TI TPS22903

TPS22903
www.ti.com ............................................................................................................................................................................................ SLVS827 – FEBRUARY 2009
ULTRA-SMALL LOW-INPUT-VOLTAGE LOW rON LOAD SWITCH
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
1
•
•
•
•
•
•
•
Input Voltage: 1.1 V to 3.6 V
Ultra-Low ON-State Resistance
– rON = 66 mΩ at VIN = 3.6 V
– rON = 75 mΩ at VIN = 2.5 V
– rON = 90 mΩ at VIN = 1.8 V
– rON = 135 mΩ at VIN = 1.2 V
500-mA Maximum Continuous Switch Current
Quiescent Current < 1 µA
Shutdown Current < 1 µA
Low Control Input Threshold Enables Use of
1.2-V/1.8-V/2.5-V/3.3-V Logic
Controlled Slew Rate (5 µs Max at 3.6 V)
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
4-Terminal Wafer Chip-Scale Package (WCSP)
– 0.8 mm × 0.8 mm,
0.4-mm Pitch, 0.5-mm Height
PDAs
Cell Phones
GPS Devices
MP3 Players
Digital Cameras
Peripheral Ports
Portable Instrumentation
YFP PACKAGE
B
B
A
A
2
1
Laser Marking View
1 2
Bump View
TERMINAL ASSIGNMENTS
B
GND
ON
A
VOUT
VIN
2
1
DESCRIPTION
TPS22903 is an ultra-small, low rON dual load switch with controlled turn on. The device contains a P-channel
MOSFET that can operate over an input voltage range of 1.1 V to 3.6 V. The switch is controlled by an on/off
input (ON), which is capable of interfacing directly with low-voltage control signals.
TPS22903 is available in a space-saving 4-terminal WCSP 0.4-mm pitch (YFP). The device is characterized for
operation over the free-air temperature range of –40°C to 85°C.
FEATURE LIST
(1)
DEVICE
rON TYPICAL
AT 3.6 V
SLEW RATE
AT 3.6 V
QUICK OUTPUT
DISCHARGE (1)
MAXIMUM
OUTPUT
CURRENT
ENABLE
TPS22903
69 mΩ
5 µs max
No
500 mA
Active high
This feature discharges the output of the switch to ground through a 120-Ω resistor, preventing the
output from floating.
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
(3)
PACKAGE
(1) (2)
WCSP – YFP (0.4-mm pitch)
ORDERABLE PART NUMBER
Tape and reel
TPS22903YFPR
TOP-SIDE MARKING (3)
_ _ _4P_
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
TPS22903
SLVS827 – FEBRUARY 2009 ............................................................................................................................................................................................ www.ti.com
BLOCK DIAGRAM
VIN
A1
Turn-On Slew Rate
Controlled Driver
ON
Control
Logic
B1
ESD Protection
A2
VOUT
B2
GND
Figure 1. Functional Block Diagram
FUNCTION TABLE
ON
(CONTROL INPUT)
VIN TO VOUT
L
OFF
H
ON
TERMINAL FUNCTIONS
TERMINAL
2
I/O
DESCRIPTION
BALL NO.
NAME
A1
VIN
I
Input of the switch, bypass this input with a ceramic capacitor to ground
A2
VOUT
O
Output of the switch
B1
ON
I
Switch control input, active high, do not leave floating
B2
GND
–
Ground
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Product Folder Link(s): TPS22903
TPS22903
www.ti.com ............................................................................................................................................................................................ SLVS827 – FEBRUARY 2009
ABSOLUTE MAXIMUM RATINGS (1)
MIN
VIN
Input voltage range
VOUT
Output voltage range
VON
Input voltage range
PD
Power dissipation at TA = 25°C
IMAX
Maximum continuous switch current
TA
Operating free-air temperature range
Tstg
Storage temperature range
Tlead
Maximum lead temperature (10-s soldering time)
ESD
(1)
MAX
–0.3
4
V
VIN + 0.3
V
4
V
0.48
W
–0.3
Electrostatic discharge protection
UNIT
0.5
A
–40
85
°C
–65
150
°C
300
°C
Human-Body Model (HBM)
2000
Charged Device Model (CDM)
1000
V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL IMPEDANCE RATINGS
θJA
(1)
Package thermal impedance (1)
TYP
UNIT
205
°C/W
MIN
MAX
UNIT
1.1
3.6
V
VIN
V
3.6
V
YFP package
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
VIN
Input voltage range
VOUT
Output voltage range
VIH
High-level input voltage, ON
VIL
Low-level input voltage, ON
CIN
Input capacitor (1)
(1)
0.85
0.4
1
V
µF
See Application Information
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TPS22903
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ELECTRICAL CHARACTERISTICS
VIN = 1.1 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN TYP (1)
MAX
UNIT
IIN
Quiescent current
IOUT = 0, VIN = VON
Full
1
µA
IIN(OFF)
OFF-state supply current
VON = GND, OUT = Open
Full
1
µA
IIN(LEAKAGE)
OFF-state switch current
VON = GND, VOUT = 0
1
µA
Full
VIN = 3.6 V
VIN = 2.5 V
rON
ON-state resistance
IOUT = –200 mA
VIN = 1.8 V
VIN = 1.2 V
VIN = 1.1 V
ION
(1)
ON-state input leakage current
VON = 1.1 V to 3.6 V or GND
25°C
66
Full
25°C
95
75
Full
25°C
90
115
125
135
Full
25°C
95
110
Full
25°C
90
mΩ
175
185
157
275
Full
300
Full
1
µA
Typical values are at VIN = 3.3 V and TA = 25°C.
SWITCHING CHARACTERISTICS
VIN = 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP (1)
MAX
0.9
1.5
µs
UNIT
tON
Turn-ON time
IOUT = 100 mA, CL = 0.1 µF
tOFF
Turn-OFF time
IOUT = 100 mA, CL = 0.1 µF
5.8
8
µs
tr
VOUT rise time
IOUT = 100 mA, CL = 0.1 µF
0.80
5
µs
tf
VOUT fall time
IOUT = 100 mA, CL = 0.1 µF
8.3
10
µs
(1)
4
Typical values are at TA = 25°C.
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TPS22903
www.ti.com ............................................................................................................................................................................................ SLVS827 – FEBRUARY 2009
TYPICAL CHARACTERISTICS
1.0
0.9
0.8
ON-State Resistance, rON (Ω)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3
Input Voltage, VIN (V)
Figure 2. rON vs VIN
100
90
80
W
Voltage Drop (mV)
70
Vdrop = 1.0 V
60
Vdrop = 1.2 V
50
Vdrop = 1.8 V
Vdrop = 2.5 V
40
Vdrop = 3.3 V
30
20
10
0
0.00
0.05
Temperature (°C)
Figure 3. rON vs Temperature (VIN = 3.3 V)
0.10
0.15
0.20
0.25
0.30
Load Current (A)
0.35
0.40
0.45
Figure 4. Voltage Drop vs Load Current
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0.50
5
TPS22903
SLVS827 – FEBRUARY 2009 ............................................................................................................................................................................................ www.ti.com
TYPICAL CHARACTERISTICS (continued)
200
250
180
200
Quiescent Current, IIN (nA)
Quiescent Current, IIN (nA)
160
140
150
120
100
100
80
60
50
40
20
0
0.5
0
1.0
1.5
2.0
2.5
3.0
Input Voltage, VIN(V)
3.5
–40
4.0
Figure 5. Quiescent Current vs VIN (VON = VIN, IOUT = 0)
25
Temperature(°C)
85
Figure 6. Quiescent Current vs Temperature (VIN = 3.3 V,
IOUT = 0)
120
250
225
200
100
IIN(OFF) Current (nA)
IIN(OFF) Current (nA)
175
80
60
150
125
100
75
40
50
20
0
0.5
25
0
1.0
1.5
2.0
2.5
Input Voltage, VIN(V)
3.0
3.5
Figure 7. IIN(OFF) vs VIN (VON = 0 V)
6
4.0
–40
25
Temperature(°C)
85
Figure 8. IIN(OFF) vs Temperature (VIN = 3.3 V)
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TPS22903
www.ti.com ............................................................................................................................................................................................ SLVS827 – FEBRUARY 2009
TYPICAL CHARACTERISTICS (continued)
250
120
225
200
IIN (Leakage) Current (nA)
IIN (Leakage) Current (nA)
100
80
60
40
175
150
125
100
75
50
20
25
0
0.5
0
1.0
1.5
2.0
2.5
3.0
3.5
–40
4.0
25
85
Temperature (°C)
Input Voltage, VIN (V)
Figure 9. IIN(Leakage) vs VIN (IOUT = 0)
Figure 10. IIN (Leakage) vs Temperature (VIN = 3.3 V)
4.0
VIN = 3.6 V
3.5
VIN = 3.3 V
3.0
VIN = 3 V
VIN = 2.5 V
VOUT (V)
2.5
2.0
VIN = 1.8 V
VIN = 1.5 V
1.5
VIN = 1.2 V
1.0
VIN = 1.1 V
0.5
0.0
–0.5
0.3
0.4
0.5
0.6
Input Voltage, VON (V)
0.7
0.8
Figure 11. ON-Input Threshold
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TPS22903
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TYPICAL CHARACTERISTICS (continued)
7
6.0
5.5
tfall
6
tOFF
5.0
4.5
5
tON/tOFF (ms)
tIrise /tfall (ms)
4.0
4
CL = 0.1 µF
IL = 100 mA
3
3.5
3.0
CL = 0.1 µF
IL = 100 mA
2.5
2.0
2
1.5
trise
1
tON
1.0
0.5
0
–40
–20
0
20
40
60
80
100
0.0
–40
–20
Figure 12. trise/tfall vs Temperature (VIN = 3.3 V)
VON
200 mV/DIV
20
40
60
80
100
Figure 13. tON/tOFF vs Temperature (VIN = 3.3 V)
VON
200 mV/DIV
CL= 0.1 mF
IOUT = 100 mA
VIN = 1.2 V
IOUT
20 mA/DIV
CL= 10 mF
IOUT = 100 mA
VIN = 1.2 V
IOUT
20 mA/DIV
5 ms/DIV
20 ms/DIV
Figure 14. tON Response
8
0
Temperature (°C)
Temperature (°C)
Figure 15. tON Response
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TYPICAL CHARACTERISTICS (continued)
VON
200 mV/DIV
VON
200 mV/DIV
CL= 0.1 mF
IOUT = 100 mA
VIN = 3.3 V
IOUT
20 mA/DIV
CL= 10 mF
IOUT = 100 mA
VIN = 3.3 V
IOUT
20 mA/DIV
5 ms/DIV
20 ms/DIV
Figure 16. tON Response
Figure 17. tON Response
CL= 0.1 mF
IOUT = 100 mA
VIN = 1.2 V
CL= 10 mF
IOUT = 100 mA
VIN = 1.2 V
VON
200 mV/DIV
VON
200 mV/DIV
IOUT
20 mA/DIV
IOUT
20 mA/DIV
2 ms/DIV
100 ms/DIV
Figure 18. tOFF Response
Figure 19. tOFF Response
CL= 0.1 mF
IOUT = 100 mA
VIN = 3.3 V
CL= 10 mF
IOUT = 100 mA
VIN = 3.3 V
VON
200 mV/DIV
VON
200 mV/DIV
IOUT
20 mA/DIV
IOUT
20 mA/DIV
5 ms/DIV
200 ms/DIV
Figure 20. tOFF Response
Figure 21. tOFF Response
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TPS22903
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PARAMETER MEASUREMENT INFORMATION
VIN
ON
VOUT
(A)
RL
CL
+
–
TPS22903
OFF
CIN =10 x CL
GND
GND
GND
TEST CIRCUIT
1.8 V
VON
VON
VON/2
VON/2
tr
0V
tON
tOFF
VOUT/2
VOUT/2
90%
VOUT
VOH
VOUT
tf
0V
10%
90%
10%
VOL
tON/tOFF WAVEFORMS
A.
trise and tfall of the control signal is 100 ns.
Figure 22. Test Circuit and tON/tOFF Waveforms
10
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TPS22903
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APPLICATION INFORMATION
ON/OFF Control
The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state as there
is no fault. ON is active-high and has a low threshold, making it capable of interfacing with low-voltage signals.
The ON pin is compatible with standard GPIO logic thresholds. It can be used with any microcontroller with
1.2-V, 1.8-V, 2.5-V, or 3.3-V GPIOs.
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-µF ceramic
capacitor, CIN, placed close to the pins, is usually sufficient. Higher values of CIN can be used to further reduce
the voltage drop during high-current application. When switching heavy loads, it is recommended to have an
input capacitor about 10 times higher than the output capacitor to avoid excessive voltage drop.
Output Capacitor
Due to the integral body diode in the PMOS switch, a CIN greater than CL is highly recommended. A CL greater
than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow
through the body diode from VOUT to VIN.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic
electrical effects along with minimizing the case-to-ambient thermal impedance.
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11
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
TPS22903YFPR
ACTIVE
DSBGA
YFP
Pins Package Eco Plan (2)
Qty
4
3000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
SNAGCU
MSL Peak Temp (3)
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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