Varistor Products Surface Mount Multilayer Varistors (MLVs) > 0201 MLA Series RoHS 0201 MLA Varistor Series Description New 0201-size MLA Multi-Layer Varistor (MLV) series can protect small electronic products from electrostatic discharge (ESD) and electrically fast transients (EFT). It's ultra-compact 0201 size, the smallest form factor available for MLV devices, is ideal for compact handheld products. The ML Series is manufactured from semiconducting ceramics, and is supplied in a leadless, surface mount package. Features • Ultra-small 0201 size for minimal board space • Low capacitance (33pF) for high data rates to minimize signal distortion • Meets IEC 610004-2 for ESD • Low leakage (<25μa) • Multilayer ceramic construction technology Absolute Maximum Ratings Unit Steady State Applied Voltage: Maximum DC Voltage (VM(DC)) 5.5 V Maximum AC Voltage (VM(AC)RMS) 4.0 V 4.0 A Operating Ambient Temperature Range (TA) -40 to +85 ºC Storage Temperature Range (TSTG) -40 to +85 ºC Transient: Non-Repetitive Surge Current, 8/20μs Waveform, (ITM) • Inherently Bi-directional • Stable performance over wide operating and storage temperature range -40°C to +85°C • Operating voltage VM(DC) = 5.5V • Rated for surge current (8 x 20μs) Temperature: Applications • Portable / handheld • Data, diagnostic I/O ports electronic devices • Computer / DSP products • Mobile communications • Industrial instruments / cellular phones including non-life sustaing • USB, video and audio ports medical equipment • Analog signal / sensor lines Device Ratings and Specifications Maximum Ratings @ +85ºC Part Number V5.5MLA020133NR V5.5MLA020147NR V5.5MLA020164NR Maximum Continuous Working Voltage Maximum Nonrepetitive Surge Current (8/20μs) Specifications @ +25ºC Maximum Clamping Voltage at 1A (8/20μs) Typical Nominal Voltage at 1mA Capacitance at DC Test Current f = 1MHz VM(DC) VM(AC) ITM VC VN(DC) Min VN(DC) Max C (V) (V) (A) (V) (V) (V) (pF) 5.5 5.5 5.5 4.0 4.0 4.0 1 1 1 28.0* 26.0* 26.0* 8.0 8.0 8.0 14.0 14.0 14.0 33.0 47.0 64.0 Notes: - Typical leakage at 25ºC at VM(DC): 0201 size <10μA typical, <25μA maximum - End surface finish of Matte-Tin with Nickel under-layer on Silver base material - Standard packing quantity 15,000 per reel, 7" reel ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/0201MLA.html for current information. 0201 MLA Varistor Series Revision: June 28, 2010 0201 MLA Series Plating consists of Silver base material (which is fired on to the Zno dialectric), Nickel barrier plated under-layer and Matte-Tin outer surface plate. Varistor Products Surface Mount Multilayer Varistors (MLVs) > 0201 MLA Series Reliability and Environmental Specifications Judge Criteria Test Condition Solderability > 95% solder coverage 245 +/- ºC, 3 +/- 1 sec. Leaching Resistance > 95% solder coverage 245 +/- ºC, 3 +/- 1 sec. High Temperature Exposure Δ Vv / Vv < 10% 1000 hours 85ºC, un-powered Thermal Shock Δ Vv / Vv < 10% -45 to +85 ºC, 30 min. cycle, 5 cycles Operating Life Δ Vv / Vv < 10% 85 ºC, DC working voltage 1000 hours Bias Humidity Δ Vv / Vv < 10% 40 ºC / 85% RH, DC working voltage 1000 hours Peak Pulse Current Test Waveform for Clamping Voltage Lead–free (Pb-free) Soldering Recommendations To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. PERCENT OF PEAK VALUE 100 50 0 T O1 TIME T1 T2 01 = Virtual Origin of Wave T = Time from 10% to 90% of Peak T1 = Rise Time = 1.25 x T T2 = Decay Time Example - For an 8/20 μs Current Waveform: 8μs = T1 = Rise Time 20μs = T2 = Decay Time When using a reflow process, care should be taken to ensure that the ML chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50º C before cleaning. 300 Multilayer Internal Construction MAXIMUM TEMPERATURE 260˚C, TIME WITHIN 5˚C OF PEAK 20 SECONDS MAXIMUM TEMPERATURE °C 250 FIRED CERAMIC DIELECTRIC RAMP RATE <3˚C/s 200 60 - 150 SEC > 217˚C 150 100 PREHEAT ZONE 50 METAL ELECTRODES METAL END TERMINATION 0 DEPLETION 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 TIME (MINUTES) REGION DEPLETION REGION GRAINS 0201 MLA Varistor Series Revision: June 28, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/0201MLA.html for current information. Varistor Products Surface Mount Multilayer Varistors (MLVs) > 0201 MLA Series Product Dimensions (mm) CHIP LAYOUT DIMENSIONS E B NOTE D L W A NOTE : Avoid metal runs in this area, parts not recommended for use in applications using Silver (Ag) epoxy paste. 0201 Size Dimension IN MM A 0.055 1.40 B 0.020 0.50 C 0.020 0.50 D (max.) 0.014 0.35 E 0.008 -/+0.004 0.20 -/+0.10 L 0.024 -/+0.002 0.60 -/+0.05 W 0.012 -/+0.002 0.30 -/+0.05 0201 MLA Series PAD LAYOUT DIMENSIONS C Part Numbering System V 5.5 MLA 0201 xx N R PACKING OPTIONS R = 7in (178mm) Diameter Reel, Paper Carrier Tape 15,000 items per reel DEVICE FAMILY Littelfuse TVSS Device MAXIMUM DC WORKING VOLTAGE END TERMINATION OPTION N = Nickel Barrier Option (Matte Tin outer surface, plated on Nickel underlayer plated on silver base metal) MULTILAYER SERIES DESIGNATOR CAPACITANCE OPTION 33 = 33pF 47 = 47pF 64 = 64pF DEVICE SIZE: 0201 = .024 inch x .012 inch (0.6 mm x 0.3 mm) Tape and Reel Specifications D0 PRODUCT IDENTIFYING LABEL P0 For T and H Pack Options: PLASTIC CARRIER TAPE For R Pack Options: EMBOSSED PAPER CARRIER TAPE P2 E F K0 W B0 t1 D1 P1 Symbol A0 EMBOSSMENT TOP TAPE Description Dimensions in Millimeters 8mm NOMINAL 178mm OR 330mm DIA. REEL 0201 A0 Width of Cavity 0.36 -/+0.02 B0 Length of Cavity 0.70 -/+0.02 W Width of Tape 8.0 -/+0.1 F Distance Between Drive Hole Centers and Cavity Centers 3.5 -/+0.05 E Distance Between Drive Hole Centers and Tape Edge 1.75 -/+0.05 P1 Distance Between Cavity Centers 2.0 -/+0.05 P2 Axial Drive Distance Between Drive Hole Centers & Cavity Centers 2.0 -/+0.05 P0 Axial Drive Distance Between Drive Hole Centers D0 Drive Hole Diameter 1.55 -/+0.05 4.0 -/+0.1 T1 Top Tape Thickness 0.42 -/+0.02 NOTE: It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags. ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/0201MLA.html for current information. 0201 MLA Varistor Series Revision: June 28, 2010