TPS22965 www.ti.com SLVSBJ0 – AUGUST 2012 Single Channel, Ultra-Low Resistance Load Switch Check for Samples: TPS22965 FEATURES DESCRIPTION • • • The TPS22965 is a small, ultra-low RON, single channel load switch with controlled turn on. The device contains an N-channel MOSFET that can operate over an input voltage range of 0.8V to 5.5V and can support a maximum continuous current of 6A. The switch is controlled by an on/off input (ON), which is capable of interfacing directly with lowvoltage control signals. In the TPS22965, a 225-Ω onchip load resistor is added for quick output discharge when switch is turned off. 1 2 • • • • • • • Integrated Single Channel Load Switch Input Voltage Range: 0.8V to 5.5V Ultra low RON Resistance – RON = 16mΩ at VIN = 5V (VBIAS = 5V) – RON = 16mΩ at VIN = 3.6V (VBIAS = 5V) – RON = 16mΩ at VIN = 1.8V (VBIAS = 5V) 6A Maximum Continuous Switch Current Low Quiescent Current (50µA) Low Control Input Threshold Enables Use of 1.2V/1.8V/2.5V/3.3V Logic Configurable Rise Time Quick Output Discharge (QOD) SON 8-pin Package With Thermal Pad ESD Performance Tested per JESD 22 – 2KV HBM and 1KV CDM APPLICATIONS • • • • • • • Ultrabook™ Notebooks/Netbooks Tablet PC Consumer Electronics Set-top Boxes/Residental Gateways Telecom Systems Solid State Drives (SSD) Power Supply The TPS22965 is available in a small, space-saving 2mm x 2mm 8-pin SON package (DSG) with integrated thermal pad allowing for high power dissipation. The device is characterized for operation over the free-air temperature range of –40°C to 85°C. Feature List RON Typical at 3.6 V (VBIAS = 5V) (1) Rise Time Adjustable Quick Output Discharge(2) Yes Maximum Output Current 6A GPIO Enable Active High Operating Temperature –40°C to 85°C (1) See Application Information section for CT value vs. rise time. (2) This feature discharges the output of the switch to GND through a 225-Ω resistor, preventing the output from floating. VIN ON CIN 16 mΩ VOUT ON CL RL CT OFF GND GND VBIAS TPS22965 Typical Application 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Ultrabook is a trademark of Intel. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated TPS22965 SLVSBJ0 – AUGUST 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION ORDERABLE PART NO. TOP-SIDE MARKING/STATUS -40°C to 85°C TA DSG Tape and reel 3000 units PACKAGE TPS22965DSGR ZSA0 -40°C to 85°C DSG Tape and reel 250 units TPS22965DSGT ZSA0 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) (2) VALUE UNIT (2) VIN Input voltage range –0.3 to 6 V VOUT Output voltage range –0.3 to 6 V VBIAS Bias voltage range –0.3 to 6 V VON Input voltage range –0.3 to 6 V IMAX Maximum continuous switch current 6 A IPLS Maximum pulsed switch current, pulse <300 µs, 2% duty cycle TA Operating free-air temperature range (3) TJ Maximum junction temperature TSTG Storage temperature range TLEAD Maximum lead temperature (10-s soldering time) ESD (1) (2) (3) Electrostatic discharge protection 8 A –40 to 85 °C 125 °C –65 to 150 °C 300 °C Human-Body Model (HBM) 2000 Charged-Device Model (CDM) 1000 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal. In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max)) THERMAL INFORMATION THERMAL METRIC (1) TPS22965 DSG (8 PINS) θJA Junction-to-ambient thermal resistance 65.3 θJCtop Junction-to-case (top) thermal resistance 74.2 θJB Junction-to-board thermal resistance 35.4 ψJT Junction-to-top characterization parameter 2.2 ψJB Junction-to-board characterization parameter 36.0 θJCbot Junction-to-case (bottom) thermal resistance 12.8 (1) 2 UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 TPS22965 www.ti.com SLVSBJ0 – AUGUST 2012 RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT VIN Input voltage range 0.8 VBIAS V VBIAS Bias voltage range 2.5 5.5 V VON ON voltage range 0 VIN V VOUT Output voltage range VIN V VIH High-level input voltage, ON VBIAS = 2.5 V to 5.5 V 1.2 5.5 V VIL Low-level input voltage, ON VBIAS = 2.5 V to 5.5 V 0 0.5 V CIN (1) Input capacitor 1 (1) µF Refer to Application Information section. ELECTRICAL CHARACTERISTICS Unless otherwise note, the specification in the following table applies over the operating ambient temperature –40°C ≤ TA ≤ 85°C (Full) and VBIAS = 5.0 V. Typical values are for TA = 25°C. PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT POWER SUPPLIES AND CURRENTS IIN(VBIAS-ON) VBIAS quiescent current IIN(VBIAS-OFF) VBIAS shutdown current IOUT = 0, VIN = VON = VBIAS = 5.0 V Full VON = GND, VOUT = 0 V Full VIN = 5.0 V IIN(VIN-OFF) VIN off-state supply current VON = GND, VOUT = 0 V ION ON pin input leakage current VON = 5.5 V 50 VIN = 3.3 V VIN = 1.8 V Full VIN = 0.8 V 75 µA 2 µA 0.2 8 0.02 3 0.01 2 0.005 Full µA 1 0.5 µA RESISTANCE CHARACTERISTICS VIN = 5.0 V VIN = 3.3 V RON ON-state resistance IOUT = –200 mA, VBIAS = 5.0 V VIN = 1.8 V VIN = 1.5 V VIN = 1.2 V VIN = 0.8 V RPD Output pulldown resistance VIN = 5.0 V, VON = 0V, IOUT = 15 mA 25°C 16 Full 25°C 25 16 Full 25°C 16 16 16 23 25 16 Full Full 23 25 Full 25°C 23 25 Full 25°C 23 25 Full 25°C 23 23 25 225 300 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 mΩ mΩ mΩ mΩ mΩ mΩ Ω 3 TPS22965 SLVSBJ0 – AUGUST 2012 www.ti.com ELECTRICAL CHARACTERISTICS Unless otherwise noted, the specification in the following table applies over the operating ambient temperature –40°C ≤ TA ≤ 85°C (Full) and VBIAS = 2.5 V. Typical values are for TA = 25°C. PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT POWER SUPPLIES AND CURRENTS IOUT = 0, VIN = VON = VBIAS = 2.5 V Full IIN(VBIAS-OFF) VBIAS shutdown current VON = GND, VOUT = 0 V Full IIN(VIN-OFF) VIN off-state supply current VON = GND, VOUT = 0 V ION ON pin input leakage current VON = 5.5 V IIN(VBIAS-ON) VBIAS quiescent current 20 30 µA 2 µA VIN = 2.5 V 0.01 3 VIN = 1.8 V 0.01 2 0.005 2 VIN = 1.2 V Full VIN = 0.8 V 0.003 Full µA 1 0.5 µA RESISTANCE CHARACTERISTICS VIN = 2.5 V VIN = 1.8 V RON ON-state resistance IOUT = –200 mA, VBIAS = 2.5 V VIN = 1.5 V VIN = 1.2 V VIN = 0.8 V RPD 4 Output pulldown resistance VIN = 2.5 V, VON = 0V, IOUT = 1 mA Submit Documentation Feedback 25°C 20 Full 25°C 28 19 Full 25°C 18 18 25 27 17 Full Full 25 27 Full 25°C 26 28 Full 25°C 26 25 27 275 325 mΩ mΩ mΩ mΩ mΩ Ω Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 TPS22965 www.ti.com SLVSBJ0 – AUGUST 2012 SWITCHING CHARACTERISTIC MEASUREMENT INFORMATION VIN VOUT ON CT CIN = 1µF ON + - (A) OFF CL RL VBIAS GND TPS22965 GND GND TEST CIRCUIT VON 50% 50% tOFF tON VOUT 50% tF tR 50% 90% VOUT 90% 10% 10% tD t ON/t OFF WAVEFORMS (A) Rise and fall times of the control signal is 100ns. Figure 1. Test Circuit and tON/tOFF Waveforms SWITCHING CHARACTERISTICS PARAMETER TEST CONDITION MIN TYP MAX UNIT VIN = VON = VBIAS = 5 V, TA = 25ºC (unless otherwise noted) tON Turn-on time 1325 tOFF Turn-off time 10 tR VOUT rise time tF VOUT fall time 3.5 tD ON delay time 500 RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 1625 µs VIN = 0.8 V, VON = VBIAS = 5V, TA = 25ºC (unless otherwise noted) tON Turn-on time tOFF Turn-off time 600 tR VOUT rise time tF VOUT fall time 5.5 tD ON delay time 460 80 RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 300 µs VIN = 2.5V, VON = 5 V, VBIAS = 2.5V, TA = 25ºC (unless otherwise noted) tON Turn-on time tOFF Turn-off time tR VOUT rise time tF VOUT fall time tD ON delay time 2200 9 RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 2275 µs 3.1 1075 VIN = 0.8 V, VON = 5 V, VBIAS = 2.5 V, TA = 25ºC (unless otherwise noted) tON Turn-on time tOFF Turn-off time tR VOUT rise time tF VOUT fall time tD ON delay time 1450 60 RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 875 µs 5.5 1010 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 5 TPS22965 SLVSBJ0 – AUGUST 2012 www.ti.com FUNCTIONAL BLOCK DIAGRAM VIN Charge Pump VBIAS ON Control Logic VOUT CT GND Figure 2. Functional Block Diagram Table 1. FUNCTIONAL TABLE 6 ON VIN to VOUT VOUT to GND L Off On H On Off Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 TPS22965 www.ti.com SLVSBJ0 – AUGUST 2012 DSG PACKAGE VIN 1 8 VOUT VOUT 8 1 VIN VIN 2 7 VOUT VOUT 7 2 VIN ON 3 6 CT CT 6 3 ON VBIAS 4 5 GND GND 5 4 VBIAS BOTTOM VIEW TOP VIEW PIN DESCRIPTIONS TPS22965 DSG PIN NAME I/O DESCRIPTION 1 VIN I Switch input. Input bypass capacitor recommended for minimizing VIN dip. Recommended voltage range for this pin for optimal RON performance is 0.8V to VBIAS. 2 VIN I Switch input. Input bypass capacitor recommended for minimizing VIN dip. Recommended voltage range for this pin for optimal RON performance is 0.8V to VBIAS. 3 ON I Active high switch control input. Do not leave floating. 4 VBIAS I Bias voltage. Power supply to the device. Recommended voltage range for this pin is 2.5V to 5.5V. See Application Information section for more information. 5 GND - Device ground. 6 CT O Switch slew rate control. Can be left floating. See Application Information section for more information. 7 VOUT O Switch output. 8 VOUT O Switch output. Thermal Pad - Thermal pad (exposed center pad) to alleviate thermal stress. Tie to GND. See Application Information for layout guidelines. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 7 TPS22965 SLVSBJ0 – AUGUST 2012 www.ti.com TYPICAL CHARACTERISTICS VBIAS vs. QUIESCENT CURRENT VBIAS vs. SHUTDOWN CURRENT 0.7 60 0.6 IINOFF_VBIAS (µA) IIN_VBIAS (µA) 50 −40C 25C 70C 85C 40 30 20 −40C 25C 70C 85C 0.5 0.4 0.3 0.2 VIN=VBIAS, VON = 5V, VOUT=OPEN 10 2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.5 4.75 VBIAS (V) 5 VIN=VBIAS, VON=0V, VOUT=0V 0.1 2.5 2.75 5.25 5.5 3 3.25 3.5 3.75 4 4.25 4.5 4.75 VBIAS (V) 5 5.25 5.5 G070 G070 TEMPERATURE vs. RON (VBIAS = 2.5V) VIN vs. OFF-STATE VIN CURRENT 24 8.5 8 7.5 7 −40C 25C 70C 85C VBIAS=5.5V, VON=0V, VOUT = 0V 23 22 6.5 21 5.5 20 5 Ron (mΩ) IINOFF_VIN (µA) 6 VIN =0.8V VIN =1.05 VIN =1.2 VIN=1.5V VIN = 1.8V VIN = 2.5V 4.5 4 3.5 19 18 17 3 2.5 16 2 15 1.5 1 14 0.5 0 0.8 1.2 1.6 VBIAS =2.5V, IOUT=−200mA 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.6 13 −40 G067 8 Submit Documentation Feedback −15 10 35 Temperature (°C) 60 85 G063 Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 TPS22965 www.ti.com SLVSBJ0 – AUGUST 2012 TYPICAL CHARACTERISTICS (continued) TEMPERATURE vs. RON (VBIAS = 5.5V) VIN vs. RON (VBIAS = 2.5V) 21 20 19.5 19 18.5 18 Ron (mΩ) 17.5 17 16.5 26 VIN =0.8V VIN =1.05 VIN =1.2 VIN=1.5V VIN = 1.8V VIN = 2.5V VIN = 3.3V VIN =3.6V VIN=4.2V VIN=5V VN=5.5V 24 23 22 21 16 15.5 20 19 18 17 15 14.5 16 14 15 13.5 14 13 12.5 12 −40 −40C 25C 70C 85C 25 Ron (mΩ) 20.5 13 VBIAS =5.5V, IOUT=−200mA −15 10 35 Temperature (°C) 60 VBIAS =2.5V, IOUT = −200mA 12 0.8 85 1.05 1.3 1.55 1.8 VIN (V) 2.05 2.3 2.5 G064 G060 VIN vs. RON (VBIAS = 5.5V) VIN vs. RON (TA = 25°C) 21 20 VBIAS =5.5V, IOUT = −200mA Temperature=25C, IOUT=−200mA VBIAS = 2.5V VBIAS = 3.3V VBIAS = 3.6V VBIAS= 4.2V VBIAS = 5V VBIAS = 5.5V 19 20 18 19 Ron (mΩ) Ron (mΩ) 17 16 18 15 17 −40C 25C 70C 85C 14 16 13 12 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.6 15 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.6 G061 G062 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 9 TPS22965 SLVSBJ0 – AUGUST 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) VIN vs. RPD (VBIAS = 5.5V) VON vs. VOUT (TA = 25°C) 2.4 231 IPD=1mA, VBIAS=5.5V, VON=0V −40C 25C 70C 85C 230 VIN=2V, Tempeature = 25C 2.2 2 1.8 229 228 VOUT (V) Rpd (Ω) 1.6 227 1.4 1.2 1 0.8 226 VBIAS = 2.5V VBIAS=3.3V VBIAS=3.6V VBIAS=4.2 VBIAS=5V VBIAS=5.5V 0.6 0.4 225 0.2 224 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 0 4.4 4.8 5.2 5.6 0 0.25 0.5 0.75 1 1.25 1.5 VON (V) 1.75 2 2.25 2.5 G065 G066 VIN vs. tD (VBIAS = 2.5V, CT = 1nF) VIN vs. tD (VBIAS = 5.5V, CT = 1nF) 1500 1450 1400 650 VBIAS = 2.5V CT = 1nf VBIAS = 5.5V, CT = 1nf 600 1350 1300 1250 550 1200 1100 tD (µs) tD (µs) 1150 1050 1000 500 450 950 900 400 850 800 −40C 25C 70C 85C 750 700 650 600 0.8 1 1.2 1.4 1.6 1.8 VIN (V) 2 2.2 2.4 2.6 300 0.8 1.2 1.6 G030 10 −40C 25C 70C 85C 350 Submit Documentation Feedback 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.5 G035 Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 TPS22965 www.ti.com SLVSBJ0 – AUGUST 2012 TYPICAL CHARACTERISTICS (continued) VIN vs. tF (VBIAS = 2.5V, CT = 1nF) VIN vs. tF (VBIAS = 5.5V, CT = 1nF) 8 8 VBIAS = 2.5V CT = 1nf −40C 25C 70C 85C 7 VBIAS = 5.5V CT = 1nf −40C 25C 70C 85C 7 6 6 tFall (µs) tFall (µs) 5 5 4 4 3 3 2 2 1 0.8 1 1 1.2 1.4 1.6 1.8 VIN (V) 2 2.2 2.4 0 0.8 1.2 1.6 2.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.6 G036 G041 VIN vs. tOFF (VBIAS = 2.5V, CT = 1nF) VIN vs. tOFF (VBIAS = 5.5V, CT = 1nF) 125 80 −40C 25C 70C 85C 70 VBIAS = 5.5V CT = 1nf −40C 25C 70C 85C 100 60 75 tOff (µs) tOff (µs) 50 40 50 30 20 25 10 VBIAS = 2.5V CT = 1nf 0 0.8 1 1.2 1.4 1.6 1.8 VIN (V) 2 2.2 2.4 2.6 0 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.6 G042 G047 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 11 TPS22965 SLVSBJ0 – AUGUST 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) VIN vs. tON (VBIAS = 2.5V, CT = 1nF) VIN vs. tON (VBIAS = 5.5V, CT = 1nF) 1600 2700 −40C 25C 70C 85C 2600 2500 2400 1500 1400 −40C 25C 70C 85C 1300 2300 2200 1200 2000 tOn (µs) tOn (µs) 2100 1900 1800 1100 1000 900 1700 800 1600 700 1500 1400 600 1300 1200 1100 0.8 1 1.2 1.4 1.6 1.8 VIN (V) 2 VBIAS = 2.5V CT = 1nf 500 2.2 400 0.8 1.2 1.6 2.4 2.6 VBIAS = 5.5V CT = 1nf 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.6 G048 G053 VIN vs. tR (VBIAS = 2.5V, CT = 1nF) VIN vs. tR (VBIAS = 5.5V, CT = 1nF) 2800 2000 −40C 25C 70C 85C 2450 1750 −40C 25C 70C 85C 1500 tRise (µs) tRise (µs) 2100 1750 1250 1000 1400 750 1050 500 VBIAS= 2.5V CT = 1nf 700 0.8 1 1.2 1.4 1.6 1.8 VIN (V) 2 2.2 2.4 VBIAS = 5.5V CT = 1nf 2.6 250 0.8 1.2 1.6 G061 12 Submit Documentation Feedback 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.6 G059 Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 TPS22965 www.ti.com SLVSBJ0 – AUGUST 2012 TYPICAL CHARACTERISTICS (continued) VBIAS vs. tR (VIN = 2.5V, CT = 1nF) 3000 −40C 25C 70C 85C 2750 2500 2250 tRise (µs) 2000 1750 1500 1250 1000 750 VIN = 2.5V CT = 1nf 500 2.5 2.8 3 3.2 3.5 3.8 4 4.2 4.5 4.8 VBIAS (V) 5 5.2 5.5 G061 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 13 TPS22965 SLVSBJ0 – AUGUST 2012 www.ti.com TYPICAL AC SCOPE CAPTURES at TA = 25ºC, CT = 1nF (CH1 = VOUT, CH2 = ON) 14 TURN-ON RESPONSE TIME (VIN = 0.8V, VBIAS = 2.5V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) TURN-ON RESPONSE TIME (VIN = 0.8V, VBIAS = 5.0V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) TURN-ON RESPONSE TIME (VIN = 2.5V, VBIAS = 2.5V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) TURN-ON RESPONSE TIME (VIN = 5.0V, VBIAS = 5.0V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) TURN-OFF RESPONSE TIME (VIN = 0.8V, VBIAS = 2.5V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) TURN-OFF RESPONSE TIME (VIN = 0.8V, VBIAS = 5.0V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 TPS22965 www.ti.com SLVSBJ0 – AUGUST 2012 TYPICAL AC SCOPE CAPTURES at TA = 25ºC, CT = 1nF (CH1 = VOUT, CH2 = ON) (continued) TURN-OFF RESPONSE TIME (VIN = 2.5V, VBIAS = 2.5V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) TURN-OFF RESPONSE TIME (VIN = 5.0V, VBIAS = 5.0V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 15 TPS22965 SLVSBJ0 – AUGUST 2012 www.ti.com APPLICATION INFORMATION ON/OFF CONTROL The ON pin controls the state of the switch. Asserting ON high enables the switch. ON is active high and has a low threshold, making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard GPIO logic thresholds. It can be used with any microcontroller with 1.2V or higher GPIO voltage. This pin cannot be left floating and must be driven either high or low for proper functionality. INPUT CAPACITOR (OPTIONAL) To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns on into a discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-µF ceramic capacitor, CIN, placed close to the pins, is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop during high current applications. When switching heavy loads, it is recommended to have an input capacitor about 10 times higher than the output capacitor to avoid excessive voltage drop. OUTPUT CAPACITOR (OPTIONAL) Due to the integrated body diode in the NMOS switch, a CIN greater than CL is highly recommended. A CL greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip caused by inrush currents during startup, however a 10 to 1 ratio for capacitance is not required for proper functionality of the device. A ratio smaller than 10 to 1 (such as 1 to 1) could cause slightly more VIN dip upon turn-on due to inrush currents. This can be mitigated by increasing the capacitance on the CT pin for a longer rise time (see below). VIN and VBIAS VOLTAGE RANGE For optimal RON performance, make sure VIN ≤ VBIAS. The device will still be functional if VIN > VBIAS but it will exhibit RON greater than what is listed in the ELECTRICAL CHARACTERISTICS table. See Figure 3 for an example of a typical device. Notice the increasing RON as VIN exceeds VBIAS voltage. Be sure to never exceed the maximum voltage rating for VIN and VBIAS. 50 45 40 VBIAS = 2.5V VBIAS = 3.3V VBIAS = 3.6V VBIAS= 4.2V VBIAS = 5V VBIAS = 5.5V Ron (mΩ) Temperature=25C, IOUT=−200mA 35 30 25 20 15 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.6 G062 Figure 3. RON vs. VIN (VIN > VBIAS) 16 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 TPS22965 www.ti.com SLVSBJ0 – AUGUST 2012 ADJUSTABLE RISE TIME A capacitor to GND on the CT pins sets the slew rate for each channel. The voltage on the CT pin can be as high as 12V. Therefore, the minimum voltage rating for the CT cap should be 25V for optimal performance. An approximate formula for the relationship between CT and slew rate is (the equation below accounts for 10% to 90% measurement on VOUT and does NOT apply for CT = 0pF. Use table below to determine rise times for when CT = 0pF): SR = 0.39 ´ CT + 13.4 (1) Where, SR = slew rate (in µs/V) CT = the capacitance value on the CT pin (in pF) The units for the constant 13.4 is in µs/V. The units for the constant 0.39 are in µs/(V*pF). Rise time can be calculated by multiplying the input voltage by the slew rate. The table below contains rise time values measured on a typical device. Rise times shown below are only valid for the power-up sequence where VIN and VBIAS are already in steady state condition, and the ON pin is asserted high. RISE TIME (µs) 10% - 90%, CL = 0.1µF, CIN = 1µF, RL = 10Ω TYPICAL VALUES at 25°C, 25V X7R 10% CERAMIC CAP CTx (pF) 5V 3.3V 1.8V 1.5V 1.2V 1.05V 0.8V 0 127 93 62 55 51 46 42 220 475 314 188 162 141 125 103 470 939 637 359 304 255 218 188 1000 1869 1229 684 567 476 414 344 2200 4020 2614 1469 1211 1024 876 681 4700 8690 5746 3167 2703 2139 1877 1568 10000 18360 12550 6849 5836 4782 4089 3449 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 17 TPS22965 SLVSBJ0 – AUGUST 2012 www.ti.com BOARD LAYOUT AND THERMAL CONSIDERATIONS For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance. The maximum IC junction temperature should be restricted to 125°C under normal operating conditions. To calculate the maximum allowable dissipation, PD(max) for a given output current and ambient temperature, use the following equation as a guideline: PD(max) = TJ(max) - TA QJA (2) Where: PD(max) = maximum allowable power dissipation TJ(max) = maximum allowable junction temperature (125°C for the TPS22965) TA = ambient temperature of the device ΘJA = junction to air thermal impedance. See Thermal Information section. This parameter is highly dependent upon board layout. The figure below shows an example of a layout. Notice the thermal vias located under the exposed thermal pad of the device. This allows for thermal diffusion away from the device. 18 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22965 PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) TPS22965DSGR PREVIEW WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS22965DSGT PREVIEW WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 31-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPS22965DSGR Package Package Pins Type Drawing WSON DSG 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 330.0 8.4 Pack Materials-Page 1 2.3 B0 (mm) K0 (mm) P1 (mm) 2.3 1.15 4.0 W Pin1 (mm) Quadrant 8.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 31-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS22965DSGR WSON DSG 8 3000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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