TPS22966 www.ti.com SLVSBH4A – JUNE 2012 – REVISED JULY 2012 Dual Channel, Ultra-Low Resistance Load Switch Check for Samples: TPS22966 FEATURES 1 • • • • • • • • • • DESCRIPTION Integrated dual channel load switch Input voltage range: 0.8V to 5.5V Ultra low RON resistance – RON = 18mΩ at VIN = 5V (VBIAS = 5V) – RON = 18mΩ at VIN = 3.6V (VBIAS = 5V) – RON = 18mΩ at VIN = 1.8V (VBIAS = 5V) 6A maximum continuous switch current per channel Low quiescent current – 80µA (both channels) – 60µA (single channel) Low control input threshold enables use of 1.2-V/1.8-V/2.5-V/3.3-V logic Configurable rise time Quick Output Discharge (QOD) SON 14-pin package with Thermal Pad ESD performance tested per JESD 22 – 2KV HBM and 1KV CDM The TPS22966 is a small, ultra-low RON, dual channel load switch with controlled turn on. The device contains two N-channel MOSFETs that can operate over an input voltage range of 0.8V to 5.5V and can support a maximum continuous current of 6A per channel. Each switch is independently controlled by an on/off input (ON1 and ON2), which is capable of interfacing directly with low-voltage control signals. In TPS22966, a 220-Ω on-chip load resistor is added for quick output discharge when switch is turned off. The TPS22966 is available in a small, space-saving 2mm x 3mm 14-SON package (DPU) with integrated thermal pad allowing for high power dissipation. The device is characterized for operation over the free-air temperature range of –40°C to 85°C. Table 1. Feature List RON TYPICAL at 3.6 V (VBIAS = 5V) 18 mΩ RISE TIME(1) Adjustable (2) QUICK OUTPUT DISCHARGE Yes MAXIMUM OUTPUT CURRENT (per channel) 6A APPLICATIONS GPIO ENABLE Active High • • • • • • • OPERATING TEMP –40°C to 85°C Ultrabook™ Notebooks/Netbooks Tablet PC Consumer electronics Set-top boxes/Residental gateways Telecom systems Solid State Drives (SSD) OFF CIN (2) This feature discharges output of the switch to GND through a 220-Ω resistor, preventing the output from floating. VOUT1 VIN 1 Dual Power Supply (1) See Application Information section for CT value vs. rise time. ON1 CL RL CT1 ON CT2 or GND VBIAS Dual DC/DC converter VOUT2 VIN2 OFF CIN ON2 CL ON TPS22966 GND GND Figure 1. Typical Application 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated TPS22966 SLVSBH4A – JUNE 2012 – REVISED JULY 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION ORDERABLE PART NO. TOP-SIDE MARKING/STATUS -40°C to 85°C TA DPU Tape and reel 3000 units PACKAGE TPS22966DPUR RB966 -40°C to 85°C DPU Tape and reel 250 units TPS22966DPUT RB966 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) (2) VALUE UNIT (2) VIN1,2 Input voltage range –0.3 to 6 V VOUT1,2 Output voltage range –0.3 to 6 V VON1,2 Input voltage range –0.3 to 6 V IMAX Maximum continuous switch current 6 A IPLS Maximum pulsed switch current, pulse <300 µs, 2% duty cycle 8 A –40 to 85 °C 125 °C –65 to 150 °C 300 °C (3) TA Operating free-air temperature range TJ Maximum junction temperature TSTG Storage temperature range TLEAD Maximum lead temperature (10-s soldering time) ESD Electrostatic discharge protection (1) (2) (3) Human-Body Model (HBM) 2000 Charged-Device Model (CDM) 1000 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal. In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max)) THERMAL INFORMATION THERMAL METRIC (1) TPS22966 DPU (14 PINS) θJA Junction-to-ambient thermal resistance 52.3 θJCtop Junction-to-case (top) thermal resistance 45.9 θJB Junction-to-board thermal resistance 11.5 ψJT Junction-to-top characterization parameter 0.8 ψJB Junction-to-board characterization parameter 11.4 θJCbot Junction-to-case (bottom) thermal resistance 6.9 (1) 2 UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 TPS22966 www.ti.com SLVSBH4A – JUNE 2012 – REVISED JULY 2012 RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT VIN1,2 Input voltage range 0.8 VBIAS V VBIAS Bias voltage range 2.5 5.5 V VON1,2 ON voltage range 0 VIN V VOUT1,2 Output voltage range VIN V VIH High-level input voltage, ON VBIAS = 2.5 V to 5.5 V 1.2 5.5 V VIL Low-level input voltage, ON VBIAS = 2.5 V to 5.5 V 0 0.5 V CIN1,2 (1) Input capacitor 1 (1) µF Refer to Application Information section. ELECTRICAL CHARACTERISTICS Unless otherwise note the specification in the following table applies over the operating ambient temperature –40°C ≤ TA ≤ 85°C (full) and VBIAS = 5.0 V. Typical values are for TA = 25°C. (unless otherwise noted) PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT POWER SUPPLIES AND CURRENTS IIN(VBIAS-ON) VBIAS quiescent current (both channels) IOUT1 = IOUT2 = 0, VIN1,2 = VON1,2 = VBIAS = 5.0 V Full 80 IIN(VBIAS-ON) VBIAS quiescent current (single channel) IOUT1 = IOUT2 = 0, VON2 = 0V VIN1,2 = VON1 = VBIAS = 5.0 V Full 60 IIN(VBIAS-OFF) VBIAS shutdown current VON1,2 = GND, VOUT1,2 = 0 V Full VIN1,2 = 5.0 V IIN(VIN-OFF) VIN1,2 off-state supply current (per channel) VON1,2 = GND, VOUT1,2 = 0 V ION ON pin input leakage current VON = 5.5 V VIN1,2 = 3.3 V VIN1,2 = 1.8 V Full VIN1,2 = 0.8 V 120 µA 2 2.1 8 0.3 3 0.07 2 0.04 1 Full µA 1 µA µA µA RESISTANCE CHARACTERISTICS VIN = 5.0 V VIN = 3.3 V RON ON-state resistance IOUT = –200 mA, VBIAS = 5.0 V VIN = 1.8 V VIN = 1.5 V VIN = 1.2 V VIN = 0.8 V RPD Output pulldown resistance VIN = 5.0 V, VON = 0V, IOUT = 15 mA 25°C 18 Full 25°C 27 18 Full 25°C 18 18 18 25 27 18 Full Full 25 27 Full 25°C 25 27 Full 25°C 25 27 Full 25°C 25 25 27 220 300 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 mΩ mΩ mΩ mΩ mΩ mΩ Ω 3 TPS22966 SLVSBH4A – JUNE 2012 – REVISED JULY 2012 www.ti.com ELECTRICAL CHARACTERISTICS Unless otherwise noted, the specification in the following table applies over the operating ambient temp –40°C ≤ TA ≤ 85°C (full) and VBIAS = 2.5 V. Typical values are for TA = 25°C unless otherwise noted. PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT POWER SUPPLIES AND CURRENTS IIN(VBIAS-ON) VBIAS quiescent current (both channels) IOUT1 = IOUT2 = 0, VIN1,2 = VON1,2 = VBIAS = 2.5 V Full IIN(VBIAS-ON) VBIAS quiescent current (single channel) IOUT1 = IOUT2 = 0, VON2 = 0V VIN1,2 = VON1 = VBIAS = 2.5 V Full VON1,2 = GND, VOUT1,2 = 0 V Full IIN(VBIAS-OFF) VBIAS shutdown current IIN(VIN-OFF) VIN1,2 off-state supply current (per channel) VON1,2 = GND, VOUT1,2 = 0 V ON pin input leakage current 37 2 0.13 3 VIN1,2 = 1.8 V 0.07 2 0.05 2 0.04 1 VIN1,2 = 1.2 V Full VON = 5.5 V µA µA VIN1,2 = 2.5 V VIN1,2 = 0.8 V ION 25 Full 1 µA µA µA RESISTANCE CHARACTERISTICS VIN = 2.5 V VIN = 1.8 V RON ON-state resistance IOUT = –200 mA, VBIAS = 2.5 V VIN = 1.5 V VIN = 1.2 V VIN = 0.8 V RPD 4 Output pulldown resistance VIN = 2.5 V, VON = 0V, IOUT = 1 mA Submit Documentation Feedback 25°C 22 Full 25°C 30 21 Full 25°C 20 20 27 29 19 Full Full 27 29 Full 25°C 28 30 Full 25°C 28 27 29 260 300 mΩ mΩ mΩ mΩ mΩ Ω Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 TPS22966 www.ti.com SLVSBH4A – JUNE 2012 – REVISED JULY 2012 SWITCHING CHARACTERISTIC MEASUREMENT INFORMATION VIN VOUT CIN = 1μF ON + - (A) ON CL RL OFF VBIAS GND TPS22966 GND GND Single channel shown for clarity. TEST CIRCUIT VON 50% 50% tOFF tON VOUT 50% 50% tf tr 90% VOUT 90% 10% 10% tD tON /t OFF WAVEFORMS (A) Rise and fall times of the control signal is 100ns. Figure 2. Test Circuit and tON/tOFF Waveforms SWITCHING CHARACTERISTICS PARAMETER TEST CONDITION MIN TYP MAX UNIT VIN = VON = VBIAS = 5 V, TA = 25ºC (unless otherwise noted) tON Turn-on time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF tOFF Turn-off time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 1210 6 tR VOUT rise time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 1370 tF VOUT fall time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 2 tD ON delay time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 460 µs VIN = 0.8 V, VON = VBIAS = 5V, TA = 25ºC (unless otherwise noted) tON Turn-on time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 550 tOFF Turn-off time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 170 tR VOUT rise time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 325 tF VOUT fall time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 16 tD ON delay time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 400 µs VIN = 2.5V, VON = 5 V, VBIAS = 2.5V, TA = 25ºC (unless otherwise noted) tON Turn-on time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 2050 tOFF Turn-off time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 5 tR VOUT rise time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 2275 tF VOUT fall time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 2.5 tD ON delay time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 990 µs VIN = 0.8 V, VON = 5 V, VBIAS = 2.5 V, TA = 25ºC (unless otherwise noted) tON Turn-on time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 1300 tOFF Turn-off time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 130 tR VOUT rise time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 875 tF VOUT fall time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 16 tD ON delay time RL = 10-Ω, CL = 0.1 µF, CT = 1000 pF 870 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 µs 5 TPS22966 SLVSBH4A – JUNE 2012 – REVISED JULY 2012 www.ti.com FUNCTIONAL BLOCK DIAGRAM VIN1 ON1 Control Logic CT1 VOUT1 GND VBIAS Charge Pump VOUT2 CT1 ON2 Control Logic VIN2 Figure 3. Functional Block Diagram Table 2. FUNCTIONAL TABLE 6 ONx VINx to VOUTx VOUTx to GND L Off On H On Off Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 TPS22966 www.ti.com SLVSBH4A – JUNE 2012 – REVISED JULY 2012 DPU PACKAGE 1 14 14 1 VIN1 VOUT1 VOUT1 VIN1 VIN1 VOUT1 VOUT1 VIN1 ON1 CT 1 CT 1 ON1 VBIAS GND GND ON2 CT2 CT2 ON2 VIN2 VOUT2 VOUT2 VIN2 VIN2 VOUT2 VOUT2 VIN2 Top View VBIAS Bottom View PIN TABLE TPS22966 DPU PIN NAME I/O DESCRIPTION 1 VIN1 I Switch #1 input. Bypass this input with a ceramic capacitor to GND. Recommended voltage range for this pin for optimal RON performance is 0.8V to VBIAS. 2 VIN1 I Switch #1 input. Bypass this input with a ceramic capacitor to GND. Recommended voltage range for this pin for optimal RON performance is 0.8V to VBIAS. 3 ON1 I Active high switch #1 control input. Do not leave floating. 4 VBIAS I Bias voltage. Power supply to the device. Recommended voltage range for this pin is 2.5V to 5.5V. See Application Information section. 5 ON2 I Active high switch #2 control input. Do not leave floating. 6 VIN2 I Switch #2 input. Bypass this input with a ceramic capacitor to GND. Recommended voltage range for this pin for optimal RON performance is 0.8V to VBIAS. 7 VIN2 I Switch #2 input. Bypass this input with a ceramic capacitor to GND. Recommended voltage range for this pin for optimal RON performance is 0.8V to VBIAS. 8 VOUT2 O Switch #2 output. 9 VOUT2 O Switch #2 output. 10 CT2 O Switch #2 slew rate control. Can be left floating. 11 GND – Ground 12 CT1 O Switch #1 slew rate control. Can be left floating. 13 VOUT1 O Switch #2 output. 14 VOUT1 O Switch #2 output. 15 Thermal Pad O Thermal pad (exposed center pad) to alleviate thermal stress. Tie to GND. See Application Information for layout guidelines. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 7 TPS22966 SLVSBH4A – JUNE 2012 – REVISED JULY 2012 www.ti.com TYPICAL CHARACTERISTICS VBIAS vs. QUIESCENT CURRENT (BOTH CHANNELS) VBIAS vs. QUIESCENT CURRENT (SINGLE CHANNEL) 100 95 90 85 70 −40C 25C 85C 70C 60 80 55 75 50 IIN_VBIAS (µA) IIN_VBIAS (µA) 70 65 60 55 50 45 40 25 10 2.5 2.75 40 35 25 30 15 45 30 35 20 −40C 25C 85C 70C 65 20 VIN1=VIN2=VBIAS, VON1=VON2=5V, VOUT=Open SW1= On, SW2=On 3 3.25 3.5 3.75 4 4.25 4.5 4.75 VBIAS (V) 5 VIN1=VIN2=VBIAS, VON1=VON2=5V, VOUT=Open SW1 = Off, SW2 = On 15 10 2.5 2.75 5.25 5.5 3 3.25 3.5 3.75 4 4.25 4.5 4.75 VBIAS (V) 5 G069 G069 VBIAS vs. SHUTDOWN CURRENT (BOTH CHANNELS) VIN vs. OFF-STATE SUPPLY CURRENT (SINGLE CHANNEL) 3 1.2 −40C 25C 85C 70C 2.5 −40C 25C 85C 70C VBIAS=5.5V, VON=0V, VOUT = 0V 2 IINOFF_VIN (µA) IINOFF_VBIAS (µA) 1 5.25 5.5 0.8 0.6 1.5 1 0.4 0.5 VIN1=VIN2=VBIAS, VON1=VON2=0V, VOUT=0V 0.2 2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.5 4.75 VBIAS (V) 5 5.25 5.5 0 0.8 1.2 1.6 G070 8 Submit Documentation Feedback 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.6 G067 Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 TPS22966 www.ti.com SLVSBH4A – JUNE 2012 – REVISED JULY 2012 TYPICAL CHARACTERISTICS (continued) TEMPERATURE vs. RON (VBIAS = 2.5V, SINGLE CHANNEL) TEMPERATURE vs. RON (VBIAS = 5.5V, SINGLE CHANNEL) 26 25 24 23 22 VIN =0.8V VIN =1.05 VIN =1.2 VIN=1.5V VIN = 1.8V VIN = 2.5V VIN =0.8V VIN =1.05 VIN =1.2 VIN=1.5V VIN = 1.8V VIN = 2.5V VIN = 3.3V VIN =3.6V VIN=4.2V VIN=5V VN=5.5V 21.5 21 20.5 20 19.5 19 Ron (mΩ) Ron (mΩ) 22 21 20 18.5 18 17.5 17 19 16.5 18 16 15.5 17 15 16 14.5 VBIAS =2.5V, IOUT=−200mA 15 −40 −15 10 35 Temperature (°C) 60 VBIAS =5.5V, IOUT=−200mA 14 −40 85 −15 10 35 Temperature (°C) 60 G063 G064 VIN vs. RON (VBIAS = 2.5V, SINGLE CHANNEL) VIN vs. RON (VBIAS = 5.5V, SINGLE CHANNEL) 26 25 24 85 22 −40C 85C 25C 70C VBIAS =5.5V, IOUT = −200mA 21 23 20 22 Ron (mΩ) Ron (mΩ) 19 21 20 19 18 17 18 17 −40C 85C 25C 70C 16 16 15 15 VBIAS =2.5V, IOUT = −200mA 14 0.8 1.05 1.3 1.55 1.8 VIN (V) 2.05 2.3 2.5 14 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.6 G060 G061 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 9 TPS22966 SLVSBH4A – JUNE 2012 – REVISED JULY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) VIN vs. RON (TA = 25°C, SINGLE CHANNEL) VIN vs. RPD (VBIAS = 5.5V, SINGLE CHANNEL) 23 216 Temperature=25C, IOUT=−200mA VBIAS = 2.5V VBIAS = 3.3V VBIAS = 3.6V VBIAS= 4.2V VBIAS = 5V VBIAS = 5.5V 22.5 22 21.5 IPD=1mA, VBIAS=5.5V, VON=0V −40C 85C 25C 70C 212 20.5 Rpd (Ω) Ron (mΩ) 21 20 208 19.5 19 18.5 204 18 17.5 17 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 200 0.8 1.2 1.6 4.4 4.8 5.2 5.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.6 G062 G065 VON vs. VOUT (TA = 25°C, SINGLE CHANNEL) VIN vs. tD (VBIAS = 2.5V, CT = 1nF) 2.4 1300 VIN=2V, Tempeature = 25C 1250 2.2 VBIAS = 2.5V CT = 1nf 1200 2 1150 1.8 1100 1050 1.4 tD (µs) VOUT (V) 1.6 1.2 950 900 1 850 0.8 800 VBIAS = 2.5V VBIAS=3.3V VBIAS=3.6V VBIAS=4.2 VBIAS=5V VBIAS=5.5V 0.6 0.4 0.2 0 1000 0 0.25 0.5 0.75 1 1.25 1.5 VON (V) 1.75 2 2.25 750 650 2.5 600 0.8 G066 10 −40C 25C 70C 85C 700 Submit Documentation Feedback 1 1.2 1.4 1.6 1.8 VIN (V) 2 2.2 2.4 2.6 G030 Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 TPS22966 www.ti.com SLVSBH4A – JUNE 2012 – REVISED JULY 2012 TYPICAL CHARACTERISTICS (continued) VIN vs. tD (VBIAS = 5.5V, CT = 1nF) VIN vs. tF (VBIAS = 2.5V, CT = 1nF) 24 650 VBIAS = 5.5V, CT = 1nf VBIAS = 2.5V CT = 1nf 600 −40C 25C 70C 85C 20 550 500 tFall (µs) tD (µs) 16 450 12 8 400 −40C 25C 70C 85C 350 300 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 4 0 0.8 4.4 4.8 5.2 5.5 1 1.2 1.4 1.6 1.8 VIN (V) 2 2.2 2.4 2.6 G035 G036 VIN vs. tF (VBIAS = 5.5V, CT = 1nF) VIN vs. tOFF (VBIAS = 2.5V, CT = 1nF) 24 160 VBIAS = 5.5V CT = 1nf −40C 25C 70C 85C 20 −40C 25C 70C 85C 150 140 130 120 110 16 tOff (µs) tFall (µs) 100 12 90 80 70 60 8 50 40 30 4 20 10 0 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.6 VBIAS = 2.5V CT = 1nf 0 0.8 1 1.2 1.4 1.6 1.8 VIN (V) 2 2.2 2.4 G041 G042 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 2.6 11 TPS22966 SLVSBH4A – JUNE 2012 – REVISED JULY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) VIN vs. tOFF (VBIAS = 5.5V, CT = 1nF) VIN vs. tON (VBIAS = 2.5V, CT = 1nF) 2500 250 225 VBIAS = 5.5V CT = 1nf −40C 25C 70C 85C 200 −40C 25C 70C 85C 2400 2300 2200 2100 175 2000 tOn (µs) tOff (µs) 150 125 100 1900 1800 1700 1600 75 1500 50 1400 1300 25 VBIAS = 2.5V CT = 1nf 1200 0 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 1100 0.8 4.4 4.8 5.2 5.6 1 1.2 1.4 1.6 1.8 VIN (V) 2 2.2 2.4 2.6 G047 G048 VIN vs. tON (VBIAS = 5.5V, CT = 1nF) VIN vs. tR (VBIAS = 2.5V, CT = 1nF) 1600 1500 1400 2800 −40C 25C 70C 85C −40C 25C 70C 85C 2450 1300 2100 1100 tRise (µs) tOn (µs) 1200 1000 900 1750 1400 800 700 600 1050 VBIAS = 5.5V CT = 1nf 500 400 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 VBIAS= 2.5V CT = 1nf 4.4 4.8 5.2 5.6 700 0.8 G053 12 Submit Documentation Feedback 1 1.2 1.4 1.6 1.8 VIN (V) 2 2.2 2.4 2.6 G061 Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 TPS22966 www.ti.com SLVSBH4A – JUNE 2012 – REVISED JULY 2012 TYPICAL CHARACTERISTICS (continued) VIN vs. tR (VBIAS = 5.5V, CT = 1nF) VBIAS vs. tR (VIN = 2.5V, CT = 1nF) 2000 1750 3000 −40C 25C 70C 85C 2500 1500 2250 2000 1250 tRise (µs) tRise (µs) −40C 25C 70C 85C 2750 1000 1750 1500 1250 750 1000 500 750 VBIAS = 5.5V CT = 1nf 250 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.6 VIN = 2.5V CT = 1nf 500 2.5 2.8 3 3.2 3.5 3.8 4 4.2 4.5 4.8 VBIAS (V) 5 5.2 5.5 G059 G061 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 13 TPS22966 SLVSBH4A – JUNE 2012 – REVISED JULY 2012 www.ti.com TYPICAL AC SCOPE CAPTURES @ TA = 25ºC, CT = 1nF 14 TURN-ON RESPONSE TIME (VIN = 0.8V, VBIAS = 2.5V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) TURN-ON RESPONSE TIME (VIN = 0.8V, VBIAS = 5.0V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) TURN-ON RESPONSE TIME (VIN = 2.5V, VBIAS = 2.5V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) TURN-ON RESPONSE TIME (VIN = 5.0V, VBIAS = 5.0V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) TURN-OFF RESPONSE TIME (VIN = 0.8V, VBIAS = 2.5V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) TURN-OFF RESPONSE TIME (VIN = 0.8V, VBIAS = 5.0V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 TPS22966 www.ti.com SLVSBH4A – JUNE 2012 – REVISED JULY 2012 TYPICAL AC SCOPE CAPTURES @ TA = 25ºC, CT = 1nF (continued) TURN-OFF RESPONSE TIME (VIN = 2.5V, VBIAS = 2.5V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) TURN-OFF RESPONSE TIME (VIN = 5.0V, VBIAS = 5.0V, CIN = 1µF, CL = 0.1µF, RL = 10Ω) Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 15 TPS22966 SLVSBH4A – JUNE 2012 – REVISED JULY 2012 www.ti.com APPLICATION INFORMATION ON/OFF CONTROL The ON pins control the state of the switch. Asserting ON high enables the switch. ON is active high and has a low threshold, making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard GPIO logic threshold. It can be used with any microcontroller with 1.2-V or higher GPIO voltage. This pin cannot be left floating and must be tied either high or low for proper functionality. INPUT CAPACITOR (OPTIONAL) To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns on into a discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-µF ceramic capacitor, CIN, placed close to the pins, is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop during high-current application. When switching heavy loads, it is recommended to have an input capacitor about 10 times higher than the output capacitor to avoid excessive voltage drop. OUTPUT CAPACITOR (OPTIONAL) Due to the integrated body diode in the NMOS switch, a CIN greater than CL is highly recommended. A CL greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip caused by inrush currents during startup. VIN and VBIAS VOLTAGE RANGE For optimal RON performance, make sure VIN ≤ VBIAS. The device will still be functional if VIN > VBIAS but it will exhibit RON greater than what is listed in the ELECTRICAL CHARACTERISTICS table. See Figure 4 for an example of a typical device. Notice the increasing RON as VIN exceeds VBIAS voltage. Be sure to never exceed the maximum voltage rating for VIN and VBIAS. 50 47 42 VBIAS = 2.5V VBIAS = 3.3V VBIAS = 3.6V VBIAS= 4.2V VBIAS = 5V VBIAS = 5.5V Temperature=25C, IOUT=−200mA Ron (mΩ) 37 32 27 22 17 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 VIN (V) 4 4.4 4.8 5.2 5.6 G062 Figure 4. RON vs. VIN (VIN > VBIAS, Single Channel) 16 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 TPS22966 www.ti.com SLVSBH4A – JUNE 2012 – REVISED JULY 2012 ADJUSTABLE RISE TIME A capacitor to GND on the CT pins sets the slew rate for each channel. An approximate formula for the relationship between CT and slew rate is (the equation below accounts for 10% to 90% measurement on VOUT and does NOT apply for CT = 0pF. Use table below to determine rise times for when CT = 0pF): SR = 0.32 ´ CT + 13.7 (1) Where, SR = slew rate (in µs/V) CT = the capacitance value on the CT pin (in pF) The units for the constant 13.7 is in µs/V. Rise time can be calculated by multiplying the input voltage by the slew rate. The table below contains rise time values measured on a typical device. Rise times shown below are only valid for the power-up sequence where VIN and VBIAS are already in steady state condition, and the ON pin is asserted high. RISE TIME (µs) 10% - 90%, CL = 0.1µF, CIN = 1µF, RL = 10Ω TYPICAL VALUES at 25°C, 25V X7R 10% CERAMIC CAP CTx (pF) 5V 3.3V 1.8V 1.5V 1.2V 1.05V 0.8V 0 124 88 63 60 53 49 42 220 481 323 193 166 143 133 109 470 855 603 348 299 251 228 175 1000 1724 1185 670 570 469 411 342 2200 3328 2240 1308 1088 893 808 650 4700 7459 4950 2820 2429 1920 1748 1411 10000 16059 10835 6040 5055 4230 3770 3033 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 17 TPS22966 SLVSBH4A – JUNE 2012 – REVISED JULY 2012 www.ti.com BOARD LAYOUT AND THERMAL CONSIDERATIONS For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance. The maximum IC junction temperature should be restricted to 125°C under normal operating conditions. To calculate the maximum allowable dissipation, PD(max) for a given output current and ambient temperature, use the following equation: PD(max) = TJ(max) - TA QJA (2) Where: PD(max) = maximum allowable power dissipation TJ(max) = maximum allowable junction temperature (125°C for the TPS22966) TA = ambient temperature of the device ΘJA = junction to air thermal impedance. See Thermal Information section. This parameter is highly dependent upon board layout. The figure below shows an example of a layout. Notice the thermal vias located under the exposed thermal pad of the device. This allows for thermal diffusion away from the device. VOUT1 capacitor VIN1 capacitor VIN2 capacitor CT1 capacitor Thermal relief vias CT2 capacitor VOUT2 capacitor 18 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 TPS22966 www.ti.com SLVSBH4A – JUNE 2012 – REVISED JULY 2012 REVISION HISTORY Changes from Original (June 2012) to Revision A Page • Updated VBIAS vs. QUIESCENT CURRENT (BOTH CHANNELS) Y-axis Units. .................................................................. 8 • Updated VBIAS vs. QUIESCENT CURRENT (SINGLE CHANNEL) Y-axis Units. ................................................................. 8 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS22966 19 PACKAGE OPTION ADDENDUM www.ti.com 9-Jul-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) TPS22966DPUR ACTIVE WSON DPU 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS22966DPUT ACTIVE WSON DPU 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS22966DPUR WSON DPU 14 3000 180.0 8.4 2.25 3.25 1.05 4.0 8.0 Q1 TPS22966DPUT WSON DPU 14 250 180.0 8.4 2.25 3.25 1.05 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS22966DPUR WSON DPU 14 3000 210.0 185.0 35.0 TPS22966DPUT WSON DPU 14 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated