ETC UPC4572C(5)

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC4572
LOW SUPPLY VOLTAGE, ULTRA LOW-NOISE, HIGH SPEED, WIDE BAND,
LOW IB DUAL OPERATIONAL AMPLIFIER
DESCRIPTION
The µPC4572 is a dual wide band, ultra low noise operational amplifier designed for low supply voltage operation
Of +4 V to +14 V single supply and ±2 V to ±7 V split supplies. Using high hFE PNP transistors for the input circuit,
Input bias current and input equivalent noise are better than conventional wide band operational amplifier.
The µPC4572 is an excellent choice for preamplifiers and active filters in audio, instrumentation, and communication
circuit.
FEATURES
•
•
•
•
Ultra low noise: en = 4.0 nV/ Hz
Low input bias current: 100 nA
High slew rate: 6 V/ µs
Low supply voltage: ±2 V to ±7 V (Split)
+4 V to +14 V (Single)
• Internal frequency compensation
★
ORDERING INFORMATION
PIN CONFIGURATION (Top View)
Part Number
Package
µPC4572C
µPC4572C(5)
µPC4572G2
µPC4572G2(5)
µPC4572HA
µPC4572HA(5)
µPC4572C, 4572C(5), 4572G2, 4572G2(5)
8-pin plastic DIP (7.62 mm (300) )
8-pin plastic DIP (7.62 mm (300) )
8-pin plastic SOP (5.72 mm (225) )
8-pin plastic SOP (5.72 mm (225) )
9-pin plastic slim SIP
9-pin plastic slim SIP
8 V+
OUT1 1
1
− +
I I1 2
7 OUT2
2
+
−
I N1 3
EQUIVALENT CIRCUIT (1/2 Circuit)
V
−
6 I I2
5 I N2
4
V+
R1
µ PC4572A,4572HA(5)
Q7
Q5
Q14
Q15
Q6
Q3
R2
Q4
C1
R3
2
3
4
5
6
7
8
9
OUT
Q10
R4
1
V+
Q12
R11
OUT 2
R9
−
R8
R6
I I2
C2
I N2
R5
V
IN
I I1
Q9
I N1
Q2
2
+ −
OUT1
Q1
1
− +
Q16
R7
V+
Q13
Q8
II
Q11
R10
Q17
V−
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. G15972EJ4V0DS00 (4th edition)
(Previous No. IC-1864)
Date Published February 2002 NS CP(K)
Printed in Japan
The mark ★ shows major revised points.
©
1986
µPC4572
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Parameter
+
Voltage between V and V
Symbol
− Note1
V −V
+
Differential Input Voltage
Input Voltage
VID
Note2
Output Voltage
−
C
Power Dissipation
Package Note4
Unit
−0.3 to +15
V
±10
V
−
+
−
+
V −0.3 to V +0.3
VI
Note3
Ratings
V
VO
V −0.3 to V +0.3
V
PT
350
mW
G2 Package
Note5
440
mW
HA Package
Note4
350
mW
10
sec
Output Short Circuit Duration Note6
Operating Ambient Temperature
TA
−20 to +80
°C
Storage Temperature
Tstg
−55 to +125
°C
Notes 1. Reverse connection of supply voltage can cause destruction.
2. The input voltage should be allowed to input without damage or destruction. Even during the transition
period of supply voltage, power on/off etc., this specification should be kept. The normal operation will
establish when the both inputs are within the Common Mode Input Voltage Range of electrical
characteristics.
3. This specification is the voltage, which should be allowed to supply to the output terminal from external
without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this
specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of
electrical characteristics.
4. Thermal derating factor is –5.0 mW/°C when ambient temperature is higher than 55°C.
5. Thermal derating factor is –4.4 mW/°C when ambient temperature is higher than 25°C.
6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and
Note 5.
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage (Split)
−
Symbol
MIN.
TYP.
MAX.
Unit
V±
±2
±5
±7
V
+
+4
+5/ +12
+14
V
Supply Voltage (V = GND)
V
Output Current
IO
±10
mA
Capacitive Load (AV = +1)
CL
100
pF
2
Data Sheet G15972EJ4V0DS
µPC4572
µPC4572C, µPC4572G2, µPC4572HA
ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = ±5 V)
Parameter
Input Offset Voltage
Input Offset Current
Input Bias Current
Symbol
Note
Large Signal Voltage Gain
Supply Current
MIN.
RS ≤ 50 Ω
TYP.
MAX.
Unit
±0.3
±5
mV
IIO
±10
±100
nA
IB
100
400
nA
7
mA
VIO
Note
Conditions
AV
RL ≥ 2 kΩ , VO = ±2 V
ICC
IO = 0 A, Both Amplifiers
10000
100000
4.5
Common Mode Rejection Ratio
CMR
70
90
dB
Supply Voltage Rejection Ratio
SVR
70
85
dB
Output Voltage Swing
Vom
±3.3
±3.7
V
Common Mode Input Voltage Range
VICM
Output Short Circuit Current
IO short
RL ≥ 10 kΩ
RL ≥ 2 kΩ
Slew Rate
SR
Gain Band Width Product
±3.5
±4
V
RL = 0
±15
±20
mA
AV = 1, RL ≥ 2 kΩ
3.5
6
V/ µs
fO = 100 kHz
10
16
MHz
Unity Gain Frequency
funity
open loop
9
MHz
Phase Margin
φunity
open loop
60
degree
Total Harmonic Distortion
THD
VO = 1 Vr.m.s., f = 20 Hz to 20 kHz
(Fig.1)
0.002
%
RIAA (Fig.2)
0.8
µVr.m.s.
FLAT+JIS A, RS = 100 Ω (Fig.3)
0.5
fO = 10 Hz
4.5
Input Equivalent Noise Voltage
GBW
±3.0
±3.5
Vn
Input Equivalent Noise Voltage Density
en
Input Equivalent Noise Current Density
in
Channel Separation
Average VIO Temperature Drift
0.65
nV/ Hz
fO = 1 kHz
4.0
fO = 1 kHz
0.7
pA/ Hz
f = 20 Hz to 20 kHz
120
dB
±2
µV/°C
∆VIO/ ∆T
Note Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage.
ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = 5 V, V− = GND)
Parameter
Input Offset Voltage
Input Offset Current
Input Bias Current
Symbol
Note
Large Signal Voltage Gain
Supply Current
RS ≤ 50 Ω
MAX.
Unit
±5
mV
±10
±100
nA
IB
100
400
nA
6
mA
AV
RL ≥ 2 kΩ
ICC
IO = 0 A, Both Amplifiers
CMR
Supply Voltage Rejection Ratio
SVR
VOH
RL ≥ 2 kΩ (RL to 1/2 V )
Output Voltage (Low)
VOL
RL ≥ 2 kΩ (RL to 1/2 V )
Common Mode Input Voltage Range
VICM
Slew Rate
SR
Gain Band Width Product
TYP.
±0.3
Common Mode Rejection Ratio
Output Voltage (High)
MIN.
IIO
VIO
Note
Conditions
+
8000
80000
60
75
dB
60
70
dB
3.2
3.5
V
4
+
1.3
1.5
AV = 1
GBW
1.6
V
3.5
V
4
V/ µs
12
MHz
Note Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage.
Data Sheet G15972EJ4V0DS
3
µPC4572
★
µPC4572C(5), µPC4572G2(5), µPC4572HA(5)
ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = ±5 V)
Parameter
Input Offset Voltage
Input Offset Current
Input Bias Current
Symbol
VIO
Note
Note
Conditions
RS ≤ 50 Ω
IIO
IB
Large Signal Voltage Gain
AV
RL ≥ 2 kΩ, VO = ±2 V
Supply Current
ICC
IO = 0 A, Both Amplifiers
Common Mode Rejection Ratio
CMR
Supply Voltage Rejection Ratio
SVR
Output Voltage Swing
Vom
Common Mode Input Voltage Range
VICM
Output Short Circuit Current
IO short
Slew Rate
SR
Gain Band Width Product
MIN.
GBW
30000
TYP.
MAX.
Unit
±0.3
±1.5
mV
±10
±50
nA
100
200
nA
5.5
mA
100000
4.5
75
90
dB
70
85
dB
RL ≥ 10 kΩ
±3.45
±3.7
V
RL ≥ 2 kΩ
±3.3
±3.5
+3.8
−3.7
±4
V
RL = 0
±15
±20
mA
AV = 1, RL ≥ 2 kΩ
3.5
6
V/ µs
fO = 100 kHz
10
16
MHz
Unity Gain Frequency
funity
open loop
9
MHz
Phase Margin
φunity
open loop
60
degree
Total Harmonic Distortion
THD
VO = 1 Vr.m.s., f = 20 Hz to 20 kHz
(Fig.1)
Input Equivalent Noise Voltage
Vn
Input Equivalent Noise Voltage Density
en
Input Equivalent Noise Current Density
in
Channel Separation
Average VIO Temperature Drift
%
0.002
µVr.m.s.
RIAA (Fig.2)
0.8
FLAT+JIS A, RS = 100 Ω (Fig.3)
0.5
fO = 10 Hz
4.5
fO = 1 kHz
4.0
fO = 1 kHz
0.7
f = 20 Hz to 20 kHz
120
dB
±2
µV/°C
∆VIO/ ∆T
0.65
nV/ Hz
pA/ Hz
Note Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage.
ELECTRICAL CHARACTERISTICS (TA = 25°C, V+ = 5 V, V− = GND)
Parameter
Input Offset Voltage
Input Offset Current
Input Bias Current
Symbol
VIO
Note
Note
Conditions
MIN.
RS ≤ 50 Ω
TYP.
MAX.
Unit
±0.3
±1.5
mV
IIO
±10
±50
nA
IB
100
200
nA
5
mA
Large Signal Voltage Gain
AV
RL ≥ 2 kΩ ,
Supply Current
ICC
IO = 0 A, Both Amplifiers
40000
80000
4
Common Mode Rejection Ratio
CMR
65
75
dB
Supply Voltage Rejection Ratio
SVR
60
70
dB
Output Voltage (High)
VOH
RL ≥ 2 kΩ (RL to 1/2 V )
3.4
3.5
V
Output Voltage (Low)
VOL
RL ≥ 2 kΩ (RL to 1/2 V )
Common Mode Input Voltage Range
VICM
Slew Rate
SR
Gain Band Width Product
+
+
1.3
1.2
AV = 1
GBW
1.45
V
3.8
V
4
V/ µs
12
MHz
Note Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage.
4
Data Sheet G15972EJ4V0DS
µPC4572
MEASUREMENT CIRCUITS
Fig. 1 Total Harmonic Distortion Measurement Circuit
−
VO = 1 Vr.m.s.
+
2 kΩ
Fig. 2 Noise Measurement Circuit (RIAA)
2400 pF 8200 pF
610 Ω 47 µ F
+
−
30 kΩ
330 kΩ
2.2 kΩ 33 µ F
56 kΩ
+
+
1.5 µ F
+
40 dB Amp.
LPF
(fO = 30 kHz)
100 kΩ
VO = (36.5 dB + 40 dB) × Vn
VO
Vn =
76.5 dB
Fig. 3 Flat Noize Measurement Circuit (FLAT + JIS A)
10 kΩ
−
100 Ω
JIS A
+
VO = 40 dB × Vn
VO
Vn =
40 dB
RS = 100 Ω
Data Sheet G15972EJ4V0DS
5
µPC4572
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.)
POWER DISSIPATION
OPEN LOOP FREQUENCY RESPONSE
120
500
AV - Open Loop Voltage Gain - dB
PT - Total Power Dissipation - mW
600
µ PC4572G2
400
200°C/W
µ PC4572C, 4572HA
300
200
227°C/W
100
0
0
20
40
60
80
V± = ±5 V
100
80
60
40
20
0
100
1
10
100
TA - Operating Ambient Temperature - ˚C
V± = ±5 V
RL = 10 kΩ
VO± - Output Voltage - V
Vom - Output Voltage Swing - Vp-p
±5
10
5
0
100
1k
10 k
100 k
1M
10 k 100 k 1 M 10 M
OUTPUT CURRENT LIMIT
LARGE SIGNAL FREQUENCY RESPONSE
15
1k
f - Frequency - Hz
±4
±3
VO+, IO SOURCE
±2
VO−, IO SINK
±1
0
10 M
V± = ±5 V
0
10
20
30
40
IO - Output Current - mA
f - Frequency - Hz
SUPPLY CURRENT
SUPPLY CURRENT
8
8
ICC - Supply Current - mA
ICC - Supply Current - mA
V± = ±5 V
6
4
2
0
−20
0
20
40
60
80
6
4
2
0
6
±5
0
±
TA - Operating Ambient Temperature - ˚C
V - Supply Voltage - V
Data Sheet G15972EJ4V0DS
±10
VOLTAGE FOLLOWER PULSE RESPONSE
COMMON MODE INPUT VOLTAGE RANGE
10
5
5
2.5
VO - Output Voltage - V
VICM - Common Mode Input Voltage Range - V
µPC4572
0
−5
−10
±5
0
V± = ±5 V
AV = 1
RL = 2 kΩ
0
−2.5
−5
±10
0
2
8
en -Input Equivalent Noise
Voltage Density - nV/ Hz
Vn - Input Equivalent Noise Voltage - µ Vr.m.s.
10
1
V± = ±5 V
RS = 100 Ω
6
4
2
0
100
1k
10 k
8
INPUT EQUIVALENT NOISE VOLTAGE DENSITY
INPUT EQUIVALENT NOISE VOLTAGE (FLAT+JIS A)
100
V± = ±5 V
10
6
t - Time - µ s
V± - Supply Voltage - V
0.1
4
100 k
10
RS - Source Resistance - Ω
100
1k
10 k
100 k
f - Frequency - Hz
TOTAL HARMONIC DISTORTION
THD - Total Harmonic Distortion - %
1
V± = ±5 V
VO = 3 Vr.m.s.
AV = 1
RL = 2 kΩ
0.1
0.01
0.001
0.0001
10
100
1k
10 k
100 k
f - Frequency - Hz
Data Sheet G15972EJ4V0DS
7
µPC4572
PACKAGE DRAWINGS (Unit: mm)
8-PIN PLASTIC DIP (7.62 mm (300) )
8
5
1
4
A
K
J
L
P
I
C
H
G
B
M
R
F
D
N
M
NOTES
1. Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.
2. ltem "K" to center of leads when formed parallel.
ITEM
MILLIMETERS
A
B
10.16 MAX.
1.27 MAX.
C
2.54 (T.P.)
D
0.50–0.10
F
1.4 MIN.
G
3.2–0.3
H
0.51 MIN.
I
J
4.31 MAX.
5.08 MAX.
K
7.62 (T.P.)
L
6.4
M
0.25 +0.10
−0.05
N
0.25
P
0.9 MIN.
R
0~15
P8C-100-300B,C-2
8
Data Sheet G15972EJ4V0DS
µPC4572
8-PIN PLASTIC SOP (5.72 mm (225) )
8
5
detail of lead end
P
4
1
A
H
F
I
G
J
S
B
C
D
M
L
N
K
S
M
E
NOTE
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
ITEM
MILLIMETERS
A
5.2 +0.17
−0.20
B
0.78 MAX.
C
1.27 (T.P.)
D
0.42 +0.08
−0.07
E
0.1–0.1
F
1.59–0.21
G
1.49
H
6.5–0.3
I
4.4–0.15
J
1.1–0.2
K
0.17 +0.08
−0.07
L
0.6–0.2
M
0.12
N
0.10
P
3 +7
−3
S8GM-50-225B-6
Data Sheet G15972EJ4V0DS
9
µPC4572
9-PIN PLASTIC SLIM SIP
A
N
M
1
Q
9
Y
V
H
C
F
K
G
M
U
J
Z
NOTE
ITEM
Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.
A
MILLIMETERS
22.86 MAX.
C
1.1 MIN.
F
0.5–0.1
G
H
J
0.25
2.54
K
0.51 MIN.
1.27 MAX.
M
5.08 MAX.
N
Q
2.8–0.2
5.75 MAX.
U
1.5 MAX.
V
0.25 +0.10
−0.05
Y
3.2–0.5
Z
1.1 MIN.
P9HA-254B-2
10
Data Sheet G15972EJ4V0DS
µPC4572
★ RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales
offices.
For more details, refer to below our document.
"SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E).
Type of Surface Mount Device
µPC4572G2, 4572G2(5): 8-pin plastic SOP (5.72 mm (225) )
Process
Infrared Ray Reflow
Conditions
Symbol
Peak temperature: 230°C or below (Package surface temperature),
IR30-00-1
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 1 time.
Vapor Phase Soldering
Peak temperature: 215°C or below (Package surface temperature),
VP15-00-1
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 1 time.
Wave Soldering
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
WS60-00-1
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Partial Heating Method
Pin temperature: 300°C or below,
–
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
µPC4572C, 4572C(5): 8-pin plastic DIP (7.62 mm (300) ), µPC4572HA, 4572HA(5): 9-pin plastic slim SIP
Process
Conditions
Wave Soldering
Solder temperature: 260°C or below,
(only to leads)
Flow time: 10 seconds or less.
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that
the package body does not get jet soldered.
Data Sheet G15972EJ4V0DS
11
µPC4572
• The information in this document is current as of February, 2002. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
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systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4