White Electronic Designs WF512K32-XXX5 512Kx32 5V FLASH MODULE, SMD 5962-94612 FEATURES Access Times of 60, 70, 90, 120, 150ns Packaging Commercial, Industrial and Military Temperature Ranges 5 Volt Programming. 5V ± 10% Supply. Low Power CMOS, 6.5mA Standby 68 lead, 40mm, Low Capacitance Hermetic CQFP (Package 501)1 Embedded Erase and Program Algorithms TTL Compatible Inputs and CMOS Outputs • 68 lead, 40mm, Low Profile 3.5mm (0.140"), CQFP (Package 502)1 Built-in Decoupling Caps for Low Noise Operation • 68 lead, 22.4mm (0.880") Low Profile CQFP (G2U) 3.5mm (0.140") high, (Package 510)1 Page Program Operation and Internal Program Control Time • 68 lead, 22.4mm (0.880") CQFP (G2L) 5.08mm (0.200") high, Package (528) Weight • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400(1)). • 1,000,000 Erase/Program Cycles Minimum Sector Architecture • 8 equal size sectors of 64KBytes each • Any combination of sectors can be concurrently erased. Also supports full chip erase WF512K32 - XG2UX5 - 8 grams typical WF512K32N - XH1X5 - 13 grams typical WF512K32 - XG4TX51 - 20 grams typical WF512K32-XG2LX5 - 8 grams typical * This product is subject to change without notice. Note 1: Package Not Recommended for New Design See Flash Programming Application Note 4M5 for algorithms. Organized as 512Kx32 FIGURE 1 – PIN CONFIGURATION FOR WF512K32N-XH1X5 Top View 1 12 23 Pin Description 34 45 I/O0-31 A0-18 WE1-4# CS1-4# OE# VCC GND NC 56 I/O8 WE2# I/O15 I/O24 VCC I/O31 I/O9 CS2# I/O14 I/O25 CS4# I/O30 I/O10 GND I/O13 I/O26 WE4# I/O29 A14 I/O11 I/O12 A7 I/O27 I/O28 A16 A10 OE# A12 A4 A1 A11 A9 A17 NC A5 A2 A0 A15 WE1# A13 A6 A3 Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected Block Diagram WE1# CS1# A18 VCC I/O7 A8 WE3# I/O23 I/O0 CS1# I/O6 I/O16 CS3# I/O22 I/O1 NC I/O5 I/O17 GND I/O21 I/O2 I/O3 I/O4 I/O18 I/O19 I/O20 512K x 8 8 11 March 2006 Rev. 11 22 33 44 55 WE2# CS2# WE3# CS3# WE4# CS4# OE# A0-18 I/O0-7 66 1 512K x 8 8 I/O8-15 512K x 8 8 I/O16-23 512K x 8 8 I/O24-31 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF512K32-XXX5 FIGURE 2 – PIN CONFIGURATION FOR WF512K32-XG4TX51 Pin Description NC A0 A1 A2 A3 A4 A5 CS1# GND CS3# WE# A6 A7 A8 A9 A10 VCC Top View I/O0-31 A0-18 WE# CS1-4# OE# VCC GND NC 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 Block Diagram CS1# 512K X 8 512K X 8 8 NC NC NC NC NC A17 A18 A15 A16 CS2# OE# CS4# A14 A13 A12 A11 CS2# CS3# CS4# WE# OE# A0-18 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 VCC Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected 8 I/O8 - 15 I/O0 - 7 512K X 8 8 I/O16 - 23 512K X 8 8 I/O24 - 31 Note 1: Package not recommended for new designs FIGURE 3 – PIN CONFIGURATION FOR WF512K32-XG2UX5 AND WF512K32-XG2LX5 Top View Pin Description NC A0 A1 A2 A3 A4 A5 CS3# GND CS4# WE1# A6 A7 A8 A9 A10 VCC I/O0-31 A0-18 WE1-4# CS1-4# OE# VCC GND NC 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 2728 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 Block Diagram WE1# CS1# 512K x 8 8 I/O0-7 March 2006 Rev. 11 WE2# CS2# WE3# CS3# WE4# CS4# OE# A0-18 512K x 8 512K x 8 512K x 8 A18 NC NC 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 VCC A11 A12 A13 A14 A15 A16 CS1# OE# CS2# A17 WE2# WE3# WE4# I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected 2 8 I/O8-15 8 I/O16-23 8 I/O24-31 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs Absolute Maximum Ratings (1) WF512K32-XXX5 CAPACITANCE TA = +25°C Parameter Operating Temperature Supply Voltage Range (VCC) Signal voltage range (any pin except A9) (2) Storage Temperature Range Lead Temperature (soldering, 10 seconds) Data Retention (Mil Temp) Endurance - write/erase cycles (Mil Temp) A9 Voltage for sector protect (VID) (3) Unit Parameter OE# capacitance WE1-4# capacitance HIP (PGA) CQFP G4T CQFP G2U/G2L CS1-4# capacitance Data# I/O capacitance Address input capacitance -55 to +125 °C -2.0 to +7.0 V -2.0 to +7.0 V -65 to +150 °C +300 °C 20 years 1,000,000 cycles min. -2.0 to +14.0 V NOTES: 1. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions,inputs may overshoot Vss to -2.0 V for periods of up to 20ns. Maximum DC voltage on output and I/O pins is Vcc + 0.5V. During voltage transitions, outputs may overshoot to Vcc + 2.0 V for periods of up to 20ns. 3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9 is +13.5V which may overshoot to 14.0 V for periods up to 20ns. Symbol Conditions COE VIN = 0V, f = 1.0 MHz CWE VIN = 0V, f = 1.0 MHz Max Unit 50 pF pF 20 50 15 VIN = 0V, f = 1.0 MHz 20 pF VI/O = 0V, f = 1.0 MHz 20 pF VIN = 0V, f = 1.0 MHz 50 pF CCS CI/O CAD This parameter is guaranteed by design but not tested. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Min Max Unit VCC VIH VIL TA TA VID 4.5 2.0 -0.5 -55 -40 11.5 5.5 VCC + 0.5 +0.8 +125 +85 12.5 V V V °C °C V Supply Voltage Input High Voltage Input Low Voltage Operating Temp. (Mil.) Operating Temp. (Ind.) A9 Voltage for Sector Protect DC CHARACTERISTICS VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Max Units VCC = 5.5, VIN = GND to VCC 10 µA ILOx32 CS# = VIH, OE# = VIH, VOUT = GND to VCC 10 µA VCC Active Current for Read (1) ICC1 CS# = VIL, OE# = VIH, f = 5MHz, VCC = 5.5 190 mA VCC Active Current for Program or Erase (2) ICC2 CS# = VIH, OE# = VIH 240 mA VCC Standby Current ICC4 VCC = 5.5, CS = VIH, f = 5MHz 6.5 mA VCC Static Current ICC3 VCC = 5.5, CS = VIH 0.6 mA Output Low Voltage VOL IOL = 8.0mA, VCC = 4.5 0.45 Output High Voltage VOH1 IOH = 2.5mA, VCC = 4.5 Low VCC Lock-Out Voltage VLKO Input Leakage Current Output Leakage Current Sym ILI Conditions Min 0.85 X VCC 3.2 V V 4.2 V DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V NOTES: 1. The ICC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz). The frequency component typically is less than 2 mA/MHz, with OE at VIH. 2. ICC active while Embedded Algorithm (program or erase) is in progress. March 2006 Rev. 11 3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF512K32-XXX5 AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,CS# CONTROLLED VCC = 5.0V, GND = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol -60 Min -70 Max Min -90 Max Min -120 Max Min -150 Max Min Unit Max Write Cycle Time tAVAV tWC 60 70 90 120 150 ns Write Enable Setup Time tWLEL tWS 0 0 0 0 0 ns Chip Select Pulse Width tELEH tCP 40 45 45 50 50 ns ns Address Setup Time tAVEL tAS 0 0 0 0 0 Data Setup Time tDVEH tDS 40 45 45 50 50 ns Data Hold Time tEHDX tDH 0 0 0 0 0 ns Address Hold Time tELAX tAH 40 45 45 50 50 ns tEHEL tCPH 20 Chip Select Pulse Width High Duration of Byte Programming Operation (1) tWHWH1 Sector Erase Time (2) tWHWH2 Read Recovery Time tGHEL 20 300 20 300 15 15 0 0 20 300 15 0 20 300 15 0 ns 300 µs 15 sec 0 ns Chip Programming Time 11 11 11 11 11 sec Chip Erase Time (3) 64 64 64 64 64 sec NOTES: 1. Typical value for tWHWH1 is 7µs. 2. Typical value for tWHWH2 is 1sec. 3. Typical value for Chip Erase Time is 8sec. FIGURE. 4 – AC TEST CIRCUIT AC Test Conditions Parameter Input Pulse Levels Input Rise and Fall Input and Output Reference Level Output Timing Reference Level I OL Current Source VZ D.U.T. 1.5V I OH Current Source March 2006 Rev. 11 Unit V ns V V Notes: V Z is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 Ω. V Z is typically the midpoint of VOH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. (Bipolar Supply) C eff = 50 pf Typ VIL = 0, VIH = 3.0 5 1.5 1.5 4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF512K32-XXX5 AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,WE# CONTROLLED VCC = 5.0V, GND = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol -60 Min -70 Max Min -90 Max Min -120 Max Min -150 Max Min Unit Max Write Cycle Time tAVAV tWC 60 70 90 120 150 ns Chip Select Setup Time tELWL tCS 0 0 0 0 0 ns Write Enable Pulse Width tWLWH tWP 40 45 45 50 50 ns ns Address Setup Time tAVWH tAS 0 0 0 0 0 Data Setup Time tDVWH tDS 40 45 45 50 50 ns Data Hold Time tWHDX tDH 0 0 0 0 0 ns Address Hold Time tWHAX tAH 40 45 45 50 50 ns Write Enable Pulse Width High tWHWL tWPH 20 Duration of Byte Programming Operation (1) tWHWH1 Sector Erase Time (2) tWHWH2 Read Recovery Time before Write tGHWL VCC Set-up Time 20 20 300 15 tVCS 0 50 Output Enable Setup Time tOES 0 Output Enable Hold Time (4) tOEH 10 10 sec µs 11 0 10 64 15 ns 11 0 10 64 µs 50 11 0 300 0 50 11 0 Chip Erase Time (3) 15 0 50 11 ns 300 15 0 50 20 300 15 0 Chip Programming Time 20 300 ns 10 64 sec ns 64 64 sec NOTES: 1. Typical value for tWHWH1 is 7µs. 2. Typical value for tWHWH2 is 1sec. 3. Typical value for Chip Erase Time is 8sec. 4. For Toggle and Data Polling. AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,WE# CONTROLLED VCC = 5.0V, -55°C ≤ TA ≤ +125°C Parameter Symbol -60 Min -70 Max Min 60 -90 Max 70 Min -120 Max 90 Min -150 Max 120 Min Unit Max Read Cycle Time tAVAV tRC Address Access Time tAVQV tACC 60 70 90 120 150 150 ns ns Chip Select Access Time tELQV tCE 60 70 90 120 150 ns Output Enable to Output Valid tGLQV tOE 30 35 35 50 55 ns Chip Select to Output High Z (1) tEHQZ tDF 20 20 20 30 35 ns Output Enable High to Output High Z (1) tGHQZ tDF Output Hold from Address, CS# or OE# Change, whichever is First tAXQX tOH 20 20 0 0 20 0 30 0 35 0 ns ns 1. Guaranteed by design, but not tested March 2006 Rev. 11 5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF512K32-XXX5 FIGURE 5 – AC WAVEFORMS FOR READ OPERATIONS CS# OE# WE# March 2006 Rev. 11 6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF512K32-XXX5 FIGURE 6 – WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED Data# Polling CS# OE# WE# D7# NOTES: 1. PA is the address of the memory location to be programmed. 2. PD is the data to be programmed at byte address. 3. D7# is the output of the complement of the data written to the device (for each chip). 4. DOUT is the output of the data written to the device. 5. Figure indicates last two bus cycles of four bus cycle sequence. March 2006 Rev. 11 7 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF512K32-XXX5 FIGURE 7 – AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS tAH Addresses 5555H 2AAAH 5555H 5555H 2AAAH SA tAS CS# tGHWL OE# tWP WE# tWPH tCS Data tDH AAH 55H 80H AAH 55H 10H/30H tDS VCC tVCS NOTE: 1. SA is the sector address for Sector Erase. March 2006 Rev. 11 8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF512K32-XXX5 FIGURE 8 – AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS t CH CS# t DF t OE OE# tOEH WE# tCE t OH D7 = Valid Data D7# D7 High Z tWHWH 1 or 2 Data D0-D7 Valid Data D0-D6 = Invalid D0-D6 t OE March 2006 Rev. 11 9 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF512K32-XXX5 FIGURE 9 – ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS Data# Polling CS# OE# WE# D7# Notes: 1. PA represents the address of the memory location to be programmed. 2. PD represents the data to be programmed at byte address. 3. D7# is the output of the complement of the data written to the device (for each chip). 4. DOUT is the output of the data written to the device. 5. Figure indicates the last two bus cycles of a four bus cycle sequence. March 2006 Rev. 11 10 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF512K32-XXX5 PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1) 4.60 (0.181) ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES March 2006 Rev. 11 11 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF512K32-XXX5 PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U) o o The White 68 lead G2U CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2U has the TCE and lead inspection advantage of the CQFP form. 0.940" TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES March 2006 Rev. 11 12 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF512K32-XXX5 PACKAGE 528: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L) 25.15 (0.990) ± 0.25 (0.010) MAX 5.10 (0.200) MAX 22.36 (0.880) ± 0.25 (0.010) MAX 0.25 (0.010) ± 0.10 (0.002) 0.23 (0.009) REF 24.0 (0.946) ± 0.25 (0.010) R 0.127 (0.005) O 1.37 (0.054) MIN 0.004 O 2 /9 0.89 (0.035) ± 1.14 (0.045) 1.27 (0.050) TYP 0.38 (0.015) ± 0.05 (0.002) 20.31 (0.800) REF 0.940" TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES March 2006 Rev. 11 13 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF512K32-XXX5 PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1 5.1 (0.200) MAX 39.6 (1.56) ± 0.38 (0.015) SQ 1.27 (0.050) ± 0.1 (0.005) PIN 1 IDENTIFIER Pin 1 12.7 (0.500) ± 0.5 (0.020) 4 PLACES 5.1 (0.200) ± 0.25 (0.010) 4 PLACES 1.27 (0.050) TYP 0.38 (0.015) ± 0.08 (0.003) 68 PLACES 0.25 (0.010) ± 0.05 (0.002) 38 (1.50) TYP 4 PLACES Note 1: Package Not Recommended for New Design ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES March 2006 Rev. 11 14 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF512K32-XXX5 ORDERING INFORMATION W F 512K32 X - XXX X X 5 X LEAD FINISH: Blank = Gold plated leads A = Solder dip leads VPP PROGRAMMING VOLTAGE 5=5V DEVICE GRADE: Q = MIL-STD-883 Compliant M = Military Screened -55°C to +125°C I = Industrial -40°C to +85°C C = Commercial 0°C to +70°C PACKAGE TYPE: H1 = 1.075" sq. Ceramic Hex In Line Package, HIP (Package 400*) G2U = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 510) G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528) G4T1 = 40mm Low Profile CQFP (Package 502) ACCESS TIME (ns) IMPROVEMENT MARK N = No Connect at pins 21 and 39 in HIP for Upgrade ORGANIZATION, 512K x 32 User configurable as 1M x 16 or 2M x 8 FLASH WHITE ELECTRONIC DESIGNS CORP. Note 1: Package Not Recommended for New Design March 2006 Rev. 11 15 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF512K32-XXX5 DEVICE TYPE SPEED PACKAGE SMD NO. 512K x 32 Flash Module 150ns 66 pin HIP (H1) 1.075" sq. 5962-94612 01H4X 512K x 32 Flash Module 120ns 66 pin HIP (H1) 1.075" sq. 5962-94612 02H4X 512K x 32 Flash Module 90ns 66 pin HIP (H1) 1.075" sq. 5962-94612 03H4X 512K x 32 Flash Module 70ns 66 pin HIP (H1) 1.075" sq. 5962-94612 04H4X 512K x 32 Flash Module 150ns 68 lead CQFP Low Profile (G4T)1 5962-94612 01HTX1 512K x 32 Flash Module 120ns 68 lead CQFP Low Profile (G4T)1 5962-94612 02HTX1 1 5962-94612 03HTX1 512K x 32 Flash Module 90ns 68 lead CQFP Low Profile (G4T) 512K x 32 Flash Module 70ns 68 lead CQFP Low Profile (G4T)1 5962-94612 04HTX1 512K x 32 Flash Module 150ns 68 lead CQFP/J (G2U) 5962-94612 01HZX 512K x 32 Flash Module 120ns 68 lead CQFP/J (G2U) 5962-94612 02HZX 512K x 32 Flash Module 90ns 68 lead CQFP/J (G2U) 5962-94612 03HZX 512K x 32 Flash Module 70ns 68 lead CQFP/J (G2U) 5962-94612 04HZX 512K x 32 Flash Module 150ns 68 lead CQFP (G2L) 5962-94612 01HAX 512K x 32 Flash Module 120ns 68 lead CQFP (G2L) 5962-94612 02HAX 512K x 32 Flash Module 90ns 68 lead CQFP (G2L) 5962-94612 03HAX 512K x 32 Flash Module 70ns 68 lead CQFP (G2L) 5962-94612 04HAX March 2006 Rev. 11 16 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com