INTEGRATED CIRCUITS DATA SHEET TDA9808 Single standard VIF-PLL with QSS-IF and FM-PLL demodulator Product specification Supersedes data of 1999 Jan 18 File under Integrated Circuits, IC02 1999 Jun 04 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 FEATURES GENERAL DESCRIPTION • 5 V supply voltage (9 V supply voltage for TDA9808 (DIP20) only) The TDA9808 is an integrated circuit for single standard (negative modulated) vision IF signal processing and FM demodulation, with single reference QSS-IF in TV and VTR sets. • Applicable for IFs (Intermediate Frequencies) of 38.9 MHz, 45.75 MHz and 58.75 MHz • Gain controlled wide band Video IF (VIF)-amplifier (AC-coupled) • True synchronous demodulation with active carrier regeneration (very linear demodulation, good intermodulation figures, reduced harmonics, excellent pulse response) • Robustness for over-modulation better than 105% due to Phase Locked Loop (PLL)-bandwidth control at negative modulated standards • VIF Automatic Gain Control (AGC) detector for gain control, operating as peak sync detector • Tuner AGC with adjustable TakeOver Point (TOP) • Automatic Frequency Control (AFC) detector without extra reference circuit • AC-coupled limiter amplifier for sound intercarrier signal • Alignment-free FM-PLL demodulator with high linearity • Sound IF (SIF) input for single reference Quasi Split Sound (QSS) mode (PLL controlled); SIF AGC detector for gain controlled SIF amplifier; single reference QSS mixer for high performance • Electrostatic Discharge (ESD) protection for all pins. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION TDA9808 DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 TDA9808T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 1999 Jun 04 2 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 QUICK REFERENCE DATA SYMBOL PARAMETER VP supply voltage IP supply current Vi(VIF)(rms) VIF input signal voltage sensitivity (RMS value) CONDITIONS VP = 9 V for TDA9808 (DIP20) only −1 dB video at output Vo(video)(p-p) video output signal voltage (peak-to-peak value) MIN. TYP. MAX. UNIT 4.5 5 9.9 V 71 83 95 mA − 60 100 µV 1.2 1.35 1.5 V 7 8 − MHz 56 60 − dB B−3 −3 dB video bandwidth on pin 9 S/NW(video) weighted signal-to-noise ratio for video αIM(0.92) intermodulation attenuation at ‘blue’ f = 0.92 MHz 58 64 − dB αIM(2.76) intermodulation attenuation at ‘blue’ f = 2.76 MHz 58 64 − dB αH(sup) suppression of harmonics in video signal 35 40 − dB Vi(SIF)(rms) sound IF input signal voltage sensitivity (RMS value) −3 dB at intercarrier output − 50 100 µV Vo(rms) audio output signal voltage for FM (RMS value) M, N standard; 25 kHz modulation 0.4 0.5 0.6 V THD total harmonic distortion 25 kHz modulation − 0.15 1.0 % S/NW(audio) weighted signal-to-noise ratio 25 kHz modulation; τ = 75 µs 55 60 − dB 1999 Jun 04 CL < 30 pF; RL > 1.5 kΩ; AC load 3 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... AFC VP GND n.c. 3 17 4 14 15 8 13 AFC DETECTOR TAGC 12 TUNER AGC 18 16 VOLTAGE REFERENCE VIF AGC Vo(vid) 9 1.35 V (p-p) SOUND TRAP 1 VIF SAW 2 VIF AMPLIFIER FPLL VIDEO DEMODULATOR AND AMPLIFIER VCO TWD NOISE CLIPPING 6 Vo AF 4 19 20 SIF AMPLIFIER SINGLE REFERENCE QSS MIXER TDA9808 FM-PLL DEMODULATOR SIF AGC 5 10 11 Vo QSS Vi FM 7 MHA736 4.5 MHz CSAGC CDEC Product specification Fig.1 Block diagram. mute switch TDA9808 handbook, full pagewidth SIF SAW Philips Semiconductors 2 x fpc Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TPLL BLOCK DIAGRAM 1999 Jun 04 CVAGC TADJ Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 PINNING SYMBOL PIN DESCRIPTION SYMBOL PIN DESCRIPTION Vi VIF1 1 VIF differential input signal voltage 1 Vi FM 11 sound intercarrier input voltage Vi VIF2 2 VIF differential input signal voltage 2 TAGC 12 tuner AGC output TADJ 3 tuner AGC takeover point adjust AFC 13 AFC output TPLL 4 PLL loop filter VCO1 14 VCO1 resonance circuit CSAGC 5 SIF AGC capacitor VCO2 15 VCO2 resonance circuit Vo AF 6 audio output GND 16 ground CDEC 7 decoupling capacitor CVAGC 17 VIF AGC capacitor 18 supply voltage n.c. 8 not connected VP Vo(vid) 9 composite video output voltage Vi SIF1 19 SIF differential input signal voltage 1 Vo QSS 10 single reference QSS output voltage Vi SIF2 20 SIF differential input signal voltage 2 handbook, halfpage Vi VIF1 1 20 Vi SIF2 Vi VIF2 2 19 Vi SIF1 handbook, halfpage 20 Vi SIF2 Vi VIF2 2 19 Vi SIF1 TADJ 3 18 VP TADJ 3 18 VP TPLL 4 17 CVAGC TPLL 4 17 CVAGC CSAGC 5 Vo AF 6 CSAGC 5 16 GND TDA9808 CDEC 7 n.c. 8 15 VCO2 Vo AF 6 14 VCO1 CDEC 7 Vo QSS 10 16 GND TDA9808T 15 VCO2 14 VCO1 n.c. 8 13 AFC Vo(vid) 9 13 AFC 12 TAGC Vo(vid) 9 12 TAGC 11 Vi FM Vo QSS 10 11 Vi FM MHA734 MHA735 Fig.2 Pin configuration DIP20. 1999 Jun 04 Vi VIF1 1 Fig.3 Pin configuration SO20. 5 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 FUNCTIONAL DESCRIPTION VCO, Travelling Wave Divider (TWD) and AFC The integrated circuit comprises the functional blocks as shown in Fig.1: The VCO operates with a resonance circuit (with L and C in parallel) at double the Picture Carrier (PC) frequency. The VCO is controlled by two integrated variable capacitors. The control voltage required to tune the VCO from its free-running frequency to double the PC frequency is generated by the frequency-phase detector of the FPLL and fed via the loop filter to the first variable capacitor. This control voltage is amplified and additionally converted into a current which represents the AFC output signal. At the centre frequency the AFC output current is equal to zero. 1. Vision IF amplifier and VIF AGC detector 2. Tuner AGC 3. Frequency Phase Locked Loop (FPLL) detector 4. Voltage Controlled Oscillator (VCO), Travelling Wave Divider (TWD) and AFC 5. Video demodulator and amplifier 6. SIF amplifier and SIF AGC The oscillator signal is divided-by-two with a TWD which generates two differential output signals with a 90 degree phase difference independent of the frequency. 7. Single reference QSS mixer 8. FM-PLL demodulator 9. Audio Frequency (AF) signal processing Video demodulator and amplifier 10. Internal voltage stabilizer. The video demodulator is realized by a multiplier which is designed for low distortion and large bandwidth. The vision IF input signal is multiplied with the ‘in phase’ signal of the travelling wave divider output. Vision IF amplifier and VIF AGC detector The vision IF amplifier consists of three AC-coupled differential amplifier stages. Each differential stage comprises a feedback network controlled by emitter degeneration. The demodulator output signal is fed to the video amplifier via an integrated low-pass filter for attenuation of the carrier harmonics. The video amplifier is realized by an operational amplifier with internal feedback and high bandwidth. A low-pass filter is integrated to achieve an attenuation of the carrier harmonics. The video output signal at pin Vo(vid) is 1.35 V (p-p) for nominal vision IF modulation. Noise clipping is provided. The AGC detector generates the required VIF gain control voltage for constant video output by charging/discharging the AGC capacitor. Therefore, for negative video modulation the synchronisation level of the video signal is detected. Tuner AGC SIF amplifier and SIF AGC The AGC capacitor voltage is converted to an internal IF control signal, and is fed to the tuner AGC to generate the tuner AGC output current at pin TAGC (open-collector output). The tuner AGC takeover point can be adjusted at pin TADJ. This allows to match the tuner to the SAW filter in order to achieve the optimum IF input level. The sound IF amplifier consists of two AC-coupled differential amplifier stages. Each differential stage comprises a controlled feedback network provided by emitter degeneration. The SIF AGC detector is related to the SIF input signal (average level of FM carrier) and controls the SIF amplifier to provide a constant SIF signal to the single reference QSS mixer. Frequency Phase Locked Loop (FPLL) detector The VIF-amplifier output signal is fed into a frequency detector and into a phase detector via a limiting amplifier. During acquisition the frequency detector produces a DC current proportional to the frequency difference between the input and the VCO signal. After frequency lock-in the phase detector produces a DC current proportional to the phase difference between the VCO and the input signal. The DC current of either the frequency detector or the phase detector is converted to a DC voltage via the loop filter, which controls the VCO frequency. 1999 Jun 04 6 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator Single reference QSS mixer AF signal processing The single reference QSS mixer is realized by a multiplier. The SIF amplifier output signal is fed to the single reference QSS mixer and converted to intercarrier frequency by the regenerated picture carrier (VCO). The mixer output signal is fed via a high-pass filter for attenuation of the video signal components to the output pin 10. With this system a high performance hi-fi stereo sound processing can be achieved. The AF amplifier consists of two parts: 1. The AF pre-amplifier for FM sound is an operational amplifier with internal feedback, high gain and high common mode rejection. The AF voltage from the PLL demodulator, by principle a small output signal, is amplified by approximately 33 dB. The low-pass characteristic of the amplifier reduces the harmonics of the intercarrier signal at the sound output terminal pin 10. An additional DC control circuit is implemented to keep the DC level constant, independent of process spread. FM-PLL demodulator The FM-PLL demodulator consists of a limiter and an FM-PLL. The limiter provides the amplification and limitation of the FM sound intercarrier signal. The result is high sensitivity and AM suppression. The amplifier consists of 7 stages which are internally AC-coupled in order to minimize the DC offset. 2. The AF output amplifier (10 dB) provides the required output level by a rail-to-rail output stage. This amplifier makes use of an input selector for switching to FM or mute state, controlled by the mute switching voltage. Internal voltage stabilizer Furthermore the AF output signal can be muted by connecting a resistor between the limiter input pin 11 and ground. The bandgap circuit internally generates a voltage of approximately 1.25 V, independent of supply voltage and temperature. A voltage regulator circuit, connected to this voltage, produces a constant voltage of 3.6 V which is used as an internal reference voltage. The FM-PLL consists of an integrated relaxation oscillator, an integrated loop filter and a phase detector. The oscillator is locked to the FM intercarrier signal, output from the limiter. As a result of locking, the oscillator frequency tracks with the modulation of the input signal and the oscillator control voltage is superimposed by the AF voltage. The FM-PLL operates as an FM demodulator. 1999 Jun 04 TDA9808 7 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP PARAMETER supply voltage CONDITIONS MIN. MAX. UNIT note 1 Tj(max) = 125 °C; TDA9808 (DIP20) − 9.9 V Tj(max) = 115 °C; TDA9808T (SO20) − 5.5 V Vi voltage at pins 1, 2, 5, 13, 17, 19 and 20 0 VP V ts(max) maximum short-circuit time to ground or VP − 10 s V12 tuner AGC output voltage 0 13.2 V Tstg storage temperature −25 +150 °C Tamb operating ambient temperature −20 +70 °C Ves electrostatic handling voltage −300 +300 V note 2 Notes 1. IP = 95 mA; Tamb = 70 °C. 2. Machine model class B (L = 2.5 µH). THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS VALUE UNIT TDA9808 (DIP20) 62 K/W TDA9808T (SO20) 85 K/W thermal resistance from junction to ambient in free air 1999 Jun 04 8 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 CHARACTERISTICS (9 V SUPPLY, TDA9808; DIP20 only) VP = 9 V; Tamb = 25 °C; see Table 1 for input frequencies and carrier ratios; input level Vi(VIF)(rms) = 10 mV (pins 1 and 2) (sync-level); Vi(SIF)(rms) = 4.5 mV (pins 19 and 20) (sound carrier); IF input from 50 Ω via broadband transformer 1 : 1; video modulation DSB; residual carrier: 10%; video signal in accordance with “NTC-7 Composite”; measurements taken in Fig.13; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply (pin 18) VP supply voltage IP supply current note 1 4.5 5.0 9.9 V 72 85 98 mA 60 90 µV True synchronous video demodulator; note 2 Vi(VIF)(rms) VIF input signal voltage sensitivity (RMS value) PLL still locked; − maximum IF gain; note 3 Composite video amplifier (pin 9; sound carrier off) Vo(video)(p-p) video output signal voltage (peak-to-peak value) see Fig.8 1.27 1.45 1.63 V S/NW(video) weighted signal-to-noise ratio see Fig.6 and note 4 56 60 − dB PSRR power supply ripple rejection at pin 9 see Fig.11 25 30 − dB tuner gain current from 20 to 80% − 6 8 dB fpc = 38.9 MHz 0.35 0.55 0.75 µA/kHz fpc = 45.75 MHz 0.35 0.55 0.75 µA/kHz fpc = 58.75 MHz 0.35 0.55 0.75 Tuner AGC (pin 12) ∆GIF IF slip by automatic gain control AFC circuit (pin 13); see Fig.10 and note 5 S ∆fIF/∆T control steepness ∆I13/∆f frequency variation by temperature note 6 IAFC = 0; note 7 − − ±20 × µA/kHz 10−6 K−1 FM-PLL sound demodulator and AF output (pin 6); note 8 Vo(AF)(6)(rms) AF output signal voltage (RMS value) ±25 kHz (50% FM deviation); see Fig.13 375 500 625 mV S/NW(audio) weighted signal-to-noise ratio “CCIR 468-4”; see Fig.13 55 60 − dB α6 mute attenuation 70 75 − dB ∆V5 DC jump voltage of AF output terminal − ±50 ±175 mV 1999 Jun 04 FM-PLL in lock mode 9 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 Notes to the characteristics 1. Values of video and sound parameters are decreased at VP = 4.5 V. 2. Loop bandwidth BL = 70 kHz (natural frequency fn = 12 kHz; damping factor d ≈ 3; calculated with sync level within gain control range). Resonance circuit of VCO: Q0 > 50; Cext: see Table 3; Cint ≈ 8.5 pF (loop voltage approximately 2.7 V). 3. Vi(VIF) signal for nominal video signal. 4. S/N is the ratio of black to white amplitude to the black level noise voltage (RMS value, pin 9). B = 5 MHz weighted in accordance with “CCIR 567” at a source impedance of 50 Ω. 5. To match the AFC output signal to different tuning systems a current source output is provided (Fig.10). 6. Depending on the ratio ∆C/C0 of the LC resonant circuit of VCO (Q0 > 50; see note 2; C0 = Cint + Cext). 7. Temperature coefficient of external LC-circuit is equal to zero. 8. Input level for second IF from an external generator with 50 Ω source impedance. AC-coupled with 10 nF capacitor, fmod = 1 kHz, 25 kHz (50% FM deviation) of audio reference. A VIF/SIF input signal is not permitted. Pin 17 has to be connected to positive supply voltage. S/N and THD measurements are taken at 50 µs (75 µs at M standard) de-emphasis. 1999 Jun 04 10 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 CHARACTERISTICS (5 V SUPPLY) VP = 5 V; Tamb = 25 °C; see Table 1 for input frequencies and carrier ratios; input level Vi(VIF)(rms) = 10 mV (pins 1 and 2) (sync-level); Vi(SIF)(rms) = 4.5 mV (pins 19 and 20) (sound carrier); IF input from 50 Ω via broadband transformer 1 : 1; video modulation DSB; residual carrier: 10%; video signal in accordance with “NTC-7 Composite”; measurements taken in Fig.13; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply (pin 18) VP supply voltage IP supply current note 1 4.5 5 5.5 V 71 83 95 mA Vision IF amplifier (pins 1 and 2) Vi(rms) allowable overload input voltage (RMS value) note 2 − − 440 mV VI(max)(rms) maximum input signal voltage (RMS value) +1 dB video at output; see Fig.4 − − 140 mV Vi(VIF)(rms) VIF input signal voltage sensitivity (RMS value) −1 dB video at output; see Fig.4 − 60 100 µV ∆Vo(int) internal IF amplitude difference between picture and sound carrier within AGC range; M standard; ∆f = 4.5 MHz − 0.7 1 dB GIFcr IF gain control range see Fig.4 65 70 − dB Ri(diff) differential input resistance note 3 1.7 2.2 2.7 kΩ Ci(diff) differential input capacitance note 3 1.2 1.7 2.5 pF VI(1,2) DC input voltage note 3 − 3.4 − V True synchronous video demodulator; note 4 fVCO(max) maximum oscillator frequency for carrier regeneration f = 2fpc 125 130 − MHz ∆fosc/∆T oscillator drift as a function of temperature oscillator is free-running; IAFC = 0; note 5 − − ±20 × 10−6 K−1 ∆fosc/∆VP oscillator shift as a function of supply voltage oscillator is free-running; note 5 − − ±1500 × 10−6 V−1 VVCO(rms) oscillator voltage swing at pins 14 and 15 (RMS value) 50 80 110 mV fcr(pc) picture carrier capture range ±1.4 ±1.8 − MHz tacq acquisition time − − 30 ms Vi(IF)(rms) IF input signal voltage maximum IF gain; sensitivity for PLL to be locked note 7 (RMS value; pins 1 and 2) − 60 90 µV 1999 Jun 04 BL = 70 kHz; note 6 11 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator SYMBOL PARAMETER TDA9808 CONDITIONS MIN. TYP. MAX. UNIT Composite video amplifier (pin 9; sound carrier off) Vo(video)(p-p) output signal voltage (peak-to-peak value) V/S see Fig.8 1.2 1.35 1.5 ratio between video (black-to-white) and sync level 2.0 2.5 3.0 Vsync(9) sync voltage level 1.4 1.5 1.6 V Vclu(9) upper video clipping voltage level 3.3 3.45 − V Vcll(9) lower video clipping voltage level − 1.1 1.25 V Ro(9) output resistance − − 10 Ω Iint(9) internal DC bias current for emitter-follower 1.6 2.0 − mA Io(sink)(9)(max) maximum AC and DC output sink current 1.0 − − mA Io(source)(9)(max) maximum AC and DC output source current 2.0 − − mA note 3 V deviation of CVBS output signal voltage 50 dB gain control − − 0.5 dB 30 dB gain control − − 0.1 dB ∆Vo(bl) black level tilt gain variation; note 8 − − 1 % Gdiff differential gain “NTC-7 Composite” − 2 5 % ϕdiff differential phase “NTC-7 Composite” − 2 4 deg B−1 −1 dB video bandwidth CL < 30 pF; RL > 1.5 kΩ; AC load 5 6 − MHz B−3 −3 dB video bandwidth CL < 30 pF; RL > 1.5 kΩ; AC load 7 8 − MHz S/NW(video) weighted signal-to-noise ratio for video see Fig.6 and note 9 56 60 − dB S/N(video) unweighted signal-to-noise ratio for video see Fig.6 and note 9 49 53 − dB αIM(0.92) intermodulation attenuation at f = 0.92 MHz; see Fig.7 and note 10 58 64 − dB 60 66 − dB 58 64 − dB 59 65 − dB ∆Vo ‘blue’ ‘yellow’ αIM(2.76) intermodulation attenuation at ‘blue’ f = 2.76 MHz; see Fig.7 and note 10 ‘yellow’ VVC(rms) residual vision carrier (RMS value) fundamental wave and harmonics − 2 10 mV αH(sup) suppression of video signal harmonics note 11a 35 40 − dB αH(spur) spurious elements note 11b 40 − − dB PSRR power supply ripple rejection at pin 9 video signal; grey level; see Fig.11 25 30 − dB 1999 Jun 04 12 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator SYMBOL PARAMETER TDA9808 CONDITIONS MIN. TYP. MAX. UNIT VIF-AGC detector (pin 17) I17 tresp 55 75 95 µA discharging current note 8 1.0 1.4 1.8 µA AGC response to an increasing VIF step note 12 − 0.05 0.1 ms/dB − 2.2 3.5 ms/dB charging current AGC response to a decreasing VIF step Tuner AGC (pin 12) IF input signal voltage for minimum starting point of tuner takeover (RMS value) input at pins 1 and 2; RTOP = 22 kΩ; I12 = 0.4 mA − 2 5 mV IF input signal voltage for maximum starting point of tuner takeover (RMS value) input at pins 1 and 2; RTOP = 0 Ω; I12 = 0.4 mA 50 100 − mV tuner takeover point accuracy RTOP = 13 kΩ; I12 = 0.4 mA 6 − 14 mV Vo(12) permissible output voltage from external source; note 3 − − 13.2 V Vsat(12) saturation voltage I12 = 1.6 mA − − 0.2 V ∆VTOP(12)/∆T variation of takeover point by temperature I12 = 0.4 mA − 0.03 0.07 dB/K I12(sink) sink current see Fig.4 no tuner gain reduction; V12 = 13.2 V − − 5 µA maximum tuner gain reduction 1.5 2 2.6 mA − 6 8 dB Vi(rms) ∆GIF IF slip by automatic gain control tuner gain current from 20 to 80% AFC circuit (pin 13); see Fig.10 and note 13 S control steepness ∆I13/∆f note 14 fpc = 38.9 MHz 0.35 0.55 0.75 µA/kHz fpc = 45.75 MHz 0.35 0.55 0.75 µA/kHz fpc = 58.75 MHz 0.35 0.55 0.75 µA/kHz 10−6 K−1 ∆fIF/∆T frequency variation by temperature IAFC = 0; note 5 − Vo(13) output voltage upper limit see Fig.10 VP − 0.7 VP − 0.3 − V output voltage lower limit see Fig.10 − 0.3 0.7 V − ±20 × Io(source)(13) output source current 150 200 250 µA Io(sink)(13) output sink current 150 200 250 µA ∆I13(p-p) residual video modulation current (peak-to-peak value) − 20 30 µA 1999 Jun 04 13 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator SYMBOL PARAMETER TDA9808 CONDITIONS MIN. TYP. MAX. UNIT Sound IF amplifier (pins 19 and 20) Vi(SIF)(rms) input signal voltage sensitivity (RMS value) −1 dB at intercarrier output pin 10 − 50 100 µV Vi(max)(rms) maximum input signal voltage (RMS value) +1 dB at intercarrier output pin 10 40 110 − mV Gcr(SIF) SIF gain control range see Fig.5 60 66 − dB Ri(diff) differential input resistance note 3 1.7 2.2 2.7 kΩ Ci(diff) differential input capacitance note 3 1.2 1.7 2.5 pF VI(19,20) DC input voltage − 3.4 − V αSIF,VIF crosstalk attenuation between SIF and VIF input 50 − − dB between pins 1 and 2 and pins 19 and 20; note 15 SIF AGC detector (pin 5) Ich(5) charging current 3.5 5 6.5 µA Idch(5) discharging current 4.5 6 7.5 µA 100 125 mV 141 198 225 mV Single reference QSS intercarrier mixer (pin 10) Vo(rms) IF intercarrier output level (RMS value) Vo(peak) IF intercarrier output level (peak value) B−3 −3 dB intercarrier bandwidth upper limit 7.5 9 − MHz VSC(rms) residual sound carrier (RMS value) fundamental wave and harmonics − 2 5 mV VVC(rms) residual vision carrier (RMS value) fundamental wave and harmonics − 2 5 mV Ro(10) output resistance note 3 − − 25 Ω VO(10) DC output voltage − 2.0 − V Iint(10) DC internal bias current for emitter-follower 1.5 1.9 − mA Isink(max)(10) maximum AC and DC output sink current 1.2 1.6 − mA Isource(max)(10) maximum AC and DC output source current 2.0 2.5 − mA 1999 Jun 04 SC1; sound carrier 2 off 75 14 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator SYMBOL PARAMETER TDA9808 CONDITIONS MIN. TYP. MAX. UNIT Limiter amplifier (pin 11); note 16 Vi(FM)(rms) input signal voltage for lock-in (RMS value) Vi(FM)(rms) input signal voltage (RMS value) + N S - weighted = ------------N − − 100 µV − 300 400 µV 200 − − mV 40 dB allowed input signal voltage (RMS value) αAM AM suppression 50 µs de-emphasis; AM: f = 1 kHz; m = 0.3 refer to 25 kHz (50% FM deviation) 46 50 − dB Ri(11) input resistance note 3 480 600 720 Ω VI(11) DC input voltage − 2.8 − V upper limit 7.0 − − MHz lower limit − − 4.0 MHz upper limit 9.0 − − MHz lower limit − − 3.5 MHz − − 4 µs FM-PLL demodulator fcr catching range of PLL fhr holding range of PLL tacq acquisition time FM operation (M, N standard; pin 6); notes 16 and 16a Vo(AF)(6)(rms) AF output signal voltage (RMS value) 25 kHz (50% FM deviation); Rx = 0 Ω; see Fig.13 and note 17 400 500 600 mV Vo(AF)(6)(cl) AF output clipping signal voltage level THD < 1.5% 1.0 − 1.2 V ∆fAF frequency deviation THD < 1.5%; Rx = 0 Ω; note 17 − − ±53 kHz ∆Vo/∆T temperature drift of AF output signal voltage − 3 × 10−3 7 × 10−3 dB/K V7 DC voltage at decoupling capacitor voltage dependent on VCO frequency; note 18 1.2 − 3.0 V Ro(6) output resistance note 3 − − 100 Ω VO(6) DC output voltage − 2.3 − V Isink(max)(6) maximum AC and DC output sink current − − 1.1 mA Isource(max)(6) maximum AC and DC output source current − − 1.1 mA B−3 −3 dB audio frequency bandwidth 100 125 − kHz 1999 Jun 04 without de-emphasis capacitor 15 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator SYMBOL PARAMETER TDA9808 CONDITIONS MIN. TYP. MAX. UNIT THD total harmonic distortion 25 kHz (50% FM deviation) − 0.15 0.5 % S/NW(audio) weighted signal-to-noise ratio for audio FM-PLL only; with 75 µs de-emphasis; 25 kHz (50% FM deviation); “CCIR 468-4” 55 60 − dB VSC(rms) residual sound carrier (RMS value) fundamental wave and harmonics − − 75 mV α6 mute attenuation of AF signal 70 75 − dB ∆V6 DC jump voltage of AF output terminal for switching AF output to mute state and vice versa FM-PLL in lock mode − ±50 ±150 mV PSRR power supply ripple rejection at pin 6 Rx = 0 Ω; f = 70 Hz; see Figs 11 and 13 20 26 − dB Single reference QSS AF performance for FM operation (M standard); notes 19, 20 and 21; see Table 1 S/NW(audio) weighted signal-to-noise ratio for audio black picture 50 56 − dB white picture 47 53 − dB colour bar 45 51 − dB Notes to the characteristics 1. Values of video and sound parameters are decreased at VP = 4.5 V. 2. Level headroom for input level jumps during gain control setting. 3. This parameter is not tested during production and is only given as an application information for designing the television receiver. 4. Loop bandwidth BL = 70 kHz (natural frequency fn = 12 kHz; damping factor d ≈ 3; calculated with sync level within gain control range). Resonance circuit of VCO: Q0 > 50; Cext see Table 3; Cint ≈ 8.5 pF (loop voltage approximately 2.7 V). 5. Temperature coefficient of external LC-circuit is equal to zero. 6. Vi(IF)(rms) = 10 mV; ∆f = 1 MHz (VCO frequency offset related to picture carrier frequency); white picture video modulation. 7. Vi(VIF) signal for nominal video signal. 8. The leakage current of the AGC capacitor should not exceed 100 nA at M, N standard. Larger currents will increase the tilt. 9. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 9). B = 5 MHz weighted in accordance with “CCIR 567”. 10. The intermodulation figures are defined: V o at 3.58 MHz α 0.92 = 20 log ----------------------------------------- + 3.6 dB ; α0.92 value at 0.92 MHz referenced to black/white signal; V o at 0.92 MHz V o at 3.58 MHz α 2.76 = 20 log ----------------------------------------- ; α2.76 value at 2.76 MHz referenced to colour carrier. V o at 2.76 MHz 1999 Jun 04 16 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 11. Measurements taken with SAW filter M3951 (sound carrier suppression: 32 dB); loop bandwidth BL = 70 kHz: a) Modulation VSB; sound carrier off; fvideo > 0.5 MHz. b) Sound carrier on; SIF SAW filter M9352; fvideo = 10 kHz to 10 MHz. 12. Response speed valid for a VIF input level range of 200 µV up to 70 mV. 13. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is given in Fig.10. The AFC-steepness can be changed by the resistors at pin 13. 14. Depending on the ratio ∆C/C0 of the LC resonant circuit of VCO (Q0 > 50; see note 4; C0 = Cint + Cext). 15. Source impedance: 2.3 kΩ in parallel to 12 pF (SAW filter); fIF = 38.9 MHz. 16. Input level for second IF from an external generator with 50 Ω source impedance, AC-coupled with 10 nF capacitor, fmod = 400 Hz, 25 kHz (50% FM deviation) of audio reference. A VIF/SIF input signal is not permitted. Pins 5 and 17 have to be connected to positive supply voltage for minimum IF gain. S/N and THD measurements are taken at 75 µs de-emphasis (modulator pre-emphasis has to be activated). The FM demodulator steepness ∆Vo(AF)/∆fAF is positive. a) Second IF input level 10 mV RMS. 17. Measured at de-emphasis circuitry with an FM deviation of 25 kHz (fmod = 400 Hz) the typical AF output signal is 500 mV RMS (Rx = 0 Ω). By using Rx = 470 Ω the AF output signal is attenuated by 6 dB (250 mV RMS). For handling a frequency deviation of more than 53 kHz the AF output signal has to be reduced by using Rx in order to avoid clipping (THD < 1.5%). For an FM deviation up to 100 kHz an attenuation of 6 dB is recommended with Rx = 470 Ω. 18. The leakage current of the decoupling capacitor (22 µF) should not exceed 1 µA. 19. For all S/N measurements the used vision IF modulator has to meet the following specifications: a) Incidental phase modulation for black-to-white jump less than 0.5 degrees. b) QSS AF performance, measured with the television demodulator AMF2 (audio output, weighted S/N ratio) better than 60 dB (deviation 25 kHz) for 6 kHz sine wave black-to-white video modulation. c) Picture-to-sound carrier ratio; PC/SC1 = 7 dB (transmitter). 20. The PC/SC1 ratio is calculated as the addition to TV transmitter PC/SC1 ratio and SAW filter PC/SC1 ratio. This PC/SC1 ratio is necessary to achieve the S/NW(audio) values as noted. A different PC/SC1 ratio will change these values. 21. Measurements taken with SAW filter M3951 for vision IF (suppressed sound carrier, minimum 25 dB) and M9352 for sound IF (suppressed picture carrier). Input level Vi(SIF)(rms) = 10 mV, 25 kHz (50% FM deviation). Measurements in accordance with “CCIR 468-4”. Table 1 Input frequencies and carrier ratios SYMBOL DESCRIPTION fpc or fIF picture/IF carrier fSC1 sound carrier B/G STANDARD M, N STANDARD 38.9 45.75/58.75 fSC2 SC1 picture-to-sound carrier SC2 1999 Jun 04 17 UNIT MHz 33.4 41.25/54.25 MHz 33.158 − MHz 13 7 dB 20 − dB Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 MHA737 70 handbook, full pagewidth gain 0.06 (dB) 60 Vi(VIF)(rms) (mV) 50 0.6 40 Ituner (mA) 0 30 (1) 6 (2) (3) (4) 20 1 10 60 0 2 −10 1 (1) Ituner; RTOP = 22 kΩ. (2) Gain. 1.5 2 2.5 3 3.5 4 V17 (V) 4.5 (3) Ituner; RTOP = 11 kΩ. (4) Ituner; RTOP = 0 Ω. Fig.4 Typical VIF (pins 1 and 2) and tuner AGC characteristic. MHA738 110 handbook, full pagewidth 100 100 Vi(SIF)(rms) 90 (mV) (dBµV) 10 80 70 1 60 50 0.1 40 30 0.01 20 1 1.5 2 2.5 3 3.5 Fig.5 Typical SIF (pins 19 and 20) AGC characteristic. 1999 Jun 04 18 4 V5 (V) 4.5 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 MED684 75 handbook, halfpage S/N (dB) 3.2 dB handbook, halfpage 10 dB 13.2 dB 50 13.2 dB 21 dB 21 dB 25 SC CC PC SC CC BLUE PC YELLOW MHA739 0 −60 −40 −20 0 20 Vi (VIF)(rms)(dB) 0.06 Fig.6 0.6 6 10 60 600 Vi (VIF)(rms)(mV) SC = sound carrier, with respect to sync level. CC = chrominance carrier, with respect to sync level. PC = picture carrier, with respect to sync level. Typical signal-to-noise ratio as a function of IF input voltage. Fig.7 Input signal conditions. MHA741 10 handbook, halfpage (1) (dB) −10 (2) zero carrier level white level 3.0 V halfpage handbook, 2.85 V −30 1.85 V black level 1.5 V sync level −50 −70 M, N standard (3) MHA740 30 50 70 90 110 input voltage (dBµV) (1) Signal. (2) AM rejection. (3) Noise. Fig.8 Typical video signal levels on output pin 9 (sound carrier off). 1999 Jun 04 Fig.9 19 Typical audio level, noise and AM rejection (50% FM deviation). Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 5 VAFC handbook, full pagewidth 225 I13 (µA) 150 (V) VP = 5 V (source current) 3.75 VP = 5 V 75 22 kΩ TDA9808 13 I13 VAFC 2.5 0 22 kΩ −75 (sink current) 1.25 −150 MHA742 0 45.35 45.75 46.15 f (MHz) −225 a. VP = 5 V. 9 VAFC handbook, full pagewidth 150 I13 (µA) 100 (V) 7.5 VP = 9 V (source current) VP = 9 V 6 50 62 kΩ TDA9808 13 I13 VAFC 4.5 0 62 kΩ −50 3 (sink current) −100 1.5 MHA743 −150 0 45.35 45.75 46.15 f (MHz) b. VP = 9 V. Fig.10 Measurement conditions and typical AFC characteristic. 1999 Jun 04 20 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 handbook, full pagewidth VP = 5 V 100 mV (f ripple = 70 Hz) VP = 5 V TDA9808 MHA744 t Fig.11 Ripple rejection condition. 1999 Jun 04 21 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator handbook, full pagewidth TDA9808 140 10 120 video 1.35 V (p-p) 1 (1) 100 10−1 SAW insertion loss 14 dB antenna input (dBµV) IF signals RMS value (V) IF slip 6 dB 80 10−2 (TOP) tuning gain control range 70 dB VIF AGC 10−3 0.66 × 10−3 60 SAW insertion loss 14 dB 10−4 40 40 dB RF gain 10−5 0.66 × 10−5 20 10 VHF/UHF tuner VIF VIF amplifier, demodulator and video tuner SAW filter TDA9808 MHA745 (1) Depends on TOP. Fig.12 Front end level diagram. 1999 Jun 04 22 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 INTERNAL CIRCUITRY Table 2 Equivalent pin circuits and pin voltages PIN NO. PIN SYMBOL DC VOLTAGE (V) 1 Vi VIF1 3.4 2 Vi VIF2 3.4 EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT) + 1 1.1 kΩ 400 µA 1.1 kΩ + 2 800 Ω 400 µA 3.4 V MHA752 3 TADJ (TOP) 0 to 1.9 30 kΩ 3.6 V 20 kΩ 9 kΩ 3 1.9 V MHA753 4 TPLL 1.5 to 4.0 + + + + Ib + 4 VCO 200 µA MHA754 1999 Jun 04 23 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator PIN NO. 5 PIN SYMBOL CSAGC DC VOLTAGE (V) TDA9808 EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT) 1.5 to 4.0 + 15 µA 5 Ib + + 5 µA MHA755 6 Vo AF 2.3 + + 27.3 kΩ 6 25 pF 27.7 kΩ 120 Ω MHA756 7 CDEC 1.2 to 3.0 + + + 90 µA 7 1 kΩ MHA757 8 n.c. 1999 Jun 04 24 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator PIN NO. 9 PIN SYMBOL Vo(vid) DC VOLTAGE (V) TDA9808 EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT) sync level: 1.5 + 100 Ω 9 2.1 pF 2.0 mA MHA758 10 Vo QSS 2.0 + 150 Ω 1.9 mA 10 14.7 kΩ MHA759 11 Vi FM 2.65 400 Ω 11 640 Ω 40 kΩ 35 µA 2.65 V 600 µA MHA760 12 TAGC 0 to 13.2 12 MHA761 13 AFC 0.3 to VP − 0.3 + 13 + IAFC ±200 µA MHA762 1999 Jun 04 25 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator PIN NO. PIN SYMBOL DC VOLTAGE (V) 14 VCO1 2.7 15 VCO2 2.7 TDA9808 EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT) 420 Ω 420 Ω 50 Ω 14 2.8 V 15 500 µA MHA763 16 GND 0 17 CVAGC 1.5 to 4.0 40 µA 17 Ib 75 µA 1.4 µA MHA764 18 VP VP 19 Vi SIF1 3.4 20 Vi SIF2 3.4 + 19 + 100 µA 1.1 kΩ 250 µA 5 kΩ 10 kΩ 1.8 V 1.1 kΩ + 20 800 Ω 250 µA 3.4 V MHA765 1999 Jun 04 26 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 22 kΩ 100 nF 10 nF 1:1 1 SIF input CVAGC 5 22 kΩ tuner AGC-output GND (1) 50 Ω 2 4 5.6 kΩ 220 nF Vi FM 3 20 19 18 17 16 15 14 13 12 11 27 mute switch TDA9808 1 2 3 4 5 6 7 8 9 1:1 1 VIF input 50 Ω 5 2 330 Ω 4 3 100 nF 22 kΩ 220 nF 15 nF 10 nF 4.7 kΩ (2) 22 µF 10 Vo QSS n.c. Rx(3) Philips Semiconductors AFC Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TEST AND APPLICATION INFORMATION 1999 Jun 04 VP Vo(vid) 1.35 V (p-p) 560 Ω 4.5 MHz(4) MHA746 Fig.13 Test circuit. CDEC Product specification See Table 3. De-emphasis circuitry for 75 µs. See note 17 of Chapter “Characteristics (5 V supply)”. Depends on TV standard. CSAGC Vo AF TDA9808 (1) (2) (3) (4) TPLL handbook, full pagewidth TADJ This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 22 kΩ 100 nF 10 nF IF input CVAGC SAW FILTER M9352 22 kΩ tuner AGC-output GND (2) 5.6 kΩ 220 nF Vi FM SIF (1) 19 20 18 17 16 14 15 13 12 11 28 mute switch TDA9808 2 1 3 4 5 6 7 8 9 VIF 50 Ω SAW FILTER M3951 (1) 100 nF 330 Ω 22 kΩ 220 nF 15 nF 10 nF 4.7 kΩ (3) 22 µF 10 Vo QSS n.c. Rx(4) Philips Semiconductors AFC Single standard VIF-PLL with QSS-IF and FM-PLL demodulator 1999 Jun 04 VP Vo(vid) 1.35 V (p-p) 560 Ω 4.5 MHz(1) MHA747 Fig.14 Application circuit. CDEC Product specification Depends on TV standard. See Table 3. De-emphasis circuitry for 75 µs. See note 17 of Chapter “Characteristics (5 V supply)”. CSAGC Vo AF TDA9808 (1) (2) (3) (4) TPLL handbook, full pagewidth TADJ Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator Table 3 TDA9808 Oscillator circuit for the different TV standards PARAMETER EUROPE USA JAPAN IF frequency 38.9 MHz 45.75 MHz 58.75 MHz VCO frequency 77.8 MHz 91.5 MHz 117.5 MHz 14 14 Oscillator circuit (1) (2) 15 (1) (3) 14 (2) 15 MHA766 (1) CVCO = 8.5 pF. (2) C = 8.2 ±0.25 pF. (3) L = 251 nH. (3) MHA766 (1) CVCO = 8.5 pF. (2) C = 10 ±0.25 pF. (3) L = 163 nH. (1) (2) 15 (3) MHA766 (1) CVCO = 8.5 pF. (2) C = 15 ±0.25 pF. (3) L = 78 nH. e.g. Toko coil 5KM 369SNS-2010Z 5KMC V369SCS-2370Z MC139 NE545SNAS100108 Philips ceramic capacitor 2222 632 51828 inside of coil 15 pF SMD; size = 0805 1999 Jun 04 29 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 PACKAGE OUTLINES DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.0 0.25 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 (1) E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 1999 Jun 04 REFERENCES IEC JEDEC EIAJ SC603 30 EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-05-24 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC 1999 Jun 04 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 31 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE • For packages with leads on two sides and a pitch (e): The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Surface mount packages REFLOW SOLDERING MANUAL SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 1999 Jun 04 When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 32 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator TDA9808 Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD MOUNTING PACKAGE WAVE REFLOW(1) DIPPING Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable(2) − suitable Surface mount not suitable suitable − suitable − suitable − not recommended(4)(5) suitable − not recommended(6) suitable − BGA, SQFP suitable(3) HLQFP, HSQFP, HSOP, HTSSOP, SMS not PLCC(4), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Jun 04 33 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator NOTES 1999 Jun 04 34 TDA9808 Philips Semiconductors Product specification Single standard VIF-PLL with QSS-IF and FM-PLL demodulator NOTES 1999 Jun 04 35 TDA9808 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. 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Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com © Philips Electronics N.V. 1999 SCA 65 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545004/06/pp36 Date of release: 1999 Jun 04 Document order number: 9397 750 05973