NEC UPC1909GS

DATA SHEET
Bipolar Analog Integrated Circuit
µPC1909
SWITCHING REGULATOR CONTROL IC
The µPC1909 is a switching regulator control IC ideal for primary side control of active-clamp type
Note
DC/DC
converters. This IC has 2 outputs employing a totem-pole circuit with peak output current 1.2 A, and is capable of
directly driving a power MOS-FET. As a result, it has been possible to realize primary side control of an active-clamp
type converter on a single chip.
Note It is necessary to obtain license from Vicor Corporation before using the µPC1909 in an active-clamp type
circuit.
FEATURES
• 2 on-chip outputs; for Q and Q
• Capable of directly driving a power MOS-FET
• Drive supply voltage range: 7 V to 24 V
• On-chip remote control circuit
• On-chip pulse-by-pulse overcurrent protection circuit
• On-chip overvoltage latch circuit
ORDERING INFORMATION
Part Number
Package
µPC1909CX
16-pin plastic DIP (300 mils)
µPC1909GS
16-pin plastic SOP (300 mils)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. G14309EJ1V0DS00 (1st edition)
Date Published July 1999 N CP(K)
Printed in Japan
©
1999
µPC1909
BLOCK DIAGRAM
CT
RT
VREF
DTC1
FB
OUT1
EMI1
VCC
16
15
14
13
12
11
10
9
Oscillator
PWM
comparator 1
Reference
power
supply
–
+
+
OLS
ON/OFF
control
Overvoltage
protection
2
+
–
–
PWM
comparator 2
Overcurrent
protection
1
2
3
4
5
6
7
8
OV
CT2
GND
OC
DTC2
OUT2
ON/OFF
EMI2
Data Sheet G14309EJ1V0DS00
µPC1909
PIN CONFIGURATION (TOP VIEW)
16-pin plastic DIP (300 mils)
µPC1909CX
16-pin plastic SOP (300 mils)
µPC1909GS
OV
1
16
CT
CT2
2
15
RT
GND
3
14
VREF
OC
4
13
DTC1
DTC2
5
12
FB
OUT2
6
11
OUT1
ON/OFF
7
10
EMI1
EMI2
8
9
VCC
PIN FUNCTION LIST
Pin Number
Pin Name
1
OV
2
CT2
3
GND
4
Function
Pin Number
Pin Name
Overvoltage protection
9
VCC
Power supply
OLS shift setting
10
EMI1
OUT1 emitter
Ground
11
OUT1
OUT1 output
OC
Overcurrent protection
12
FB
5
DTC2
OUT2 dead-time setting
13
DTC1
OUT1 dead-time setting
6
OUT2
OUT2 output
14
VREF
Reference voltage output
7
ON/OFF
ON/OFF control
15
RT
Timing resistance
8
EMI2
OUT2 emitter
16
CT
Timing capacitance
Data Sheet G14309EJ1V0DS00
Function
Feedback input
3
µPC1909
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (Unless otherwise specified, TA = 25°°C)
Parameter
Supply Voltage
µPC1909CX
Symbol
µPC1909GS
Unit
VCC
26
V
Output Current (DC, per output)
IC (DC)
100
mA
Output Current (peak, per output)
IC (peak)
1.2
A
Total Power Dissipation
PT
1000
694
mW
Operating Ambient Temperature
TA
−20 to +85
°C
Operating Junction Temperature
TJ
−20 to +150
°C
Storage Temperature
Tstg
−55 to +150
°C
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on
the verge of suffering physical damage, and therefore the product must be used under
conditions that ensure that the absolute maximum ratings are not exceeded.
Recommended Operating Conditions
Parameter
4
Symbol
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
7
10
24
V
Oscillation Frequency
fOSC
50
200
500
kHz
Output Load Capacitance
CL
2200
3000
pF
Output Load Resistance
RL
10
Operating Junction Temperature
TJ
−20
Data Sheet G14309EJ1V0DS00
kΩ
+100
°C
µPC1909
Electrical Characteristics (Unless otherwise specified, TA = 25°°C, VCC = 10 V, RT = 10 kΩ
Ω , fosc = 200 kHz)
Block
Total
Parameter
Standby Current
Circuit Current
Symbol
ICC (SB)
Conditions
MIN.
VCC = 7 V
MAX.
0.1
Unit
mA
6
12
18
mA
VCC (L to H)
8
9
10
V
VH
3
4
5
V
4.7
4.9
5.1
V
ICC
Without load
TYP.
UnderVoltage
Lockout
Circuit
Start-Up Threshold Voltage
Reference
Voltage
Output Voltage
VREF
Line Regulation
REGIN
8 V ≤ VCC ≤ 15 V,
IREF = 0 A
1
10
mV
Load Regulation
REGL
1 mA ≤ IREF ≤ 4 mA
6
12
mV
−10°C ≤ TA ≤ +85°C,
IREF = 0 A
400
(700)
µV/°C
IREF = 0 A
15
Operating Voltage Hysteresis
Width
Output Voltage Temperature
Coefficient
Oscillation
PWM
Comparator
Output
Remote
Control
Short Circuit Current
IO short
Oscillation Frequency
fOSC
Overvoltage
Latch
180
200
Frequency Line Regulation
∆f/∆V
8 V ≤ VCC ≤ 15 V
1
Frequency Temperature
Coefficient
∆f/∆T
−10°C ≤ TA ≤ +85°C
2
Input Bias Current
mA
220
kHz
%
(5)
%
IB (COMP1)
VCOMP1 = VREF
10
µA
IB (COMP2)
VCOMP2 = VREF
10
µA
Low-level Threshold Voltage
VTH (L)
1.5
V
High-level Threshold Voltage
VTH (H)
3.5
V
3
%
Dead-time Temperature
Coeficient
∆DT/∆T
Low-level Output Voltage
VOL
ISINK = 3 mA
High-level Output Voltage
VOH
ISOURCE = 30 mA
−10°C ≤ TA ≤ +85°C,
VD = 0.46 VREF
0.5
V
VCC − 1.6
V
Rise Time
tr
RL = 15 Ω, CL = 2200 pF
60
ns
Fall Time
tf
RL = 15 Ω, CL = 2200 pF
40
ns
Input Voltage at Output ON
VIN (ON)
2.4
2.6
2.8
V
Input Voltage at Output OFF
VIN (OFF)
2.2
2.4
2.6
V
VH
0.1
0.2
0.3
V
VTH (OC)
190
210
230
mV
Hysteresis Width
Overcurrent
Latch
∆VREF/∆T
IREF = 0 A
Overcurrent Threshold Voltage
Input Bias Current
IB (OC)
Delay to Output
td (OC)
Overvoltage Threshold Voltage
VCC = 0 V
VTH (OV)
2
200
µA
150
ns
2.4
VOV = VREF
2.8
V
4
µA
Input Bias Current
IB (OV)
OVL Reset Voltage
VR (OV)
2
V
Delay to Output
td (OV)
750
ns
Remark Values in parentheses ( ) represent reference values.
Data Sheet G14309EJ1V0DS00
5
µPC1909
TYPICAL CHARACTERISTICS CURVES (UNLESS OTHERWISE SPECIFIED, TA = 25°°C, VCC = 10 V, REFERENCE VALUES)
PT vs. TA
Under-Voltage Lockout Circuit
1.2
15
12.5
125 °C/W
0.8
VOUT1 - Output voltage - V
PT - Total Power Dissipation - W
µ PC1909CX
1.0
µ PC1909GS
0.6
180 °C/W
0.4
0.2
10
7.5
5
2.5
0
25
50
75
100
125
TA - Ambient Temperature - °C
VCC (H to L)
0
150
2.5
18
16
16
14
12
VH
10
0.8
0.4
0
5
5
7.5
10
12.5
VCC - Supply Voltage - V
10
15
20
VCC - Supply Voltage - V
14
12
VH
10
0.8
SB)
ICC (
25
0
fOSC = 200 kHz
5
10
15
20
VCC - Supply Voltage - V
ICC(SB) vs. TA
20
200
VOUT1 - Output Voltage - V
ICC(SB) - Standby Current - µA
25
VOUT1 vs. VIN
250
150
100
15
10
5
50
VIN (OFF)
0
−25
6
15
0.4
fOSC = 200 kHz
Without load
B)
ICC (S
VCC (L to H)
ICC vs. VCC (During OVL Operation)
18
ICC - Circuit Current - mA
ICC - Circuit Current - mA
ICC vs. VCC
VH
0
25
50
75
TA - Ambient Temperature - °C
100
0
Data Sheet G14309EJ1V0DS00
VIN (ON)
1
2
3
4
5
VIN - Remote Control Voltage - V
6
µPC1909
fosc vs. RT, CT
1000
20
500
fosc - Oscillation Frequency - kHz
∆VREF - Reference Voltage Deviation - mV
∆VREF vs. TA
30
10
0
−10
−20
−30
−25
0
25
50
75
TA - Ambient Temperature - °C
100
CT = 220 pF
100
50
CT = 1000 pF
10
fosc vs. TA
50
RT - Timing Resistance - kΩ
VOH - High-Level Output
Voltage - V
220
215
210
205
VCC
−1
VCC
− 1.5
VCC
−2
VOL - Low-Level Output
Voltage - V
200
195
190
185
180
175
−25
0
25
50
75
TA - Ambient Temperature - °C
100
1.53
1.49
1.45
–25
tf, tr vs. TA (OUT1)
0
25
50
75
TA - Ambient Temperature - °C
100
fOSC = 555 kHz
tr - OUT2 Output Rise Time - ns
tr - OUT2 Output Fall Time - ns
fOSC = 555 kHz
80
tr
60
tf
40
20
0
−25
100
tf, tr vs. TA (OUT2)
100
tr - OUT1 Output Rise Time - ns
tr - OUT1 Output Fall Time - ns
100
VOH, VOL vs. TA
225
fosc - Oscillation Frequency - kHz
CT = 470 pF
0
25
50
75
TA - Ambient Temperature - °C
100
80
60
40
tr
tf
20
0
−25
Data Sheet G14309EJ1V0DS00
0
25
50
75
TA - Ambient Temperature - °C
100
7
µPC1909
Duty vs. TA
45
44
Duty-ON Duty - %
43
42
41
40
39
38
37
36
35
−25
8
0
25
50
75
TA - Ambient Temperature - °C
100
Data Sheet G14309EJ1V0DS00
µPC1909
TIMING CHART
Feedback input
FB
Oscillation
waveform CT
Oscillation
waveform CT’
Vd
tqc
tqd
OUT1
output waveform
OUT2
output waveform
(1) Oscillation waveform (CT)
This waveform is determined by the external capacitor connected to the CT pin (pin 16) and the external resistor
connected to the RT pin (pin 15). It is usually a 1.5-V to 3.5-V triangle waveform (the rise and fall times are the
same).
(2) Output waveform (OUT1)
Whichever is the lower of the DTC1 pin (pin 13) and FB pin (pin 12) voltages is compared with the triangle wave
of the CT pin (pin 16). The OUT1 pin (pin 11) is high level while the triangle wave is low.
(3) Output waveform (OUT2)
Whichever is the higher of the DTC2 pin (pin 5) and FB pin (pin 12) voltages is compared with the level-shifted
triangle wave (CT’). The OUT2 pin (pin 6) is high level while the level-shifted triangle wave is high.
(4) Triangle wave level shift
The triangle wave that controls OUT2 is the original triangle wave of the CT pin (pin 16) shifted to a lower
potential via the level shift circuit (OLS). The amount of shift (Vd) can be adjusted using the resistor (RCT2)
connected between the CT2 pin (pin 2) and the VREF pin.
The relationship between the shift amount (Vd) and the resistance value (kΩ) of the resistor RCT2 connected to
the CT2 pin (pin 2) is as follows.
Vd =
4.3
× 2 [V]
RCT2[kΩ] + 10
(5) Dead-time (tqc, tqd) adjustment
The dead time between the fall of OUT1 and the rise of OUT2 (tqc) and the dead time between the fall of OUT2
and the rise of OUT1 (tqd) is determined by the oscillation frequency and the amount of level shift of the triangle
wave. Although usually tqc = tqd, if setting these independently, connect a suitable resistor between the CT pin
and the VREF pin, as well as between the CT pin and GND, and adjust the dead time by making the oscillation
waveform asymmetrical.
Data Sheet G14309EJ1V0DS00
9
µPC1909
PACKAGE DRAWINGS
16 PIN PLASTIC DIP (300 mil)
16
9
1
8
A
I
K
L
H
G
J
P
F
C
D
N
R
M
B
M
NOTES
1) Each lead centerline is located within 0.25 mm (0.01 inch)
of its true position (T.P.) at maximum material condition.
2) Item "K" to center of leads when formed parallel.
ITEM
MILLIMETERS
INCHES
A
20.32 MAX.
0.800 MAX.
B
1.27 MAX.
0.050 MAX.
C
2.54 (T.P.)
D
0.50±0.10
0.100 (T.P.)
+0.004
0.020 –0.005
F
1.1 MIN.
0.043 MIN.
G
3.5±0.3
0.138±0.012
H
0.51 MIN.
0.020 MIN.
I
4.31 MAX.
0.170 MAX.
J
5.08 MAX.
0.200 MAX.
K
L
7.62 (T.P.)
6.5
0.300 (T.P.)
0.256
M
0.25 +0.10
–0.05
0.010 +0.004
–0.003
N
0.25
0.01
P
1.1 MIN.
0.043 MIN.
R
0∼15°
0∼15°
P16C-100-300B-1
10
Data Sheet G14309EJ1V0DS00
µPC1909
16 PIN PLASTIC SOP (300 mil)
16
9
detail of lead end
P
1
8
A
H
F
I
G
J
S
B
N
S
L
K
C
D
M
M
E
NOTE
ITEM
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
MILLIMETERS
A
10.2±0.2
B
0.78 MAX.
C
1.27 (T.P.)
D
0.42 +0.08
−0.07
E
0.1±0.1
F
1.65±0.15
G
1.55
H
7.7±0.3
I
5.6±0.2
J
1.1±0.2
K
0.22 +0.08
−0.07
L
0.6±0.2
M
0.12
N
0.10
P
+7°
3° −3°
P16GM-50-300B-5
Data Sheet G14309EJ1V0DS00
11
µPC1909
RECOMMENDED SOLDERING CONDITIONS
The µPC1909 should be soldered and mounted under the following recommended conditions. For the details of
the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology
Manual (C10535E). For soldering methods and conditions other than those recommended below, contact your NEC
sales representative.
Insertion Type
µPC1909CX: 16-pin plastic DIP (300 mils)
Soldering Method
Soldering Conditions
Wave soldering (pins only)
Solder bath temperature: 260°C Max., Time: 10 seconds max.
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin)
Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with
the package.
Surface Mounting Type
µPC1909GS: 16-pin plastic SOP (300 mils)
Soldering Method
Soldering Conditions
Recommended
Condition symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max.
(at 210°C or higher), Count: Twice or less
IR35-00-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max.
(at 200°C or higher), Count: Twice or less
VP15-00-2
Wave soldering
Soldering bath temperature: 260°C or less, Time: 10 seconds max.,
Count: Once, Preheating temperature: 120°C MAX.
(package surface temperature)
WS60-00-1
Caution Do not use different soldering methods together.
12
Data Sheet G14309EJ1V0DS00
µPC1909
[MEMO]
Data Sheet G14309EJ1V0DS00
13
µPC1909
[MEMO]
14
Data Sheet G14309EJ1V0DS00
µPC1909
[MEMO]
Data Sheet G14309EJ1V0DS00
15
µPC1909
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8