INTEGRATED CIRCUITS DATA SHEET TSA5514 1.3 GHz bidirectional I2C-bus controlled synthesizer Product specification File under Integrated Circuits, IC02 October 1992 Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer FEATURES APPLICATIONS • Complete 1.3 GHz single chip system • TV tuners • Low power 5 V, 35 mA • VCR Tuners • I2C-bus TSA5514 programming • In-lock flag DESCRIPTION • Varicap drive disable The TSA5514 is a single chip PLL frequency synthesizer designed for TV tuning systems. Control data is entered via the I2C-bus; five serial bytes are required to address the device, select the oscillator frequency, programme the seven output ports and set the charge-pump current. Four of these ports can also be used as input ports (three general purpose I/O ports, one ADC). Digital information concerning those ports can be read out of the TSA5514 on the SDA line (one status byte) during a READ operation. A flag is set when the loop is “in-lock” and is read during a READ operation. The device has 4 programmable addresses, programmed by applying a specific voltage to AS pin. The phase comparator operates at 7.8125 kHz when a 4 MHz crystal is used. • Low radiation • Address selection for Picture-In-Picture (PIP), DBS tuner (4 addresses) • 5-level analog-to-digital converter • 7 bus controlled ports; 3 output, 4 open collector input/output • Power-down flag QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT Vcc supply voltage − 5 − V Icc supply current − 35 − mA ∆fr frequency range 64 − 1300 MHz VI input voltage level 80 MHz to 150 MHz 12 − 300 mV 150 MHz to 1 GHz 9 − 300 mV 1 GHz to 1.3 GHz 40 − 300 mV fxtal crystal oscillator frequency 3.2 4.0 4.48 MHz Io open-collector output current 10 − − mA Tamb operating ambient temperature range −10 − +80 °C Tstg IC storage temperature range −40 − +150 °C ORDERING INFORMATION EXTENDED TYPE NUMBER PACKAGE PINS PIN POSITION MATERIAL CODE TSA5514 18 DIL plastic SOT102(1) TSA5514T 16 SO plastic SOT109A(2) TSA5514AT 20 SO plastic SOT163A(3) Note 1. SOT102-1; 1996 December 4. 2. SOT109-1; 1996 December 4. 3. SOT 163-1; 1996 December 4. October 1992 2 Philips Semiconductors Product specification TSA5514 Fig.1 Block diagram. 1.3 GHz bidirectional I2C-bus controlled synthesizer October 1992 3 Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer Fig.3 Pin configuration for SOT109. Fig.2 Pin configuration for SOT102. Fig.4 Pin configuration for SOT163. October 1992 TSA5514 4 Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer PINNING PIN SYMBOL DESCRIPTION SOT102 SOT109 SOT163 PD 1 1 1 charge-pump output Q1 2 2 2 crystal oscillator input 1 Q2 3 3 3 crystal oscillator reference voltage n.c. − − 4 not connected SDA 4 4 5 serial data input/output SCL 5 5 6 serial clock input P7 6 6 7 port output/input (general purpose) n.c. − − 8 not connected P6 7 7 9 port output/input for general purpose ADC P5 8 8 10 port output/input (general purpose) P4 9 9 11 port output/input (general purpose) AS 10 10 12 address selection input P2 11 11 13 port output P1 12 − 14 port output P0 13 − 15 port output Vcc 14 12 16 voltage supply RFIN1 15 13 17 UHF/VHF signal input 1 RFIN2 16 14 18 UHF/VHF signal input 2 (decoupled) VEE 17 15 19 ground UD 18 16 20 drive output October 1992 5 TSA5514 Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer byte 2 or byte 4. The meaning of the bits in the data bytes is given in Table 1. The first bit of the first data byte transmitted indicates whether frequency data (first bit = 0) or charge pump and port information (first bit = 1) will follow. Until an I2C-bus STOP condition is sent by the controller, additional data bytes can be entered without the need to re-address the device. This allows a smooth frequency sweep for fine tuning or AFC purpose. At power-on the ports are set to the high impedance state. FUNCTIONAL DESCRIPTION I2C-bus. The TSA5514 is controlled via the two-wire For programming, there is one module address (7 bits) and the R/W bit for selecting READ or WRITE mode. WRITE mode: R/W = 0 (see Table 1) After the address transmission (first byte), data bytes can be sent to the device. Four data bytes are required to fully program the TSA5514. The bus transceiver has an auto-increment facility which permits the programming of the TSA5514 within one single transmission (address + 4 data bytes). The 7.8125 kHz reference frequency is obtained by dividing the output of the 4 MHz crystal oscillator by 512. Because the input of UHF/VHF signal is first divided by 8 the step size is 62.5 kHz. A 3.2 MHz crystal can offer step sizes of 50 kHz. The TSA5514 can also be partially programmed on the condition that the first data byte following the address is Table 1 TSA5514 Write data format MSB Address LSB 1 1 0 0 0 MA1 Programmable divider 0 N14 N13 N12 N11 N10 N9 N8 A byte 2 Programmable divider N7 N6 N5 N4 N3 N2 N1 N0 A byte 3 1 CP T1 T0 x x x OS A byte 4 P7 P6 P5 P4 x P2 P1* P0* A byte 5 Charge-pump and test bits Output ports control bits MA0 0 A byte 1 Note to Table 1 * Not valid for TSA5514T MA1, MA0 programmable address bits (see Table 4) A acknowledge bit N14 to N0 programmable divider bits N = N14 × 214 + N13 × 213 +... + N1 × 21 +N0 CP charge-pump current CP = 0 50 µA CP = 1 220 µA P7 to P0 = 1 open-collector output is active P7 to P0 = 0 outputs are in high impedance state T1, T0, OS = 0 0 0 normal operation T1 = 1 P6 = fref, P7 = fDIV T0 = 1 3-state charge-pump OS = 1 operational amplifier output is switched off (varicap drive disable) Note 1. x = don’t care October 1992 6 Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer below 3 V and at power-on. It is reset when an end of data is detected by the TSA5514 (end of a READ sequence). Control of the loop is made possible with the in-lock flag FL which indicates (FL = 1) when the loop is phase-locked. The bits I2, I1 and I0 represent the status of the I/O ports P7, P5 and P4 respectively. A logic 0 indicates a LOW level and a logic 1 a HIGH level (TTL levels). A built-in 5-level ADC is available on I/O port P6. This converter can be used to feed AFC information to the controller from the IF section of the television as illustrated in the typical application circuit (Fig.8). The relationship between bits A2, A1 and A0 and the input voltage on port P6 is given in Table 3. READ mode: R/W = 1 (see Table 2) Data can be read out of the TSA5514 by setting the R/W bit to 1. After the slave address has been recognized, the TSA5514 generates an acknowledge pulse and the first data byte (status word) is transferred on the SDA line (MSB first). Data is valid on the SDA line during a high position of the SCL clock signal. A second data byte can be read out of the TSA5514 if the processor generates an acknowledge on the SDA line. End of transmission will occur if no acknowledge from the processor occurs. The TSA5514 will then release the data line to allow the processor to generate a STOP condition. When ports P4 to P7 are used as inputs, they must be programmed in their high-impedance state. The POR flag (power-on reset) is set to 1 when Vcc goes Table 2 TSA5514 Read data format MSB Address Status byte LSB 1 1 0 0 0 MA1 MA0 1 A byte 1 POR FL I2 I1 I0 A2 A1 A0 − byte 2 POR power-on reset flag. (POR = 1 on power-on) FL in-lock flag (FL = 1 when the loop is phase-locked) I2, I1, I0 digital information for I/O ports P7, P5 and P4 respectively A2, A1, A0 digital outputs of the 5-level ADC. Accuracy is 1/2 LSB (see Table 3) MSB is transmitted first. Address selection The module address contains programmable address bits (MA1 and MA0) which offer the possibility of having several synthesizers (up to 4) in one system. The relationship between MA1 and MA0 and the input voltage on AS pin is given in Table 4. October 1992 7 Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer Table 3 TSA5514 ADC levels VOLTAGE APPLIED ON THE PORT P6 A2 A1 A0 0.6 Vcc to 13.5 V 1 0 0 0.45 Vcc to 0.6 Vcc 0 1 1 0.3 Vcc to 0.45 Vcc 0 1 0 0.15 Vcc to 0.3 Vcc 0 0 1 0 to 0.15 Vcc 0 0 0 Table 4 Address selection MA1 MA0 VOLTAGE APPLIED ON PIN AS 0 0 0 to 0.1 Vcc 0 1 open 1 0 0.4 to 0.6 Vcc 1 1 0.9 Vcc to Vcc LIMITING VALUES In accordance with Absolute Maximum Rating System (IEC 134); all pin numbers refer to DIL18 version SYMBOL PARAMETER MIN. MAX. UNIT Vcc supply voltage −0.3 6 V V1 charge-pump output voltage −0.3 Vcc V V2 crystal (Q1) input voltage −0.3 Vcc V V4 serial data input/output voltage −0.3 6 V V5 serial clock input voltage −0.3 6 V V10 address selection input voltage −0.3 6 V V6-13 P7 to P0 input/output voltage −0.3 +16 V V15 prescaler input voltage −0.3 +2.5 V V18 drive output voltage −0.3 Vcc V I6-13 P7 to P0 output current (open collector) −1 15 mA I4 SDA output current (open collector) −1 5 mA Tstg IC storage temperature range −40 +150 °C Tj maximum junction temperature − 150 °C THERMAL RESISTANCE SYMBOL Rth j-a October 1992 PARAMETER THERMAL RESISTANCE from junction to ambient in free air DIL18 80 K/W SO16 110 K/W SO20 80 K/W 8 Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer TSA5514 CHARACTERISTICS Vcc = 5 V; Tamb = 25 °C, unless otherwise specified All pin numbers refer to DIL18 version SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Functional range Vcc supply voltage range 4.5 − 5.5 V Tamb operating ambient temperature range −10 − +80 °C f input frequency 64 − 1300 MHz N divider 256 − 32767 Icc supply current 25 35 50 mA fXTAL crystal oscillator frequency range 3.2 4.0 4.48 MHz ZI input impedance (pin 2) −480 −400 −320 Ω f = 80 to 150 MHz 12/−25 − 300/2.6 mV/dBm f = 150 to 1000 MHz 9/−28 − 300/2.6 mV/dBm f = 1000 to 1300 MHz 40/−15 − 300/2.6 mV/dBm input level crystal series resonance resistance ≤ 150 Ω VCC = 4.5 V to 5.5 V; Tamb = −10 to +80 °C; see typical sensitivity curve Fig.6 RI prescaler input resistance (see Fig.7) − 50 − Ω CI input capacitance − 2 − pF Output ports (open collector) P0 to P2; P4 to P7 (see note 1) ILO output leakage current VO = 13.5 V − − 10 µA VOL LOW level output voltage IOL = 10 mA; note 2 − − 0.7 V Address selection input IOH HIGH level input current VOH = 5 V − − 20 µA IOL LOW level input current VOL = 0 V −20 − − µA − − 0.8 V Input ports P4, P5 and P7 VIL LOW level input voltage VIH HIGH level input voltage 2.7 − − V IIH HIGH level input current VIH = 13.5 V − − 10 µA IIL LOW level input current VIL = 0 V −10 − − µA Input port P6 IIH HIGH level input current VIH = 13.5 V − − 10 µA IIL LOW level input current VIL = 0 V −10 − − µA SCL and SDA inputs VIH HIGH level input voltage 3.0 − 5.5 V VIL LOW level input voltage − − 1.5 V October 1992 9 Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer SYMBOL PARAMETER CONDITIONS TSA5514 MIN. TYP. MAX. UNIT SCL and SDA inputs IIH IIL HIGH level input current LOW level input current VIH = 5 V; Vcc = 0 V − − 10 µA VIH = 5 V; Vcc = 5 V − − 10 µA VIL = 0 V; Vcc = 0 V −10 − − µA VIL = 0 V; Vcc = 5 V −10 − − µA Output SDA (pin 4; open collector) ILO output leakage current VO = 5.5 V − − 10 µA VO output voltage IO = 3 mA − − 0.4 V Charge-pump output PD (pin 1) IOH HIGH level output current (absolute value) CP = 1 90 220 300 µA IOL LOW level output current (absolute value) CP = 0 22 50 75 µA V1 output voltage in-lock 1.5 − 2.5 V I1leak off-state leakage current T0 = 1 −5 − 5 nA Operational amplifier output UD (test mode T0 = 1) V18 output voltage VIL = 0 V − − 100 mV V18 output voltage when switched-off OS = 1; VIL = 2 V − − 200 mV G operational amplifier current gain; I18/(I1 - I1leak) OS = 0; VIL = 2 V; I18 = 10 µA 2000 − − Notes to the characteristics 1. When a port is active, the collector voltage must not exceed 6 V. 2. Measured with a single open-collector port active. October 1992 10 Philips Semiconductors Product specification TSA5514 Fig.5 Typical application (DIL18). 1.3 GHz bidirectional I2C-bus controlled synthesizer October 1992 11 Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer TSA5514 Fig.6 Prescaler typical input sensitivity curve; Vcc = 4.5 to 5.5 V; Tamb = −10 to +80 °C. Fig.7 Prescaler Smith chart of typical input impedance; Vcc = 5 V; reference value = 50 Ω. October 1992 12 Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer TSA5514 FLOCK FLAG DEFINITION (FL) When the FL flag is 1, the maximum frequency deviation (∆f) from stable frequency can be expressed as follows: ∆f = ± ( K VCO ⁄ K O ) × I CP × ( C1 + C2 ) ⁄ ( C1 × C2 ) Where: KVCO = oscillator slope (Hz/V) ICP = charge-pump current (A) KO = 4 × 10E6 C1 and C2 = loop filter capacitors (see Fig.8) Fig.8 Loop filter. FLOCK FLAG APPLICATION • Kvco = 16 MHz/V (UHF band) • ICP = 220 µA • C1 = 180 nF • C2 = 39 nF • ∆f = ± 27.5 kHz. Table 5 Flock flag settings MIN. MAX. UNIT Time span between actual phase lock and FL-flag setting 1024 1152 µs Time span between the loop losing lock and FL-flag resetting 0 128 µs October 1992 13 Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer TSA5514 PACKAGE OUTLINES DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 1.40 1.14 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 0.85 inches 0.19 0.020 0.15 0.055 0.044 0.021 0.015 0.055 0.044 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.033 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 93-10-14 95-01-23 SOT102-1 October 1992 EUROPEAN PROJECTION 14 Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer TSA5514 SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.16 0.15 0.050 0.039 0.016 0.028 0.020 0.01 0.01 0.004 0.028 0.012 inches 0.244 0.041 0.228 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC October 1992 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 15 o 8 0o Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer TSA5514 SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.419 0.043 0.050 0.055 0.394 0.016 inches 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC October 1992 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 16 o 8 0o Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. October 1992 TSA5514 17 Philips Semiconductors Product specification 1.3 GHz bidirectional I2C-bus controlled synthesizer TSA5514 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. October 1992 18