TI TPS22912CYZVT

TPS22912
www.ti.com
SLVSB78 – APRIL 2012
Ultra-Small, Low on Resistance Load Switch with Controlled Turn-on
Check for Samples: TPS22912
FEATURES
DESCRIPTION
•
•
The TPS22912 is a small, low rON load switch with
controlled turn-on and contains a P-channel MOSFET
that can operate over an input voltage range of 1.4 V
to 5.5 V. The switch is controlled by a high input
(ON), which is capable of interfacing directly with lowvoltage control signals.
1
•
•
•
•
•
•
•
Integrated Single Load Switch
Ultra Small CSP-4 Package 0.9mm × 0.9mm,
0.5mm Pitch
Input Voltage Range: 1.4-V to 5.5-V
Low ON-Resistance
– rON = 60-mΩ at VIN = 5-V
– rON = 61-mΩ at VIN = 3.3-V
– rON = 74-mΩ at VIN = 1.8-V
– rON = 84-mΩ at VIN = 1.5-V
2-A Maximum Continuous Switch Current
Low Threshold Control Input
Controlled Slew-rate Options
Under-Voltage Lock Out
Reverse Current Protection
APPLICATIONS
•
•
•
•
•
•
•
Portable Industrial / Medical Equipment
Portable Media Players
Point of Sales Terminals
GPS Navigation Devices
Digital Cameras
Portable Instrumentation
Smartphones / Wireless Handsets
The slew rate of the device is internally controlled in
order to avoid inrush current. The TPS22912 family
has various rise time options and is active high
enable. (see Table 1).
The TPS22912 provides circuit breaker functionality
by latching off the power switch during reverse
voltage situations. An internal reverse voltage
comparator disables the power switch when the
output voltage (VOUT) is higher than the input (VIN).
This process quickly (10µs typical) stops the flow of
current towards the input side of the switch. Reverse
current protection is always active, even when the
device is disabled. Additionally, under-voltage lockout
(UVLO) protection turns the switch off if the input
voltage is too low.
The TPS22912 is available in a ultra-small, spacesaving 4-pin CSP package and is characterized for
operation over the free-air temperature range of
–40°C to 85°C.
TYPICAL APPLICATION
Power
Supply
VOUT
VIN
ON
CIN
CL
ON
RL
OFF
TPS22912
GND
GND
Table 1. Feature List
QUICK OUTPUT
DISCHARGE (1)
MAXIMUM OUTPUT
CURRENT
ENABLE
61 mΩ
1 µs
No
2-A
Active High
61 mΩ
100 µs
No
2-A
Active High
61 mΩ
1000 µs
No
2-A
Active High
61 mΩ
4500 µs
No
2-A
Active High
rON (typ) at 3.3 V
TPS22912A (2)
TPS22912B (2)
TPS22912C
TPS22912D
(1)
(2)
RISE TIME at 3.3V
(typ)
DEVICE
(2)
This feature discharges the output of the switch to ground through a 150-Ω resistor, preventing the output from floating.
Contact local sales/distributor or factory for availability.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
TPS22912
SLVSB78 – APRIL 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PACKAGE (1)
TA
(1)
(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING/
STATUS (2)
–40°C to 85°C
YZV (0.5mm pitch)
Tape and Reel
TPS22912AYZVR
Contact factory for availability
–40°C to 85°C
YZV (0.5mm pitch)
Tape and Reel
TPS22912BYZVR
Contact factory for availability
–40°C to 85°C
YZV (0.5mm pitch)
Tape and Reel
TPS22912CYZVR
_ _ _ _ 78
–40°C to 85°C
YZV (0.5mm pitch)
Tape and Reel
TPS22912DYZVR
Contact factory for availability
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Contact factory for details and availability for PREVIEW devices, minimum order quantities may apply.
DEVICE INFORMATION
YZV PACKAGE
TERMINAL ASSIGNMENTS
B
ON
GND
A
VIN
VOUT
2
1
PIN FUNCTIONS
TPS22912
YZV
B1
2
PIN NAME
GND
B2
ON
A1
VOUT
A2
VIN
DESCRIPTION
Ground
Switch control input, active high. Do not leave floating
Switch output
Switch input. Use ceramic capacitor to GND for bypass.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :TPS22912
TPS22912
www.ti.com
SLVSB78 – APRIL 2012
BLOCK DIAGRAM
VIN
Reverse
Current
Protection
UVLO
ON
Control
Logic
GND
VOUT
Table 2. FUNCTION TABLE
ON
VIN to VOUT
L
OFF
H
ON
ABSOLUTE MAXIMUM RATINGS
VALUE
UNIT
VIN
Input voltage range
–0.3 to 6
V
VOUT
Output voltage range
–0.3 to 6
V
VON
Input voltage range
–0.3 to 6
V
IMAX
Maximum continuous switch current
2
A
IPLS
Maximum pulsed switch current, pulse ≤500 ms, 50% duty cycle
3
A
TA
Operating free-air temperature range
–40 to 85
°C
TJ
Maximum junction temperature
125
°C
TSTG
Storage temperature range
–65 to 150
°C
TLEAD
Maximum lead temperature (10-s soldering time)
300
°C
ESD
Electrostatic discharge protection
Human-Body Model (HBM) (VIN, VOUT, GND pins)
2000
Charged-Device Model (CDM) (VIN, VOUT, ON, GND pins)
1000
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :TPS22912
V
3
TPS22912
SLVSB78 – APRIL 2012
www.ti.com
THERMAL INFORMATION
TPS22912
THERMAL METRIC (1)
CSP
UNITS
4 PINS
θJA
Junction-to-ambient thermal resistance
θJCtop
Junction-to-case (top) thermal resistance
1.9
θJB
Junction-to-board thermal resistance
36.8
ψJT
Junction-to-top characterization parameter
11.3
ψJB
Junction-to-board characterization parameter
36.8
θJCbot
Junction-to-case (bottom) thermal resistance
N/A
(1)
189.1
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
VIN
Input voltage range
VON
ON voltage range
VOUT
Output voltage range (Note: VOUT greater than VIN will cause the reverse current protection of this
device to trigger. See application section.)
VIH
High-level input voltage, ON
VIL
Low-level input voltage, ON
CIN
Input Capacitor
(1)
4
MIN
MAX
1.4
5.5
V
0
5.5
V
VIN
UNIT
(1)
VIN = 3.61 V to 5.5 V
1.1
5.5
V
VIN = 1.4 V to 3.6 V
1.1
5.5
V
0.6
V
VIN = 3.61 V to 5.5 V
VIN = 1.4 V to 3. 6V
0.4
1
(1)
V
µF
Refer to the application section.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :TPS22912
TPS22912
www.ti.com
SLVSB78 – APRIL 2012
ELECTRICAL CHARACTERISTICS
VIN = 1.4 V to 5.5 V, TA = –40ºC to 85ºC (unless otherwise noted)
PARAMETER
IIN
Quiescent current
IIN(off)
(1)
IIN(Leakage)
Off supply current
Leakage current
TEST CONDITIONS
TA
MIN
2
10
IOUT = 0, VON = VIN = 4.2 V
2
7.0
IOUT = 0, VON = VIN = 3.6 V
2
7.0
IOUT = 0, VON = VIN = 2.5 V
0.9
5
IOUT = 0, VON = VIN = 1.5 V
0.7
5
RL = 1 MΩ, VIN = 5.25 V, VON = GND
1.2
10
RL = 1 MΩ, VIN = 4.2 V, VON = GND
0.2
7.0
RL = 1 MΩ, VIN = 3.6 V, VON = GND
Full
0.1
7.0
RL = 1 MΩ, VIN = 2.5 V, VON = GND
0.1
5
RL = 1 MΩ, VIN = 1.5 V, VON = GND
0.1
5
VOUT = 0, VIN = 5.25 V, VON = GND
1.2
10
VOUT = 0, VIN = 4.2 V, VON = GND
0.2
7.0
0.1
7.0
0.1
5
VOUT = 0, VIN = 3.6 V, VON = GND
Full
Full
VOUT = 0, VIN = 1.5 V, VON = GND
VIN = 5.25 V, IOUT = –200 mA
VIN = 5.0 V, IOUT = –200 mA
VIN = 4.2 V, IOUT = –200 mA
On-resistance
VIN = 3.3 V, IOUT = –200 mA
VIN = 2.5 V, IOUT = –200 mA
VIN = 1.8 V, IOUT = –200 mA
VIN = 1.5 V, IOUT = –200 mA
UVLO
Under voltage lockout
MAX
IOUT = 0, VON = VIN = 5.25 V
VOUT = 0, VIN = 2.5 V, VON = GND
rON
TYP
VIN increasing, VON = 3.6 V,
IOUT = –100 mA
VIN decreasing, VON = 3.6 V, IOUT = –100
mA
25°C
0.1
5
60
80
Full
UNIT
µA
µA
µA
110
25°C
60
Full
80
110
25°C
60
Full
80
110
25°C
60.7
Full
80
110
25°C
63.4
Full
mΩ
90
120
25°C
74.2
Full
100
130
25°C
83.9
Full
120
150
1.2
Full
V
0.50
ION
ON input leakage current
VON = 1.4 V to 5.25 V or GND
Full
VRCP
Reverse Current Voltage
Threshold
VOUT > VIN
25°C
54
mV
IRCP(leak)
Reverse Current Protection
Leakage after Reverse
Current event
VOUT – VIN > VRCP
25°C
0.3
µA
tDELAY
Reverse Current Response
Delay
VIN = 5V
10
µs
(1)
1
µA
Verified by characterization, not production tested.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :TPS22912
5
TPS22912
SLVSB78 – APRIL 2012
www.ti.com
SWITCHING CHARACTERISTICS
PARAMETER
TPS22912
TEST CONDITION
TYP
UNIT
VIN = 5 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
6.6
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
912
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
3
840
µs
VIN = 3.3 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
1147
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
8.6
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
1030
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
3
µs
VIN = 1.5 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
17.4
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
1970
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
6.5
2513
µs
PARAMETRIC MEASUREMENT INFORMATION
VOUT
VIN
CIN = 1µF
ON
+
-
(A)
ON
CL
RL
OFF
GND
TPS22912
GND
GND
TEST CIRCUIT
VON
50%
50%
tOFF
tON
VOUT
50%
50%
tf
tr
90%
VOUT
90%
10%
10%
tON /t OFF WAVEFORMS
(A) Rise and fall times of the control signal is 100ns.
A.
Rise and fall times of the control signal are 100 ns.
Figure 1. Test Circuit and tON/tOFF Waveforms
6
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :TPS22912
TPS22912
www.ti.com
SLVSB78 – APRIL 2012
TYPICAL CHARACTERISTICS
ON-STATE RESISTANCE
vs
INPUT VOLTAGE
ON INPUT THRESHOLD
120
6
−40C
25C
85C
100
VIN = 5.0V
VIN = 4.2V
VIN = 3.3V
VIN = 2.5V
VIN = 1.8V
VIN = 1.5V
5.5
5
4.5
4
VOUT (V)
Ron (mΩ)
80
60
40
3.5
3
2.5
2
1.5
20
1
0.5
0
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
4
4.5
5
5.5
0
6
0
0.2
0.4
0.6
0.8
VON (V)
1
1.2
1.4
G000
G000
Figure 2.
Figure 3.
INPUT CURRENT, QUIESCENT
vs
INPUT VOLTAGE
INPUT CURRENT, LEAK
vs
INPUT VOLTAGE
3000
3.5
−40C
25C
85C
3
−40C
25C
85C
2500
2.5
IIN_Leak (nA)
IIN_Q (µA)
2000
2
1.5
1500
1000
1
500
0.5
0
0
1
2
3
Voltage (V)
4
5
6
0
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
4
4.5
5
5.5
G000
Figure 4.
6
G000
Figure 5.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :TPS22912
7
TPS22912
SLVSB78 – APRIL 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
ON-STATE RESISTANCE
vs
TEMPERATURE
INPUT CURRENT, OFF
vs
INPUT VOLTAGE
180
160
140
Ron (mΩ)
120
VIN = 1.4V
VIN = 1.5V
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 4.2V
VIN= 5.0V
VIN = 5.5V
100
80
60
40
20
0
−40
−15
10
35
Temperature (°C)
60
85
G000
Figure 6.
Figure 7.
Maximum Power Dissipation (W)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
−40 −30 −20 −10 0 10 20 30 40 50
Ambient Temperature (°C)
60
70
G001
Figure 8. Allowable Power Dissipation
8
80
Figure 9. ULVO Response IOUT = -100mA
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :TPS22912
TPS22912
www.ti.com
SLVSB78 – APRIL 2012
TYPICAL CHARACTERISTICS (continued)
Figure 10. Reverse Current Protection VOUT = 3.3V, VIN = 3.3V Decreasing to 0V
TYPICAL AC CHARACTERISTICS FOR TPS22912C
RISE TIME
vs
TEMPERATURE
FALL TIME
vs
TEMPERATURE
1200
4
VIN =5.0V, CL = 0.1 µF, RL = 10 Ohms
1000
3
tFall (µs)
tRise (µs)
800
600
2
400
1
200
VIN =5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
60
G000
Figure 11.
85
G000
Figure 12.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :TPS22912
9
TPS22912
SLVSB78 – APRIL 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
RISE TIME
vs
TEMPERATURE
FALL TIME
vs
TEMPERATURE
3000
10
VIN =1.5V, CL = 0.1 µF, RL = 10 Ohms
9
2500
8
7
2000
tFall (µs)
tRise (µs)
6
1500
5
4
1000
3
2
500
1
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
G000
85
G000
Figure 13.
Figure 14.
TURN-ON TIME
vs
TEMPERATURE
TURN-OFF TIME
vs
TEMPERATURE
1200
10
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
1000
8
800
tOff (µs)
tOn (µs)
6
600
4
400
2
200
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
G000
Figure 15.
10
60
85
G000
Figure 16.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :TPS22912
TPS22912
www.ti.com
SLVSB78 – APRIL 2012
TYPICAL CHARACTERISTICS (continued)
TURN-ON TIME
vs
TEMPERATURE
TURN-OFF TIME
vs
TEMPERATURE
25
4000
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
3500
20
3000
15
tOff (µs)
tOn (µs)
2500
2000
10
1500
1000
5
500
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
G000
85
G000
Figure 17.
Figure 18.
RISE TIME
vs
INPUT VOLTAGE
3500
3000
tRise (µs)
2500
2000
1500
1000
500
−40C
25C
85C
CL = 1 µF, RL = 10 Ohms, VON = 1.8V
0
0
0.5
1
1.5
2
2.5 3 3.5
VIN (V)
4
4.5
5
5.5
6
G000
Figure 19.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :TPS22912
11
TPS22912
SLVSB78 – APRIL 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
12
TURN-ON RESPONSE
VIN = 5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
TURN-OFF RESPONSE
VIN = 5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 20.
Figure 21.
TURN-ON RESPONSE TIME
VIN = 5V, TA = 25°C, CIN =10µF, CL = 1µF, RL = 10Ω
TURN-OFF RESPONSE TIME
VIN = 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 22.
Figure 23.
TURN-ON RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
TURN-OFF RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 24.
Figure 25.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :TPS22912
TPS22912
www.ti.com
SLVSB78 – APRIL 2012
TYPICAL CHARACTERISTICS (continued)
VIN
TURN-ON RESPONSE TIME
= 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
TURN-OFF RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 26.
Figure 27.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :TPS22912
13
TPS22912
SLVSB78 – APRIL 2012
www.ti.com
APPLICATION INFORMATION
On/Off Control
The ON pin controls the state of the switch. Asserting ON high enables the switch. ON is active high and has a
low threshold, making the pin capable of interfacing with low-voltage signals. The ON pin is compatible with
standard GPIO logic threshold. It can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIO.
Input Capacitor
To limit the voltage drop on the input supply caused by transient inrush currents, a capacitor needs to be placed
between VIN and GND. A 1-μF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher
values of CIN can be used to further reduce the voltage drop.
Output Capacitor
A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip caused by inrush currents during startup.
Devices with faster rise times may require a larger ratio to minimize VIN dip.
Under-Voltage Lockout
Under-voltage lockout protection turns off the switch if the input voltage is below the under-voltage lockout
threshold. During under-voltage lockout (UVLO), if the voltage level at VOUT exceeds the voltage level at VIN by
the Reverse Current Voltage Threshold (VRVP), the body diode will be disengaged to prevent any current flow to
VIN. With the ON pin active, the input voltage rising above the under-voltage lockout threshold will cause a
controlled turn-on of the switch to limit current over-shoot.
14
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :TPS22912
TPS22912
www.ti.com
SLVSB78 – APRIL 2012
Reverse Current Protection
In a scenario where VOUT is greater than VIN, there is potential for reverse current to flow through the pass FET
or the body diode. The TPS22912 monitors VIN and VOUT voltage levels. When the reverse current voltage
threshold (VRCP) is exceeded, the switch is disabled (within 10μs typ). Additionally, the body diode is disengaged
so as to prevent any reverse current flow to VIN. The FET, and the output (VOUT), will resume normal operation
when the reverse current scenario is no longer present. The peak instantaneous reverse current is the current it
takes to trip the reverse current protection. After the reverse current protection has tripped due to the peak
instantaneous reverse current, the DC (off-state) leakage current from VOUT and VIN is referred to as IRCP(leak)
(see figure below).
Use the following formula to calculate the amount of peak instantaneous reverse current for a particular
application:
IRC =
VRCP
RON( VIN)
Where,
IRC is the amount of reverse current,
RON(VIN) is the on-resistance at the VIN of the reverse current condition.
VOUT
VRCP
I RC
VIN
I REVERSE _CURRENT
IRCP (LEAK)
Figure 28. Reverse Current
Board Layout
For best performance, all traces should be as short as possible. The input and output capacitors should be
placed close to the device to minimize the effects that parasitic trace inductances may have on normal operation.
Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects along with minimizing the
case to ambient thermal impedance.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :TPS22912
15
PACKAGE OPTION ADDENDUM
www.ti.com
30-May-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TPS22912CYZVR
ACTIVE
DSBGA
YZV
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS22912CYZVT
ACTIVE
DSBGA
YZV
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Apr-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPS22912CYZVR
DSBGA
YZV
4
3000
178.0
9.2
TPS22912CYZVT
DSBGA
YZV
4
250
178.0
9.2
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1.0
1.0
0.63
4.0
8.0
Q1
1.0
1.0
0.63
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Apr-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS22912CYZVR
DSBGA
YZV
4
3000
220.0
220.0
35.0
TPS22912CYZVT
DSBGA
YZV
4
250
220.0
220.0
35.0
Pack Materials-Page 2
D: Max = 0.918 mm, Min =0.858 mm
E: Max = 0.918 mm, Min =0.858 mm
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated