PHILIPS TDA8722T

INTEGRATED CIRCUITS
DATA SHEET
TDA8722
I2C-bus programmable modulator
for negative video modulation and
FM sound
Product specification
Supersedes data of 1995 Mar 21
File under Integrated Circuits, IC02
1998 Jun 23
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
FEATURES
• Video amplifier with clamp and white clip circuits
• FM sound modulator
• Asymmetrical and symmetrical RF outputs available
• Symmetrical RF oscillator using only a few external
components
GENERAL DESCRIPTION
• External adjusting of modulation depth and level of the
sound subcarrier
The TDA8722 is a programmable modulator which
generates an RF TV channel from a baseband video
signal and a baseband audio signal in the event of
negative video and FM sound standards (PAL B/G, I, D/K
and NTSC).
• I2C-bus receiver for frequency setting and test-mode
selection
• One I2C programmable output port
• On-chip Phase-Locked Loop (PLL) frequency
synthesizer
It is especially suited for satellite receivers, video
recorders and cable converters. The video carrier
frequency is set exactly to the correct channel frequency
by a PLL synthesizer which is programmed in accordance
with the I2C-bus format.
• On-chip power supply regulator
• Bus switchable oscillator
• On-chip Test Pattern Signal Generator (TPSG).
APPLICATIONS
• Video recorders
• Cable converters
• Satellite receivers.
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
TDA8722T
SO20
TDA8722M
SSOP20
1998 Jun 23
DESCRIPTION
VERSION
plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
2
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
QUICK REFERENCE DATA
VDDA = VDDD = 5 V; Tamb = 25 °C after the IC has reached thermal equilibrium; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDDA
analog supply voltage
4.5
5.0
5.5
V
VDDD
digital supply voltage
4.5
5.0
5.5
V
IDD
total supply current
normal mode
41
52
63
mA
∆m
typical modulation depth range
video level (pin 19) = 0.5 V (p-p);
note 1; see Fig.10
65
−
90
%
∆P/S
typical picture-to-sound level
range
note 2; see Fig.11
−18
−
−10
dB
VRF
RF output voltage level
asymmetrical on a 75 Ω load
frequency between
471.25 and 855.25 MHz
77
80
83
dBµV
δf
FM deviation on audio
subcarrier
fi = 400 Hz; V1 = 0.5 V (RMS);
before pre-emphasis filter
20
25
30
kHz
Notes
1. Value depends on value of resistor R17 (see Fig.7).
2. Value depends on value of capacitor C17 (see Fig.7).
1998 Jun 23
3
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
BLOCK DIAGRAM
VIDEO
handbook, full pagewidth
ADJUST
19
17
TDA8722
CLAMP
AGND
VDDA
18
20
RFA
RFB
16
15
ASYMMETRICAL
OUTPUT
BUFFER
VOLTAGE
REGULATOR
VIDEO AMP
CLIP
AUDIO
SOSCA
SOSCB
1
TPSG
2
3
MIXER
SWITCH
AUDIO
FM MODULATOR
TPSG on
PC
balance test
SDA
SCL
P0
13
12
12-BIT
DIVIDER
(N)
I 2C-BUS
RECEIVER
6
5
4
UOSCA
OGND
UOSCB
10 bits
14
RF oscillator on
enable/
select
8
CP
f DIV
PHASE
DETECTOR
LOGIC
f ref
11
10
VDDD
DGND
CHARGE
PUMP
7
AMP
AMP
enable
31.25 kHz
DIVIDER
(M = 128)
9
4 MHz
OSCILLATOR
MBE401
Fig.1 Block diagram.
1998 Jun 23
UHF
OSCILLATOR
PRESCALER
(8)
4
XTAL
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
PINNING
SYMBOL PIN
DESCRIPTION
AUDIO
1
audio input
SOSCA
2
sound oscillator A
SOSCB
3
sound oscillator B
UOSCB
4
UHF oscillator B
OGND
5
RF oscillator ground
UOSCA
6
UHF oscillator A
AMP
7
CP
XTAL
DGND
handbook, halfpage
AUDIO
1
20 VDDA
SOSCA
2
19 VIDEO
tuning amplifier output
SOSCB
3
18 AGND
8
charge pump output
UOSCB
4
17 ADJUST
9
crystal oscillator
OGND
5
10
digital ground
VDDD
11
digital supply voltage
SCL
12
serial clock input (I2C-bus)
SDA
13
serial data input (I2C-bus)
P0
14
NPN open-collector output Port
RFB
15
asymmetrical RF output B
RFA
16
asymmetrical RF output A
ADJUST
17
modulation depth and picture-to-sound
distance adjustment pin
AGND
18
analog ground
VIDEO
19
video input
VDDA
20
analog supply voltage
UOSCA
6
15 RFB
AMP
7
14 P0
CP
8
13 SDA
XTAL
9
12 SCL
11 VDDD
DGND 10
MBE394
Fig.2 Pin configuration.
and ground (R17). The value can change between 47 kΩ
and infinite (R17 removed); see Fig.10.
FUNCTIONAL DESCRIPTION
The TDA8722 is a programmable modulator which can be
divided into two main blocks:
The video part also contains a test pattern signal generator
to simplify the adjustment of the receiving channel of the
TV set to the required channel of the modulator. The
pattern consists of a synchronization pulse and two
vertical white bars on screen (see Fig.3).
• A modulator for negative video modulation and
FM sound TV standards
• A programmable PLL frequency synthesizer.
The video part of the modulator consists of a clamping
circuit which sets the internal reference voltage to the
bottom of the synchronizing pulse, followed by a white clip
which avoids over modulation in case the video signal is
too strong. Typically, the IC starts to clip the video signal
when the voltage at the video input (pin 19) is
>560 mV (p-p) while the normal voltage at the video input
is 500 mV (p-p). This clipping function ensures that the
video modulation depth is not too high. The modulation
depth is adjusted in the application between at least
65 and 90% by changing the resistor value between pin 17
1998 Jun 23
16 RFA
TDA8722
The audio part of the modulator contains an FM sound
modulator. The frequency of the sound subcarrier is set in
the application by external components (C3, L3 and R3).
The difference between the video carrier level and the
sound subcarrier level is adjusted in the application by
changing the value of the capacitor between pin 17 and
ground (C17). The value can change between
0 and 47 pF. The distance between the video carrier and
the sound subcarrier can be adjusted between at least
−10 and −18 dB (see Fig.11).
5
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
To bias the audio input it is necessary to put a resistor in
the application between pin 1 and ground. The resistor
has a typical value of 12 kΩ.
TDA8722
N is a 12-bit dividing number (10 bits are programmable
by the I2C-bus).
fref is the crystal frequency (4 MHz) divided by 128
(31.25 kHz).
The RF part of the oscillator consists of:
• An oscillator which operates at the required video
carrier frequency. The range of the oscillator is
determined in the application by C5, C6, L5 and D5.
The circuit allows a step of 250 kHz but because only
10 bits are programmable, the programming steps are
1 MHz.
When the PLL loop is locked, both inputs of the phase
comparator are equal, which gives equation:
f osc
f xtal
f DIV = ------------= --------- = f ref
8×N
128
• An RF mixer. It first combines the video signal and the
sound subcarrier to build a baseband TV channel.
Then the baseband signal is mixed with the oscillator
signal to get the RF TV channel. The mixer has two
outputs which can be used as two independent
asymmetrical outputs, or as one symmetrical output. In
the event of asymmetrical use, the unused output must
be loaded with a 75 Ω resistor (see Fig.7).
During the test mode operation, fDIV and fref can be
monitored on the output Port pin (pin 14).
Software information
The oscillator frequency is set by a programmable PLL
frequency synthesizer in accordance with equation:
The synthesizer is controlled via a two-wire I2C-bus
receiver. For programming, the address byte (C8 HEX)
has to be sent first. Then one or two data bytes are used
to set the 10 programmable bits of the dividing number N,
the test bits (see Table 1) and the output Port state. Note
that after power-up of the IC, the two data bytes must be
sent.
fosc = 8 × N × fref
Where:
fosc is the local oscillator frequency.
MBE395
handbook, full pagewidth
0
10
20
30
40
50
60
t (µs)
Fig.3 Test pattern signal.
1998 Jun 23
6
70
64
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
Table 1
TDA8722
Data format; notes 1 and 2
BIT 7
MSB
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
LSB
ACKNOWLEDGE BIT
Address byte C8
1
1
0
0
1
0
0
0
ACK
Data byte 1
0
b11
b10
b9
b8
b7
b6
b5
ACK
1
T0(3)
T1(3)
T2(3)
P0(4)
b4
b3
b2
ACK
BYTE
Data byte 2
Notes
1. The 10 programmable bits of N are: b2 to b11.
2. Internal hardware sets: b1 = 0 and b0 = 1.
3. T0, T1 and T2 are bits used for test purposes (see Table 5).
4. P0 is a bit used for controlling the state of the output Port (see Table 6).
Table 2
Structure of the dividing number N
BITS(1)
RESULT
Frequency (MHz)(3)
b11
b10
b9
b8
b7
b6
b5
b4
b3
b2
b1(2)
b0(2)
512
256
128
64
32
16
8
4
2
1
0.5
0.25
Notes
1. Bits b2 to b11 are programmable and represent the integer part of the frequency in MHz. Bits b1 and b0 are fixed
internally to b1 = 0 and b0 = 1 to get the added 0.25 MHz, common for most TV channels.
2. Bits b1 and b0 are not programmable.
3. fosc = 512b11 + 256b10 + 128b9 + 64b8 + 32b7 + 16b6 + 8b5 + 4b4 + 2b3 + b2 + 0.25 (MHz).
Table 3
Dividing number N for programming channel 21 (471.25 MHz)
BITS
RESULT
Value
Frequency
(MHz)(2)
b11
b10
b9
b8
b7
b6
b5
b4
b3
b2
b1(1)
b0(1)
0
1
1
1
0
1
0
1
1
1
0
1
0
256
128
64
0
16
0
4
2
1
0
0.25
Notes
1. Bits b1 and b0 are not programmable.
2. fosc = 0 + 256 + 128 + 64 + 0 + 16 + 0 + 4 + 2 + 1 + 0.25 (MHz) = 471.25 MHz.
Table 4
Content of the data bytes to program channel 21 (471.25 MHz)
BIT 7
MSB
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
LSB
ACKNOWLEDGE BIT
Address byte C8
1
1
0
0
1
0
0
0
ACK
Data byte 1
0
0
1
1
1
0
1
0
ACK
Data byte 2
1
0
0
0
0
1
1
1
ACK
BYTE
It is possible to change only one data byte. The circuit will recognize which one is received with the value of MSB
(0 for data byte 1 and 1 for data byte 2). It is possible to change the frequency by 1 MHz with data byte 2. It is easy to
increment the channel frequency when its frequency width is 8 MHz by simply incrementing data byte 1.
1998 Jun 23
7
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
The bits T0 to T2 are available for test purposes and the possibilities are shown in Table 5.
Table 5
Test modes
T0
T1
T2
OPERATIONAL MODE
0
0
0
normal operation
0
0
1
Test Pattern Signal Generator (TPSG) on; note 1
0
1
0
RF oscillator off; note 2
0
1
1
balance test; note 3
1
0
0
fref out (if p0 = 0); note 4
1
0
1
high-impedance test; note 5
1
1
0
fDIV out (if p0 = 0); note 4
1
1
1
phase detector disabled; baseband signals on RF outputs; note 6
Notes
1. In ‘TPSG on’ mode the video carrier is modulated by the test signal consisting of a synchronization pulse and two
vertical white bars on a black screen. This mode should be selected to adjust the TV set receiving the modulated
signal to the right frequency.
2. In ‘RF oscillator off’ mode, the RF oscillator and the RF mixer are switched-off and there is no RF carrier coming out
of the device. This mode can be selected to avoid RF radiation to other parts when the modulator output is not used.
3. In ‘balance test’, the video carrier is over modulated. This simplifies residual carrier measurements.
4. In ‘fref’ and ‘fDIV’ modes, the reference frequency fref in the phase comparator or the divided RF oscillator frequency
fDIV is available on the output Port pin. This mode requires that bit P0 = 0.
5. The ‘high-impedance test’ mode may be used to inject an external tuning voltage to the RF tank circuit, to test the
oscillator. In this mode, the phase detector is disabled and the external transistor of the tuning amplifier is
switched-off. The AMP output (pin 7) is LOW (<200 mV).
6. In the ‘phase detector disabled’ mode, it is possible to measure the leakage current at the input of the tuning amplifier,
on the CP pin. In this mode the RF oscillator is off, and the baseband TV channel signal is present on the RF outputs
for testing the audio and video parts.
The possibilities of bit P0, which controls the output Port
(pin 14) are given in Table 6.
Table 6
P0
The Port is an NPN open-collector type. For monitoring the
fref or fDIV frequency on the output Port, the P0 bit must be
logic 0 to let the output Port free.
1998 Jun 23
8
Output Port programming
OUTPUT PORT STATE
0
off; high impedance
1
on; sinking current
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VDDA
analog supply voltage
−0.3
+6
V
VDDD
digital supply voltage
−0.3
+6
V
VDD
operating supply voltage
4.5
5.5
V
Vmax
maximum voltage on all pins
−0.3
VDD
V
Tstg
IC storage temperature
−40
+125
°C
Tamb
operating ambient temperature
−20
+85
°C
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it
is desirable to take normal precautions appropriate to handling integrated circuits. Every pin withstands the ESD test in
accordance with “MIL-STD-883C category B” (2000 V). Every pin withstands the ESD test in accordance with Philips
Semiconductors Machine Model (MM) 0 Ω, 200 pF (200 V).
THERMAL RESISTANCE
SYMBOL
Rth j-a
1998 Jun 23
PARAMETER
VALUE
UNIT
SO20; SOT163-1
85
K/W
SSOP20; SOT266-1
120
K/W
thermal resistance from junction to ambient in free air
9
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
CHARACTERISTICS
VDDA = VDDD = 5 V; Tamb = 25 °C; valid over the whole UHF band; measured in circuit of Fig.7;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
IDD
supply current
normal mode
41
52
63
mA
RF off test mode
30
38
46
mA
Video characteristics
I19
input current (AC)
V19 = 3.2 V
−
0.5
2.0
µA
z19
video input impedance
V19 = 3.2 V
30
−
−
kΩ
m
modulation depth
V19 = 500 mV (p-p) EBU
77
colour bars; R17 = 120 kΩ;
see Fig.7
82
87
%
during clipping condition;
note 1
85
−
98
%
TPSG mode;
R17 = 120 kΩ
72
82
92
%
balance test mode;
R17 = 120 kΩ
110
−
−
%
∆m
modulation depth range
V19 = 500 mV (p-p) EBU
colour bars;
47 kΩ ≤ R17 ≤ ∞
65
−
90
%
∆mAPL
variation of modulation depth with
change of APL between 10 and 90%
referenced to the value for
APL = 50%;
V19 = 500 mV (p-p)
−2
−
+2
%
Vclip(p-p)
video input level where clipping starts
(peak-to-peak value)
video level on pin 19;
note 2
−
0.56
−
V
fRF < 700 MHz; note 3
48
52
−
dB
S/N video video signal-to-noise ratio
fRF > 700 MHz; note 3
46
50
−
dB
Gdiff
differential gain
note 4
−8
−
+8
%
φdiff
differential phase
note 4
−8
−
+8
deg
V/S
video-to-sync ratio
V19 = 500 mV (p-p);
V/S = 7/3
6.9/3.1 7/3
7.1/2.9
fvideo
frequency response for the video signal
note 5
−1
−
+1
dB
Audio characteristics (for PAL G standard; audio subcarrier at 5.5 MHz)
Z1
audio input impedance
30
−
−
kΩ
δm
modulation deviation
f1 = 400 Hz;
V1 = 0.5 V (RMS) before
pre-emphasis filter
20
25
30
kHz
δmmax
maximum modulation deviation
f1 = 400 Hz;
V1 = 2.0 V (RMS) before
pre-emphasis filter
60
85
−
kHz
THD
total harmonic distortion
f1 = 1 kHz;
V1 = 0.5 V (RMS) before
pre-emphasis filter
−
0.4
1.5
%
1998 Jun 23
10
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
SYMBOL
PARAMETER
S/N audio audio signal-to-noise ratio
TDA8722
CONDITIONS
MIN.
TYP.
MAX.
UNIT
note 6
45
50
−
dB
faudio
frequency response of the audio signal
note 7
−1
−
+1
dB
P/S
picture-to-sound ratio
no audio signal;
FM = 5.5 MHz;
C17 = 15 pF
−16
−13
−10
dB
∆P/S
picture-to-sound ratio range
no audio signal;
FM = 5.5 MHz;
0 pF ≤ C17 ≤ 39 pF
−18
−
−10
dB
Channel characteristics
fRF
RF frequency range
using tank circuit of Fig.7
471.25 −
855.25 MHz
VRF
output level on RFA and RFB
asymmetrical output
loaded with 75 Ω;
f = 471.25 to 855.25 MHz
77
80
83
dBµV
∆VRF
difference between the level of
modulated carrier and the level of the
unmodulated carrier
measurement is made
during synchronization
pulse for the modulated
carrier
0
1
2
dB
SPO
spurious outside channel
note 8
−
−62
−
dBc
RFsh
RF second harmonic level on
asymmetrical output
fRF = 471.25 MHz
−
−30
−25
dBc
fRF = 855.25 MHz
−
−20
−15
dBc
fs = 5.5 MHz;
C17 = 15 pF;
fRF < 700 MHz
−
−65
−60
dBc
fs = 5.5 MHz;
C17 = 15 pF;
fRF > 700 MHz
−
−63
−58
dBc
sound carrier third harmonic level
fs = 5.5 MHz; C17 = 15 pF
−
−65
−60
dBc
video signal harmonics
note 9
−
−60
−55
dBc
fref
reference frequency spurious
fp + 31.25 kHz
−
−65
−60
dBc
IM
chrominance beat
note 10
−
−65
−60
dBc
SCsh
SCth
sound carrier second harmonic level
Charge pump output (CP)
I8
output current
−
±100
−
µA
V7
output voltage
in lock
1.5
−
2.5
V
IOZ
OFF-state leakage current
VCP = 2 V; T0 = 1; T1 = 1;
T2 = 1
−
−
10
nA
Amplifier output (AMP)
G
amplifier current gain
VCP = 2 V; IAMP = 10 µA
−
4000
−
V7sat
output saturation voltage
VCP = 0 V; T0 = 1; T1 = 0;
T2 = 1
−
140
200
mV
−
−
−500
Ω
Crystal oscillator characteristics (XTAL)
Z9
1998 Jun 23
oscillator input impedance
11
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
SYMBOL
PARAMETER
TDA8722
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Output Port characteristics (P0)
VOL
LOW level output voltage
P0 = 1; I14 = 5 mA
−
150
400
mV
IOZ
OFF-state leakage current
P0 = 0; VDD = 5.5 V
−
−
10
µA
I14(max)
maximum Port current
P0 = 1
−
−
10
mA
I2C-bus receiver characteristics (SDA and SCL)
VIH
HIGH level input voltage
3
−
5.5
V
VIL
LOW level input voltage
0
−
1.5
V
IIH
HIGH level input current
VIH = 5 V; VDD = 0 or 5 V
−
−
10
µA
IIL
LOW level input current
VIL = 0 V; VDD = 0 or 5 V
−10
−
−
µA
Vo
output voltage on SDA
during acknowledge
pulse; IIL = 3 mA
−
−
0.4
V
Notes
1. Modulation depth when the video signal is between 560 and 1000 mV (peak-to-peak value) at pin 19. R17 = 120 kΩ
in the application.
2. For application information only.
3. Ratio between the CCIR 17 line bar amplitude (corresponding to the level difference between black and white;
see Fig.4 and the RMS value of the noise on a black line (line 22 or 335) measured on the video signal after
demodulation for PAL G standard. Measurement is unweighted, done between 200 kHz and 5 MHz.
4. Measured for PAL G standard on 4 first steps of CCIR 330 line, corresponding to a 5 step staircase with
300 mV (peak-to-peak value) chrominance carrier when the level between synchronization pulse and white is 1 V;
see Fig.5.
5. Measured with a spectrum analyzer with ‘peak hold’ function, applying a 500 mV (peak-to-peak value) sine wave at
the video input of the IC, with a frequency of 0.5, 2.0, 4.0 and 4.8 MHz. The reference is the value measured for
1.0 MHz.
6. Measured using CCIR 468-3 weighting filter and quasi-peak detection, with an audio frequency of 1 kHz and a
deviation of 50 kHz. Video signal is EBU colour bars of 500 mV (peak-to-peak value) on pin 19.
7. Measured in PAL G standard with no pre-emphasis on the audio input and no de-emphasis in the receiver. Audio
input level is adjusted for having a deviation of 25 kHz at 1 kHz audio frequency. Measurement is done for
frequencies between 50 Hz and 15 kHz, reference is the level measured for 1 kHz.
8. Except for the harmonics of the RF oscillator frequency and for the combinations between the RF oscillator
frequency and the sound oscillator frequency (fRF + 2fs, 2fRF + fs, etc.). This measurement includes the spurious at
the 1⁄4fRF, 1⁄2fRF and 3⁄4fRF.
9. Corresponding to the harmonics of the video signal. Measured by putting a 1 MHz sine wave of
500 mV (peak-to-peak value) at the video input (pin 19) and checking the level at fRF + 2 MHz, fRF + 3 MHz, etc.
10. Measured with a 4.43 MHz sine wave of 350 mV (peak-to-peak value) at the video input. Measurement is the
difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency
of the picture carrier plus 1.07 MHz. C17 = 15 pF in the application diagram of Fig.7.
1998 Jun 23
12
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
MBE396
handbook, full pagewidth
1V
0.3 V
0V
0
10
20
30
40
50
60
70
64
t (µs)
Fig.4 CCIR insertion line N.17.
MBE397
handbook, full pagewidth
1V
0.3 V
0V
0
10
20
30
40
50
60
t (µs)
Fig.5 CCIR insertion line N.330.
1998 Jun 23
13
70
64
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
INTERNAL PIN CONFIGURATION
handbook, full pagewidth
VOLTAGE
REGULATOR
AUDIO
20
UOSCB
3
17
4
16
OGND
UOSCA
AMP
15
5
AGND
ADJUST
RFA
RFB
6
14
P0
7
13
CP
VIDEO
2
18
SOSCB
DDA
1
19
SOSCA
V
SDA
8
9
XTAL
12
DGND
11
MBE402
ESD protection components are not shown in the diagram.
Fig.6 Pin equivalent circuit for each pin.
1998 Jun 23
SCL
10
14
V DDD
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
APPLICATION INFORMATION
VIDEO
RF
75 Ω
100 nF
C19
handbook, full pagewidthR20
470 Ω
R15
R19
470 Ω
R18
82 Ω
PORT
75 Ω
15 pF
100 nF
C17
100 pF
C16
R17
120 kΩ
1 kΩ
R14
100 pF
C15
SCL
C20
SDA
20
19
18
17
16
15
14
13
12
11
Q9
10 nF
TDA8722
4 MHz
C11
27 pF
1
2
3
4
5
6
7
8
L5 (2)
K1
AUDIO
(1)
C1
220 pF
R1
220 kΩ
R4
220 Ω
R2
12 kΩ
C3
56 pF
R3
15 kΩ
L3
(3)
33 pF
C5
D5
C9
R8
12 kΩ
R9
33 V
R6
22 kΩ
22 kΩ
5V
R7
15 µH
K2
10
150 nF
C8
33 pF
C6
BB215
R5
22 kΩ
9
(4)
C30
10 nF
12 kΩ
10 nF
C7
C31
2.2 µF
T8
BC547B
MBE403
(1)
(2)
(3)
(4)
K1: switches the pre-emphasis filter on or off.
L5: air coil; 1.5 turns; diameter of 2 mm.
L3: to adjust the application to the right sound carrier frequency (5.5 MHz for PAL G).
K2: Switches the FM sound oscillator on or off.
Fig.7 Reference measuring set-up.
1998 Jun 23
C21
2.2 µF
15
GND
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
Application design
handbook, full pagewidth
VIDEO
RF
75 Ω
100 nF
C19
R20
470 Ω
R15
75 Ω
R19
470 Ω
R18
82 Ω
PORT
100 kΩ
RV1 (1)
15 pF
100 nF
82 kΩ
R17
100 pF
C16
100 pF
C15
SCL
SDA
C20
C17
20
19
18
5V
17
16
15
14
13
12
11
Q9
10 nF
TDA8722
4 MHz
C11
27 pF
1
2
3
4
5
6
7
8
L5
33 pF
C5
C3
AUDIO
C1
220 pF
R1
220 kΩ
R2
12 kΩ
56 pF
R3
15 kΩ
D5
10
C9
150 nF
C8
33 pF
C6
R8
12 kΩ
R9
BB215
R5
22 kΩ
9
33 V
R6
22 kΩ
L3
22 kΩ
R7
15 µH
C30
10 nF
12 kΩ
10 nF
C7
T8
BC547B
MBE405
(1) RV1 allows fine adjustment of the modulation depth between 70 and 90%.
Fig.8 Application using an asymmetrical output.
1998 Jun 23
16
GND
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
RF
75 Ω
handbook, full pagewidth
VIDEO
100 nF
C19
R20
470 Ω
6
R19
470 Ω
R18
82 Ω
TDA8722
1
TOKO - B4F
617DB - 1010
4
TR1
2
3
PORT
100 nF
R17
120 kΩ
C17
C20
R15
300 Ω
100 pF
C16
15 pF
SCL
SDA
100 pF
C15
5V
20
19
18
17
16
15
14
13
12
11
Q9
10 nF
TDA8722
1
2
3
4
5
4 MHz
C11
6
7
8
9
27 pF
10
C9
L5
C3
AUDIO
C1
56 pF
R3
220 pF
R1
15 kΩ
L3
220 kΩ
R2
12 kΩ
15 µH
150 nF
C8
33 pF
C5
D5
BB215
R5
22 kΩ
33 pF
C6
R8
12 kΩ
R9
33 V
22 kΩ
R6
22 kΩ
R7
12 kΩ
10 nF
C7
C30
10 nF
T8
BC547B
MBE404
GND
Fig.9 Application using a symmetrical output with a balun transformer.
In the design of the application, it is highly recommended
to separate the part of the RF oscillator as much as
possible from the part of the RF outputs in order to avoid
parasitic coupling between these two parts.
similar as possible to the load connected to the used pin,
see Fig.8.
A good improvement in performance is obtained using a
1 : 4 symmetrical to asymmetrical transformer
(balun; balance-to-unbalance) connected between the
two outputs. In this event both outputs have their loads
matched. The level of the RF second harmonic, and the
spurious outside channel is decreasing. The parasitic
coupling between RF outputs and RF oscillator is also
reduced (see Fig.9).
A good solution is shielding the RF oscillator part to avoid
radiation from and to this part. The pin 5 (OGND) must be
connected to the shielding box and to ground.
RF outputs
For inexpensive applications, it is possible to use the IC
with an asymmetrical output (pins 15 or 16). In this event,
the unused output pin must be loaded with a load as
1998 Jun 23
17
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
Modulation depth
TDA8722
Table 7
With 500 mV (peak-to-peak value) video input signal, the
wanted modulation depth must be set by the value of R17
(resistor between pin 17 and ground) as shown Fig.10. For
a good accuracy, it is recommended to use a 1% type
resistor.
It is also possible to use an adjustable resistor, see Fig.8.
Depending on the layout of the PCB, it may be necessary
to slightly change the value of R17 from the one given in
Fig.10 to get the wanted modulation depth.
Value of resistor for several Q factor ranges
COIL QUALITY
FACTOR
PROPOSED VALUE FOR R3
(kΩ)
30 to 40
82 to 33
40 to 50
33 to 27
50 to 60
27 to 22
60 to 80
22 to 18
80 to >100
18 to 15
The use of a coil with a quality factor <30 may result in a
non operating oscillator. For safety, it is recommended to
use a coil with a quality factor ≥50.
Sound oscillator design
The frequency of the sound subcarrier is fixed by the tank
circuit connected between pins 2 and 3. This frequency
can be adjusted between 4.5 and 6.5 MHz covering all
existing standards in the world.
Picture-to-sound ratio
The picture-to-sound ratio can be adjusted in the
application by changing the value of C17 (capacitor
between pin 17 and ground); see Fig.11.
The damping resistor R3 between pins 2 and 3 is
necessary to decrease the quality factor of the tank circuit
allowing the frequency to be modulated by the audio
signal. The value of this resistor is calculated for several
Q factor ranges of the coil for a sound frequency of
5.5 MHz (see Table 7).
Figure 11 shows us that the picture-to-sound ratio will
change for a constant value of C17 when the sound
subcarrier frequency will change.
RF harmonics
This IC has been designed to have the lowest level of
unwanted RF harmonics at the frequencies where these
are the hardest to be filtered out, especially for the second
harmonic of the RF carrier at the lowest frequencies of the
UHF band.
MBE398
100
handbook, halfpage
modulation
depth
(%)
The level of the second and third RF harmonic is shown in
Fig.12 for an asymmetrical application. This chart gives a
typical value while the level of these harmonics can vary
depending on the design of the application.
90
It is possible to reduce the level of the second harmonic by
using a wide band transformer at the output of the IC and
create a symmetrical application (see Fig.9).
80
To reduce the out-of-band harmonics and especially the
third one, it is necessary to use a low-pass filter at the
output of the IC.
70
60
10
102
R17 (kΩ)
10 3
Fig.10 Typical modulation depth as a function of
the value of R17.
1998 Jun 23
18
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
MBE399
8
MBE400
14
handbook, halfpage
handbook, halfpage
RF
harmonics
(dBc)
P/S
(dB)
third harmonic
18
12
22
16
(1)
(2)
(3)
(4)
26
second harmonic
20
0
10
20
30
C17 (pF)
30
450
40
R17 = 120 kΩ.
(1) 4.5 MHz.
(2) 5.5 MHz.
(3) 6.0 MHz.
(4) 6.5 MHz.
Fig.11 Typical picture-to-sound ratio as a function
of the value of C17.
650
750
850
RF (MHz)
Fig.12 Typical level of RF harmonics for an
asymmetrical application.
The input impedance on pin 17 is approximately 3500 Ω,
the incoming signal must be capacitive coupled, the
resistor R17 between pin 17 and ground must remain to
adjust the modulation depth, the capacitor C17 between
pin 17 and ground may be changed depending on the
capacitance brought on by the incoming network. If this
capacitance is large, it is possible to remove C17.
Figure 13 shows a possible application for injecting such
kind of signal into the modulator IC.
VHF operation
This IC can operate on frequencies as low as 200 MHz
(and especially for VHF 3 band) provided the impedance
of the tuned circuit between pins 4 and 6 is >1 kΩ.
NICAM and stereo
Because of the fact that the ADJUST pin (pin 17) is an
access point to the RF mixer, it is possible to use this pin
to inject an external modulated subcarrier into the IC.
Following this application, to get a picture-to-second
sound carrier ratio of −20 dB, it is necessary to apply a
level of approximately 800 mV (peak-to-peak value) at
the second carrier input, when the picture-to-first sound
carrier ratio is approximately −13 dB.
This is especially interesting when it is necessary to
transmit a second frequency modulated audio subcarrier
for stereo sound (f = 5.72 MHz) or a NICAM QPSK
modulated carrier for digital audio transmission
(f = 5.85 or 6.552 MHz).
In addition, the internal FM sound modulator can be
switched off by short-circuiting pins 2 and 3.
The incoming signal must be externally modulated either
in FM with the desired signal corresponding to PAL B/G
specification for stereo sound transmission, or in QPSK in
accordance with the NICAM transmission system.
1998 Jun 23
550
19
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
RF 75 Ω
handbook, full pagewidth
SECOND
CARRIER
VIDEO
R15
75 Ω
R21
10 kΩ
10 pF
C21
R20
470 Ω
100 nF
C19
R18
82 Ω
R17
120 kΩ
R19
470 Ω
100 pF
C16
100 pF
C15
C17
PORT
100 nF
C20
20
19
18
17
16
15
14
TDA8722
Fig.13 Possible application for a second sound subcarrier.
1998 Jun 23
20
MGC419
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
PACKAGE OUTLINES
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
11
20
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
10
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013AC
1998 Jun 23
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
21
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
D
SOT266-1
E
A
X
c
y
HE
v M A
Z
11
20
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
10
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.5
0.15
0
1.4
1.2
0.25
0.32
0.20
0.20
0.13
6.6
6.4
4.5
4.3
0.65
6.6
6.2
1.0
0.75
0.45
0.65
0.45
0.2
0.13
0.1
0.48
0.18
10
0o
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
90-04-05
95-02-25
SOT266-1
1998 Jun 23
EUROPEAN
PROJECTION
22
o
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
SOLDERING
SSOP
Introduction
Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
If wave soldering cannot be avoided, the following
conditions must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
• The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.
Reflow soldering
Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).
Reflow soldering techniques are suitable for all SO and
SSOP packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
METHOD (SO AND SSOP)
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
SO
Repairing soldered joints
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
1998 Jun 23
23
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
TDA8722
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1998 Jun 23
24
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
NOTES
1998 Jun 23
25
TDA8722
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
NOTES
1998 Jun 23
26
TDA8722
Philips Semiconductors
Product specification
I2C-bus programmable modulator for
negative video modulation and FM sound
NOTES
1998 Jun 23
27
TDA8722
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Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1998
SCA60
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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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Printed in The Netherlands
545104/1200/02/pp28
Date of release: 1998 Jun 23
Document order number:
9397 750 03431