ETC WF128K32

WF128K32-XXX5
HI-RELIABILITY PRODUCT
128KX32 5V FLASH MODULE, SMD 5962-94716
FEATURES
■ Access Times of 50*, 60, 70, 90, 120, 150ns
■ Commercial, Industrial and Military Temperature Ranges
■ Packaging:
• 66 pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
■ 5 Volt Programming. 5V ± 10% Supply
■ Low Power CMOS, 1mA Standby Typical
■ Embedded Erase and Program Algorithms
• 68 lead, 40mm, Low Profile 3.5mm (0.140"), CQFP
(Package 502)
• 68 lead, Hermetic CQFP, 22.4mm (0.880 inch) square.
Designed to fit JEDEC 68 lead 0.990" CQFJ footprint.
– G2 (Package 500), 5.08mm (0.200 inch) high
– G2U (Package 510), 3.56mm (0.140 inch) high
■ TTL Compatible Inputs and CMOS Outputs
■ Built-in Decoupling Caps and Multiple Ground Pins for
Low Noise Operation
■ Page Program Operation and Internal Program Control Time
■ Weight
WF128K32-XG2X5 - 8 grams typical
WF128K32-XG2UX5 - 8 grams typical
WF128K32-XH1X5 - 13 grams typical
WF128K32-XG4TX5 - 20 grams typical
■ Sector Architecture
• 8 equal size sectors of 16KBytes each
• Any combination of sectors can be concurrently erased.
Also supports full chip erase
■ 100,000 Erase/Program Cycles Typical, 0°C to +70°C
Note: For programming information refer to Flash Programming 1M5
Application Note.
■ Organized as 128Kx32
FIG. 1
* The access time of 50ns is available in Industrial and Commercial
temperature ranges only.
PIN CONFIGURATION FOR WF128K32N-XH1X5
TOP VIEW
1
12
23
PIN DESCRIPTION
34
45
56
I/O0-31
Data Inputs/Outputs
I/O8
WE2
I/O15
I/O24
VCC
I/O31
A0-16
Address Inputs
I/O9
CS2
I/O14
I/O25
CS4
I/O30
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
I/O10
GND
I/O13
I/O26
WE4
I/O29
A14
I/O11
I/O12
A7
I/O27
I/O28
A16
A10
OE
A12
A4
A1
A11
A9
NC
NC
A5
A2
A0
A15
WE1
A13
A6
A3
VCC
NC
I/O7
WE3
A8
GND
Ground
NC
Not Connected
BLOCK DIAGRAM
WE1 CS 1
I/O23
WE2 CS2
WE3 CS 3
WE 4CS4
OE
A0-16
I/O0
CS1
I/O6
I/O16
CS3
I/O22
I/O1
NC
I/O5
I/O17
GND
I/O21
I/O2
I/O3
I/O4
I/O18
I/O19
I/O20
128K x 8
11
22
33
44
55
8
8
128K x 8
8
128K x 8
8
66
I/O0-7
June 2000 Rev. 2
128K x 8
1
I/O8-15
I/O16-23
I/O24-31
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF128K32-XXX5
FIG. 2
PIN CONFIGURATION FOR WF128K32-XG4TX5
PIN DESCRIPTION
NC
A0
A1
A2
A3
A4
A5
CS1
GND
CS3
WE
A6
A7
A8
A9
A10
VCC
TOP VIEW
I/O0-31
Data Inputs/Outputs
A0-16
Address Inputs
WE
Write Enable
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
GND
I/O8
I/O9
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
BLOCK DIAGRAM
CS 3
CS 2
CS 1
CS 4
WE
OE
A0-16
128K x 8
128K x 8
128K x 8
128K x 8
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
VCC
A11
A12
A13
A14
A15
A16
CS2
OE
CS4
NC
NC
NC
NC
NC
NC
NC
FIG. 3
I/O8-15
I/O0-7
8
I/O16-23
PIN CONFIGURATION FOR WF128K32-XG2X5 (Dual Cavity)
AND WF128K32-XG2UX5 (Single Cavity)
TOP VIEW
I/O24-31
PIN DESCRIPTION
NC
A0
A1
A2
A3
A4
A5
CS3
GND
CS4
WE1
A6
A7
A8
A9
A10
VCC
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
GND
I/O8
I/O9
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
8
8
8
I/O0-31
Data Inputs/Outputs
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
A0-16
Address Inputs
WE1-4
Write Enables
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
CS1-4
Chip Selects
OE
Output Enable
0.940"
VCC
Power Supply
The White 68 lead G2/G2U CQFP
fills the same fit and function as
the JEDEC 68 lead CQFJ or 68
PLCC. But the G2/G2U has the
TCE and lead inspection advantage of the CQFP form.
GND
Ground
NC
Not Connected
WE1 CS 1
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
BLOCK DIAGRAM
WE2 CS2
WE3 CS 3
WE 4CS4
A0-16
NC
NC
NC
WE4
WE2
WE3
OE
CS2
NC
A16
CS1
A15
A14
A13
A12
A11
VCC
OE
128K x 8
8
I/O0-7
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2
128K x 8
8
I/O8-15
128K x 8
8
I/O16-23
128K x 8
8
I/O24-31
WF128K32-XXX5
ABSOLUTE MAXIMUM RATINGS (1)
RECOMMENDED OPERATING CONDITIONS
Symbol
Min
Max
Unit
Operating Temperature
-55 to +125
°C
Supply Voltage
V CC
4.5
5.5
V
Supply Voltage Range (VCC)
-2.0 to +7.0
V
Input High Voltage
V IH
2.0
V CC + 0.3
V
Signal voltage range (any pin except A9) (2)
-2.0 to +7.0
V
Input Low Voltage
V IL
-0.5
+0.8
V
Storage Temperature Range
-65 to +150
°C
Operating Temp. (Mil.)
TA
-55
+125
°C
+300
°C
A9 Voltage for Sector Protect
VID
11.5
12.5
V
Parameter
Parameter
Unit
Lead Temperature (soldering, 10 seconds)
Data Retention Mil Temp
10 years
Endurance (write/erase cycles) Mil Temp
10,000 cycles min.
A9 Voltage for sector protect (VID) (3)
-2.0 to +14.0
CAPACITANCE
(T A = +25°C)
V
NOTES:
1. Stresses above the absolute maximum rating may cause permanent damage
to the device. Extended operation at the maximum levels may degrade
performance and affect reliability.
2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions,
inputs may overshoot VSS to -2.0 V for periods of up to 20ns. Maximum DC
voltage on output and I/O pins is V CC + 0.5V. During voltage transitions,
outputs may overshoot to Vcc + 2.0 V for periods of up to 20ns.
3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may
overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9
is +13.5V which may overshoot to 14.0 V for periods up to 20ns.
Parameter
Symbol
Conditions
OE capacitance
COE
VIN = 0 V, f = 1.0 MHz
WE1-4 capacitance
HIP (PGA)
CQFP G4T
CQFP G2
CQFP G2U
CWE
VIN = 0 V, f = 1.0 MHz
Max
50
Unit
pF
pF
20
50
20
15
CS1-4 capacitance
CCS
VIN = 0 V, f = 1.0 MHz
20
pF
Data I/O capacitance
CI/O
VI/O = 0 V, f = 1.0 MHz
20
pF
Address input capacitance
CAD
VIN = 0 V, f = 1.0 MHz
50
pF
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS - CMOS COMPATIBLE
(VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C)
Parameter
Symbol
Conditions
Unit
Min
Input Leakage Current
Output Leakage Current
Max
µA
ILI
VCC = 5.5, VIN = GND to VCC
10
ILOx32
VCC = 5.5, VIN = GND to VCC
10
µA
VCC Active Current for Read (1)
ICC1
CS = VIL, OE = VIH
140
mA
VCC Active Current for Program
or Erase (2)
ICC2
CS = VIL, OE = VIH
200
mA
VCC Standby Current
ICC3
VCC = 5.5, CS = VIH, f = 5MHz
6.5
mA
VCC Static Current
ICC4
VCC = 5.5, CS = VIH
0.6
mA
Output Low Voltage
VOL
IOL = 8.0 mA, VCC = 4.5
Output High Voltage
VOH1
IOH = -2.5 mA, VCC = 4.5
0.85 x
VCC
0.45
V
V
Output High Voltage
VOH2
IOH = -100 µA, VCC = 4.5
VCC
-0.4
V
Low VCC Lock Out Voltage
VLKO
3.2
V
NOTES:
1. The I CC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz).
The frequency component typically is less than 2 mA/MHz, with OE at VIH.
2. I CC active while Embedded Algorithm (program or erase) is in progress.
3. DC test conditions: V IL = 0.3V, VIH = V CC - 0.3V
3
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WF128K32-XXX5
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, CS CONTROLLED
(VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C)
Parameter
Symbol
-50
Min
-60
Max
Min
-70
Max
-90
Min Max
Min
-120
Max
Min
-150
Max
Min
Unit
Max
Write Cycle Time
t AVAV
t WC
50
60
70
90
120
150
ns
WE Setup Time
t WLEL
t WS
0
0
0
0
0
0
ns
CS Pulse Width
t ELEH
t CP
25
30
35
45
50
50
ns
Address Setup Time
t AVEL
t AS
0
0
0
0
0
0
ns
Data Setup Time
t DVEH
t DS
25
30
30
45
50
50
ns
Data Hold Time
t EHDX
t DH
0
0
0
0
0
0
ns
Address Hold Time
t ELAX
t AH
40
45
45
45
50
50
ns
WE Hold from WE High
t EHWH
t WH
0
0
0
0
0
0
ns
CS Pulse Width High
tEHEL
tCPH
20
20
20
20
20
20
ns
Duration of Programming Operation
t WHWH1
14
Duration of Erase Operation
t WHWH2
2.2
Read Recovery before Write
t GHEL
0
Chip Programming Time
14
60
2.2
14
60
2.2
0
12.5
14
60
2.2
0
12.5
14
60
0
12.5
FIG. 4
60
2.2
0
12.5
µs
14
2.2
60
0
12.5
ns
12.5
AC TEST CONDITIONS
AC TEST CIRCUIT
Parameter
I OL
Current Source
VZ
D.U.T.
≈ 1.5V
(Bipolar Supply)
C eff = 50 pf
I OH
Current Source
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4
Typ
sec
Unit
Input Pulse Levels
VIL = 0, VIH = 3.0
V
Input Rise and Fall
5
ns
Input and Output Reference Level
1.5
V
Output Timing Reference Level
1.5
V
NOTES:
V Z is programmable from -2V to +7V.
I OL & IOH programmable from 0 to 16mA.
Tester Impedance Z0 = 75 Ω.
V Z is typically the midpoint of VOH and V OL.
I OL & IOH are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
sec
WF128K32-XXX5
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, WE CONTROLLED
(VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C)
Parameter
Symbol
-50
Min
-60
Max
Min
-70
Max
Min
-90
Max
Min
-120
Max
Min
-150
Max
Min
Unit
Max
Write Cycle Time
t AVAV
t WC
50
60
70
90
120
150
Chip Select Setup Time
t ELWL
t CS
0
0
0
0
0
0
ns
Write Enable Pulse Width
t WLWH
t WP
25
30
35
45
50
50
ns
Address Setup Time
t AVWL
t AS
0
0
0
0
0
0
ns
Data Setup Time
t DVWH
t DS
25
30
30
45
50
50
ns
Data Hold Time
t WHDX
t DH
0
0
0
0
0
0
ns
Address Hold Time
t WLAX
t AH
40
45
45
45
50
50
ns
Chip Select Hold Time
t WHEH
t CH
0
0
0
0
0
0
ns
Write Enable Pulse Width High
t WHWL
t WPH
20
20
20
20
20
20
ns
Duration of Byte Programming Operation (min)
t WHWH1
14
Sector Erase Time
t WHWH2
2.2
t GHWL
0
Read Recovery Time Before Write
VCC Setup Time
t VCS
14
60
14
2.2
60
0
50
60
0
50
Chip Programming Time
14
2.2
60
0
50
12.5
14
2.2
12.5
µs
14
2.2
60
0
50
12.5
ns
2.2
60
0
50
ns
µs
50
12.5
sec
12.5
12.5
sec
Output Enable Setup Time
tOES
0
0
0
0
0
0
ns
Output Enable Hold Time (1)
tOEH
10
10
10
10
10
10
ns
1. For Toggle and Data Polling.
AC CHARACTERISTICS – READ ONLY OPERATIONS
(VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C)
Parameter
Symbol
-50
Min
-60
Max
Min
50
-70
Max
60
Min
-90
Max
Min
90
120
-150
Max
Min
Unit
Max
Read Cycle Time
t AVAV
t RC
Address Access Time
t AVQV
t ACC
50
60
70
90
120
150
ns
Chip Select Access Time
t ELQV
t CE
50
60
70
90
120
150
ns
OE to Output Valid
t GLQV
t OE
25
30
35
40
50
55
ns
Chip Select to Output High Z (1)
t EHQZ
t DF
20
20
20
25
30
35
ns
OE High to Output High Z (1)
t GHQZ
t DF
20
20
20
25
30
35
ns
Output Hold from Address, CS or OE Change,
whichever is first
t AXQX
t OH
0
0
70
-120
Min Max
0
0
0
150
0
ns
ns
1. Guaranteed by design, not tested.
5
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WF128K32-XXX5
FIG. 5
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
6
Outputs
WE
OE
CS
Addresses
High Z
tACC
tCE
tOE
Addresses Stable
tRC
Output Valid
tOH
tDF
High Z
AC WAVEFORMS FOR READ OPERATIONS
WF128K32-XXX5
FIG. 6
A0H
5.0 V
Data
tDS
tCS
WE
OE
7
tDH
tWPH
tWP
tGHWL
tWC
CS
NOTES:
1. PA is the address of the memory location
to be programmed.
2. PD is the data to be programmed at byte address.
3. D7 is the output of the complement of the
data written to the device (for each chip).
4. DOUT is the output of the data written to
the device.
5. Figure indicates last two bus cycles of four bus
cycle sequence.
Addresses
5555H
tAS
PA
PD
tAH
tWHWH1
Data Polling
D7
PA
DOUT
tOE
tCE
tRC
tDF
tOH
WRITE/ERASE/PROGRAM OPERATION, WE CONTROLLED
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF128K32-XXX5
FIG. 7
NOTES:
1. SA is the sector address
for Sector Erase.
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
AAH
tDS
tDH
tWPH
VCC
tVCS
8
Data
WE
OE
CS
Addresses
tGHWL
tCS
tWP
tAS
55H
2AAAH
5555H
tAH
5555H
80H
5555H
AAH
2AAAH
55H
SA
10H/30H
AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS
WF128K32-XXX5
FIG. 8
Data
WE
OE
CS
D7
D0-D6
t CH
tOEH
tCE
t OE
tWHWH 1 or 2
D7
D0-D6 = Invalid
t OE
D7 =
Valid Data
D0-D7
Valid Data
t OH
t DF
High Z
AC WAVEFORMS FOR DATA POLLING DURING
EMBEDDED ALGORITHM OPERATIONS
9
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WF128K32-XXX5
FIG. 9
tDH
tCPH
A0H
NOTES:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D7 is the output of the complement of the data written to the device (for each chip).
4. DOUT is the output of the data written to the device.
5. Figure indicates the last two bus cycles of a four bus cycle sequence.
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10
5.0 V
tDS
Data
CS
OE
tWS
tWC
WE
Addresses
5555H
tGHEL
tCP
tAS
PA
PD
tAH
tWHWH1
Data Polling
D7
PA
DOUT
WRITE/ERASE/PROGRAM OPERATION, CS CONTROLLED
WF128K32-XXX5
PACKAGE 400:
66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
27.3 (1.075) ± 0.25 (0.010) SQ
PIN 1 IDENTIFIER
SQUARE PAD
ON BOTTOM
25.4 (1.0) TYP
4.34 (0.171)
MAX
3.81 (0.150)
± 0.13 (0.005)
1.42 (0.056) ± 0.13 (0.005)
0.76 (0.030) ± 0.13 (0.005)
2.54 (0.100)
TYP
1.27 (0.050) TYP DIA
15.24 (0.600) TYP
0.46 (0.018) ± 0.05 (0.002) DIA
25.4 (1.0) TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 502:
68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)
39.6 (1.56) ± 0.38 (0.015) SQ
PIN 1 IDENTIFIER
3.56 (0.140) MAX
Pin 1
12.7 (0.500)
± 0.5 (0.020)
4 PLACES
5.1 (0.200)
± 0.25 (0.010)
4 PLACES
0.38 (0.015)
± 0.08 (0.003)
68 PLACES
1.27 (0.050)
TYP
0.25 (0.010)
± 0.05 (0.002)
38 (1.50) TYP
4 PLACES
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
11
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF128K32-XXX5
PACKAGE 500:
68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2)
25.1 (0.990) ± 0.25 (0.010) SQ
5.1 (0.200) MAX
22.4 (0.880) ± 0.25 (0.010) SQ
0.25 (0.010) ± 0.1 (0.002)
0.25 (0.010) REF
Pin 1
R 0.25
(0.010)
24.0 (0.946)
± 0.25 (0.010)
0.25 (0.010)
± 0.127 (0.005)
1° / 7°
1.0 (0.040)
± 0.127 (0.005)
23.87
(0.940) REF
DETAIL A
1.27 (0.050) TYP
SEE DETAIL "A"
0.38 (0.015) ± 0.05 (0.002)
20.3 (0.800) REF
The White 68 lead G2 CQFP fills
the same fit and function as the
JEDEC 68 lead CQFJ or 68 PLCC.
But the G2 has the TCE and lead
inspection advantage of the
CQFP form.
0.940"
TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
12
WF128K32-XXX5
PACKAGE 510:
68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)
25.15 (0.990) ± 0.25 (0.010) SQ
3.51 (0.140) MAX
22.36 (0.880) ± 0.25 (0.010) SQ
0.25 (0.010) ± 0.10 (0.002)
0.25 (0.010) REF
Pin 1
R 0.25
(0.010)
24.0 (0.946)
± 0.25 (0.010)
0.53 (0.021)
± 0.18 (0.007)
1° / 7°
1.01 (0.040)
± 0.13 (0.005)
23.87
(0.940) REF
DETAIL A
1.27 (0.050) TYP
SEE DETAIL "A"
0.38 (0.015) ± 0.05 (0.002)
20.3 (0.800) REF
The White 68 lead G2U CQFP
fills the same fit and function as
the JEDEC 68 lead CQFJ or 68
PLCC. But the G2U has the TCE
and lead inspection advantage
of the CQFP form.
0.940"
TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
13
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF128K32-XXX5
ORDERING INFORMATION
W F 128K32 X - XXX X X 5 X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
VPP PROGRAMMING VOLTAGE
5 = 5V
DEVICE GRADE:
Q = MIL - STD 833 Compliant
M = Military Screened -55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to + 70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400)
G2 = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 500)
G2U = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 510)
G4T = 40mm Ceramic Low Profile, CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrade
ORGANIZATION, 128K x 32
User configurable as 256K x 16 or 512K x 8
Flash
WHITE ELECTRONIC DESIGNS CORP.
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
14
WF128K32-XXX5
DEVICE TYPE
SPEED
PACKAGE
SMD NO.
128K x 32 Flash
150ns
66 pin HIP (H1)
5962-94716 01H8X
128K x 32 Flash
120ns
66 pin HIP (H1)
5962-94716 02H8X
128K x 32 Flash
90ns
66 pin HIP (H1)
5962-94716 03H8X
128K x 32 Flash
70ns
66 pin HIP (H1)
5962-94716 04H8X
128K x 32 Flash
60ns
66 pin HIP (H1)
5962-94716 05H8X
128K x 32 Flash
150ns
68 lead CQFP/J (G2)
5962-94716 01HMX
128K x 32 Flash
120ns
68 lead CQFP/J (G2)
5962-94716 02HMX
128K x 32 Flash
90ns
68 lead CQFP/J (G2)
5962-94716 03HMX
128K x 32 Flash
70ns
68 lead CQFP/J (G2)
5962-94716 04HMX
128K x 32 Flash
60ns
68 lead CQFP/J (G2)
5962-94716 05HMX
128K x 32 Flash
150ns
68 lead CQFP/J (G2U)
5962-94716 01HNX
128K x 32 Flash
120ns
68 lead CQFP/J (G2U)
5962-94716 02HNX
128K x 32 Flash
90ns
68 lead CQFP/J (G2U)
5962-94716 03HNX
128K x 32 Flash
70ns
68 lead CQFP/J (G2U)
5962-94716 04HNX
128K x 32 Flash
60ns
68 lead CQFP/J (G2U)
5962-94716 05HNX
128K x 32 Flash
150ns
68 lead CQFP Low Profile (G4T)
5962-94716 01H4X
128K x 32 Flash
120ns
68 lead CQFP Low Profile (G4T)
5962-94716 02H4X
128K x 32 Flash
90ns
68 lead CQFP Low Profile (G4T)
5962-94716 03H4X
128K x 32 Flash
70ns
68 lead CQFP Low Profile (G4T)
5962-94716 04H4X
128K x 32 Flash
60ns
68 lead CQFP Low Profile (G4T)
5962-94716 05H4X
15
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com