TI TMS470R1VF348APZ-T

TMS470R1VF338, TMS470R1VF348, TMS470R1VF3382, TMS470R1VF3482
16/32-BIT RISC FLASH MICROCONTROLLERS
SPNS077J – NOVEMBER 2001 – REVISED AUGUST 2006
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High-Performance Static CMOS Technology
TMS470R1x 16/32-Bit RISC Core (ARM7TDMI™)
– 24-MHz System Clock (48-MHz Pipeline
Mode)
– Independent 16/32-Bit Instruction Set
– Open Architecture With Third-Party Support
– Built-In Debug Module
– Utilizes Big-Endian Format
– Class II Serial Interface (C2SIb)
– Two Selectable Data Rates
– Normal Mode 10.4 Kbps and 4X Mode
41.6 Kbps
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High-End Timer (HET)
– 27 Programmable I/O Channels (VF338x):
– 23 High-Resolution Pins
– 4 Standard-Resolution Pins
– 16 Programmable I/O Channels (VF348x):
– 14 High-Resolution Pins
– 2 Standard-Resolution Pins
– High-Resolution Share Feature (XOR)
– High-End Timer RAM
– 64-Instruction Capacity
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10-Bit Multi-Buffered ADC (MibADC)
12-Channel (VF338x)
16-Channel (VF348x)
– 64-Word FIFO Buffer
– Single- or Continuous-Conversion Modes
– 1.55 μs Minimum Sample and Conversion
Time
– Calibration Mode and Self-Test Features
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Eight External Interrupts
470+ System Module
– 32-Bit Address Space Decoding
– Bus Supervision for Mem and Peripherals
– Analog Watchdog (AWD) Timer
– Real-Time Interrupt (RTI)
– System Integrity and Failure Detection
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Flexible Interrupt Handling
5 Dedicated General-Purpose I/O (GIO) Pins,
1 Input-Only GIO Pin, and 48 Additional
Peripheral I/Os (VF338x)
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11 Dedicated GIO Pins,1 Input-Only GIO Pin,
and 38 Additional Peripheral I/Os (VF348x)
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Zero-Pin Phase-Locked Loop (ZPLL)-Based
Clock Module With Prescaler
– Multiply-by-4 or -8 Internal ZPLL Option
– ZPLL Bypass Mode
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External Clock Prescale (ECP) Module
– Programmable Low-Frequency External
Clock (CLK)
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Six Communication Interfaces:
– Two Serial Peripheral Interfaces (SPIs)
– 255 Programmable Baud Rates
– Two Serial Communications Interfaces
(SCIs)
– 224 Selectable Baud Rates
– Asynchronous/Isosynchronous Modes
– Standard CAN Controller (SCC)
– 16-Mailbox Capacity
– Fully Compliant With CAN Protocol,
Version 2.0B
Compatible ROM Device
On-Chip Scan-Base Emulation Logic,
IEEE Standard 1149.1† (JTAG) Test-Access Port
100-Pin Plastic Low-Profile Quad Flatpack
(PZ Suffix)
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Integrated Memory
– 256K-Byte Program Flash
– One Bank With 14 Contiguous Sectors
– Internal State Machine for Programming
and Erase
– 10K-Byte Static RAM (SRAM) (VF3x8)
– 12K-Byte Static RAM (SRAM) (VF3x82)
Operating Features
– Core Supply Voltage (VCC): 1.81 V - 2.06 V
– Core Supply Voltage (VCC): 1.70 V - 2.06 V for
VF3x8xE when used from - 40C to 85C
– I/O Supply Voltage (VCCIO): 3.0 V - 3.6 V
– Low-Power Modes: STANDBY and HALT
– Industrial and Automotive Temperature
Ranges
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Development System Support Tools Available
– Code Composer Studio™ Integrated Development Environment (IDE)
– HET Assembler and Simulator
– Real-Time In-Circuit Emulation
– Flash Programming
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are property of their respective owners.
Code Composer Studio is a trademark of Texas Instruments.
ARM7TDMI is a trademark of Advanced RISC Machines Limited (ARM).
† The test-access port is compatible with the IEEE Standard 1149.1-1990, IEEE Standard Test-Access Port and Boundary Scan Architecture
specification. Boundary scan is not supported on this device.
Copyright © 2006, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication
date. Products conform to specifications per the Texas
Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251-1443
1
TMS470R1VF338, TMS470R1VF348, TMS470R1VF3382, TMS470R1VF3482
16/32-BIT RISC FLASH MICROCONTROLLERS
SPNS077J – NOVEMBER 2001 – REVISED AUGUST 2006
PLLDIS
TDI
TDO
TCK
HET[8]
HET[9]
VCCIO
VSSIO
CLKOUT
CANSRX
CANSTX
SCI1CLK
SCI1TX
SCI1RX
VSS
VCC
ADIN[7]
ADEVT
ADIN[6]
ADIN[5]
ADIN[4]
ADIN[3]
ADIN[2]
ADIN[1]
ADIN[0]
TMS470R1VF338x 100-PIN PZ PACKAGE (TOP VIEW)
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
HET[20]
ADREFHI
80
46
HET[21]
ADREFLO
VCCAD
81
45
HET[22]
82
44
SPI2ENA
VSSAD
83
43
SPI2SOMI
TMS
84
42
SPI2SIMO
TMS2
85
41
SPI2CLK
VSS
86
40
VCC
VCC
87
39
VSS
HET[0]
88
38
C2SIbRX
HET[1]
89
37
C2SIbTX
VSS
90
36
C2SIbLPN
VCC
91
35
HET[24]
FLTP2
92
34
HET[31]
FLTP1
93
33
HET[30]
VCCP
94
32
HET[29]
HET[2]
95
31
SCI2TX
HET[3]
96
30
SCI2RX
HET[4]
97
29
GIOA[1]/INT[1]/ECLK
HET[5]
98
28
GIOA[0]/INT0†
HET[6]
99
27
TEST
HET[7]
100
26
TRST
† GIOA[0]/INT0 (pin 28) is an input-only GIO pin.
2
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251-1443
GIOA[4]/INT4
GIOA[5]/INT5
GIOA[6]/INT6
GIOA[7]/INT7
HET[10]
PORRST
HET[11]
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
HET[12]
9
HET[13]
8
HET[14]
7
HET[15]
6
HET[16]
5
HET[17]
4
VCCIO
3
RST
2
VSSIO
1
VCC
ADIN[8]
47
OSCIN
HET[19]
79
OSCOUT
48
VSS
78
SPI1CLK
HET[18]
ADIN[9]
SPI1SOMI
AWD
49
SPI1SIMO
50
77
SPI1ENA
76
ADIN[10]
SPI1SCS
ADIN[11]
TMS470R1VF338, TMS470R1VF348, TMS470R1VF3382, TMS470R1VF3482
16/32-BIT RISC FLASH MICROCONTROLLERS
SPNS077J – NOVEMBER 2001 – REVISED AUGUST 2006
PLLDIS
TDI
TDO
TCK
HET[8]
VCCIO
VSSIO
CANSRX
CLKOUT
CANSTX
SCI1TX
SCI1CLK
SCI1RX
VSS
VCC
ADIN[7]
ADEVT
ADIN[6]
ADIN[5]
ADIN[15]
ADIN[4]
ADIN[3]
ADIN[2]
ADIN[1]
ADIN[0]
TMS470R1VF348x 100-PIN PZ PACKAGE (TOP VIEW)
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
79
ADIN[9]
80
46
HET[21]
ADIN[12]
ADIN[8]
81
45
SPI2SCS
82
44
SPI2ENA
ADREFHI
83
43
SPI2SOMI
ADREFLO
84
42
SPI2SIMO
VCCAD
85
41
SPI2CLK
VSSAD
86
40
VCC
TMS
87
39
VSS
TMS2
88
38
C2SIbRX
VSS
89
37
C2SIbTX
VCC
90
36
C2SIbLPN
HET[0]
91
35
HET[24]
VSS
92
34
HET[31]
VCC
93
33
SCI2TX
FLTP2
94
32
SCI2RX
FLTP1
95
31
GIOA[3]/INT3
VCCP
96
30
GIOA[2]/INT2
HET[2]
97
29
GIOA[1]/INT1/ECLK
HET[4]
98
28
GIOA[0]/INT0†
HET[6]
99
27
TEST
HET[7]
100
26
TRST
GIOA[4]/INT4
GIOA[5]/INT5
GIOA[6]/INT6
PORRST
GIOA[7]/INT7
HET[10]
HET[11]
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
HET[12]
9
GIOB[0]
8
HET[13]
7
GIOB[1]
6
GIOB[2]
5
GIOB[3]
4
VSSIO
3
VCCIO
2
RST
1
VCC
ADIN[13]
HET[20]
OSCIN
HET[19]
47
OSCOUT
48
VSS
78
SPI1CLK
HET[18]
ADIN[10]
SPI1SOMI
AWD
49
SPI1SIMO
50
77
SPI1ENA
76
ADIN[14]
SPI1SCS
ADIN[11]
† GIOA[0]/INT0 (pin 28) is an input-only GIO pin.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251-1443
3
TMS470R1VF338, TMS470R1VF348, TMS470R1VF3382, TMS470R1VF3482
16/32-BIT RISC FLASH MICROCONTROLLERS
SPNS077J – NOVEMBER 2001 – REVISED AUGUST 2006
description
The TMS470R1VF338, TMS470R1VF348, TMS470R1VF3382, and TMS470R1VF3482† devices are members of the Texas Instruments TMS470R1x family of general-purpose16/32-bit reduced instruction set computer
(RISC) microcontrollers. The VF3x8x microcontroller offers high performance utilizing the high-speed
ARM7TDMI 16/32-bit RISC central processing unit (CPU), resulting in a high instruction throughput while
maintaining greater code efficiency. The ARM7TDMI 16/32-bit RISC CPU views memory as a linear collection
of bytes numbered upwards from zero. The TMS470R1VF3x8x utilizes the big-endian format where the most
significant byte of a word is stored at the lowest numbered byte and the least significant byte at the highest
numbered byte.
High-end embedded control applications demand more performance from their controllers while maintaining
low costs. The VF3x8x RISC core architecture offers solutions to these performance and cost demands while
maintaining low power consumption.
The VF338/VF348/VF3382/VF3482 device contains the following:
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ARM7TDMI 16/32-Bit RISC CPU
TMS470R1x system module (SYS) with 470+ enhancements
256K-byte flash
10K-byte SRAM (VF3x8)
12K-byte SRAM (VF3x82)
Zero-pin phase-locked loop (ZPLL) clock module
Analog watchdog (AWD) timer
Real-time interrupt (RTI) module
Two serial peripheral interface (SPI) modules
Two serial communications interface (SCI) modules
Standard CAN controller (SCC)
Class II serial interface (C2SIb)
10-bit multi-buffered analog-to-digital converter (MibADC), 12-input channels (VF338x), 16-input channels
(VF348x)
High-end timer (HET) controlling 27 I/Os (VF338x), controlling 16 I/Os (VF348x)
External Clock Prescale (ECP)
Up to 53 I/O pins and 1 input-only pin (VF338x), up to 49 I/O pins and 1 input-only pin (VF348x)
The functions performed by the 470+ system module (SYS) include: address decoding; memory protection;
memory and peripherals bus supervision; reset and abort exception management; prioritization for all internal
interrupt sources; device clock control; and parallel signature analysis (PSA). This data sheet includes devicespecific information such as memory and peripheral select assignment, interrupt priority, and a device memory
map. For a more detailed functional description of the SYS module, see the TMS470R1x System Module
Reference Guide (literature number SPNU189).
The VF3x8x memory includes general-purpose SRAM supporting single-cycle read/write accesses in byte,
half-word, and word modes.
The flash memory on this device is a nonvolatile, electrically erasable and programmable memory implemented
with a 32-bit-wide data bus interface.The flash operates with a system clock frequency of up to 24 MHz. In
pipeline mode, the flash operates with a system clock frequency of up to 48 MHz. For more detailed information
on the flash, see the flash section of this data sheet and the TMS470R1x F05 Flash Reference Guide (literature
number SPNU213).
† Throughout the remainder of this document, the TMS470R1VF338, TMSVF348, TMS470R1VF3382 and TMS470R1VF3482 device names,
where generic, shall be referred to as TMS470R1VF3x8x or VF3x8x; where applicable to only the 10K SRAM devices, VF3x8; where applicable
to only the 12K SRAM devices, VF3x82; where applicable to only VF338 and VF3382 as VF338x; where applicable to only VF348 and VF3482
as VF348x;and, where unique, shall be referred to as either their full device name or VF338 or VF348 or VF3382 or VF3482.
4
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251-1443
TMS470R1VF338, TMS470R1VF348, TMS470R1VF3382, TMS470R1VF3482
16/32-BIT RISC FLASH MICROCONTROLLERS
SPNS077J – NOVEMBER 2001 – REVISED AUGUST 2006
description (continued)
The VF3x8x device has six communication interfaces: two SPIs, two SCIs, an SCC, and a C2SIb. The SPI
provides a convenient method of serial interaction for high-speed communications between similar shift-register
type devices. The SCI is a full-duplex, serial I/O interface intended for asynchronous communication between
the CPU and other peripherals using the standard Non-Return-to-Zero (NRZ) format. The SCC uses a serial,
multimaster communication protocol that efficiently supports distributed real-time control with robust
communication rates of up to 1 megabit per second (Mbps). The SCC is ideal for applications operating in noisy
and harsh environments (e.g., automotive and industrial fields) that require reliable serial communication or
multiplexed wiring. The C2SIb allows the VF3x8x to transmit and receive messages on a class II network
following an SAE J1850† standard. For more detailed functional information on the SPI, SCI, and SCC peripherals, see the specific reference guides (literature numbers SPNU195, SPNU196, and SPNU197, respectively).
For more detailed functional information on the C2SIb peripheral, see the TMS470R1x Class II Serial Interface
B (C2SIb) Reference Guide (literature number SPNU214).
The HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications.
The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and
an attached I/O port. The HET can be used for compare, capture, or general-purpose I/O. It is especially well
suited for applications requiring multiple sensor information and drive actuators with complex and accurate
time pulses. For more detailed functional information on the HET, see the TMS470R1x High-End Timer (HET)
Reference Guide (literature number SPNU199).
The VF3x8x device has a 10-bit-resolution sample-and-hold MibADC. The MibADC channels can be converted
individually or can be grouped by software for sequential conversion sequences. There are three separate
groupings, two of which are triggerable by an external event. Each sequence can be converted once when
triggered or configured for continuous conversion mode. For more detailed functional information on the MibADC, see the TMS470R1x Multi-Buffered Analog-to-Digital Converter (MibADC) Reference Guide (literature
number SPNU206).
The zero-pin phase-locked loop (ZPLL) clock module contains a phase-locked loop, a clock-monitor circuit, a
clock-enable circuit, and a prescaler (with prescale values of 1–8). The function of the ZPLL is to multiply the
external frequency reference to a higher frequency for internal use. The ZPLL provides ACLK‡ to the system
(SYS) module. The SYS module subsequently provides system clock (SYSCLK), real-time interrupt clock
(RTICLK), CPU clock (MCLK), and peripheral interface clock (ICLK) to all other VF3x8x device modules. For
more detailed functional information on the ZPLL, see the TMS470R1x Zero-Pin Phase Locked Loop (ZPLL)
Clock Module Reference Guide (literature number SPNU212).
The VF3x8x device also has an external clock prescaler (ECP) module that when enabled, outputs a continuous
external clock (ECLK) on a specified GIO pin. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (ICLK) frequency. For more detailed functional information on the ECP, see the
TMS470R1x External Clock Prescaler (ECP) Reference Guide (literature number SPNU202).
device characteristics
The TMS470R1VF3x8x device is a derivative of the F05 system emulation device SE470R1VB8AD. Table 1
identifies all the characteristics of the TMS470R1VF3x8x device except the SYSTEM and CPU, which are
generic. The COMMENTS column aids the user in software-programming and references device-specific information.
† SAE Standard J1850 Class B Data Communication Network Interface
‡ ACLK should not be confused with the MibADC internal clock, ADCLK. ACLK is the continuous system clock from an external resonator/crystal
reference.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251-1443
5
TMS470R1VF338, TMS470R1VF348, TMS470R1VF3382, TMS470R1VF3482
16/32-BIT RISC FLASH MICROCONTROLLERS
SPNS077J – NOVEMBER 2001 – REVISED AUGUST 2006
device characteristics (continued)
Table 1. Device Characteristics
CHARACTERISTICS
DEVICE DESCRIPTION
TMS470R1VF338X
DEVICE DESCRIPTION
TMS470R1VF348X
COMMENTS FOR VF3X8X
MEMORY
For the number of memory selects on this device, see the Memory Selection Assignment table (Table 2).
Flash is pipeline-capable
256K-Byte Flash
INTERNAL
MEMORY
10K-Byte SRAM (VF338)
12K-Byte SRAM (VF3382)
256K-Byte Flash
The VF3x8 RAM is implemented in one 10K array
selected by two memory-select signals. The VF3x82
10K-Byte SRAM (VF348)
RAM is implemented in one 12K array selected by two
12K-Byte SRAM (VF3482)
memory-select signals. (See the Memory Selection
Assignment table, Table 2).
PERIPHERALS
For the device-specific interrupt priority configurations, see the Interrupt Priority table (Table 4). And for the 1K peripheral address ranges and
their peripheral selects, see the VF338/VF348x Peripherals, System Module, and Flash Base Addresses table (Table 3).
CLOCK
ZPLL
ZPLL
GENERAL-PURPOSE
I/Os
5 I/O
1 Input only
11 I/O
1 Input only
ECP
YES
YES
C2SIb
1
1
SCI
1 (3-pin)
1 (2-pin)
1 (3-pin)
1 (2-pin)
CAN
(HECC and/or SCC)
1 SCC
1 SCC
SPI
(5-pin, 4-pin or 3-pin)
1 (5-pin)
1 (4-pin)
2 (5-pin)
Zero-pin PLL has no external loop filter pins.
Port A has six (6) external pins
(VF338x – GIOA[2]/INT2 and GIOA[3]/INT3 are not
available.)
Port A has eight (8) external pins and Port B has four (4)
external pins (VF348x)
SCI2 has no external clock pin, only transmit/receive pins
(SCI2TX and SCI2RX)
Standard CAN controller
VF338x SPI1 (5-pin), SPI2 (4-pin)
SPI2 has no chip select pin
The VF338x and VF348x devices have both the logic and
registers for a full 32-I/O HET implemented, even though
not all 32 pins are available externally.
6
The high-resolution (HR) SHARE feature allows even HR
pins to share the next higher odd HR pin structures. This
HR sharing is independent of whether or not the odd pin
is available externally. If an odd pin is available externally
and shared, then the odd pin can only be used as a
general-purpose I/O. For more information on HR
SHARE, see the TMS470R1x High-End Timer (HET)
Reference Guide (literature number SPNU199).
HET with
XOR Share
27 I/O
16 I/O
HET RAM
64-Instruction Capacity
64-Instruction Capacity
MibADC
10-bit, 12-channel
64-word FIFO
10-bit, 16-channel
64-word FIFO
12-channel MibADC (VF338x), 16-channel MibADC
(VF348x). Both the logic and registers for a full
16-channel MibADC are present. Capable of being event
triggered from a user-selectable event source.
CORE VOLTAGE
1.81 - 2.06 V (see note)
1.81 - 2.06 V (see note)
When used from -40C to 85C, the core voltage range for
VF3x8xE devices is 1.70 - 2.06 V
I/O VOLTAGE
3.0 - 3.6 V
3.0 - 3.6 V
PINS
100
100
PACKAGE
PZ
PZ
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251-1443
TMS470R1VF338, TMS470R1VF348, TMS470R1VF3382, TMS470R1VF3482
16/32-BIT RISC FLASH MICROCONTROLLERS
SPNS077J – NOVEMBER 2001 – REVISED AUGUST 2006
functional block diagram
External Pins
VCCP
FLTP1
FLTP2
OSCIN
RAM
(10K Bytes) (VF3x8)
(12K Bytes) (VF3x82)
FLASH
(256K Bytes)
14 Sectors
ZPLL
PLLDIS
ADIN[11:0]†
CPU Address/Data Bus
MibADC
with
64-Word
FIFO
TRST
TMS470R1x
CPU
TCK
ADEVT
ADREFHI
ADREFLO
VCCAD
VSSAD
TDI
TMS
TMS470R1x 470+ SYSTEM MODULE
RST
AWD
TEST
PORRST
Expansion Address/Data Bus
TDO
TMS2
OSCOUT
Crystal
External Pins
CLKOUT
HET with
XOR Share
(64-Word)
SCC
HET [31:29, 24]‡
HET[22:0]‡
CANSTX
CANSRX
SCI1CLK
SCI1
SCI1TX
SCI1RX
SCI2
SCI2TX
SCI2RX
C2SIbTX
C2SIb
C2SIbRX
SPI2
SPI1
SPI1SCS
SPI1ENA
SPI1SIMO
SPI1SOMI
SPI1CLK
ECP
GIO
GIOA[0]/INT[0]¶
GIOA[2:7]/
INT[2:7]#
GIOB[3:0]#
GIOA[1]/INT[1]/
ECLK
SPI2SCS§
SPI2ENA
SPI2SIMO
SPI2SOMI
SPI2CLK
C2SIbLPN
† ADIN[11:0] for VF338x and ADIN[15:0] for VF348.
‡ HET[31:29, 24] and HET[22:0] for VF338, HET[31, 24] and HET[21:18, 13:10, 8, 7, 6, 4, 2, 0] for VF348.
§ The SPI2 chip select pin (SPI2SCS) is only applicable to the VF348x device.
¶ GIOA[0]/INT[0] is an input-only GIO pin.
# GIOA[2]/INT[2], GIOA[3]/INT[3], and GIOB[3:0] pins are not applicable to the VF338x device.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251-1443
7
TMS470R1VF338, TMS470R1VF348, TMS470R1VF3382, TMS470R1VF3482
16/32-BIT RISC FLASH MICROCONTROLLERS
SPNS077J – NOVEMBER 2001 – REVISED AUGUST 2006
Terminal Functions
TERMINAL
NAME
VF338
VF348
HET[0]
88
91
HET[1]
89
–
HET[2]
95
97
HET[3]
96
–
HET[4]
97
98
HET[5]
98
–
TYPE†‡
INTERNAL
PULLUP/
PULLDOWN§
DESCRIPTION
HIGH-END TIMER (HET)
HET[6]
99
99
HET[7]
100
100
HET[8]
55
55
HET[9]
56
–
HET[10]
20
20
The VF338x and VF348x devices have both the logic and registers for a
full 32-I/O HET implemented, even though not all 32 pins are available
externally
Timer input capture or output compare. The HET[31:0] applicable pins
can be programmed as general-purpose input/output (GIO) pins.
HET[22:0] are high-resolution pins and HET[31:29, 24] are standardresolution pins for VF338x.
HET[21:18, 13:10, 8, 7, 6, 4, 2, 0] are high-resolution pins and HET[31,
24] are standard-resolution pins for VF348x.
HET[11]
19
19
HET[12]
18
18
HET[13]
17
17
HET[14]
16
–
HET[15]
15
–
HET[16]
14
–
HET[17]
13
–
HET[18]
49
49
HET[19]
48
48
HET[20]
47
47
HET[21]
46
46
HET[22]
45
–
HET[24]
35
35
HET[28]
–¶
–¶
HET[29]
32
–
HET[30]
33
–
HET[31]
34
34
CANSRX
60
59
3.3-V I/O
CANSTX
61
60
3.3-V I/O
C2SIbLPN
36
36
3.3-V I/O
C2SIbRX
38
38
3.3-V I/O
C2SIbTX
37
37
3.3-V I/O
3.3-V I/O
IPD
The high-resolution (HR) SHARE feature allows even HR pins to share
the next higher odd HR pin structures. This HR sharing is independent of
whether or not the odd pin is available externally. If an odd pin is available
externally and shared, then the odd pin can only be used as a generalpurpose I/O. For more information on HR SHARE, see the TMS470R1x
High-End Timer (HET) Reference Guide (literature number SPNU199).
The HET[19] or HET[18] pins can also be used as a user-selectable event
source to event trigger the MibADC event group or group1 providing the
associated register source bits are properly configured and defined. For
the internal device connections, see the MibADC section of this data
sheet. And for more detailed functional information on the MibADC, see
the TMS470R1x Multi-Buffered Analog-to-Digital Converter (MibADC)
Reference Guide (literature number SPNU206).
STANDARD CAN CONTROLLER (SCC)
SCC receive pin or GIO pin
IPU
SCC transmit pin or GIO pin
CLASS II SERIAL INTERFACE (C2SIb)
IPD
C2SIb module loopback enable pin or GIO pin
C2SIb module receive data input pin or GIO pin
IPD
C2SIb module transmit data output pin or GIO pin
† I = input, O = output, PWR = power, GND = ground, REF = reference voltage, NC = no connect
‡ All I/O pins, except RST, are configured as inputs while PORRST is low and immediately after PORRST goes high.
§ IPD = internal pulldown, IPU = internal pullup (all internal pullups and pulldowns are active on input pins, independent of the PORRST state.)
¶ N/A on the VF348x device. For the VF338x device only, the HET[28] signal is only connected to the pad not to a package pin.
8
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SPNS077J – NOVEMBER 2001 – REVISED AUGUST 2006
Terminal Functions (Continued)
TERMINAL
NAME
VF338
VF348
GIOA[0]/INT0
28
28
GIOA[1]/INT1/
ECLK
29
29
GIOA[2]/INT2
–
30
GIOA[3]/INT3
–
31
GIOA[4]/INT4
25
25
GIOA[5]/INT5
24
24
GIOA[6]/INT6
23
23
GIOA[7]/INT7
22
22
GIOB[0]
–
16
GIOB[1]
–
15
GIOB[2]
–
14
GIOB[3]
–
13
TYPE†‡
INTERNAL
PULLUP/
PULLDOWN§
DESCRIPTION
GENERAL-PURPOSE I/O (GIO)
3.3-V I
General-purpose input/output pins. GIOA[0]/INT[0] is an input-only pin.
GIOA[7:0]/INT[7:0] are interrupt-capable pins.
3.3-V I/O
IPD
GIOA[1]/INT[1]/ECLK pin is multiplexed with the external clock-out
function of the external clock prescale (ECP) module.
GIOA[2]/INT[2] and GIOA[3]/INT[3] pins are not applicable on the VF338x
device.
3.3-V I/O
IPD
General-purpose input/output pins (VF348x only).
MULTI-BUFFERED ANALOG-TO-DIGITAL CONVERTER (MibADC)
ADEVT
67
66
ADIN[0]
75
75
ADIN[1]
74
74
ADIN[2]
73
73
ADIN[3]
72
72
ADIN[4]
71
71
ADIN[5]
70
69
ADIN[6]
69
68
ADIN[7]
68
67
ADIN[8]
79
82
3.3-V I/O
IPD
MibADC event input. ADEVT can be programmed as a GIO pin.The
ADEVT pin can also be used as a user-selectable event source to event
trigger the MibADC event group or group1 providing the associated
register source bits are properly configured and defined. For the internal
device connections, see the MibADC section of this data sheet.
MibADC analog input pins
3.3-V I
The VF338x device has only 12 input channels but all S/W registers are
capable. ADIN[15:12] pins are not applicable to the VF338x device.
ADIN[9]
78
80
ADIN[10]
77
78
ADIN[11]
76
76
ADIN[12]
–
81
ADIN[13]
–
79
ADIN[14]
–
77
ADIN[15]
–
70
ADREFHI
80
83
3.3-V
REF I
MibADC module high-voltage reference input
ADREFLO
81
84
GND
REF I
MibADC module low-voltage reference input
VCCAD
82
85
3.3-V
PWR
MibADC analog supply voltage
VSSAD
83
86
GND
MibADC analog ground reference
The VF348x device has all 16 input channels.
† I = input, O = output, PWR = power, GND = ground, REF = reference voltage, NC = no connect
‡ All I/O pins, except RST, are configured as inputs while PORRST is low and immediately after PORRST goes high.
§ IPD = internal pulldown, IPU = internal pullup (all internal pullups and pulldowns are active on input pins, independent of the PORRST state.)
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16/32-BIT RISC FLASH MICROCONTROLLERS
SPNS077J – NOVEMBER 2001 – REVISED AUGUST 2006
Terminal Functions (Continued)
TERMINAL
NAME
TYPE†‡
INTERNAL
PULLUP/
PULLDOWN§
DESCRIPTION
VF338
VF348
SPI1CLK
5
5
SPI1 clock. SPI1CLK can be programmed as a GIO pin.
SPI1ENA
1
1
SPI1 chip enable. SPI1ENA can be programmed as a GIO pin.
SPI1SCS
2
2
SERIAL PERIPHERAL INTERFACE 1 (SPI1)
SPI1SIMO
3
3
SPI1SOMI
4
4
SPI1 slave chip select. SPI1SCS can be programmed as a GIO pin.
3.3-V I/O
IPD
SPI1 data stream. Slave in/master out. SPI1SIMO can be programmed as
a GIO pin.
SPI1 data stream. Slave out/master in. SPI1SOMI can be programmed as
a GIO pin.
SERIAL PERIPHERAL INTERFACE 2 (SPI2)
SPI2CLK
41
41
SPI2ENA
44
44
SPI2 clock. SPI2CLK can be programmed as a GIO pin.
SPI2 chip enable. SPI2ENA can be programmed as a GIO pin.
SPI2 slave chip select. SPI2SCS can be programmed as a GIO pin.
(This pin is not applicable to the VF338x device.)
SPI2SCS
–
45
SPI2SIMO
42
42
SPI2 data stream. Slave in/master out. SPI2SIMO can be programmed as
a GIO pin.
SPI2SOMI
43
43
SPI2 data stream. Slave out/master in. SPI2SOMI can be programmed as
a GIO pin.
3.3-V I/O
IPD
ZERO-PIN PHASE-LOCKED LOOP (ZPLL)
OSCIN
8
8
1.8-V I
Crystal connection pin or external clock input
OSCOUT
7
7
1.8-V O
External crystal connection pin
PLLDIS
51
51
3.3-V I
IPD
Enable/disable the ZPLL. The ZPLL can be bypassed and the oscillator
becomes the system clock. If not in bypass mode, TI recommends that this
pin be connected to ground or pulled down to ground by an external resistor.
SERIAL COMMUNICATIONS INTERFACE 1 (SCI1)
SCI1CLK
62
61
3.3-V I/O
IPD
SCI1 clock. SCI1CLK can be programmed as a GIO pin.
SCI1RX
64
63
3.3-V I/O
IPU
SCI1 data receive. SCI1RX can be programmed as a GIO pin.
SCI1TX
63
62
3.3-V I/O
IPU
SCI1 data transmit. SCI1TX can be programmed as a GIO pin.
SERIAL COMMUNICATIONS INTERFACE 2 (SCI2)
SCI2RX
30
32
3.3-V I/O
IPU
SCI2 data receive. SCI2RX can be programmed as a GIO pin.
SCI2TX
31
33
3.3-V I/O
IPU
SCI2 data transmit. SCI2TX can be programmed as a GIO pin.
SYSTEM MODULE (SYS)
CLKOUT
59
58
3.3-V I/O
IPD
Bidirectional pin. CLKOUT can be programmed as a GIO pin or the output
of SYSCLK, ICLK, or MCLK.
PORRST
21
21
3.3-V I
IPD
Input master chip power-up reset. External VCC monitor circuitry must
assert a power-on reset.
IPU
Bidirectional reset. The internal circuitry can assert a reset, and an external
system reset can assert a device reset. On this pin, the output buffer is
implemented as an open drain (drives low only).
To ensure an external reset is not arbitrarily generated, TI recommends
that an external pullup resistor be connected to this pin.
RST
10
10
3.3-V I/O
† I = input, O = output, PWR = power, GND = ground, REF = reference voltage, NC = no connect
‡ All I/O pins, except RST, are configured as inputs while PORRST is low and immediately after PORRST goes high.
§ IPD = internal pulldown, IPU = internal pullup (all internal pullups and pulldowns are active on input pins, independent of the PORRST state.)
10
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Terminal Functions (Continued)
TERMINAL
NAME
AWD
VF338
VF348
50
50
INTERNAL
PULLUP/
DESCRIPTION
PULLDOWN§
WATCHDOG/REAL-TIME INTERRUPT (WD/RTI)
Analog watchdog reset. The AWD pin provides a system reset if the WD
KEY is not written in time by the system, providing an external RC network
circuit is connected. If the user is not using AWD, TI recommends that this
pin be connected to ground or pulled down to ground by an external
resistor.
3.3-V I/O
IPD
TYPE†‡
TCK
54
54
3.3-V I
TDI
52
52
3.3-V I
TDO
53
53
3.3-V O
TEST
27
27
3.3-V I
TMS
84
87
3.3-V I
TMS2
85
88
3.3-V I
TRST
26
26
3.3-V I
FLTP1
FLTP2
93
92
95
94
NC
VCCP
94
96
3.3-V
PWR
VCC
9
40
66
87
91
9
40
65
90
93
1.8-V
PWR
VCCIO
12
58
12
57
3.3-V
PWR
VSS
6
39
65
86
90
6
39
64
89
92
VSSIO
11
57
11
56
For more details on the external RC network circuit, see the TMS470R1x
System Module Reference Guide (literature number SPNU189) and the
application note Analog Watchdog Resistor, Capacitor and Discharge
Interval Selection Constraints (literature number SPNA005).
TEST/DEBUG (T/D)
IPD
Test clock. TCK controls the test hardware (JTAG)
Test data in. TDI inputs serial data to the test instruction register, test data
IPU
register, and programmable test address (JTAG).
Test data out. TDO outputs serial data from the test instruction register,
IPD
test data register, identification register, and programmable test address
(JTAG).
Test enable. Reserved for internal use only. TI recommends that this pin
IPD
be connected to ground or pulled down to ground by an external resistor.
Serial input for controlling the state of the CPU test access port (TAP)
IPU
controller (JTAG)
Serial input for controlling the second TAP. TI recommends that this pin
IPU
be connected to VCCIO or pulled up to VCCIO by an external resistor.
IPD
Test hardware reset to TAP1 and TAP2. IEEE Standard 1149-1 (JTAG)
Boundary-Scan Logic. TI recommends that this pin be pulled down to
ground by an external resistor.
FLASH
Flash test pads 1 and 2. For proper operation, these pins must not be
connected [no connect (NC)].
Flash external pump voltage (3.3 V)
SUPPLY VOLTAGE CORE (1.8 V)
Core logic supply voltage
SUPPLY VOLTAGE DIGITAL I/O (3.3 V)
Digital I/O supply voltage
SUPPLY GROUND CORE
GND
Core supply ground reference
SUPPLY GROUND DIGITAL I/O
GND
Digital I/O supply ground reference
† I = input, O = output, PWR = power, GND = ground, REF = reference voltage, NC = no connect
‡ All I/O pins, except RST, are configured as inputs while PORRST is low and immediately after PORRST goes high.
§ IPD = internal pulldown, IPU = internal pullup (all internal pullups and pulldowns are active on input pins, independent of the PORRST state.)
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16/32-BIT RISC FLASH MICROCONTROLLERS
SPNS077J – NOVEMBER 2001 – REVISED AUGUST 2006
VF338X/VF348X DEVICE-SPECIFIC INFORMATION
memory
Figure 1 shows the memory map of the VF3x8x device.
0xFFFF_FFFF
Memory (4G Bytes)
SYSTEM
0xFFFF_FFFF
0xFFFF_FD00
System Module Control Registers
(512K Bytes)
Reserved
0xFFF8_0000
0xFFF7_FFFF
0xFFF0_0000
0xFFEF_FFFF
0xFFE8_C000
0xFFE8_BFFF
0xFFE8_8000
0xFFE8_7FFF
0xFFE8_4024
0xFFE8_4023
0xFFE8_4000
0xFFE8_3FFF
HET
Peripheral Control Registers
(512K Bytes)
SPI1
SCI2
Reserved
SCI1
Flash Control Registers
MibADC
Reserved
GIO/ECP
MPU Control Registers
Reserved
SCC
Reserved
SCC RAM
0xFFE0_0000
Reserved
RAM
(10K Bytes)
(VF3x8)
SPI2
Reserved
C2SIb
RAM
(12K Bytes)
(VF3x82)
Program
and
Data Area
FLASH
(256K Bytes)
14 Sectors
Reserved
FIQ
IRQ
Reserved
Data Abort
Prefetch Abort
0x0000_0020
0x0000_001F
0x0000_0000
Software Interrupt
Undefined Instruction
Exception, Interrupt, and
Reset Vectors
Reset
0xFFF8_0000
0xFFF7_FC00
0xFFF7_F800
0xFFF7_F500
0xFFF7_F400
0xFFF7_F000
0xFFF7_EC00
0xFFF7_E400
0xFFF7_E000
0xFFF7_DC00
0xFFF7_D800
0xFFF7_D400
0xFFF7_CC00
0xFFF7_C800
0xFFF0_0000
0x0000_001F
0x0000_001C
0x0000_0018
0x0000_0014
0x0000_0010
0x0000_000C
0x0000_0008
0x0000_0004
0x0000_0000
NOTES: A. Memory addresses are configurable by the system (SYS) module within the range of 0x0000_0000 to 0xFFE0_0000.
B. The CPU registers are not a part of the memory map.
Figure 1. Memory Map
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memory selects
Memory selects allow the user to address memory arrays (i.e., flash, RAM, and HET RAM) at user-defined
addresses. Each memory select has its own set (low and high) of memory base address registers (MFBAHRx
and MFBALRx) that, together, define the array’s starting (base) address, block size, and protection.
The base address of each memory select is configurable to any memory address boundary that is a multiple
of the decoded block size. For more information on how to control and configure these memory select registers,
see the bus structure and memory sections of the TMS470R1x System Module Reference Guide (literature
number SPNU189).
For the memory selection assignments and the memory selected, see Table 2.
Table 2. Memory Selection Assignment
MEMORY
SELECT
MEMORY SELECTED
(ALL INTERNAL)
0 (fine)
FLASH
1 (fine)
FLASH
MEMORY
SIZE
MPU
256K
2 (fine)
RAM
3 (fine)
RAM
12K (VF3x82)
4 (fine)
HET RAM
1K
10K (VF3x8)†
†
MEMORY BASE ADDRESS REGISTER
NO
MFBAHR0 and MFBALR0
NO
MFBAHR1 and MFBALR1
YES
MFBAHR2 and MFBALR2
YES
MFBAHR3 and MFBALR3
MFBAHR4 and MFBALR4
STATIC MEM
CTL REGISTER
SMCR1
† The starting addresses for both RAM memory-select signals cannot be offset from each other by a multiple of the user-defined block size in the
memory-base address register.
RAM
The VF3x8 device contains 10K of internal static RAM configurable by the SYS module to be addressed within
the range of 0x0000_0000 to 0xFFE0_0000. This VF3x8 RAM is implemented in one 10K array selected by
two memory-select signals. The VF3x82 device contains 12K of internal static RAM configurable by the SYS
module to be addressed within the range of 0x0000_0000 to 0xFFE0_0000. This VF3x82 RAM is implemented
in one 12K array selected by two memory-select signals. This VF3x8x configuration imposes an additional
constraint on the memory map for RAM; the starting addresses for both RAM memory selects cannot be offset
from each other by the multiples of the size of the physical RAM (i.e., 12K for the VF3x82 device). The VF3x8x
RAM is addressed through memory selects 2 and 3.
The RAM can be protected by the memory protection unit (MPU) portion of the SYS module, allowing the user
finer blocks of memory protection than is allowed by the memory selects. The MPU is ideal for protecting an
operating system while allowing access to the current task. For more detailed information on the MPU portion
of the SYS module and memory protection, see the memory section of the TMS470R1x System Module
Reference Guide (literature number SPNU189).
F05 flash
The F05 flash memory is a nonvolatile electrically erasable and programmable memory implemented with a
32-bit-wide data bus interface. The F05 flash has an external state machine for programming and erase
functions. See the flash read and flash program and erase sections of this document.
flash protection keys
The VF3x8x device provides flash protection keys. These four 32-bit protection keys prevent program/erase/
compaction operations from occurring until after the four protection keys have been matched by the CPU loading
the correct user keys into the FMPKEY control register. The protection keys on both VF338x and VF348x are
located in the last 4 words of the first 8K sector. For more detailed information on the flash protection keys and
the FMPKEY control register, see the Optional Quadruple Protection Keys and Programming the Protection
Keys portions of the TMS470R1x F05 Flash Reference Guide (literature number SPNU213).
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FLASH read
The VF3x8x flash memory is configurable by the SYS module to be addressed within the range of 0x0000_0000
to 0xFFE0_0000. The flash is addressed through memory selects 0 and 1.
Note: The flash external pump voltage (VCCP) is required for all operations (program, erase, and read).
flash pipeline mode
When in pipeline mode, the flash operates with a system clock frequency of up to 48 MHz (versus a system
clock in normal mode of up to 24 MHz). Flash in pipeline mode is capable of accessing 64-bit words and provides
two 32-bit pipelined words to the CPU. Also in pipeline mode, the flash can be read with no wait states when
memory addresses are contiguous (after the initial 1-or 2-wait-state reads).
Note: After a system reset, pipeline mode is disabled (ENPIPE bit [FMREGOPT.0] is a 0). In other words, the
VF3x8x device powers up and comes out of reset in non-pipeline mode. Furthermore, setting the flash configuration mode bit (GLBCTRL.4) will override pipeline mode.
flash program and erase
The VF3x8x device flash has one 256K-byte bank that consists of fourteen sectors. These fourteen sectors
are sized as follows:
SECTOR
NO.
SEGMENT
LOW ADDRESS
HIGH ADDRESS
0
8K Bytes
0x00000000
0x00001FFF
1
8K Bytes
0x00002000
0x00003FFF
2
8K Bytes
0x00004000
0x00005FFF
3
8K Bytes
0x00006000
0x00007FFF
4
32K Bytes
0x00008000
0x0000FFFF
5
32K Bytes
0x00010000
0x00017FFF
6
32K Bytes
0x00018000
0x0001FFFF
7
32K Bytes
0x00020000
0x00027FFF
8
32K Bytes
0x00028000
0x0002FFFF
0x00037FFF
9
32K Bytes
0x00030000
10
8K Bytes
0x00038000
0x00039FFF
11
8K Bytes
0x0003A000
0x0003BFFF
12
8K Bytes
0x0003C000
0x0003DFFF
13
8K Bytes
0x0003E000
0x0003FFFF
The minimum size for an erase operation is one sector. The maximum size for a program operation is one
16-bit word.
Note: The flash external pump voltage (VCCP) is required for all operations (program, erase, and read).
For more detailed information on flash program and erase operations, see the TMS470R1x F05 Flash Reference
Guide (literature number SPNU213).
HET RAM
The VF3x8x device contains HET RAM. The HET RAM has a 64-instruction capability. The HET RAM is
configurable by the SYS module to be addressed within the range of 0x0000_0000 to 0xFFE0_0000. The HET
RAM is addressed through memory select 4.
XOR share
The VF3x8x HET peripheral contains the XOR-share feature. This feature allows two adjacent HET highresolution channels to be XORed together, making it possible to output smaller pulses than a standard HET.
For more detailed information on the HET XOR-share feature, see the TMS470R1x High-End Timer (HET)
Reference Guide (literature number SPNU199).
14
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peripheral selects and base addresses
The VF3x8x device uses ten of the sixteen peripheral selects to decode the base addresses of the peripherals.
These peripheral selects are fixed and transparent to the user since they are part of the decoding scheme used
by the SYS module.
Control registers for the peripherals, SYS module, and flash begin at the base addresses shown in Table 3.
Table 3. Peripherals, System Module, and Flash Base Addresses
CONNECTING MODULE
ADDRESS RANGE
BASE ADDRESS
ENDING ADDRESS
PERIPHERAL SELECTS
SYSTEM
0XFFFF_FD00
0XFFFF_FFFF
RESERVED
0XFFF8_0000
0XFFFF_FCFF
N/A
HET
0XFFF7_FC00
0XFFF7_FFFF
PS[0]
PS[1]
SPI1
0XFFF7_F800
0XFFF7_FBFF
SCI2
0XFFF7_F500
0XFFF7_F7FF
SCI1
0XFFF7_F400
0XFFF7_F4FF
N/A
PS[2]
ADC
0XFFF7_F000
0XFFF7_F3FF
GIO/ECP
0XFFF7_EC00
0XFFF7_EFFF
PS[3]
PS[4]
RESERVED
0XFFF7_E400
0XFFF7_EBFF
PS[5] - PS[6]
SCC
0XFFF7_E000
0XFFF7_E3FF
PS[7]
SCC RAM
0XFFF7_DC00
0XFFF7_DFFF
PS[8]
RESERVED
0XFFF7_D800
0XFFF7_DBFF
PS[9]
SPI2
0XFFF7_D400
0XFFF7_D7FF
PS[10]
RESERVED
0XFFF7_CC00
0XFFF7_D3FF
PS[11] - PS[12]
C2SIb
0XFFF7_C800
0XFFF7_CBFF
PS[13]
RESERVED
0XFFF7_C000
0XFFF7_C7FF
PS[14] - PS[15]
RESERVED
0XFFF0_0000
0XFFF7_BFFF
N/A
FLASH CONTROL REGISTERS
0XFFE8_8000
0XFFE8_BFFF
N/A
MPU CONTROL REGISTERS
0XFFE8_4000
0XFFE8_4023
N/A
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interrupt priority
The central interrupt manager (CIM) portion of the SYS module manages the interrupt requests from the device
modules (i.e., SPI1 or SPI2, SCI1 or SCI2, and RTI, etc.).
Although the CIM can accept up to 32 interrupt request signals, the VF3x8x device only uses 21 of those
interrupt request signals. The request channels are maskable so that individual channels can be selectively
disabled. All interrupt requests can be programmed in the CIM to be of either type:
z
Fast interrupt request (FIQ)
z
Normal interrupt request (IRQ)
The precedences of request channels decrease with ascending channel order in the CIM (0 [highest] and
31 [lowest] priority). For these channel priorities and the associated modules, see Table 4.
Table 4. Interrupt Priority
MODULES
INTERRUPT SOURCES
SPI1 end-transfer/overrun
0
RTI
COMP2 interrupt
1
RTI
COMP1 interrupt
2
RTI
TAP interrupt
3
SPI2
SPI2 end-transfer/overrun
4
GIO
Interrupt A
5
RESERVED
HET
6
Interrupt 1
7
RESERVED
SCI1/SCI2
8
SCI1/SCI2 error interrupt
9
SCI1
SCI1 receive interrupt
10
C2SIb
C2SIb interrupt
11
RESERVED
12
RESERVED
SCC
13
Interrupt A
14
MibADC
End event conversion
16
SCI2
SCI2 receive interrupt
17
RESERVED
15
RESERVED
18
RESERVED
SCI1
System
19
SCI1 transmit interrupt
20
SW interrupt (SSI)
21
RESERVED
HET
22
Interrupt 2
23
RESERVED
24
SCC
Interrupt B
SCI2
SCI2 transmit interrupt
26
End Group 1 conversion
27
MibADC
25
RESERVED
GIO
MibADC
28
Interrupt B
29
End Group 2 conversion
30
RESERVED
16
INTERRUPT LEVEL/CHANNEL
SPI1
31
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MibADC
The multi-buffered analog-to-digital converter (MibADC) accepts an analog signal and converts the signal to a
10-bit digital value.
The VF3x8x MibADC module can function in two modes: compatibility mode, where it’s programmer’s model
is compatible with the TMS470R1x ADC module and its digital results are stored in digital result registers; or
in buffered mode, where the digital result registers are replaced with three FIFO buffers, one for each conversion
group [event, group1 (G1), and group2 (G2)]. In buffered mode, the MibADC buffers can be serviced by
interrupts.
MibADC event trigger enhancements
The MibADC includes two major enhancements over the event-triggering capability of the TMS470R1x ADC.
z
Both group1 and the event group can be configured for event-triggered operation, providing up to two eventtriggered groups.
z
The trigger source and polarity can be selected individually for both group 1 and the event group from the
three options identified in Table 5.
Table 5. MibADC Event Hookup Configuration
SOURCE SELECT BITS FOR G1 OR EVENT
(G1SRC[1:0] or EVSRC[1:0])
SIGNAL PIN NAME
EVENT1
00
ADEVT
EVENT2
01
HET18
EVENT3
10
HET19
EVENT4
11
RESERVED
EVENT #
For group 1, these event-triggered selections are configured via the group 1 source select bits (G1SRC[1:0])
in the AD event source register (ADEVTSRC.[5:4]). For the event group, these event-triggered selections are
configured via the event group source select bits (EVSRC[1:0]) in the AD event source register
(ADEVTSRC.[1:0]).
For more detailed functional information on the MibADC, see the TMS470R1x Multi-Buffered Analog-to-Digital
Converter (MibADC) Reference Guide (literature number SPNU206).
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development system support
Texas Instruments provides extensive hardware and software development support tools for the TMS470R1x
family. These support tools include:
z
Code Composer Studio™ IDE
–
–
–
z
Optimizing C compiler
–
–
–
–
–
–
–
z
Provides extensive macro capability
Allows high-speed operation
Allows extensive control of the assembly process using assembler directives
Automatically resolves memory references as C and assembly modules are combined
TMS470R1x CPU Simulator
–
–
–
z
Supports high-level language programming
Full implementation of the standard ANSI C language
Powerful optimizer that improves code-execution speed and reduces code size
Extensive run-time support library included
TMS470R1x control registers easily accessible from the C program
Interfaces C functions and assembly functions easily
Establishes comprehensive, easy-to-use tool set for the development of high-performance
microcontroller applications in C/C++
Assembly language tools (assembler and linker)
–
–
–
–
z
Fully integrated suite of software development tools
Includes Compiler/Assembler/Linker, Debugger, and Simulator
Supports Real-Time analysis, data visualization, and open API
Provides capability to simulate CPU operation without emulation hardware
Allows inspection and modifications of memory locations
Allows debugging programs in C or assembly language
XDS emulation communication kits
–
Allow high-speed JTAG communication to the TMS470R1x emulator or target board
For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.
Code Composer Studio is a trademark of Texas Instruments.
18
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documentation support
Extensive documentation supports all of the TMS470 microcontroller family generation of devices. The types
of documentation available include: data sheets with design specifications; complete user’s guides for all
devices and development support tools; and hardware and software applications. Useful reference documentation includes:
z
z
User’s Guides
–
TMS470R1x 32-Bit RISC Microcontroller Family User’s Guide (literature number SPNU134)
–
TMS470R1x C/C++ Compiler User’s Guide (literature number SPNU151)
–
TMS470R1x Code Generation Tools Getting Started Guide (literature number SPNU117)
–
TMS470R1x C Source Debugger User’s Guide (literature number SPNU124)
–
TMS470R1x Assembly Language Tools User’s Guide (literature number SPNU118)
–
TMS470R1x System Module Reference Guide (literature number SPNU189)
–
TMS470R1x Serial Peripheral Interface (SPI) Reference Guide (literature number SPNU195)
–
TMS470R1x Serial Communication Interface (SCI) Reference Guide (literature number SPNU196)
–
TMS470R1x Controller Area Network (CAN) Reference Guide (literature number SPNU197)
–
TMS470R1x High-End Timer (HET) Reference Guide (literature number SPNU199)
–
TMS470R1x External Clock Prescale (ECP) Reference Guide (literature number SPNU202)
–
TMS470R1x Multi-Buffered Analog-to-Digital Converter (MibADC) Reference Guide
(literature number SPNU206)
–
TMS470R1x Zero-Pin Phase-Locked Loop (ZPLL) Clock Module Reference Guide
(literature number SPNU212)
–
TMS470R1x F05 Flash Reference Guide (literature number SPNU213)
–
TMS470R1x Class II Serial Interface B (C2SIb) Reference Guide
(literature number SPNU214)
Application Reports:
–
Analog Watchdog Resistor, Capacitor and Discharge Interval Selection Constraints
(literature number SPNA005)
–
F05/C05 Power Up Reset and Power Sequencing Requirements (literature number SPNA009)
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device numbering conventions
Figure 2 illustrates the numbering and symbol nomenclature for the TMS470R1x family.
TMS 470 R1 V F 33 8 2 PZ Q
Prefix: TMS = Standard Prefix for Fully Qualified Devices
Family:
470 = TMS470 RISC-Embedded Microcontroller Family
V = 1.8-V Core Voltage
Program Memory Types:
CPU Type:
Device Type:
Program Memory Size
C
F
L
B
R
=
=
=
=
=
Masked ROM
Flash
ROM-less
System Emulator for Development Tools
RAM
R1 = ARM7TDMI CPU
33 = ’33 Devices Containing the Following Modules:
– ZPLL Clock
– 1K-Byte HET RAM (64 Instructions)
– Analog Watchdog (AWD)
– Real-Time Interrupt (RTI)
– 10-Bit, 12-Input Multi-buffered Analog-to-Digital
Converter (MibADC)†
– Two Serial Peripheral Interface (SPI) Modules
– Two Serial Communications Interface (SCI) Modules
– Class II Serial Interface (C2SIb)
– Standard Controller Area Network (CAN) [SCC]
– High-End Timer (HET)
– External Clock Prescaler (ECP)
8 = 0
– No on-chip program memory
1–5 – 1 to < 128K Bytes
6–B – 128K Bytes to < 1M Bytes
C–F – > 1M Bytes
Device Sub-type
2 = Blank
= 2
Operating Free-Air
Temperature Ranges:
Package:
A =
T =
Q =
– 10 KB SRAM
– 12 KB SRAM
–40°C to 85°C
–40°C to 105°C
–40°C to 125°C
PZ = 100-Pin Plastic Low-Profile Quad Flatpack (LQFP)
† The VF348x device contains a 10-bit, 16-input MibADC.
Figure 2. TMS470R1x Family Nomenclature
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device identification code register
The device identification code register identifies the silicon version, the technology family (TF), a ROM or flash
device, and an assigned device-specific part number (see Table 6). The VF3x8x device identification code
register value is 0x0857.
Table 6. TMS470 Device ID Bit Allocation Register
BIT 31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
BIT 16
6
5
4
3
2
1
BIT 0
Reserved
FFFF_FFF0
BIT 15
LEGEND:
For bits 3–15:
For bits 0–2:
14
13
12
11
10
9
8
7
VERSION
TF
R/F
PART NUMBER
1
1
1
R-K
R-K
R-K
R-K
R-1
R-1
R-1
R = Read only, -K = Value constant after RESET
R = Read only, -1 = Value after RESET
Bits 31:16
Reserved. Reads are undefined and writes have no effect.
Bits 15:12
VERSION. Silicon version (revision) bits
These bits identify what version of silicon the device is. Initial device version numbers
start at "0000".
Bit 11
TF. Technology Family (TF) bit
This bit distinguishes the technology family core power supply:
0 = 3.3 V for F10/C10 devices
1 = 1.8 V for F05/C05 devices
Bit 10
R/F. ROM/flash bit
This bit distinguishes between ROM and flash devices:
0 = Flash device
1 = ROM device
Bits 9:3
PART NUMBER. Device-specific part number bits
These bits identify the assigned device-specific part number.
The assigned device-specific part number for the VF3x8x device is: 0001010.
Bits 2:0
"1" Mandatory High. Bits 2,1, and 0 are tied high by default.
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device part numbers
Table 7 lists all the available TMS470R1VF3x8x devices.
Table 7. Device Part Number†
DEVICE PART
NUMBER
TMS470R1VF338PZQ
PROGRAM MEMORY
ROM
PACKAGE
FLASH
EEPROM
100-PIN
LQFP
X
X
TMS470R1VF338PZ-T
X
X
TMS470R1VF338PZA
X
X
TMS470R1VF348PZQ
X
X
TMS470R1VF348PZ-T
X
X
TMS470R1VF348PZA
X
X
TMS470R1VF338APZQ
X
X
TMS470R1VF338APZ-T
X
X
TMS470R1VF338APZA
X
X
TMS470R1VF348APZQ
X
X
TMS470R1VF348APZ-T
X
X
TMS470R1VF348APZA
X
X
TMS470R1VF338EPZQ
X
X
TMS470R1VF338EPZ-T
X
X
TMS470R1VF338EPZA
X
X
TMS470R1VF348EPZQ
X
X
TMS470R1VF348EPZ-T
X
X
TMS470R1VF348EPZA
X
X
TMS470R1VF3382APZQ
X
X
TMS470R1VF3382APZ-T
X
X
TMS470R1VF3382APZA
X
X
TMS470R1VF3482APZQ
X
X
TMS470R1VF3482APZ-T
X
X
TMS470R1VF3482APZA
X
X
TMS470R1VF3382EPZQ
X
X
TMS470R1VF3382EPZ-T
X
X
TMS470R1VF3382EPZA
X
X
TMS470R1VF3482EPZQ
X
X
TMS470R1VF3482EPZ-T
X
X
TMS470R1VF3482EPZA
X
X
TEMPERATURE RANGES
−40°C TO 85°C
−40°C TO 105°C
−40°C TO 125°C
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
† The various part numbers listed in this table differ due to differences in either electrical specifications or functional errata. Electrical differences
will be noted in this datasheet. For functional errata, see the errata document for the specific part number you are using.
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DEVICE ELECTRICAL SPECIFICATIONS AND TIMING PARAMETERS
absolute maximum ratings over operating free-air temperature range, Q version
(unless otherwise noted)†
Supply voltage ranges: VCC , VCCF (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 2.5 V
Supply voltage ranges: VCCIO , VCCAD , VCCP (flash pump) (see Note 1) . . . . . . . . . . . . . . . . . . . −0.3 V to 4.1V
Input voltage range: All input pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4.1 V
Input clamp current: IIK (VI < 0 or VI > VCCIO)
All pins except ADIN[0:11]‡, PORRST, TRST, TEST and TCK . . . . . . . . . . . . . . ±20 mA
IIK (VI < 0 or VI > VCCAD)
ADIN[0:11]‡ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 mA
Operating free-air temperature ranges, TA: A version (VF348x) . . . . . . . . . . . . . . . . . . . . . . . . . . .−40°C to 85°C
T version (VF348x) . . . . . . . . . . . . . . . . . . . . . . . . . .−40°C to 105°C
Q version (VF338x). . . . . . . . . . . . . . . . . . . . . . . . . .−40°C to 125°C
Operating junction temperature range, TJ A version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 115°C
T version. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 40°C to 130°C
Q version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .−40°C to 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .−65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is
not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ ADIN[0:11] for VF338x only and ADIN[0:15] for VF348x only.
NOTE 1: All voltage values are with respect to their associated grounds.
device recommended operating conditions§
MIN
− 40C to 125C
1.81
− 40C to 85C (VF3x8xE only)
1.70
NOM
MAX
UNIT
2.06
V
VCC
Digital logic supply voltage (Core)
2.06
V
VCCIO
Digital logic supply voltage (I/O)
3
3.3
3.6
V
VCCAD
ADC supply voltage
3
3.3
3.6
V
VCCP
Flash pump supply voltage
3
3.3
3.6
V
VSS
Digital logic supply ground
VSSAD
ADC supply ground
TA
TJ
Operating free-air temperature
Operating junction temperature
0
V
− 0.1
0.1
V
A version (VF348x)
− 40
85
°C
T version (VF348x)
− 40
105
°C
Q version (VF338x)
− 40
125
°C
A version
− 40
115
°C
T version
− 40
130
°C
Q version
− 40
150
°C
§ All voltages are with respect to VSS, except VCCAD, which is with respect to VSSAD.
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16/32-BIT RISC FLASH MICROCONTROLLERS
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electrical characteristics over recommended operating free-air temperature range, Q version
(unless otherwise noted)†
PARAMETER
Vhys
TEST CONDITIONS
Input hysteresis
All
inputs‡
except OSCIN
VIL
Low-level input voltage
VIH
High-level input voltage
Vth
Input threshold voltage
AWD only
RDSON
Drain to source on resistance
AWD only§
VOL
Low-level output voltage¶
VOH
High-level output voltage¶
IIC
Input clamp current (I/O pins)#
II
IOL
IOH
Input current (I/O pins)
Low-level output
current
High-level output
current
MIN
MAX
0.15
OSCIN only
0.8
− 0.3
0.35 VCC
2
0.65 VCC
1.35
VOL = 0.35V @ IOL = 8mA
IOL = IOL MAX
IOH = 50 μA
VCCIO + 0.3
V
45
Ω
0.8 VCCIO
VI < VSSIO − 0.3 or
VI > VCCIO + 0.3
−2
2
−1
1
IIL Pulldown
VI = VSS
IIH Pulldown
VI = VCCIO
5
40
IIL Pullup
VI = VSS
−40
−5
IIH Pullup
VI = VCCIO
−1
1
All other pins
No pullup or pulldown
−1
1
CLKOUT, AWD, TDO
VOL = VOL MAX
8
RST, SPI1CLK,
SPI1SIMO, SPI1SOMI,
SPI2CLK, SPI2SIMO,
SPI2SOMI
VOL = VOL MAX
4
All other output pins||
VOL = VOL MAX
2
VOH = VOH MIN
−8
VOH = VOH MIN
−4
All other output pins||
VOH = VOH MIN
−2
V
V
VCCIO − 0.2
CLKOUT, TDO
V
1.8
0.2
SPI1CLK, SPI1SIMO,
SPI1SOMI, SPI2CLK,
SPI2SIMO, SPI2SOMI
V
VCC + 0.3
0.2 VCCIO
IOL = 50 μA
IOH = IOH MIN
V
− 0.3
All inputs except OSCIN
OSCIN only
UNIT
mA
μA
mA
mA
† Source currents (out of the device) are negative while sink currents (into the device) are positive.
‡ This does not apply to the PORRST pin. For PORRST exceptions, see the RST and PORRST timings section on page 31.
§ These values help to determine the external RC network circuit. For more details, see the TMS470R1x System Module Reference Guide
(literature number SPNU189).
¶ VOL and VOH are linear with respect to the amount of load current (IOL/IOH) applied.
# Parameter does not apply to input-only or output-only pins.
||
The 2 mA buffers on this device are called zero-dominant buffers. If two of these buffers are shorted together and one is outputting a low level
and the other is outputting a high level, the resulting value will always be low.
,For flash pumps/banks in sleep mode.
†I/O pins configured as inputs or outputs with no load. All pulldown inputs ≤ 0.2 V. All pullup inputs ≥ VCCIO − 0.2 V.
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electrical characteristics over recommended operating free-air temperature range, Q version
(unless otherwise noted) (continued)†
PARAMETER
MAX
UNIT
SYSCLK = 48 MHz,
ICLK = 24 MHz, VCC = 2.06 V
TEST CONDITIONS
70
mA
SYSCLK = 24 MHz,
ICLK = 12 MHz, VCC = 2.06 V
50
mA
VCC digital supply current (standby mode)K
OSCIN = 6 MHz, VCC = 2.06 V
3.0
mA
VCC digital supply current (halt mode)K
All frequencies, VCC = 2.06 V
1.0
mA
VCCIO digital supply current (operating mode)
No DC load, VCCIO = 3.6 Vo
10
mA
VCCIO digital supply current (standby mode)
No DC load, VCCIO = 3.6 Vo
300
μA
VCCIO digital supply current (halt mode)
No DC load, VCCIO = 3.6 Vo
300
μA
VCC digital supply current (operating mode)
ICC
ICCIO
ICCAD
ICCP
MIN
TYP
VCCAD supply current (operating mode)
All frequencies, VCCAD = 3.6 V
15
mA
VCCAD supply current (standby mode)
All frequencies, VCCAD = 3.6 V
20
μA
VCCAD supply current (halt mode)
All frequencies, VCCAD = 3.6 V
20
μA
VCCP = 3.6 V read operation
45
mA
VCCP = 3.6 V program and erase
70
mA
20
μA
20
μA
VCCP pump supply current
VCCP = 3.6 V standby mode
operationK
VCCP = 3.6 V halt mode
operationK
CI
Input capacitance
2
pF
CO
Output capacitance
3
pF
† Source currents (out of the device) are negative while sink currents (into the device) are positive.
‡ This does not apply to the PORRST pin. For PORRST exceptions, see the RST and PORRST timings section on page 31.
§ These values help to determine the external RC network circuit. For more details, see the TMS470R1x System Module Reference Guide
(literature number SPNU189).
¶ VOL and VOH are linear with respect to the amount of load current (IOL/IOH) applied.
¶ Parameter does not apply to input-only or output-only pins.
||
The 2 mA buffers on this device are called zero-dominant buffers. If two of these buffers are shorted together and one is outputting a low level
and the other is outputting a high level, the resulting value will always be low.
,For flash pumps/banks in sleep mode.
†I/O pins configured as inputs or outputs with no load. All pulldown inputs ≤ 0.2 V. All pullup inputs ≥ VCCIO − 0.2 V.
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PARAMETER MEASUREMENT INFORMATION
IOL
Tester Pin
Electronics
50 Ω
VLOAD
Output
Under
Test
CL
IOH
Where: IOL
= IOL MAX for the respective pin (see Note A)
= IOH MIN for the respective pin (see Note A)
IOH
VLOAD = 1.5 V
= 150-pF typical load-circuit capacitance (see Note B)
CL
NOTES: A. For these values, see the electrical characteristics over recommended operating free-air temperature range table.
B. All timing parameters measured using an external load capacitance of 150 pF unless otherwise noted.
Figure 3. Test Load Circuit
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timing parameter symbology
Timing parameter symbols have been created in accordance with JEDEC Standard 100. In order to shorten
the symbols, some of the pin names and other related terminology have been abbreviated as follows:
CM
CO
ER
ICLK
M
OSC, OSCI
OSCO
P
R
R0
R1
Compaction, CMPCT
CLKOUT
Erase
Interface clock
Master mode
OSCIN
OSCOUT
Program, PROG
Ready
Read margin 0, RDMRGN0
Read margin 1, RDMRGN1
RD
RST
RX
S
SCC
SIMO
SOMI
SPC
SYS
TX
Read
Reset, RST
SCInRX
Slave mode
SCInCLK
SPInSIMO
SPInSOMI
SPInCLK
System clock
SCInTX
r
su
t
v
w
rise time
setup time
transition time
valid time
pulse duration (width)
Lowercase subscripts and their meanings are:
a
c
d
f
h
access time
cycle time (period)
delay time
fall time
hold time
The following additional letters are used with these meanings:
H
High
X
L
V
Low
Valid
Z
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external reference resonator/crystal oscillator clock option
The oscillator is enabled by connecting the appropriate fundamental 4–20 MHz resonator/crystal and load
capacitors across the external OSCIN and OSCOUT pins as shown in Figure 4a. The oscillator is a singlestage inverter held in bias by an integrated bias resistor. This resistor is disabled during leakage test measurement and HALT mode. TI strongly encourages each customer to submit samples of the device to the
resonator/crystal vendors for validation. The vendors are equipped to determine what load capacitors will
best tune their resonator/crystal to the microcontroller device for optimum start-up and operation over temperature/voltage extremes.
An external oscillator source can be used by connecting a 1.8V clock signal to the OSCIN pin and leaving the
OSCOUT pin unconnected (open) as shown in Figure 4b.
OSCIN
C1
(see Note A)
OSCOUT
Crystal
OSCIN
C2
(see Note A)
External
Clock Signal
(toggling 0–1.8 V)
(a)
(b)
NOTE A: The values of C1 and C2 should be provided by the resonator/crystal vendor.
Figure 4. Crystal/Clock Connection
28
OSCOUT
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ZPLL and clock specifications
timing requirements for ZPLL circuits enabled or disabled
MIN
MAX
UNIT
4
20
MHz
f(OSC)
Input clock frequency
tc(OSC)
Cycle time, OSCIN
50
ns
tw(OSCIL)
Pulse duration, OSCIN low
15
ns
tw(OSCIH)
Pulse duration, OSCIN high
15
ns
f(OSCRST)
OSC FAIL
frequency†
53
kHz
† Causes a device reset (specifically a clock reset) by setting the RST OSC FAIL (GLBCTRL.15) and the OSC FAIL flag (GLBSTAT.1) bits equal
to 1. For more detailed information on these bits and device resets, see the TMS470R1x System Module Reference Guide (literature number
SPNU189).
switching characteristics over recommended operating conditions for clocks‡§
PARAMETER
f(SYS)
System clock frequency#
f(CONFIG)
System clock frequency - flash config mode
f(ICLK)
f(ECLK)
Interface clock frequency
External clock output frequency for ECP Module
tc(SYS)
Cycle time, system clock
tc(CONFIG)
Cycle time, system clock - flash config mode
tc(ICLK)
tc(ECLK)
Cycle time, interface clock
Cycle time, ECP module external clock output
TEST CONDITIONS¶
MAX
UNIT
Pipeline mode enabled
MIN
48
MHz
Pipeline mode disabled
24
MHz
24
MHz
Pipeline mode enabled
25
MHz
Pipeline mode disabled
24
MHz
Pipeline mode enabled
25
MHz
24
MHz
Pipeline mode disabled
Pipeline mode enabled
20.8
ns
Pipeline mode disabled
41.6
ns
41.6
ns
Pipeline mode enabled
40
ns
Pipeline mode disabled
41.6
ns
Pipeline mode enabled
40
ns
Pipeline mode disabled
41.6
ns
‡ f(SYS) = M × f(OSC) / R, where M = {4 or 8}, R = {1,2,3,4,5,6,7,8} when PLLDIS = 0. R is the system-clock divider determined by the CLKDIVPRE
[2:0] bits in the global control register (GLBCTRL.[2:0]) and M is the PLL multiplier determined by the MULT4 bit also in the GLBCTRL register
(GLBCTRL.3).
f(SYS) = f(OSC) / R, where R = {1,2,3,4,5,6,7,8} when PLLDIS = 1.
f(ICLK) = f(SYS) / X, where X = {1,2,3,4,5,6,7,8,9,10,11,12,13,14,15,16}. X is the interface clock divider ratio determined by the PCR0.[4:1] bits
in the SYS module.
§ f(ECLK) = f(ICLK) / N, where N = {1 to 256}. N is the ECP prescale value defined by the ECPCTRL.[7:0] register bits in the ECP module
¶ Pipeline mode enabled or disabled is determined by the ENPIPE bit (FMREGOPT.0).
# Flash Vread must be set to 5V to achieve maximum System Clock Frequency.
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ZPLL and clock specifications (continued)
switching characteristics over recommended operating conditions for external clocks
(see Figure 5 and Figure 6)†‡§
NO.
PARAMETER
TEST CONDITIONS
SYSCLK or MCLK
1
tw(COL)
Pulse duration, CLKOUT low
MIN
0.5tc(ICLK) – tf
ICLK, X is even or 1#
ICLK, X is odd and not
1#
tw(COH)
Pulse duration, CLKOUT high ICLK, X is even or
0.5tc(ICLK) – tr
ICLK, X is odd and not 1
3
4
tw(EOH)
Pulse duration, ECLK low
Pulse duration, ECLK high
ns
0.5tc(SYS) – tr
1#
#
tw(EOL)
UNIT
0.5tc(ICLK) + 0.5tc(SYS) – tf
SYSCLK or MCLK¶
2
MAX
0.5tc(SYS) – tf
¶
N is even and X is even or odd
0.5tc(ECLK) – tf
N is odd and X is even
0.5tc(ECLK) – tf
N is odd and X is odd and not 1
0.5tc(ECLK) + 0.5tc(SYS) – tf
N is even and X is even or odd
0.5tc(ECLK) – tr
0.5tc(ECLK) – tr
N is odd and X is even
N is odd and X is odd and not 1
ns
0.5tc(ICLK) – 0.5tc(SYS) – tr
ns
ns
0.5tc(ECLK) – 0.5tc(SYS) – tr
† X = {1,2,3,4,5,6,7,8,9,10,11,12,13,14,15,16}. X is the interface clock divider ratio determined by the PCR0.[4:1] bits in the SYS module.
‡ N = {1 to 256}. N is the ECP prescale value defined by the ECPCTRL.[7:0] register bits in the ECP module.
§ CLKOUT/ECLK pulse durations (low/high) are a function of the OSCIN pulse durations when PLLDIS is active.
¶ Clock source bits selected as either SYSCLK (CLKCNTL.[6:5] = 11 binary) or MCLK (CLKCNTL.[6:5] = 10 binary).
# Clock source bits selected as ICLK (CLKCNTL.[6:5] = 01 binary).
2
CLKOUT
1
Figure 5. CLKOUT Timing Diagram
4
ECLK
3
Figure 6. ECLK Timing Diagram
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RST and PORRST timings
timing requirements for PORRST (see Figure 7)
MIN
NO.
MAX
UNIT
VCCPORL
VCC low supply level when PORRST must be active during power up
VCCPORH
VCC high supply level when PORRST must remain active during power up and become
active during power down
VCCIOPORL
VCCIO low supply level when PORRST must be active during power up
VCCIOPORH
VCCIO high supply level when PORRST must remain active during power up and
become active during power down
VIL
Low-level input voltage after VCCIO > VCCIOPORH
VIL(PORRST)
Low-level input voltage of PORRST before VCCIO > VCCIOPORL
3
tsu(PORRST)r
Setup time, PORRST active before VCCIO > VCCIOPORL during power up
0
ms
5
tsu(VCCIO)r
Setup time, VCCIO > VCCIOPORL before VCC > VCCPORL
0
ms
6
th(PORRST)r
Hold time, PORRST active after VCC > VCCPORH
1
ms
0.6
1.5
V
V
1.1
2.75
V
V
0.2 VCCIO
V
0.5
V
7
tsu(PORRST)f
Setup time, PORRST active before VCC ≤ VCCPORH during power down
8
μs
8
th(PORRST)rio
Hold time, PORRST active after VCC > VCCIOPORH
1
ms
9
th(PORRST)d
Hold time, PORRST active after VCC < VCCPORL
0
ms
10
tsu(PORRST)fio
Setup time, PORRST active before VCC ≤ VCCIOPORH during power down
0
ns
11
tsu(VCCIO)f
Setup time, VCC < VCCPORL before VCCIO < VCCIOPORL
0
ns
VCCP/VCCIO
VCC
VCCIOPORH
VCCPORH
6
VCCIOPORL
11
VCC
7
6
VCCPORL
VCC
5
VCCP/VCCIO
3
PORRST
VCCIOPORH
VCCIO
8
VCCPORH
10
7
VCCPORL
VCCIOPORL
9
VIL(PORRST)
VIL
VIL
VIL
VIL
VIL(PORRST)
Figure 7. PORRST Timing Diagram
switching characteristics over recommended operating conditions for RST†
PARAMETER
tv(RST)
tfsu
MIN
4112tc(OSC)
Valid time, RST active after PORRST inactive
8tc(SYS)
Valid time, RST active (all others)
Flash start up time, from RST inactive to fetch of first instruction from flash
(flash pump stabilization time)
456tc(OSC)
MAX
UNIT
ns
ns
† Specified values do NOT include rise/fall times. For rise and fall timings, see the switching characteristics for output timings versus load
capacitance table.
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JTAG scan interface timing (JTAG clock specification 10-MHz and 50-pF load on TDO output)
MIN
NO.
UNIT
1
Cycle time, JTAG low and high period
50
ns
2
tsu(TDI/TMS - TCKr)
Setup time, TDI, TMS before TCK rise (TCKr)
15
ns
3
th(TCKr -TDI/TMS)
Hold time, TDI, TMS after TCKr
15
ns
4
th(TCKf -TDO)
Hold time, TDO after TCKf
10
ns
5
td(TCKf -TDO)
Delay time, TDO valid after TCK fall (TCKf)
45
TCK
1
1
TMS
TDI
2
3
TDO
4
5
Figure 8. JTAG Scan Timing
32
MAX
tc(JTAG)
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16/32-BIT RISC FLASH MICROCONTROLLERS
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output timings
switching characteristics for output timings versus load capacitance (CL) (see Figure 9)
MIN
PARAMETER
tr
tf
tr
tf
tr
tf
Rise time, CLKOUT, AWD, TDO
Fall time, CLKOUT, AWD, TDO
Rise time, SPInCLK, SPInSOMI, SPInSIMO†
Fall time, RST, SPInCLK, SPInSOMI, SPInSIMO†
Rise time, all other output pins
Fall time, all other output pins
MAX UNIT
CL = 15 pF
0.5
2.50
CL = 50 pF
1.5
5
CL = 100 pF
3
9
CL = 150 pF
4.5
12.5
CL = 15 pF
0.5
2.5
CL = 50 pF
1.5
5
CL = 100 pF
3
9
CL = 150 pF
4.5
12.5
CL = 15 pF
2.5
8
CL = 50 pF
5
14
CL = 100 pF
9
23
CL = 150 pF
13
32
CL = 15 pF
2.5
8
CL= 50 pF
5
14
CL = 100 pF
9
23
CL = 150 pF
13
32
CL = 15 pF
2.5
10
CL = 50 pF
6.0
25
CL = 100 pF
12
45
CL = 150 pF
18
65
CL = 15 pF
3
10
CL = 50 pF
8.5
25
CL = 100 pF
16
45
CL = 150 pF
23
65
ns
ns
ns
ns
ns
ns
† n = 1 and 2
tr
tf
80%
Output
20%
VCC
80%
20%
0
Figure 9. CMOS-Level Outputs
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input timings
timing requirements for input timings† (see Figure 10)
MIN
tpw
tc(ICLK) + 10
Input minimum pulse width
† tc(ICLK) = interface clock cycle time = 1/f(ICLK)
tpw
Input
80%
20%
VCC
80%
20%
Figure 10. CMOS-Level Inputs
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0
MAX
UNIT
ns
TMS470R1VF338, TMS470R1VF348, TMS470R1VF3382, TMS470R1VF3482
16/32-BIT RISC FLASH MICROCONTROLLERS
SPNS077J – NOVEMBER 2001 – REVISED AUGUST 2006
flash timings
timing requirements for program flash†
tprog(16-bit)
Half word (16-bit) programming time
tprog(Total)
256K-byte programming
terase(sector)
Sector erase time
twec
Write/erase cycles at TA = 125°C
tfp(RST)
MIN
TYP
MAX
UNIT
4
16
200
μs
2
8
s
time‡
2
15
s
100
cycles
Flash pump settling time from RST to SLEEP
91tc(SYS)
ns
tfp(SLEEP)
Initial flash pump settling time from SLEEP to STANDBY
91tc(SYS)
ns
tfp(STDBY)
Initial flash pump settling time from STANDBY to ACTIVE
46tc(SYS)
ns
† For more detailed information on the flash core sectors, see the flash program and erase section of this data sheet.
‡ The 256K-byte programming times include overhead of state machine.
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SPIn master mode timing parameters
SPIn master mode external timing parameters (CLOCK PHASE = 0, SPInCLK = output, SPInSIMO =
output, and SPInSOMI = input)†‡§ (see Figure 11)
NO.
1
2#
3#
MIN
tc(SPC)M
6
MAX
100
256tc(ICLK)
0.5tc(SPC)M + 5
tw(SPCH)M
Pulse duration, SPInCLK high (clock polarity = 0)
0.5tc(SPC)M – tr
tw(SPCL)M
Pulse duration, SPInCLK low (clock polarity = 1)
0.5tc(SPC)M – tf
0.5tc(SPC)M + 5
tw(SPCL)M
Pulse duration, SPInCLK low (clock polarity = 0)
0.5tc(SPC)M – tf
0.5tc(SPC)M + 5
tw(SPCH)M
Pulse duration, SPInCLK high (clock polarity = 1)
0.5tc(SPC)M – tr
0.5tc(SPC)M + 5
td(SPCH-SIMO)M
Delay time, SPInCLK high to SPInSIMO valid
(clock polarity = 0)
10
td(SPCL-SIMO)M
Delay time, SPInCLK low to SPInSIMO valid
(clock polarity = 1)
10
tv(SPCL-SIMO)M
Valid time, SPInSIMO data valid
tsu(SOMI-SPCL)M
Setup time, SPInSOMI before SPInCLK low
(clock polarity = 0)
6
tsu(SOMI-SPCH)M
Setup time, SPInSOMI before SPInCLK high
(clock polarity = 1)
6
tv(SPCL-SOMI)M
Valid time, SPInSOMI data valid after SPInCLK low
(clock polarity = 0)
4
tv(SPCH-SOMI)M
Valid time, SPInSOMI data valid after SPInCLK high
(clock polarity = 1)
4
4#
5#
Cycle time, SPInCLK
¶
#
7#
UNIT
ns
ns
ns
ns
tc(SPC)M – 5 – tr/f
ns
ns
ns
† The MASTER bit (SPInCTRL2.3) is set and the CLOCK PHASE bit (SPInCTRL2.0) is cleared.
‡ tc(ICLK) = interface clock cycle time = 1/f(ICLK)
§ For rise and fall timings, see the “switching characteristics for output timings versus load capacitance” table.
¶ When the SPI is in Master mode, the following must be true:
For PS values from 1 to 255:
tc(SPC)M ≥ (PS +1)tc(ICLK) ≥ 100 ns, where PS is the prescale value set in the SPInCTL1.[12:5] register bits.
For PS values of 0:
tc(SPC)M = 2tc(ICLK) ≥ 100 ns.
# The active edge of the SPInCLK signal referenced is controlled by the CLOCK POLARITY bit (SPInCTRL2.1).
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SPIn master mode timing parameters (continued)
1
SPInCLK
(clock polarity = 0)
2
3
SPInCLK
(clock polarity = 1)
4
5
SPInSIMO
Master Out Data Is Valid
6
7
SPInSOMI
Master In Data
Must Be Valid
Figure 11. SPIn Master Mode External Timing (CLOCK PHASE = 0)
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SPIn master mode timing parameters (continued)
SPIn master mode external timing parameters (CLOCK PHASE = 1, SPInCLK = output, SPInSIMO =
output, and SPInSOMI = input)†‡§ (see Figure 12)
MIN
MAX
UNIT
100
256tc(ICLK)
ns
Pulse duration, SPInCLK high (clock polarity = 0)
0.5tc(SPC)M – tr
0.5tc(SPC)M + 5
tw(SPCL)M
Pulse duration, SPInCLK low (clock polarity = 1)
0.5tc(SPC)M – tf
0.5tc(SPC)M + 5
tw(SPCL)M
NO.
1
2#
3#
4
tc(SPC)M
Cycle time, SPInCLK
tw(SPCH)M
Pulse duration, SPInCLK low (clock polarity = 0)
0.5tc(SPC)M – tf
0.5tc(SPC)M + 5
tw(SPCH)M
Pulse duration, SPInCLK high (clock polarity = 1)
0.5tc(SPC)M – tr
0.5tc(SPC)M + 5
tv(SIMO-SPCH)M
Valid time, SPInCLK high after SPInSIMO data valid
(clock polarity = 0)
0.5tc(SPC)M – 10
tv(SIMO-SPCL)M
Valid time, SPInCLK low after SPInSIMO data valid
(clock polarity = 1)
0.5tc(SPC)M – 10
tv(SPCH-SIMO)M
Valid time, SPInSIMO data valid after SPInCLK high
(clock polarity = 0)
0.5tc(SPC)M – 5 – tr
tv(SPCL-SIMO)M
Valid time, SPInSIMO data valid after SPInCLK low
(clock polarity = 1)
0.5tc(SPC)M – 5 – tf
tsu(SOMI-SPCH)M
Setup time, SPInSOMI before SPInCLK high
(clock polarity = 0)
6
tsu(SOMI-SPCL)M
Setup time, SPInSOMI before SPInCLK low
(clock polarity = 1)
6
tv(SPCH-SOMI)M
Valid time, SPInSOMI data valid after SPInCLK high
(clock polarity = 0)
4
tv(SPCL-SOMI)M
Valid time, SPInSOMI data valid after SPInCLK low
(clock polarity = 1)
4
#
5#
6#
7
¶
#
ns
ns
ns
ns
ns
ns
† The MASTER bit (SPInCTRL2.3) is set and the CLOCK PHASE bit (SPInCTRL2.0) is set.
‡ tc(ICLK) = interface clock cycle time = 1/f(ICLK)
§ For rise and fall timings, see the switching characteristics for output timings versus load capacitance table.
¶ When the SPI is in Master mode, the following must be true:
For PS values from 1 to 255:
tc(SPC)M ≥ (PS +1)tc(ICLK) ≥ 100 ns, where PS is the prescale value set in the SPInCTL1.[12:5] register bits.
For PS values of 0:
tc(SPC)M = 2tc(ICLK) ≥ 100 ns.
# The active edge of the SPInCLK signal referenced is controlled by the CLOCK POLARITY bit (SPInCTRL2.1).
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SPIn master mode timing parameters (continued)
1
SPInCLK
(clock polarity = 0)
2
3
SPInCLK
(clock polarity = 1)
4
5
SPInSIMO
Master Out Data Is Valid
Data Valid
6
7
SPInSOMI
Master In Data
Must Be Valid
Figure 12. SPIn Master Mode External Timing (CLOCK PHASE = 1)
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SPIn slave mode timing parameters
SPIn slave mode external timing parameters (CLOCK PHASE = 0, SPInCLK = input, SPInSIMO =
input, and SPInSOMI = output)†‡§¶ (see Figure 13)
NO.
1
4
5
MAX
UNIT
ns
Cycle time, SPInCLK
100
256tc(ICLK)
tw(SPCH)S
Pulse duration, SPInCLK high
(clock polarity = 0)
0.5tc(SPC)S – 0.25tc(ICLK)
0.5tc(SPC)S + 0.25tc(ICLK)
tw(SPCL)S
Pulse duration, SPInCLK low
(clock polarity = 1)
0.5tc(SPC)S – 0.25tc(ICLK)
0.5tc(SPC)S + 0.25tc(ICLK)
tw(SPCL)S
Pulse duration, SPInCLK low
(clock polarity = 0)
0.5tc(SPC)S – 0.25tc(ICLK)
0.5tc(SPC)S + 0.25tc(ICLK)
tw(SPCH)S
Pulse duration, SPInCLK high
(clock polarity = 1)
0.5tc(SPC)S – 0.25tc(ICLK)
0.5tc(SPC)S + 0.25tc(ICLK)
td(SPCH-SOMI)S
Delay time, SPInCLK high to SPInSOMI valid
(clock polarity = 0)
6 + tr
td(SPCL-SOMI)S
Delay time, SPInCLK low to SPInSOMI valid
(clock polarity = 1)
6 + tf
tv(SPCH-SOMI)S
Valid time, SPInSOMI data valid after
SPInCLK high (clock polarity = 0)
tc(SPC)S – 6 – tr
tv(SPCL-SOMI)S
Valid time, SPInSOMI data valid after
SPInCLK low (clock polarity = 1)
tc(SPC)S – 6 – tf
tsu(SIMO-SPCL)S
Setup time, SPInSIMO before SPInCLK low
(clock polarity = 0)
6
tsu(SIMO-SPCH)S
Setup time, SPInSIMO before SPInCLK high
(clock polarity = 1)
6
tv(SPCL-SIMO)S
Valid time, SPInSIMO data valid after
SPInCLK low (clock polarity = 0)
6
tv(SPCH-SIMO)S
Valid time, SPInSIMO data valid after
SPInCLK high (clock polarity = 1)
6
2||
3
MIN
tc(SPC)S
||
||
||
6||
7||
#
ns
ns
ns
ns
ns
ns
† The MASTER bit (SPInCTRL2.3) is cleared and the CLOCK PHASE bit (SPInCTRL2.0) is cleared.
‡ If the SPI is in slave mode, the following must be true: tc(SPC)S ≥ (PS + 1) tc(ICLK), where PS = prescale value set in SPInCTL1.[12:5].
§ For rise and fall timings, see the switching characteristics for output timings versus load capacitance table.
¶ tc(ICLK) = interface clock cycle time = 1/f(ICLK)
# When the SPIn is in Slave mode, the following must be true:
For PS values from 1 to 255:
tc(SPC)S ≥ (PS +1)tc(ICLK) ≥ 100 ns, where PS is the prescale value set in the SPInCTL1.[12:5] register bits.
For PS values of 0:
tc(SPC)S = 2tc(ICLK) ≥ 100 ns.
||
The active edge of the SPInCLK signal referenced is controlled by the CLOCK POLARITY bit (SPInCTRL2.1).
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SPIn slave mode timing parameters (continued)
1
SPInCLK
(clock polarity = 0)
2
3
SPInCLK
(clock polarity = 1)
4
5
SPInSOMI
SPISOMI Data Is Valid
6
7
SPInSIMO
SPISIMO Data
Must Be Valid
Figure 13. SPIn Slave Mode External Timing (CLOCK PHASE = 0)
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SPIn slave mode timing parameters (continued)
SPIn slave mode external timing parameters (CLOCK PHASE = 1, SPInCLK = input, SPInSIMO =
input, and SPInSOMI = output)†‡§¶ (see Figure 14)
NO.
1
2
MIN
MAX
UNIT
100
256tc(ICLK)
ns
Pulse duration, SPInCLK high
(clock polarity = 0)
0.5tc(SPC)S –0.25tc(ICLK)
0.5tc(SPC)S + 0.25tc(ICLK)
tw(SPCL)S
Pulse duration, SPInCLK low
(clock polarity = 1)
0.5tc(SPC)S –0.25tc(ICLK)
0.5tc(SPC)S + 0.25tc(ICLK)
tw(SPCL)S
Pulse duration, SPInCLK low
(clock polarity = 0)
0.5tc(SPC)S –0.25tc(ICLK)
0.5tc(SPC)S + 0.25tc(ICLK)
tw(SPCH)S
Pulse duration, SPInCLK high
(clock polarity = 1)
0.5tc(SPC)S –0.25tc(ICLK)
0.5tc(SPC)S + 0.25tc(ICLK)
tv(SOMI-SPCH)S
Valid time, SPInCLK high after SPInSOMI
data valid (clock polarity = 0)
0.5tc(SPC)S – 6 – tr
tv(SOMI-SPCL)S
Valid time, SPInCLK low after SPInSOMI
data valid (clock polarity = 1)
0.5tc(SPC)S – 6 – tf
tv(SPCH-SOMI)S
Valid time, SPInSOMI data valid after
SPInCLK high (clock polarity = 0)
0.5tc(SPC)S – 6 – tr
tv(SPCL-SOMI)S
Valid time, SPInSOMI data valid after
SPInCLK low (clock polarity = 1)
0.5tc(SPC)S – 6 – tf
tsu(SIMO-SPCH)S
Setup time, SPInSIMO before SPInCLK
high (clock polarity = 0)
6
tsu(SIMO-SPCL)S
Setup time, SPInSIMO before SPInCLK
low (clock polarity = 1)
6
tv(SPCH-SIMO)S
Valid time, SPInSIMO data valid after
SPInCLK high (clock polarity = 0)
6
tv(SPCL-SIMO)S
Valid time, SPInSIMO data valid after
SPInCLK low (clock polarity = 1)
6
tc(SPC)S
Cycle time, SPInCLK
tw(SPCH)S
||
3||
4||
5||
6||
7||
#
ns
ns
ns
ns
ns
ns
† The MASTER bit (SPInCTRL2.3) is cleared and the CLOCK PHASE bit (SPInCTRL2.0) is set.
‡ If the SPI is in slave mode, the following must be true: tc(SPC)S ≥ (PS + 1) tc(ICLK), where PS = prescale value set in SPInCTL1.[12:5].
§ For rise and fall timings, see the switching characteristics for output timings versus load capacitance table.
¶ tc(ICLK) = interface clock cycle time = 1/f(ICLK)
# When the SPIn is in Slave mode, the following must be true:
For PS values from 1 to 255:
tc(SPC)S ≥ (PS +1)tc(ICLK) ≥ 100 ns, where PS is the prescale value set in the SPInCTL1.[12:5] register bits.
For PS values of 0:
tc(SPC)S = 2tc(ICLK) ≥ 100 ns.
||
The active edge of the SPInCLK signal referenced is controlled by the CLOCK POLARITY bit (SPInCTRL2.1).
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SPIn slave mode timing parameters (continued)
1
SPInCLK
(clock polarity = 0)
2
3
SPInCLK
(clock polarity = 1)
4
5
SPInSOMI
SPISOMI Data Is Valid
Data Valid
6
7
SPInSIMO
SPISIMO Data Must
Be Valid
Figure 14. SPIn Slave Mode External Timing (CLOCK PHASE = 1)
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SCIn isosynchronous mode timings — internal clock
timing requirements for internal clock SCIn isosynchronous mode†‡§ (see Figure 15)
(BAUD + 1)
IS EVEN OR BAUD = 0
NO.
(BAUD + 1)
IS ODD AND BAUD ≠ 0
UNIT
MIN
MAX
MIN
MAX
2tc(ICLK)
224tc(ICLK)
3tc(ICLK)
(224 –1) tc(ICLK)
1
tc(SCC)
Cycle time, SCInCLK
2
tw(SCCL)
Pulse duration,
SCInCLK low
0.5tc(SCC) – tf
0.5tc(SCC) + 5
0.5tc(SCC) +0.5tc(ICLK) – tf 0.5tc(SCC) +0.5tc(ICLK)
ns
3
tw(SCCH)
Pulse duration,
SCInCLK high
0.5tc(SCC) – tr
0.5tc(SCC) + 5
0.5tc(SCC) –0.5tc(ICLK) – tr 0.5tc(SCC) –0.5tc(ICLK)
ns
4
td(SCCH-TXV)
Delay time, SCInCLK
high to SCInTX valid
5
tv(TX)
Valid time, SCInTX data
after SCInCLK low
6
tsu(RX-SCCL)
Setup time, SCInRX
before SCInCLK low
7
tv(SCCL-RX)
Valid time, SCInRX data
- tc(ICLK) + tf + 20
after SCInCLK low
10
10
ns
ns
tc(SCC) – 10
tc(SCC) – 10
ns
tc(ICLK) + tf + 20
tc(ICLK) + tf + 20
ns
- tc(ICLK) + tf + 20
ns
† BAUD = 24-bit concatenated value formed by the SCI[H,M,L]BAUD registers.
‡ tc(ICLK) = interface clock cycle time = 1/f(ICLK)
§ For rise and fall timings, see the switching characteristics for output timings versus load capacitance table.
1
3
2
SCICLK
5
4
Data Valid
SCITX
6
7
Data Valid
SCIRX
NOTE A: Data transmission/reception characteristics for isosynchronous mode with internal clocking are similar to the asynchronous mode.
Data transmission occurs on the SCICLK rising edge, and data reception on the SCICLK falling edge.
Figure 15. SCIn Isosynchronous Mode Timing Diagram For Internal Clock
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SCIn isosynchronous mode timings — external clock
timing requirements for external clock SCIn isosynchronous mode†‡ (see Figure 16)
NO.
MIN
MAX
8tc(ICLK)
UNIT
1
tc(SCC)
Cycle time, SCInCLK
2
tw(SCCH)
Pulse duration, SCInCLK high
0.5tc(SCC) – 0.25tc(ICLK)
0.5tc(SCC) + 0.25tc(ICLK)
ns
3
tw(SCCL)
Pulse duration, SCInCLK low
0.5tc(SCC) – 0.25tc(ICLK)
0.5tc(SCC) + 0.25tc(ICLK)
ns
4
td(SCCH-TXV)
Delay time, SCInCLK high to SCInTX valid
2tc(ICLK) + 12 + tr
ns
5
tv(TX)
Valid time, SCInTX data after SCInCLK low
6
tsu(RX-SCCL)
Setup time, SCInRX before SCInCLK low
7
tv(SCCL-RX)
Valid time, SCInRX data after SCInCLK low
§
ns
2tc(SCC)–10
ns
0
ns
2tc(ICLK) + 10
ns
† tc(ICLK) = interface clock cycle time = 1/f(ICLK)
‡ For rise and fall timings, see the switching characteristics for output timings versus load capacitance table.
§ When driving an external SCInCLK, the following must be true: tc(SCC) ≥ 8tc(ICLK)
1
2
3
SCICLK
5
4
Data Valid
SCITX
6
7
Data Valid
SCIRX
NOTE A: Data transmission/reception characteristics for isosynchronous mode with external clocking are similar to the asynchronous
mode. Data transmission occurs on the SCICLK rising edge, and data reception on the SCICLK falling edge.
Figure 16. SCIn Isosynchronous Mode Timing Diagram for External Clock
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high-end timer (HET) timings
minimum PWM output pulse width:
This is equal to one High Resolution Clock Period (HRP). The HRP is defined by the 6-bit High Resolution
Prescale Factor (hr) which is user defined, giving prescale factors of 1 to 64, with a linear increment of codes.
Therefore, the minimum PWM output pulse width = HRP(min) = hr(min)/SYSCLK = 1/SYSCLK
For example, for a SYSCLK of 30 MHz, the minimum PWM output pulse width = 1/30 = 33.33ns
minimum input pulses we can capture:
The input pulse width must be greater or equal to the Low Resolution Clock Period (LRP), i.e., the HET loop
(the HET program must fit within the LRP). The LRP is defined by the 3-bit Loop-Resolution Prescale Factor
(lr), which is user defined, with a power of 2 increment of codes. That is, the value of lr can be 1, 2, 4, 8, 16, or 32.
Therefore, the minimum input pulse width = LRP(min) = hr(min) * lr(min)/SYSCLK = 1 * 1/SYSCLK
For example, with a SYSCLK of 30 MHz, the minimum input pulse width = 1 * 1/30 = 33.33 ns
Note: Once the input pulse width is greater than LRP, the resolution of the measurement is still HRP. (That is,
the captured value gives the number of HRP clocks inside the pulse.)
Abbreviations:
High resolution clock period = HRP = hr/SYSCLK
Loop resolution clock period = LRP = hr*lr/SYSCLK
hr = HET high resolution divide rate = 1, 2, 3,...63, 64
lr = HET low resolution divide rate = 1, 2, 4, 8, 16, 32
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standard CAN controller (SCC) mode timings
dynamic characteristics for the CANSTX and CANSRX pins
PARAMETER
TEST CONDITIONS
td(CANSTX)
Delay time, transmit shift register to CANSTX pin†
td(CANSRX)
Delay time, CANSRX pin to receive shift register
MIN
MAX
UNIT
15
ns
5
ns
† These values do not include rise/fall times of the output buffer.
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multi-buffered A-to-D converter (MibADC)
The multi-buffered A-to-D converter (MibADC) has a separate power bus for its analog circuitry that enhances
the A-to-D performance by preventing digital switching noise on the logic circuitry which could be present on
VSS and VCC from coupling into the A-to-D analog stage. All A-to-D specifications are given with respect to
ADREFLO unless otherwise noted.
Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 bits (1024 values)
Monotonic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Assured
Output conversion code . . . . . . . . . . . . . . . . . . . . . . . .00h to 3FFh [00 for VAI ≤ADREFLO; 3FF for VAI ≥ ADREFHI]
MibADC recommended operating conditions†
ADREFHI
A-to-D high -voltage reference source
ADREFLO
A-to-D low-voltage reference source
VAI
Analog input voltage
IAIC
MIN
MAX
UNIT
VSSAD
VCCAD
V
VSSAD
VCCAD
V
VSSAD − 0.3
VCCAD + 0.3
V
−2
2
mA
‡
Analog input clamp current
(VAI < VSSAD – 0.3 or VAI > VCCAD + 0.3)
† For VCCAD and VSSAD recommended operating conditions, see the device recommended operating conditions table.
‡ Input currents into any ADC input channel outside the specified limits could affect conversion results of other channels.
operating characteristics over full ranges of recommended operating conditions§¶
PARAMETER
Analog input resistance
See Figure 17
Ci
Analog input capacitance
See Figure 17
IAIL
Analog input leakage current
See Figure 17
IADREFHI
ADREFHI input current
ADREFHI = 3.6 V, ADREFLO = VSSAD
CR
Conversion range over which specified
accuracy is maintained
ADREFHI − ADREFLO
EDNL
Differential nonlinearity error
EINL
ETOT
MIN
MAX
UNIT
250
500
Ω
Conversion
10
pF
Sampling
30
pF
1
μA
5
mA
–1
3.6
V
Difference between the actual step width and the
ideal value after offset correction. (See Figure 18)
±2
LSB
Integral nonlinearity error
Maximum deviation from the best straight line through
the MibADC. MibADC transfer characteristics,
excluding the quantization error after offset
correction.
(See Figure 19)
±2
LSB
Total error/Absolute accuracy
Maximum value of the difference between an analog
value and the ideal midstep value.
(See Figure 20)
±2
LSB
§ VCCIO = VCCAD = ADREFHI
¶ 1 LSB = (ADREFHI – ADREFLO)/210 for the MibADC
48
TYP
DESCRIPTION/CONDITIONS
Ri
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multi-buffered A-to-D converter (MibADC) (continued)
External
Rs
MibADC
Input Pin
Ri
Sample Switch
Parasitic
Capacitance
Vsrc
Sample
Capacitor
Rleak
Ci
Figure 17. MibADC Input Equivalent Circuit
Multi-Buffer ADC timing requirements
MIN
NOM
MAX
UNIT
0.05
μs
1
μs
0.55
μs
tc(ADCLK)
Cycle time, MibADC clock
td(SH)
Delay time, sample and hold time
td(C)
Delay time, conversion time
Delay time, total sample/hold and conversion time
1.55
μs
td(SHC)
†
† This is the minimum sample/hold and conversion time that can be achieved. These parameters are dependent on many factors for more detail,
see the TMS470R1x Multi-Buffered Analog-to-Digital Converter (MibADC) Reference Guide (literature number SPNU206).
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multi-buffered A-to-D converter (MibADC) (continued)
The differential nonlinearity error shown in Figure 18 (sometimes referred to as differential linearity) is the
difference between an actual step width and the ideal value of 1 LSB.
0 ... 110
Digital Output Code
0 ... 101
0 ...
0.
.. 100
0 ...
0.
.. 011
Differential
Linearity Error (1/2 LSB)
1 LSB
0 ...
0.
.. 010
0 ...
0.
.. 001
Differential Linearity
Error (–1/2 LSB)
1 LSB
0 ...
0.
.. 000
0
1
2
3
4
Analog Input Value (LSB)
5
NOTE A: 1 LSB = (ADREFHI – ADREFLO)/210
Figure 18. Differential Nonlinearity (DNL)
The integral nonlinearity error shown in Figure 19 (sometimes referred to as linearity error) is the deviation of
the values on the actual transfer function from a straight line.
0 ... 111
Ideal
Transition
Digital Output Code
0 ... 110
0 ... 101
Actual
Transition
0 ... 100
At Transition
011/100
(– 1/2 LSB)
0 ... 011
0 ... 010
End-Point Lin. Error
At Transition
001/010 (– 1/4 LSB)
0 ... 001
0 ... 000
0
1
2
3
4
5
6
Analog Input Value (LSB)
NOTE A: 1 LSB = (ADREFHI – ADREFLO)/210
7
Figure 19. Integral Nonlinearity (INL) Error
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multi-buffer A-to-D converter (MibADC) (continued)
The absolute accuracy or total error of an MibADC as shown in Figure 20 is the maximum value of the difference
between an analog value and the ideal midstep value.
0 ... 111
Digital Output Code
0 ... 110
0 ... 101
0 ... 100
Total Error
At Step 0 ... 101
(–1 1/4 LSB)
0 ... 011
0 ... 010
Total Error
At Step
0 ... 001 (1/2 LSB)
0 ... 001
0 ... 000
0
1
2
3
4
5
6
Analog Input Value (LSB)
NOTE A: 1 LSB = (ADREFHI – ADREFLO)/210
7
Figure 20. Absolute Accuracy (Total) Error
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MECHANICAL DATA
PZ (S-PQFP-G100)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
75
0,08 M
51
76
50
100
26
1
0,13 NOM
25
12,00 TYP
Gage Plane
14,20
SQ
13,80
16,20
SQ
15,80
0,05 MIN
1,45
1,35
0,25
0°-7°
0,75
0,45
Seating Plane
0,08
1,60 MAX
4040149/B 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
Thermal Resistance Characteristics
52
PARAMETER
°C/W
RΘJA
51
RΘJC
5
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List of Figures
TMS470R1VF338x 100-Pin PZ Package (TOP VIEW)
TMS470R1VF348x 100-Pin PZ Package (TOP VIEW)
Functional Block Diagram
Figure 1. Memory Map
Figure 2. TMS470R1x Family Nomenclature
Figure 3. Test Load Circuit
Figure 4. Crystal/Clock Connection
Figure 5. CLKOUT Timing Diagram
Figure 6. ECLK Timing Diagram
Figure 7. PORRST Timing Diagram
Figure 8. JTAG Scan Timing
Figure 9. CMOS-Level Outputs
Figure 10. CMOS-Level Inputs
Figure 11. SPIn Master Mode External Timing (CLOCK PHASE = 0)
Figure 12. SPIn Master Mode External Timing (CLOCK PHASE = 1)
Figure 13. SPIn Slave Mode External Timing (CLOCK PHASE = 0)
Figure 14. SPIn Slave Mode External Timing (CLOCK PHASE = 1)
Figure 15. SCIn Isosynchronous Mode Timing Diagram For Internal Clock
Figure 16. SCIn Isosynchronous Mode Timing Diagram for External Clock
Figure 17. MibADC Input Equivalent Circuit
Figure 18. Differential Nonlinearity (DNL)
Figure 19. Integral Nonlinearity (INL) Error
Figure 20. Absolute Accuracy (Total) Error
Mechanical Data
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List of Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
54
Device Characteristics
Memory Selection Assignment
Peripherals, System Module, and Flash Base Addresses
Interrupt Priority
MibADC Event Hookup Configuration
TMS470 Device ID Bit Allocation Register
Device Part Number
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REVISION HISTORY
REVISION HISTORY
REV
J
DATE
8/06
NOTES
Updates:
Page 23, operating junction temperature range broken out into A, T, and Q versions
Page 36, timing #5 updated
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