmed via the I2C-bus. The minimum
frequency that can be synthesized is 16 MHz, and the
maximum frequency is 1023.9375 MHz.
The two words C1 and F1 are differentiated inside the IC
by the first bit being logic 1 or logic 0 respectively.
The contents of the 4 bytes is shown in Table 5.
• The divided frequency called fdiv(video) is compared to the
reference frequency called fref(video) coming from the
crystal oscillator and divided in the reference divider.
The crystal oscillator is intended to be used with a
crystal of 4 MHz.
At the power-up of the TDA8822, the I2C-bus state is the
following:
• N13 to N0 are not fixed
• SC setting = 1: the sound carrier is fixed to 5.5 MHz
• The comparison between fref(video) and fdiv(video) is done
in the video phase detector. The resulting signal is fed
via the video charge pump to the loop amplifier,
including the tuning voltage drive (33 V) inside the IC.
1997 Jan 08
• MD is set to 4 (82.5%), PS is set to 1 (−12 dB) and DEV
is set to 2 (50.5%)
8
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
• T0 is set to logic 1, RF0 is set to logic 1, TPSG is set to
logic 1 and P0 is set to logic 0 to select the video high
impedance test mode because it is in this mode that the
RF oscillator starts in the best conditions.
• N is the programmable divider ratio:
N = N13 × 213 + N12 × 212 + ... + N1 × 2 + N0
• fosc is the RF oscillator frequency.
DEV2, DEV1 and DEV0 are the bits to set the sound
subcarrier frequency deviation (see Table 3).
The TPSG bit is used to switch on or off the TPSG using
the I2C-bus. It is also possible to switch the TPSG on in the
application, connecting the pin TPSG to DGND. This
pin TPSG has a double function and acts as an input or as
an output.
PS2, PS1 and PS0 are the bits to set the picture-to-sound
ratio (see Table 4).
MD2, MD1 and MD0 are the bits to set the modulation
depth (see Table 1).
These are the two functions:
• Output: if the TPSG is set using the I2C-bus, the
pin TPSG is used as an output open collector NPN port.
This port can be used to indicate with an LED that the
TPSG is on. This is especially useful in systems using
an on-screen display. If the TV set is not tuned to the
right channel there is an alternate indication that the
TPSG is on (see Fig.9).
SC1 and SC0 are the bits to set the sound subcarrier
frequency according to Table 2.
RF0 is a bit that controls the RF oscillator on/off. In normal
mode, it should be set to logic 1. If the modulator is not
used and may create some interferences with other
signals in the application, it should be set to logic 0
(see Table 6).
• Input: if the TPSG is set with an hardware switch in the
application, the TPSG pin is used as one of the inputs to
select the TPSG mode (see Fig.8).
Notice that if the bit RF0 is logic 0 while the bit TPSG is
logic 1, then the RF oscillator is still running, but the sound
oscillator is off, and the TPSG is also off (see Table 8).
Notice that if the TPSG bit is set to logic 1 while the RF0
bit is set to logic 0, the TPSG is turned off, and the sound
oscillator is off (see Table 8).
The bit P0 controls the output port P0, which is an open
collector NPN port, able to drive up to 10 mA
(see Table 7).
N13 to N0 are the 14 bits to set the video programmable
divider ratio and then to set the picture carrier frequency
following the formula: fosc = fref(video) × 8 × N,
T0 is a bit used for test purposes. If this bit is set to logic 0,
the IC operates in normal configuration. If it is set to
logic 1, then the use of bits TPSG, RF0 and P0 is changed
to select 1 of the 8 test modes as explained in Table 9.
where:
• fref(video) is the frequency on pin XTAL divided by the
reference divider ratio. For example, with a 4 MHz
crystal connected to
4 000 000
pin XTAL, f ref ( video ) = ------------------------ = 7812.5 Hz
512
Table 5
Contents of programming words
MSB
LSB
BYTE
ACKNOWLEDGE BIT
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
Address byte CA
1
1
0
0
1
0
1
0
ACK
F1: frequency
byte 1
0
TPSG
N13
N12
N11
N10
N9
N8
ACK
F0: frequency
byte 0
N7
N6
N5
N4
N3
N2
N1
N0
ACK
C1: control byte 1
1
DEV2
DEV1
DEV0
PS2
PS1
PS0
0
ACK
C0: control byte 0
MD2
MD1
MD0
SC1
SC0
RF0
P0
T0
ACK
1997 Jan 08
9
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
Table 6
TDA8822
RF oscillator on/off setting (see note 1)
STATE OF RF0
ACTION ON RF OSCILLATOR
0
stopped; no RF carrier
1
operating; normal use
Note
1. This table is valid only if bit TPSG is set to logic 0.
Table 7
Output port programming
STATE OF P0
Table 8
VOLTAGE ON PORT
(with a pull-up resistor to VCCD)
PORT STATE
0
high impedance
close to VCCD
1
sinking current
close to 0 V
Overview of the normal modes
T0
RF0
TPSG
P0
0
1
0
X(1)
input: open
RF on; TPSG off
0
1
0
X(1)
input: to DGND
RF on; TPSG on
1
X(1)
output: sinking current
RF on; TPSG on
0
1
PIN TPSG
MODE
0
0
0
X(1)
input: open or to DGND
RF off
0
0
1
X(1)
input: open
RF on; TPSG off; sound oscillator off
0
0
1
X(1)
input: to DGND
RF on; TPSG on; sound oscillator off
0
X(1)
X(1)
0
X(1)
Port P0 off (high impedance)
0
X(1)
X(1)
1
X(1)
Port P0 on (sinking current)
Note
1. X means logic 0 or logic 1, don’t care.
1997 Jan 08
10
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
Table 9
TDA8822
Overview of the test modes
T0
RF0
TPSG
P0
PIN(1) TPSG
1
0
0
0
X
fref(audio) on P0; both CP sinking current; notes 2 and 6
1
0
0
1
X
fdiv(audio) on P0; note 3
1
0
1
0
X
fref(video) on P0; both CP sourcing current; notes 4 and 6
1
0
1
1
X
fdiv(video) on P0; note 5
1
1
0
0
X
video charge pump off; note 7
1
1
0
1
X
audio charge pump off and balance test; notes 8 and 11
1
1
1
0
X
video high impedance test; note 9
1
1
1
1
X
baseband signal on RF outputs; note 10
TEST MODES
Notes
1. During the test mode (bit T0 set to logic 1), the pin TPSG is unused, meaning that the input information does not have
any effect, and that the output port does not sink any current.
2. In ‘fref(audio) on P0’ mode, the reference frequency of the audio PLL is available on the port P0.
f div ( audio )
3. In ‘fdiv(audio) on P0’ mode, -------------------------- is available on the port P0 (fdiv(audio) is the frequency from the sound oscillator
2
divided by the dividing ratio of the audio programmable divider).
4. In ‘fref(video) on P0’ mode, the reference frequency of the video PLL is available on the port P0.
f div ( video )
5. In ‘fdiv(video) on P0’ mode, ------------------------- is available on the port P0 (fdiv(video) is the frequency of the RF oscillator divided
2
by the dividing ratio of the video programmable divider).
6. In ‘both CP sinking or sourcing current’ modes, the charge pump of the audio PLL and the one of the video PLL are
sinking or sourcing their nominal current.
7. The ‘video charge pump off’ mode allows to measure the leakage current on the video PLL charge pump.
8. The ‘audio charge pump off’ mode allows to measure the leakage current on the audio PLL charge pump.
9. In the ‘video high-impedance’ mode, it is possible to inject an external tuning voltage for the RF carrier setting.
In this mode, the video PLL is off.
10. In the ‘baseband signal on RF outputs’ mode, the RF oscillator is off, and it is possible to measure the baseband
video and audio subcarrier signals on the RF output pins.
11. During the ‘balance test’ mode the picture carrier is over-modulated allowing the measurement of the residual carrier.
1997 Jan 08
11
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
Example of programming
We want to program the TDA8822 in a UHF application, on channel 21 (picture carrier at 471.25 MHz) in a B/G standard
(sound carrier at 5.5 MHz from the picture carrier) with a Picture-to-Sound ratio of −12 dB, a modulation depth of 82.5%
and a deviation set to 50.5% in normal mode, without TPSG, output port on.
These are the values of the bits that must be programmed:
f osc
471 250 000
• The video dividing ratio will be N = ---------------- = ------------------------------ = 7540 = 01110101110100
f ref × 8
7 812.5 × 8
• TPSG bit will be set to logic 0
• DEV2 will be set to logic 0, DEV1 to logic 1 and DEV0 to logic 0
• PS2 will be set to logic 0, PS1 to logic 0 and PS0 to logic 1
• MD2 will be set to logic 1, MD1 to logic 0 and MD0 to logic 0
• SC1 will be set to logic 0 and SC0 to logic 1
• P0 will be set to logic 1
• RF0 will be set to logic 1
• T0 will be set to logic 0.
The protocol to the TDA8822 is illustrated in Table 10.
Table 10 Example of programming for the TDA8822.
MSB
LSB
BYTE
ACKNOWLEDGE
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
Address byte CA
1
1
0
0
1
0
1
0
ACK
F1: frequency
byte 1
0
0
0
1
1
1
0
1
ACK
F0: frequency
byte 0
0
1
1
1
0
1
0
0
ACK
C1: control byte 1
1
0
1
0
0
0
1
0
ACK
C0: Control byte 0
1
0
0
0
1
1
1
0
ACK
1997 Jan 08
12
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VCCA
analog supply voltage
−0.3
+7.0
V
VCCD
digital supply voltage
−0.3
+7.0
V
VCC
operating supply voltage
4.5
5.5
V
Vmax
maximum voltage on all pins except SCL, SDA and VVT
−0.3
VCC
V
VBUS(max)
maximum voltage on SCL and SDA pins
−0.3
+7.0
V
VVVT(max)
maximum voltage on VVT pin
−0.3
+35.0
V
Tstg
storage temperature
−40
+125
°C
Tamb
operating ambient temperature
−20
+85
°C
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it
is desirable to take normal precautions appropriate to handling integrated circuits. The IC withstands the ESD test in
accordance with the “UZW-B0/FQ-A302” specification equivalent to the “MIL-STD-883C category B” (2000 V). The IC
withstands the ESD test in accordance with Philips Semiconductors Machine Model (MM), specification
“UZW-B0/FQ-B302”, issue date November 6th, 1990,(0 Ω, 200 pF, 200 V).
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
1997 Jan 08
PARAMETER
VALUE
UNIT
SO24; SOT137-1
74
K/W
SSOP24; SOT340-1
120
K/W
thermal resistance from junction to ambient in free air
13
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
CHARACTERISTICS
VCCA = VCCD = 5 V; Tamb = 25 °C; in PAL B/G, PAL I, PAL D/K, or NTSC; MD setting = 4; DEV setting = 2;
PS setting = 1; video input signal = 500 mV (p-p) EBU colour bars; audio input signal = 45 mV (p-p) 1 kHz sine wave;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
IP
power supply current
analog and digital parts
−
60
72
mA
Video characteristics
IVIDEO
video input current
−
0.5
2.0
µA
zVIDEO
video input impedance
30
−
−
kΩ
md
modulation depth
part-to-part variation;
MD setting = 4
77.5
82.5
87.5
%
md(clip)
modulation depth during clipping
condition
video input level lower
than 1 V (p-p)
−
−
99
%
md(TPSG)
modulation depth when TPSG mode
on
part to part variation,
MD setting = 4
72.5
82.5
92.5
%
md(APL)
variation of the modulation depth with
change of APL between 10 and 90%
reference for APL = 50%
−2
0
+2
%
S/N
video signal-to-noise ratio
note 1
48
52
−
dB
Gdiff
differential gain
note 2
−
3
6
%
ϕdiff
differential phase
note 2
−
3
6
deg
V/S
video-to-sync ratio
input signal: V/S = 7 : 3
6.9 : 3.1 7 : 3
7.1 : 2.9
fvideo
frequency response for the video
signal
note 3
−1
−
+1
dB
Audio characteristics
ZAUDIO
audio input impedance
without any resistor
between AUDIO and
AGND
30
−
−
kΩ
∆fm
modulation deviation
SC setting = 1, 2 or 3;
DEV setting = 2
20
25
30
kHz
SC setting = 0;
DEV setting = 2
10
12.5
15
kHz
∆fm(max)
maximum modulation deviation
VAUDIO = 500 mV (p-p);
note 4
180
250
−
kHz
THD
total harmonic distortion
50 mV (p-p) sine wave at
1 kHz on AUDIO pin
−
0.4
1.0
%
S/N
audio signal-to-noise ratio
note 5
44
47
−
dB
fAUDIO
frequency response of the audio signal note 6
−1
−
+1
dB
∆fsc(acc)
sound subcarrier accuracy
note 7
−1
0
+1
kHz
P/S
picture-to-sound ratio
no audio signal; no video
signal; PS setting = 1
−15
−12
−9
dB
1997 Jan 08
14
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
SYMBOL
PARAMETER
TDA8822
CONDITIONS
MIN.
TYP.
MAX.
UNIT
NICAM characteristics
10
−
−
kΩ
−23
−20
−17
dB
−
+1
dB
ZNICAM
NICAM input impedance
P/N
level between picture carrier and
NICAM carrier
NICAM input
level = 150 mV (p-p);
no video signal
fNICAM
frequency response of the NICAM
input
for frequencies between 5 −1
and 8 MHz; reference for
6.5 MHz
BER
bit error rate
note 11
−
10−6
−
EHD
eye-height degradation
note 11
−
4
−
%
with application VHF 1
47
−
88
MHz
with application VHF 3
174
−
230
MHz
with application UHF
470
−
860
MHz
note 7
−75
−
+75
kHz
80
83
dBµV
0
2
dB
Channel characteristics
fRF
RF frequency range
fRF(acc)
picture carrier accuracy
VRF
output level on RF outputs during sync. between 45 and 860 MHz 77
pulse, loaded with 75 Ω
VRF(flat)
flatness of the RF output level across
each band
reference is centre of
each band
−2
Zo(RF)
RF output impedance
single ended
−
75
−
Ω
SPUo
spurious outside channel
note 8
−
−
−40
dBc
SPU2PC
RF second harmonic level
on asymmetrical output at −
low end of UHF band
−
−10
dBc
SPU2SC
sound carrier second harmonic level
−
−65
−60
dBc
SPU3SC
sound carrier third harmonic level
−
−65
−60
dBc
SPUfref
reference frequency spurious
measured with Philips
application board
−
−
−40
dBc
CHRBEAT
chroma beat
note 9
−
−
−63
dBc
NICBEAT
NICAM beat
note 10
−
−
−63
dBc
Video charge pump output and video tuning amplifier: VCP and VVT
IVCP
output current
−
50
−
µA
IVCP(lk)
off-state leakage current
−10
−
10
nA
VVVT(min)
minimum tuning voltage on pin VVT
27 kΩ resistor between
pin VVT and +33 V
−
−
0.2
V
IVVT(lk)
leakage current on pin VVT
27 kΩ resistor between
pin VVT and +33 V; high
impedance test mode
−
−
10
µA
Audio charge pump output: ACP
IACP
output current
−
3
−
µA
IACP(lk)
off-state leakage current
−10
−
10
nA
VACP
tuning voltage range for the audio PLL,
on pin ACP
1.5
−
4.5
V
1997 Jan 08
15
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
SYMBOL
PARAMETER
TDA8822
CONDITIONS
MIN.
TYP.
MAX.
UNIT
XTAL characteristics
|ZXTAL|
XTAL input impedance
absolute value;
with a 4 MHz crystal
600
1200
−
Ω
150
400
mV
Output Port characteristics
VPORT
low voltage
port on; IPORT = 10 mA
−
IPORT(lk)
off-state leakage current
port off; VCCD = 5.5 V
−
−
10
µA
IPORT(sink)
sinking current in the port
port on
10
−
−
mA
TPSG pin characteristics
VTPSG(on)
voltage on pin TPSG to switch the
TPSG on
0
−
1.5
V
VTPSG(off)
voltage on pin TPSG to switch the
TPSG off
3.0
−
VCCD
V
ITPSGL
LOW input current in pin TPSG
TPSG to DGND
−100
−
−
µA
ITPSGH
HIGH input current in pin TPSG
TPSG to VCCD
−
−
100
µA
ITPSG(sink)
output sinking current in pin TPSG
TPSG set on using
I2C-bus
10
−
−
mA
VTPSG(sink)
voltage on pin TPSG used as output
TPSG set on using
I2C-bus
−
150
400
mV
I2C-bus receiver characteristics, pins SCL and SDA
fSCL
frequency on SCL line
−
−
100
kHz
VIH
HIGH level input voltage
3
−
5.5
V
VIL
LOW level input voltage
0
−
1.5
V
IIH
HIGH level input current
VIH = 5 V; VCCD = 0 or 5 V −
−
10
µA
IIL
LOW level input current
VIL = 0 V; VCCD = 0 or 5 V −10
−
−
µA
VSDA(ack)
acknowledge output voltage on SDA
during acknowledge
pulse; IIL = 3 mA
−
0.4
V
−
Notes
1. Ratio between the CCIR 17-line bar amplitude (corresponding to the level difference between black and white;
see Fig.4) and the RMS value of the noise on a black line (line 22 or 335) measured on the video signal after
demodulation. Measurement is done for frequencies between 200 kHz and 5 MHz. Measurement is unweighted.
2. Measured on CCIR 330 line, corresponding to a 5-step staircase with a chroma carrier of amplitude equal to 0.3
times the voltage between sync pulse and white (see Fig.5). The video signal is 500 mV (p-p). The modulation depth
is adjusted using the I2C-bus to MD setting = 4 (82.5% typical modulation depth).
3. Measured with a spectrum analyser with ‘peak hold’ function, applying a 500 mV (p-p) sine wave at the video input
of the IC, with a sweeping frequency between 0.5 and 6.0 MHz. The reference is the value measured at 1.0 MHz.
4. To have a deviation between 50 and 250 kHz, the audio frequency must be higher than 100 Hz.
5. Measured with an audio frequency of 1 kHz with a level adjusted to get a deviation of 50 kHz with DEV setting = 2,
using CCIR 468-3 weighting filter, with a quasi-peak detection. The input signal has pre-emphasis and the receiver
has de-emphasis. Video signal is 500 mV (p-p) EBU colour bars on pin VIDEO.
1997 Jan 08
16
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
6. Measured with no pre-emphasis on the audio input and no de-emphasis in the receiver. Measurement is done for
frequencies between 50 Hz and 15 kHz, reference is the level measured at 1 kHz.
7. The accuracy only depends on the accuracy of the reference frequency (accuracy of the crystal). Notice that the
value of the capacitor in series with the crystal must be chosen to be as close as possible to the load capacitance of
the crystal.
8. Except for the harmonics of the RF oscillator frequency and for the combinations between the RF oscillator
frequency and the sound oscillator frequency (fRF + 2fs, 2fRF + fs, etc.). This measurement includes the spurious at
the 1⁄4fRF, 1⁄2fRF and 3⁄4fRF.
9. Chroma beat
a) For PAL: measured applying a 4.43 MHz sine wave of 200 mV (p-p) at the video input. Measurement is the
difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 1.07 MHz for PAL B/G, 1.57 MHz for PAL I and 2.07 MHz for PAL D/K.
b) For NTSC: measured applying a 3.58 MHz sine wave of 200 mV (p-p) at the video input. Measurement is the
difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 920 kHz.
10. NICAM beat
a) For PAL B/G: measured applying a sine wave of 150 mV (p-p) at 5.85 MHz on the NICAM input. Measurement
is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 350 kHz or 5.15 MHz.
b) For PAL I: measured applying a sine wave of 150 mV (p-p) at 6.552 MHz on the NICAM input. Measurement is
the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 552 kHz or 5.448 MHz.
11. NICAM eye height and Bit Error Rate measurement conditions:
a) A NICAM frame is applied from a Textronix 728E in B/G mode on the NICAM input of the TDA8822 through an
attenuator to get 150 mV (p-p). The sound subcarrier is set to 5.5 MHz (SC = 1) and the picture to sound ratio is
set to -12 dB (PS = 1). There is no video signal applied to the video input and no audio signal on the audio input.
b) The RF carrier is demodulated with a Rohde & Schwartz EMFP demodulator for PAL B/G, the sound trap filter is
set off, and the video signal is fed to a Textronix 728D NICAM demodulator for B/G. Measurements of the eye
height and bit error rate are done on the 728D.
1997 Jan 08
17
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
MBE396
handbook, full pagewidth
1V
0.3 V
0V
0
10
20
30
40
50
60
70
64
t (µs)
Fig.4 CCIR insertion line 17.
MBE397
handbook, full pagewidth
1V
0.3 V
0V
0
10
20
30
40
50
60
t (µs)
Fig.5 CCIR insertion line 330.
1997 Jan 08
18
70
64
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
INTERNAL PIN CONFIGURATION
handbook, full pagewidth
VCCA
1
VOLTAGE
REGULATOR
VCCA
VCCA
ACP
24
regulated
voltage
2
VIDEO
AGND
23
AGND
regulator voltage
AGND
22
VCCD
AUDIO
AGND
VCCA
21
NICAM
DGND
VCCA
regulated voltage
AGND
20
PREEMPH
19
18
AGND
regulated voltage
RFOSCA
RFOSCB
RFGND
VCCA
3
RFA
RFB
4
5
VCCD
OGND
RFOSCC
RFOSCD
VVT
17
6
7
8
TPSG
9
DGND
VCCD
DGND
16
VCCD
P0
DGND
VCP
10
VCCD
15
VCCD
SDA
DGND
11
DGND
VCCD
VCCD
14
XTAL
SCL
12
DGND
13
DGND
MGE681
Fig.6 Pin equivalent circuit for each pin.
1997 Jan 08
19
DGND
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
APPLICATION INFORMATION
handbook, full pagewidth
R14
SCL
270 Ω
R15
SDA
270 Ω
C21
RFB
NICAM
R21
51 Ω
1 nF
C22
RFA
220 pF
R27
AUDIO
220 kΩ
VIDEO
R24
C24
470 Ω
100 nF
R26
82 Ω
R22
12
kΩ
C18
100
pF
C19
100
pF
R18
1 kΩ
P0
R25
470 Ω
VIDEO
24
AGND
AUDIO
22
23
NICAM
RFGND
20
21
RFA
19
RFB
18
TPSG
P0
SCL
DGND
17
16
SDA
15
14
13
8
9
10
11
12
TDA8822
1
2
VCCA
3
ACP
4
PRE
EMPH
C4
C2
2.2
µF
C1
100
nF
5
6
RFOSCA RFOSCB OGND
(1)
RFOSCC RFOSCD VVT
C7
C5
(1)
(1)
VCP
VCCD
XTAL
C8
C10
4.7
nF
(1)
L1 (1)
R10
33
kΩ
XTAL1
4 MHz
C6
(1)
R2
4.7
kΩ
C25
10
nF
7
C26
68 nF
D1
R5
22 kΩ
(1)
R7
R8
22 kΩ
15 kΩ
C9
10 nF
C27
100 nF
R9
27 kΩ
C12
18 pF
C11
10 nF
VCC = 5 V
MGE678
VVT = 33 V
(1) The components marked: C4, C5, C6, C7, C8, L1 and D1 must be chosen from Table 11 to get the desired frequency range.
Fig.7 Reference application.
1997 Jan 08
20
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
Application design
In the design of the application, it is highly recommended to separate the part of the RF oscillator as much as possible
from the part of the RF outputs in order to avoid parasitic coupling between these two parts.
A good solution is shielding the RF oscillator part to avoid radiation from and to this part. The pin OGND must be
connected to the shielding box and to ground.
The frequency range the IC covers is fixed by the choice of the components marked with a note (1) in Fig.7. For these
components, it is recommended to use the values indicated in Table 11.
Table 11 Components to be used for the RF oscillator
FREQUENCY
RANGE
BAND
VALUE FOR
C4, C5, C7, C8
VALUE
FOR C6
D1
L1: NUMBER
OF TURNS
L1:COIL
DIAMETER
L1: WIRE
DIAMETER
VHF1
47 to 130 MHz
5.6 pF
100 pF
BB132
14.5
3.0 mm
0.3 mm
VHF3
130 to 350 MHz
4.7 pF
150 pF
BB133
4.5
3.0 mm
0.4 mm
UHF
470 to 860 MHz
1.8 pF
22 pF
BB134
1.5
2.5 mm
0.5 mm
Video input (pin 24)
Audio input (pin 22)
The video input level on the IC is of 500 mV (p-p). In most
of the cases, the available video signals are of 1 V (p-p)
with a source impedance of 75 Ω.
The IC is sensitive to 45 mV (p-p) on pin AUDIO and the
DC voltage on this pin is close to 0 V.
This pin needs to be grounded through a 12 kΩ resistor
(R22 in Fig.7). Care must then be taken if a coupling
capacitor needs to be implemented on the audio path to
connect it between the signal source and the input, with
the resistor of 12 kΩ still connected to the AUDIO pin.
To handle this kind of signal, we use a resistive divider with
two 470 Ω resistors (R24 and R25 in Fig.7) to divide the
1 V (p-p) signal down to 500 mV (p-p). In order to get an
input impedance of 75 Ω, a resistor of 82 Ω is implemented
in parallel to the divider (R26 in Fig.7).
NICAM input (pin 21)
Audio pre-emphasis
The NICAM pin is sensitive to 150 mV (p-p) to reach a
level between picture carrier and NICAM carrier of typical
−20 dBc.
The capacitor C22 connected in parallel with R27 is
defining the time constant for the pre-emphasis following
Table 12.
It is possible to put on this pin either a NICAM modulated
carrier for a NICAM application or a frequency modulated
carrier for the stereo system with a second FM carrier used
e.g. in Germany.
Table 12 Choice of the pre-emphasis constant
STANDARD
CAPACITOR
C22
TIME
CONSTANT
NTSC
330 pF
75 µs
PAL
220 pF
50 µs
special; note 1
no capacitor
−
In a specific application where the main sound subcarrier
would be generated outside the IC, it is also possible to
inject the main sound carrier to this pin, with a level
depending on the wanted P/S. In this event, it is necessary
to stop the internal sound oscillator by setting RF0 to
logic 0 and TPSG to logic 1 (see Table 8).
Note
1. This mode has to be considered if the pre-emphasis is
applied else-where on the path of the audio signal, or
if there is no need for pre-emphasis in specific
applications. Note also that the pre-emphasis can be
done by connecting a capacitor between pin
PREEMPH (pin 3) and ground. The value for this
capacitor is 10 nF for PAL and 15 nF for NTSC.
1997 Jan 08
21
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
If a cutoff frequency slightly higher than 20 Hz can be
accepted, it is possible to reduce the value of the 2.2 µF
capacitor (C2) to 220 nF. In this case C26 needs to be
changed from 68 nf to 22 nF and R3 needs to be changed
from 4.7 kΩ to 33 kΩ.
TPSG input/output (pin 17)
As already mentioned, this pin can be used either as an
input or as an output.
• As an input, it allows to turn on the TPSG, without
changing anything to the word the TDA8822 is
programmed through the I2C-bus.
RF outputs (pins 18 and 19)
In this mode, it is simply necessary to connect a switch
between the pin TPSG and DGND (see Fig.8). If the
switch is open, then the TPSG is selected
corresponding to the I2C-bus programming; if the switch
is closed, then the TPSG is on.
For inexpensive applications, it is possible to use the IC
with an asymmetrical output.
In an asymmetrical application, the unused output pin
must be loaded with a load as close as possible to the load
connected to the used pin.
• As an output, it allows to indicate e.g. with an LED that
the TPSG has been programmed on using the I2C-bus.
A good improvement in performance is obtained using a
symmetrical to asymmetrical transformer
(balun; balance-to-unbalance) connected between the two
outputs. In this event both outputs have their loads
matched. The level of the RF second harmonic, and the
spurious outside channel is decreasing. The parasitic
coupling between RF outputs and RF oscillator is also
reduced.
In this mode, the pin acts as an open-collector output
port, it is possible to connect a LED to the 5 V power
supply with a series resistor to limit the current to about
10 mA (see Fig.9).
XTAL pin (pin 12)
This pin is connected to a 4 MHz crystal in series with a
capacitor. The value of this capacitor has to be as close as
possible to the load capacitance of the crystal.
RF harmonics
This IC has been designed to have the lowest level of
unwanted RF harmonics at the frequencies where these
are the hardest to be filtered out, especially for the second
harmonic of the RF carrier at the lowest frequencies of the
UHF band.
It is also possible to drive the IC with an external 4 MHz
signal from a voltage source. A level of 50 mV(RMS)
insures stable operation. A capacitor of about 18 pF and a
resistor of 680 Ω needs to be placed in series with the
voltage source.
It is possible to reduce the level of the second harmonic by
using a wide-band transformer at the output of the IC and
create a symmetrical application.
ACP pin (pin 2)
This pin is the charge pump output for the sound subcarrier
PLL as well as the input of the sound subcarrier VCO.
To reduce the out-of-band harmonics and especially the
third one, it is necessary to use a low-pass filter at the
output of the IC.
It is necessary to connect the loop filter between this pin
and ground. The loop filter indicated in Fig.7 gives a cut-off
frequency lower than 20 Hz.
1997 Jan 08
22
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
handbook, halfpage
20
19
handbook, halfpage
RFGND
20
C19
RFA
RFA
VCC = 5 V
100 pF
18
TDA8822
C18
RFB
19
RFGND
16
15
R15
1 kΩ
RFB
18
14
13
17
P0
P0
SCL
16
R15
270 Ω
SDA
15
SCL
14
DGND
13
MGE679
R15
1 kΩ
R17
330 Ω
TPSG
P0
SDA
P0
R15
270 Ω
SCL
SDA
R14
270 Ω
SCL
DGND
MGE680
Fig.8 Use of the pin TPSG as an input.
1997 Jan 08
VCC = 5 V
RFB
S1
R14
270 Ω
C18
RFB
100 pF
TPSG
SDA
RFA
100 pF
100 pF
17
C19
RFA
Fig.9 Use of the pin TPSG as an output.
23
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
PACKAGE OUTLINES
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT137-1
075E05
MS-013AD
1997 Jan 08
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
24
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
D
SOT340-1
E
A
X
c
HE
y
v M A
Z
24
13
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
bp
e
detail X
w M
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.0
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
0.8
0.4
8
0o
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
OUTLINE
VERSION
SOT340-1
1997 Jan 08
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
93-09-08
95-02-04
MO-150AG
25
o
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
SOLDERING
SSOP
Introduction
Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
If wave soldering cannot be avoided, the following
conditions must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
• The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.
Reflow soldering
Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).
Reflow soldering techniques are suitable for all SO and
SSOP packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
METHOD (SO AND SSOP)
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
SO
Repairing soldered joints
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
1997 Jan 08
26
Philips Semiconductors
Preliminary specification
Universal I2C-bus programmable RF
modulator
TDA8822
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1997 Jan 08
27
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© Philips Electronics N.V. 1997
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
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Printed in The Netherlands
537021/50/01/pp28
Date of release: 1997 Jan 08
Document order number:
9397 750 01601