TI TPS22913C

TPS22913
SLVSB20 – SEPTEMBER 2011
www.ti.com
Ultra-Small, Low on Resistance Load Switch with Controlled Turn-on
Check for Samples: TPS22913
FEATURES
DESCRIPTION
•
•
The TPS22913 is a small, low rON load switch with
controlled turn on. The device contains a P-channel
MOSFET that can operate over an input voltage
range of 1.4 V to 5.5 V. The switch is controlled by an
on/off input (ON), which is capable of interfacing
directly with low-voltage control signals. The
TPS22913 is active high enable.
1
•
•
•
•
•
•
•
•
Integrated Single Load Switch
Ultra Small CSP-4 Package 0.9mm × 0.9mm,
0.5mm Pitch
Input Voltage Range: 1.4-V to 5.5-V
Low ON-Resistance
– rON = 60-mΩ at VIN = 5-V
– rON = 61-mΩ at VIN = 3.3-V
– rON = 74-mΩ at VIN = 1.8-V
– rON = 84-mΩ at VIN = 1.5-V
2-A Maximum Continuous Switch Current
Low Threshold Control Input
Controlled Slew-rate Options
Under-Voltage Lock Out
Quick Output Discharge Transistor
Reverse Current Protection
APPLICATIONS
•
•
•
•
•
•
•
•
Portable Industrial Equipment
Portable Medical Equipment
Portable Media Players
Point Of Sales Terminal
GPS Devices
Digital Cameras
Portable Instrumentation
Smartphones
The TPS22913 contains a 150-Ω on-chip load
resistor for quick output discharge when the switch is
turned off. The rise time of the device is internally
controlled in order to avoid inrush current. The
TPS22913 family has various slew rate options (see
Table 1).
The TPS22913 device provides circuit breaker
functionality by latching off the power-switch during
reverse voltage situations. An internal reverse voltage
comparator disables the power-switch when the
output voltage is driven higher than the input (VIN) to
quickly (10µs typ) stop the flow of current towards the
input side of the switch. The reverse current
protection is active when the power switch is enabled
(ON). Additionally, during under-voltage lockout
(UVLO), or when the switch is disabled, no reverse
current can flow as the switch body diode is not
engaged.
The TPS22913 is available in an ultra-small,
space-saving
4-pin
CSP
package
and
is
characterized for operation over the free-air
temperature range of –40°C to 85°C.
TYPICAL APPLICATION
VOUT
VIN
Power
Supply
CIN
ON
CL
ON
OFF
TPS22913
RL
GND
GND
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TPS22913
SLVSB20 – SEPTEMBER 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Table 1. Feature List
DEVICE
rON (typ) at 3.3 V
SLEW RATE
(typ)
QUICK OUTPUT
DISCHARGE (1)
MAXIMUM OUTPUT
CURRENT
ENABLE
TPS22913A (2)
63 mΩ
0.1 µs/V
Yes
2-A
Active High
TPS22913B
63 mΩ
20 µs/V
Yes
2-A
Active High
TPS22913C
63 mΩ
200 µs/V
Yes
2-A
Active High
63 mΩ
900 µs/V
Yes
2-A
Active High
TPS22913D
(1)
(2)
(2)
This feature discharges the output of the switch to ground through an 150-Ω resistor, preventing the output from floating.
Contact local sales/distributor or factory for availability.
ORDERING INFORMATION
TA
(1)
(2)
PACKAGE
(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING/
STATUS (2)
TPS22913AYZVR
Contact factory for availability
_ _ _ _ 64
–40°C to 85°C
YZV (0.5mm pitch)
Tape and Reel
–40°C to 85°C
YZV (0.5mm pitch)
Tape and Reel
TPS22913BYZVR
–40°C to 85°C
YZV (0.5mm pitch)
Tape and Reel
TPS22913CYZVR
_ _ _ _ 76
–40°C to 85°C
YZV (0.5mm pitch)
Tape and Reel
TPS22913DYZVR
Contact factory for availability
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Contact factory for details and availability for PREVIEW devices, minimum order quantities may apply.
DEVICE INFORMATION
YZV PACKAGE
TERMINALS ASSIGNMENTS
B
ON
GND
A
VIN
VOUT
2
1
PIN FUNCTIONS
TPS22913
YZV
2
PIN NAME
B1
GND
B2
ON
A1
VOUT
A2
VIN
DESCRIPTION
Ground
Switch control input, active high. Do not leave floating
Switch output
Switch input, bypass this input with a ceramic capacitor to
ground
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TPS22913
SLVSB20 – SEPTEMBER 2011
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BLOCK DIAGRAM
VIN
Reverse
Current
Protection
UVLO
Control
Logic
ON
VOUT
GND
Table 2. FUNCTION TABLE
(1)
ON
VIN to VOUT
VOUT to GND (1)
L
OFF
ON
H
ON
OFF
See Application section ‘Output Pull-Down’
ABSOLUTE MAXIMUM RATINGS
VALUE
UNIT
VIN
Input voltage range
–0.3 to 6
V
VOUT
Output voltage range
VIN + 0.3
V
VON
Input voltage range
–0.3 to 6
V
IMAX
Maximum continuous switch current
2
A
IPLS
Maximum pulsed switch current, pulse <300 µS, 2% duty cycle
TA
Operating free-air temperature range
TJ
Maximum junction temperature
TSTG
Storage temperature range
TLEAD
Maximum lead temperature (10-s soldering time)
ESD
Electrostatic discharge protection
2.5
A
–40 to 85
°C
125
°C
–65 to 150
°C
300
°C
Human-Body Model (HBM) (VIN, VOUT, GND pins)
2000
Charged-Device Model (CDM) (VIN, VOUT, ON, GND pins)
1000
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V
3
TPS22913
SLVSB20 – SEPTEMBER 2011
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THERMAL INFORMATION
TPS22913
THERMAL METRIC (1)
CSP
UNITS
(4) PINS
θJA
Junction-to-ambient thermal resistance
θJCtop
Junction-to-case (top) thermal resistance
1.9
θJB
Junction-to-board thermal resistance
36.8
ψJT
Junction-to-top characterization parameter
11.3
ψJB
Junction-to-board characterization parameter
36.8
θJCbot
Junction-to-case (bottom) thermal resistance
N/A
(1)
189.1
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
VIN
Input voltage range
VON
ON voltage range
VOUT
Output voltage range
VIH
High-level input voltage, ON
VIL
CIN
(1)
4
Low-level input voltage, ON
MIN
MAX
1.4
5.5
V
5.5
V
0
UNIT
VIN
VIN = 3.61 V to 5.5 V
1.1
5.5
V
VIN = 1.4 V to 3.6 V
1.1
5.5
V
VIN = 3.61 V to 5.5 V
0.6
V
VIN = 1.4 V to 3. 6V
0.4
V
Input Capacitor
1
(1)
µF
Refer to the application section.
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ELECTRICAL CHARACTERISTICS
VIN = 1.4 V to 5.5 V, TA = –40ºC to 85ºC (unless otherwise noted)
PARAMETER
IIN
IIN(off)
IIN(Leakage)
Quiescent current
Off supply current
Leakage current
TEST CONDITIONS
TA
MIN
2
10
IOUT = 0, VIN = VON = 4.2 V
2
7.0
IOUT = 0, VIN = VON = 3.6 V
2
7.0
IOUT = 0, VIN = VON = 2.5 V
0.9
5
IOUT = 0, VIN = VON = 1.5 V
0.7
5
VON = GND, VOUT = Open, VIN = 5.25 V
1.2
10
VON = GND, VOUT = Open, VIN = 4.2 V
0.2
7.0
VON = GND, VOUT = Open, VIN = 3.6 V
Full
0.1
7.0
VON = GND, VOUT = Open, VIN = 2.5 V
0.1
5
VON = GND, VOUT = Open, VIN = 1.5 V
0.1
5
VON = GND, VOUT = 0, VIN = 5.25 V
1.2
10
VON = GND, VOUT = 0, VIN = 4.2 V
0.2
7.0
0.1
7.0
0.1
5
VON = GND, VOUT = 0, VIN = 3.6 V
Full
Full
VON = GND, VOUT = 0, VIN = 1.5 V
VIN = 5.25 V, IOUT = –200 mA
VIN = 5.0 V, IOUT = –200 mA
VIN = 4.2 V, IOUT = –200 mA
On-resistance
VIN = 3.3 V, IOUT = –200 mA
VIN = 2.5 V, IOUT = –200 mA
VIN = 1.8 V, IOUT = –200 mA
VIN = 1.5 V, IOUT = –200 mA
25°C
Reverse Current Response
Delay
VIN = 5V
63.4
Full
80
80
90
74.2
Full
100
130
25°C
83.9
Full
120
150
153
200
1.2
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Ω
V
0.50
Full
1
µA
44
mV
10
µs
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mΩ
120
25°C
VIN decreasing, VON 3.6 V, RL = 10 Ω
µA
80
110
25°C
Full
µA
110
60.7
Full
VIN increasing, VON = 3.6 V,
IOUT = –100 mA
tDELAY
60
Full
Under voltage lockout
µA
110
25°C
UVLO
VRVP
60
25°C
25°C
VON = 1.4 V to 5.25 V or GND
80
Full
VIN = 3.3 V, VON = 0, IOUT = 30 mA
Reverse Current Voltage
Threshold
5
60
UNIT
110
25°C
Output pull down resistance
ON input leakage current
0.1
Full
RPD
ION
MAX
IOUT = 0, VIN = VON = 5.25 V
VON = GND, VOUT = 0, VIN = 2.5 V
rON
TYP
5
TPS22913
SLVSB20 – SEPTEMBER 2011
www.ti.com
SWITCHING CHARACTERISTICS
PARAMETER
TEST CONDITION
TPS22913
B
TPS22913
C
TYP
TYP
770
UNIT
VIN = 5 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
76
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
6.6
6.6
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
82
838
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
3
3
1048
µs
VIN = 3.3 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
102
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
8.5
8.6
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
97
980
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
3
3
2344
µs
VIN = 1.5 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
234
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
17
18
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
244
1823
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
6.5
6.5
µs
PARAMETRIC MEASUREMENT INFORMATION
VOUT
VIN
CIN = 1 mF
ON
+
-
CL
ON
(A)
RL
OFF
TPS22913
GND
GND
GND
TEST CIRCUIT
VON 50%
50%
tf
tr
tOFF
tON
VOUT
50%
50%
90% 90%
VOUT
10%
10%
tONH/tOFF WAVEFORMS
(A) Rise and fall times of the control signal is 100 ns.
A.
Rise and fall times of the control signal is 100 ns.
Figure 1. Test Circuit and tON/tOFF Waveforms
6
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TYPICAL CHARACTERISTICS
ON-STATE RESISTANCE
vs
INPUT VOLTAGE
ON INPUT THRESHOLD
120
6
−40C
25C
85C
110
5
90
4.5
80
4
70
3.5
VOUT (V)
Ron (mΩ)
100
60
50
3
2.5
40
2
30
1.5
20
1
10
0.5
0
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
4
4.5
5
5.5
VIN = 5.0V
VIN = 4.2V
VIN = 3.3V
VIN = 2.5V
VIN = 1.8V
VIN = 1.5V
5.5
0
6
0
0.2
0.4
0.6
VON (V)
0.8
1
1.2
G000
G000
Figure 2.
Figure 3.
INPUT CURRENT, QUIESCENT
vs
INPUT VOLTAGE
INPUT CURRENT, LEAK
vs
INPUT VOLTAGE
3500
4
−40C
25C
85C
4
−40C
25C
85C
3000
3
2500
IIN_Leak (nA)
IIN_Q (µA)
2
2
2
2000
1500
1000
1
500
0
0
0
1
2
3
Voltage (V)
4
5
6
0
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
4
4.5
5
5.5
G000
Figure 4.
6
G000
Figure 5.
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TYPICAL CHARACTERISTICS (continued)
ON-STATE RESISTANCE
vs
TEMPERATURE
INPUT CURRENT, OFF
vs
INPUT VOLTAGE
120
3500
−40C
25C
85C
3000
2500
IIN_Off (nA)
Ron (mΩ)
VIN = 1.4V
VIN = 1.5V
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 4.2V
VIN= 5.0V
VIN = 5.5V
80
2000
1500
1000
500
40
−40
−15
10
35
Temperature (°C)
60
85
0
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
4
4.5
5
G000
5.5
6
G000
Figure 6.
Figure 7.
Maximum Power Dissipation (W)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
−40 −30 −20 −10 0 10 20 30 40 50
Ambient Temperature (°C)
60
70
80
G001
Figure 8. Allowable Power Dissipation
Figure 9. ULVO Response IOUT = -100mA
Figure 10. Reverse Current Protection VOUT = 3.3V, VIN = 3.3V Decreasing to 0V
8
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TYPICAL CHARACTERISTICS (continued)
TYPICAL AC CHARACTERISTICS FOR TPS22913B
RISE TIME
vs
TEMPERATURE
FALL TIME
vs
TEMPERATURE
180
10
160
9
VIN =5.0V, CL = 0.1 µF, RL = 10 Ohms
8
140
7
120
tFall (µs)
tRise (µs)
6
100
80
5
4
60
3
40
2
20
1
VIN =5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
60
G000
85
G000
Figure 11.
Figure 12.
RISE TIME
vs
TEMPERATURE
FALL TIME
vs
TEMPERATURE
500
400
tRise (µs)
300
200
100
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
G000
Figure 13.
Figure 14.
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TYPICAL CHARACTERISTICS (continued)
TURN-ON TIME
vs
TEMPERATURE
TURN-OFF TIME
vs
TEMPERATURE
150
20
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
90
12
tOff (µs)
16
tOn (µs)
120
60
8
30
4
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
G000
85
G000
Figure 15.
Figure 16.
TURN-ON TIME
vs
TEMPERATURE
TURN-OFF TIME
vs
TEMPERATURE
40
500
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
400
30
tOff (µs)
tOn (µs)
300
20
200
10
100
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
G000
Figure 17.
10
60
85
G000
Figure 18.
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TYPICAL CHARACTERISTICS (continued)
RISE TIME
vs
INPUT VOLTAGE
300
250
tRise (µs)
200
150
100
50
−40C
25C
85C
CL = 0.1 µF, RL = 10 Ohms, VON = 1.8V
0
0
0.5
1
1.5
2
2.5 3 3.5
VIN (V)
4
4.5
5
5.5
6
G000
Figure 19.
TURN-ON RESPONSE
VIN = 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
TURN-OFF RESPONSE
VIN = 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 20.
Figure 21.
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TYPICAL CHARACTERISTICS (continued)
VIN
12
TURN-ON RESPONSE TIME
= 5V, TA = 25°C, CIN =1µF, CL = 0.1µF, RL = 10Ω
TURN-OFF RESPONSE TIME
VIN = 5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 22.
Figure 23.
TURN-Of RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
TURN-Of RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 24.
Figure 25.
TURN-Of RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
TURN-Of RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 26.
Figure 27.
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TYPICAL CHARACTERISTICS (continued)
TYPICAL AC CHARACTERISTICS FOR TPS22913C
RISE TIME
vs
TEMPERATURE
FALL TIME
vs
TEMPERATURE
1200
4
VIN =5.0V, CL = 0.1 µF, RL = 10 Ohms
1000
3
tFall (µs)
tRise (µs)
800
600
2
400
1
200
VIN =5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
G000
85
G000
Figure 28.
Figure 29.
RISE TIME
vs
TEMPERATURE
FALL TIME
vs
TEMPERATURE
3000
10
VIN =1.5V, CL = 0.1 µF, RL = 10 Ohms
9
2500
8
7
2000
tFall (µs)
tRise (µs)
6
1500
5
4
1000
3
2
500
1
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
60
G000
Figure 30.
85
G000
Figure 31.
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TYPICAL CHARACTERISTICS (continued)
TURN-ON TIME
vs
TEMPERATURE
TURN-OFF TIME
vs
TEMPERATURE
1200
10
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
1000
8
800
tOff (µs)
tOn (µs)
6
600
4
400
2
200
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
G000
85
G000
Figure 32.
Figure 33.
TURN-ON TIME
vs
TEMPERATURE
TURN-OFF TIME
vs
TEMPERATURE
3500
25
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
3000
20
15
2000
tOff (µs)
tOn (µs)
2500
1500
10
1000
5
500
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
G000
Figure 34.
14
60
85
G000
Figure 35.
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TYPICAL CHARACTERISTICS (continued)
RISE TIME
vs
INPUT VOLTAGE
3000
2500
tRise (µs)
2000
1500
1000
500
−40C
25C
85C
CL = 1 µF, RL = 10 Ohms, VON = 1.8V
0
0
0.5
1
1.5
2
2.5 3 3.5
VIN (V)
4
4.5
5
5.5
6
G000
Figure 36.
TURN-ON RESPONSE
VIN = 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
TURN-OFF RESPONSE
VIN = 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 37.
Figure 38.
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Product Folder Link(s) :TPS22913
15
TPS22913
SLVSB20 – SEPTEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
VIN
16
TURN-ON RESPONSE TIME
= 5V, TA = 25°C, CIN =1µF, CL = 0.1µF, RL = 10Ω
TURN-OFF RESPONSE TIME
VIN = 5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 39.
Figure 40.
TURN-Of RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
TURN-Of RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 41.
Figure 42.
TURN-Of RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
TURN-Of RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 43.
Figure 44.
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TPS22913
SLVSB20 – SEPTEMBER 2011
www.ti.com
APPLICATION INFORMATION
On/Off Control
The ON pin controls the state of the switch. Asserting ON high enables the switch. ON is active high and has a
low threshold, making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard
GPIO logic threshold. It can be used with any microcontroller with 1.8-V, 2.5-V or 3.3-V GPIOs.
Input Capacitor
To limit the voltage drop on the input supply caused by transient inrush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic
capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce
the voltage drop.
Output Capacitor
A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip caused by inrush currents during startup.
Output Pull-Down
The output pulldown is active when the user is turning off the main pass FET. The pulldown discharges the
output rail to approximately 10% of the rail, and then the output pulldown is automatically disconnected to
optimize the shutdown current.
Under-Voltage Lockout
The under-voltage lockout turns-off the switch if the input voltage drops below the under-voltage lockout
threshold. With the ON pin active the input voltage rising above the under-voltage lockout threshold will cause a
controlled turn-on of the switch which limits current over-shoots. During under-voltage lockout (UVLO), no
reverse current can flow as the body diode is not engaged.
Reverse Current Protection
In a scenario where VOUT is greater than VIN, there could be reverse current through the body diode of the PMOS
FET. The TPS22913 monitors the current through the FET and shuts off the FET when a reverse current is
detected. The FET, and the output, resumes normal operation when the reverse current scenario is no longer
present. When the reverse current protection (RCP) is active, no reverse current can flow as the body diode is
not engaged. During under-voltage lockout (UVLO), or when the switch is disabled, no reverse current can flow
as the body diode is not engaged.
Use the following formula to calculate the amount of reverse current for a particular application:
IRC =
0.044V
RON( VIN)
Where,
IRC is the amount of reverse current,
RON(VIN) is the on-resistance at the VIN of the reverse current condition.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects
along with minimizing the case to ambient thermal impedance.
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17
PACKAGE OPTION ADDENDUM
www.ti.com
3-Oct-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TPS22913BYZVR
ACTIVE
DSBGA
YZV
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS22913BYZVT
ACTIVE
DSBGA
YZV
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS22913CYZVR
ACTIVE
DSBGA
YZV
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS22913CYZVT
PREVIEW
DSBGA
YZV
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Sep-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPS22913BYZVR
DSBGA
YZV
4
3000
178.0
9.2
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1.0
1.0
0.63
4.0
8.0
Q1
TPS22913BYZVT
DSBGA
YZV
4
250
178.0
9.2
1.0
1.0
0.63
4.0
8.0
Q1
TPS22913CYZVR
DSBGA
YZV
4
3000
178.0
9.2
1.0
1.0
0.63
4.0
8.0
Q1
TPS22913CYZVT
DSBGA
YZV
4
250
178.0
9.2
1.0
1.0
0.63
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Sep-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS22913BYZVR
DSBGA
YZV
4
3000
220.0
220.0
35.0
TPS22913BYZVT
DSBGA
YZV
4
250
220.0
220.0
35.0
TPS22913CYZVR
DSBGA
YZV
4
3000
220.0
220.0
35.0
TPS22913CYZVT
DSBGA
YZV
4
250
220.0
220.0
35.0
Pack Materials-Page 2
D: Max = 0.918 mm, Min =0.858 mm
E: Max = 0.918 mm, Min =0.858 mm
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