PRELIMINARY DATA SHEET NEC's 13 GHz INPUT DIVIDE BY 4 PRESCALER IC UPB1513TU FOR SATELLITE COMMUNICATIONS FEATURES DESCRIPTION • OPERATING FREQUENCY: fin = 5 to 13 GHz • LOW CURRENT CONSUMPTION: ICC = 48 mA @ VCC = 5.0 V • HIGH-DENSITY SURFACE MOUNTING: 8-pin lead-less minimold • SUPPLY VOLTAGE: VCC = 4.5 to 5.5 V • DIVISION RATIO: 4 NEC's UPB1513TU is a silicon germanium (SiGe) monolithic integrated circuit designed as a divide by 4 prescaler IC for satellite communications and point-to-point/multi-point radios. The package is 8-pin lead-less minimold suitable for surface mount. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) silicon bipolar process. APPLICATIONS • POINT-TO-POINT/ MULTI-POINT RADIOS • VSAT RADIOS ORDERING INFORMATION PART NUMBER ORDER NUMBER UPB1513TU-E2 UPB1513TU-E2-A PACKAGE 8-pin lead-less minimold (Pb-Free) Note MARKING SUPPLYING FORM 1513 • 8 mm wide embossed taping • Pin 5, 6, 7, 8 indicates pull-out direction of tape • Qty 5 kpcs/reel Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPB1513TU California Eastern Laboratories UPB1513TU INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS (Top View) 1 8 Regulator 7 2 3 1/2 1/2 4 PIN NO. PIN NAME 1 VCC1 2 IN 3 GND 4 IN 6 5 OUT 6 GND 5 7 OUT 8 VCC2 SYSTEM APPLICATION EXAMPLE LNA Down-Converter µ PB1513TU 13 GHz Prescaler 1/4 PLL Diplexer PA Up-Converter UPB1513TU PIN EXPLANATION PIN NO. PIN NAME APPLIED VOLTAGE (V) 1 VCC1 5 FUNCTION AND APPLICATIONS Power supply pin. This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to minimize ground impedance. 2 IN − Signal input pin. This pin should be coupled to signal source with capasitor (example : 100 pF) for DC cut. 3 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 4 IN − Signal input bypass pin. This pin must be equipped with bypass capacitor (example : 100 pF) to minimize ground impedance. 5 OUT − Divided frequency output pin. This pin shoud be coupled to load device with capasitor (example : 100 pF) for DC cut. 6 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 7 OUT − Divided frequency output pin. This pin should be coupled to load device with capasitor (example : 100 pF) for DC cut. 8 VCC2 5 Power supply pin. This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to minimize ground impedance. UPB1513TU ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage Total Power Dissipation Thermal Resistance (junction to ground paddle) SYMBOL VCC PD Rth(j-c) TEST CONDITIONS TA = +25°C TA = +85°C Note TA = +85°C Note RATINGS UNIT 6 V 867 mW 75 °C/W Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Note Mounted on 33 × 21 × 0.4 mm polyimide PCB, with copper patterning on both sides. RECOMMENDED OPERATING RANGE SYMBOL MIN. TYP. MAX. UNIT Supply Voltage PARAMETER VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA −40 +25 +85 °C ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V, TA = −40 to +85°C, ZS = ZL = 50 Ω) MIN. TYP. MAX. UNIT Circuit Current PARAMETER ICC No Signals − 48 75 mA Input Sensitibity Pin1 fin = 5 to 6 GHz −8 − −5 dBm Pin2 fin = 6 to 12 GHz −8 − 0 dBm Pin3 fin = 12 to 13 GHz −5 − 0 dBm Pout fin = 5 to 13 GHz, single ended, Pin = −5 dBm −11 −4 2 dBm Output Power SYMBOL TEST CONDITIONS UPB1513TU TYPICAL CHARACTERISTICS (TA = +25ºC, unless otherwise specified) INPUT SENSITIVITY vs. FREQUENCY OUTPUT POWER vs. FREQUENCY 15 5 0 Guaranteed operating range -5 -10 -15 -20 -25 -30 -35 0 5 10 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V 15 20 Output Power Pout (dBm) Input Sensitivity Pin (dBm) 10 Frequency f (GHz) OUTPUT POWER vs. FREQUENCY VCC = 3.0 V 5 0 Output Power Pout (dBm) Input Sensitivity Pin (dBm) 10 Guaranteed operating range -5 -10 -15 -20 -25 -30 -35 0 TA = -40ºC TA = +25ºC TA = +85ºC 5 10 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V 15 20 Frequency f (GHz) INPUT SENSITIVITY vs. FREQUENCY 15 3 2 Pin = -5 dBm 1 0 -1 Guaranteed operating range -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 10 0 5 15 Frequency f (GHz) Remark The graphs indicate nominal characteristics. 20 3 2 VCC = 3.0 V 1 Pin = -5 dBm 0 -1 Guaranteed operating range -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 10 0 5 Frequency f (GHz) TA = -40ºC TA = +25ºC TA = +85ºC 15 20 UPB1513TU MEASUREMENT CIRCUITS 100 pF 10 nF 5V 1 Power Supply 100 pF 50 Ω 2 3 4 Signal Generator VCC1 VCC2 IN OUT GND GND IN 100 pF 51 Ω OUT 8 7 100 pF 6 5 100 pF 50 Ω Spectrum Analyzer 51 Ω The application circuits and their parameters are for reference only and are not intended for actual design-ins. UPB1513TU ILLUSTRATION OF THE MEASUREMENT CIRCUIT ASSEMBLED ON EVALUATION BOARD 100 pF 100 pF 10 nF 8 7 6 5 1 2 3 4 100 pF 51 Ω 100 pF 100 pF 51 Ω Remarks 1. 33 × 21 × 0.4 mm double-sided copper-clad polyimide PCB 2. Back side: GND pattern 3. Solder plated on pattern 4. 5. represents cutout : Through holes UPB1513TU PACKAGE DIMENSIONS 8-PIN LEAD-LESS MINIMOLD (UNIT:mm) (Top View) (Bottom View) (0.65) (0.65) (0.6) (0.3) 3 4 8 0.4±0.1 (0.6) 7 0.16±0.05 0.125+0.1 -0.05 (0.25) (0.25) 0.5±0.03 0.4±0.1 2 6 (1.4) 1 5 (0.35) (0.35) 5 (0.35)(0.35) 6 (0.6) 7 (0.5) (0.5) 8 2.0±0.1 2.2±0.05 2.0±0.1 4 (0.75) 3 (0.75) 2 1 UPB1513TU NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground terminals as short as possible. (4) Bypass capacitance must be attached to VCC line. (5) Exposed heat sink at bottom on package must be soldered to PCB RF/DC ground. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 120°C or below : 1 time : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 01/04/05 A Business Partner of NEC Compound Semiconductor Devices, Ltd. 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.