TIC236 SERIES SILICON TRIACS Copyright © 2000, Power Innovations Limited, UK ● High Current Triacs ● 12 A RMS ● Glass Passivated Wafer ● 400 V to 800 V Off-State Voltage ● Max IGT of 50 mA (Quadrants 1 - 3) DECEMBER 1971 - REVISED JUNE 2000 TO-220 PACKAGE (TOP VIEW) MT1 1 MT2 2 G 3 Pin 2 is in electrical contact with the mounting base. MDC2ACA absolute maximum ratings over operating case temperature (unless otherwise noted) RATING SYMBOL VALUE TIC236D TIC236M Repetitive peak off-state voltage (see Note 1) TIC236S UNIT 400 600 VDRM V 700 TIC236N 800 IT(RMS) 12 Peak on-state surge current full-sine-wave at (or below) 25°C case temperature (see Note 3) ITSM 100 A Peak gate current IGM ±1 A Operating case temperature range TC -40 to +110 °C Storage temperature range Tstg -40 to +125 °C TL 230 °C Full-cycle RMS on-state current at (or below) 70°C case temperature (see Note 2) Lead temperature 1.6 mm from case for 10 seconds A NOTES: 1. These values apply bidirectionally for any value of resistance between the gate and Main Terminal 1. 2. This value applies for 50-Hz full-sine-wave operation with resistive load. Above 70°C derate linearly to 110°C case temperature at the rate of 300 mA/°C. 3. This value applies for one 50-Hz full-sine-wave when the device is operating at (or below) the rated value of peak reverse voltage and on-state current. Surge may be repeated after the device has returned to original thermal equilibrium. electrical characteristics at 25°C case temperature (unless otherwise noted) PARAMETER IDRM IGT VGT VT IH TEST CONDITIONS Repetitive peak VD = Rated VDRM off-state current IG = 0 MIN TYP TC = 110°C MAX UNIT ±2 mA Vsupply = +12 V† RL = 10 Ω tp(g) > 20 µs 12 50 Gate trigger Vsupply = +12 V† RL = 10 Ω tp(g) > 20 µs -19 -50 current Vsupply = -12 V† RL = 10 Ω tp(g) > 20 µs -16 -50 Vsupply = -12 V† RL = 10 Ω tp(g) > 20 µs 34 Vsupply = +12 V† RL = 10 Ω tp(g) > 20 µs 0.8 2 Gate trigger Vsupply = +12 V† RL = 10 Ω tp(g) > 20 µs -0.8 -2 voltage Vsupply = -12 V† RL = 10 Ω tp(g) > 20 µs -0.8 -2 Vsupply = -12 V† RL = 10 Ω tp(g) > 20 µs 0.9 2 ITM = ±17 A IG = 50 mA (see Note 4) ±1.4 ±2.1 Vsupply = +12 V† IG = 0 Init’ ITM = 100 mA 22 40 Vsupply = -12 V† IG = 0 Init’ ITM = -100 mA -12 -40 On-state voltage Holding current mA V V mA † All voltages are with respect to Main Terminal 1. NOTE 4: This parameter must be measured using pulse techniques, tp = ≤ 1 ms, duty cycle ≤ 2 %. Voltage-sensing contacts separate from the current carrying contacts are located within 3.2 mm from the device body. PRODUCT INFORMATION Information is current as of publication date. Products conform to specifications in accordance with the terms of Power Innovations standard warranty. Production processing does not necessarily include testing of all parameters. 1 TIC236 SERIES SILICON TRIACS DECEMBER 1971 - REVISED JUNE 2000 electrical characteristics at 25°C case temperature (unless otherwise noted) (continued) PARAMETER IL TEST CONDITIONS Vsupply = +12 V† Latching current off-state voltage dv/dt(c) di/dt TYP VD = Rated VD UNIT MAX 80 (see Note 5) Vsupply = -12 V† Critical rate of rise of dv/dt MIN mA -80 IG = 0 TC = 110°C Critical rise of VD = Rated VD TC = 80°C commutation voltage di/dt = 0.5 IT(RMS)/ms IT = 1.4 IT(RMS) Critical rate of rise of VD = Rated VD on -state current diG/dt = 50 mA/µs IGT = 50 mA ±1.2 TC = 110°C ±400 V/µs ±9 V/µs ±100 A/µs † All voltages are with respect to Main Terminal 1. NOTE 5: The triacs are triggered by a 15-V (open-circuit amplitude) pulse supplied by a generator with the following characteristics: RG = 100 Ω, tp(g) = 20 µs, tr = ≤ 15 ns, f = 1 kHz. thermal characteristics PARAMETER RθJC Junction to case thermal resistance RθJA Junction to free air thermal resistance MIN TYP MAX UNIT 2 °C/W 62.5 °C/W TYPICAL CHARACTERISTICS GATE TRIGGER VOLTAGE vs GATE TRIGGER CURRENT vs IGT - Gate Trigger Current - mA 100 10 1 0·1 -60 Vsupply IGTM + + + + -40 -20 VAA = ± 12 V 0 20 40 60 80 100 Vsupply IGTM + + + + VAA = ± 12 V } 120 INFORMATION TC08AB 1 tp(g) = 20 µs Figure 1. 2 10 RL = 10 Ω TC - Case Temperature - °C PRODUCT CASE TEMPERATURE TC08AA VGT - Gate Trigger Voltage - V CASE TEMPERATURE 1000 0·1 -60 -40 -20 RL = 10 Ω tp(g) = 20 µs 0 20 40 60 80 TC - Case Temperature - °C Figure 2. 100 120 TIC236 SERIES SILICON TRIACS DECEMBER 1971 - REVISED JUNE 2000 TYPICAL CHARACTERISTICS HOLDING CURRENT vs LATCHING CURRENT vs CASE TEMPERATURE 10 1 Vsupply 1000 -40 10 Vsupply IGTM Initiating ITM = 100 mA -20 0 20 40 60 80 100 120 TC - Case Temperature - °C Figure 3. PRODUCT TC08AE 100 VAA = ± 12 V IG = 0 + 0.1 -60 CASE TEMPERATURE TC08AD IL - Latching Current - mA IH - Holding Current - mA 100 1 -60 + + -40 + + VAA = ± 12 V -20 0 20 40 60 80 100 120 TC - Case Temperature - °C Figure 4. INFORMATION 3 TIC236 SERIES SILICON TRIACS DECEMBER 1971 - REVISED JUNE 2000 MECHANICAL DATA TO-220 3-pin plastic flange-mount package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. TO-220 4,70 4,20 ø 10,4 10,0 3,96 3,71 1,32 1,23 2,95 2,54 6,6 6,0 15,32 14,55 18,0 TYP. 6,1 5,6 1,47 1,07 0,97 0,66 1 2 14,1 12,7 3 2,74 2,34 5,28 4,68 ALL LINEAR DIMENSIONS IN MILLIMETERS NOTE A: The centre pin is in electrical contact with the mounting tab. PRODUCT 4 INFORMATION 0,64 0,41 2,90 2,40 TIC236 SERIES SILICON TRIACS DECEMBER 1971 - REVISED JUNE 2000 IMPORTANT NOTICE Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the information being relied on is current. PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except as mandated by government requirements. PI accepts no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor is any license, either express or implied, granted under any patent right, copyright, design right, or other intellectual property right of PI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS. Copyright © 2000, Power Innovations Limited PRODUCT INFORMATION 5