X9315
®
Low Noise, Low Power, 32 Taps
Data Sheet
December 21, 2009
Digitally Controlled Potentiometer
(XDCP™)
FN8179.2
Features
• Solid-state potentiometer
The Intersil X9315 is a digitally controlled potentiometer
(XDCP). The device consists of a resistor array, wiper
switches, a control section, and nonvolatile memory. The
wiper position is controlled by a 3-wire interface.
The potentiometer is implemented by a resistor array
composed of 31 resistive elements and a wiper switching
network. Between each element and at either end are tap
points accessible to the wiper terminal. The position of the
wiper element is controlled by the CS, U/D, and INC inputs.
The position of the wiper can be stored in nonvolatile
memory and then be recalled upon a subsequent power-up
operation.
The device can be used as a three-terminal potentiometer or
as a two-terminal variable resistor in a wide variety of
applications including:
• Control
• 3-wire serial interface
• 32 wiper tap points
- Wiper position stored in nonvolatile memory and
recalled on power-up
• 31 resistive elements
- Temperature compensated
- End to end resistance range ± 20%
- Terminal voltage, 0 to VCC
• Low power CMOS
- VCC = 2.7V or 5V
- Active current, 80/400µA max.
- Standby current, 5µA max.
• High reliability
- Endurance, 100,000 data changes per bit
- Register data retention, 100 years
• Parameter Adjustments
• RTOTAL values = 10kΩ, 50kΩ, 100kΩ
• Signal Processing
• Packages
- 8 Ld SOIC, MSOP and PDIP
• Pb-free available (RoHS compliant)
Block Diagram
U/D
INC
CS
VCC (Supply Voltage)
Control
and
Memory
RW/VW
Device Select
(CS)
RH/VH
31
30
29
RH/VH
Up/Down
(U/D)
Increment
(INC)
5-Bit
Up/Down
Counter
5-Bit
Nonvolatile
Memory
RL/VL
28
One
of
Thirty
Two
Decoder
Transfer
Gates
Resistor
Array
2
VSS (Ground)
General
VCC
VSS
Store and
Recall
Control
Circuitry
1
0
RL/VL
RW/VW
Detailed
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
XDCP is a trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005, 2009. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
X9315
Ordering Information
PART NUMBER
PART MARKING
VCC LIMITS
(V)
RTOTAL
(kΩ)
TEMP RANGE
(°C)
5 ±10%
10
0 to 70
8 Ld MSOP (Pb-free) M8.118
8 Ld MSOP (Pb-free) M8.118
PKG.
DWG. #
PACKAGE
X9315WMZ (Note 2)
DDT
X9315WMZT1 (Notes 1, 2)
DDT
0 to 70
X9315WMIT2 (Note 1)
AAX
-40 to 85
8 Ld MSOP
X9315WMIZ (Note 2)
AKW
-40 to 85
8 Ld MSOP (Pb-free) M8.118
X9315WMIZT1 (Notes 1, 2)
AKW
-40 to 85
8 Ld MSOP (Pb-free) M8.118
X9315WP
X9315WP
0 to 70
8 Ld PDIP
MDP0031
X9315WST1 (Note 1)
X9315W
0 to 70
8 Ld SOIC
M8.15E
X9315WSZ (Note 2)
X9315W Z
0 to 70
8 Ld SOIC (Pb-free)
M8.15
X9315WSZT1 (Notes 1, 2)
X9315W Z
0 to 70
8 Ld SOIC (Pb-free)
M8.15
X9315WSI
X9315W I
-40 to 85
8 Ld SOIC
M8.15E
X9315WSIT1 (Note 1)
X9315W I
-40 to 85
8 Ld SOIC
M8.15E
X9315WSIZ (Note 2)
X9315W ZI
-40 to 85
8 Ld SOIC (Pb-free)
M8.15
X9315WSIZT1 (Notes 1, 2)
X9315W ZI
-40 to 85
8 Ld SOIC (Pb-free)
M8.15
X9315UMZ (Note 2)
DDS
X9315UMZT1 (Notes 1, 2)
50
M8.118
0 to 70
8 Ld MSOP (Pb-free) M8.118
DDS
0 to 70
8 Ld MSOP (Pb-free) M8.118
X9315UMI
AEB
-40 to 85
8 Ld MSOP
M8.118
X9315UMIT1 (Notes 1, 2)
AEB
-40 to 85
8 Ld MSOP
M8.118
X9315UMIZ (Note 2)
DDR
-40 to 85
8 Ld MSOP (Pb-free) M8.118
X9315UMIZT1 (Notes 1, 2)
DDR
-40 to 85
8 Ld MSOP (Pb-free) M8.118
X9315UST2 (Note 1)
X9315U
0 to 70
8 Ld SOIC
M8.15E
X9315USZ (Note 2)
X9315U Z
0 to 70
8 Ld SOIC (Pb-free)
M8.15
X9315USZT1 (Notes 1, 2)
X9315U Z
0 to 70
8 Ld SOIC (Pb-free)
M8.15
X9315USIZ (Note 2)
X9315U ZI
-40 to 85
8 Ld SOIC (Pb-free)
M8.15
X9315USIZT1 (Notes 1, 2)
X9315U ZI
-40 to 85
8 Ld SOIC (Pb-free)
M8.15
X9315TMZ (Note 2)
DDN
X9315TMZT1 (Notes 1, 2)
100
0 to 70
8 Ld MSOP (Pb-free) M8.118
DDN
0 to 70
8 Ld MSOP (Pb-free) M8.118
X9315TMIZ (Note 2)
DDL
-40 to 85
8 Ld MSOP (Pb-free) M8.118
X9315TMIZT1 (Notes 1, 2)
DDL
-40 to 85
8 Ld MSOP (Pb-free) M8.118
X9315TSZ (Note 2)
X9315T Z
0 to 70
8 Ld SOIC (Pb-free)
M8.15
X9315TSZT1 (Notes 1, 2)
X9315T Z
0 to 70
8 Ld SOIC (Pb-free)
M8.15
X9315TSIZ (Note 2)
X9315T ZI
-40 to 85
8 Ld SOIC (Pb-free)
M8.15
X9315TSIZT1 (Notes 1, 2)
X9315T ZI
-40 to 85
8 Ld SOIC (Pb-free)
M8.15
X9315WMZ-2.7 (Note 2)
AOI
X9315WMZ-2.7T1 (Notes 1, 2)
0 to 70
8 Ld MSOP (Pb-free) M8.118
AOI
0 to 70
8 Ld MSOP (Pb-free) M8.118
X9315WMI-2.7T2 (Note 1)
AAV
-40 to 85
8 Ld MSOP
X9315WMIZ-2.7 (Note 2)
AKX
-40 to 85
8 Ld MSOP (Pb-free) M8.118
X9315WMIZ-2.7T1 (Notes 1, 2)
AKX
-40 to 85
8 Ld MSOP (Pb-free) M8.118
X9315WS-2.7
X9315W F
2
2.7 to 5.5
10
0 to 70
8 Ld SOIC
M8.118
M8.15E
FN8179.2
December 21, 2009
X9315
Ordering Information (Continued)
PART NUMBER
PART MARKING
VCC LIMITS
(V)
RTOTAL
(kΩ)
TEMP RANGE
(°C)
2.7 to 5.5
10
0 to 70
8 Ld SOIC
M8.15E
PKG.
DWG. #
PACKAGE
X9315WS-2.7T1 (Note 1)
X9315W F
X9315WSZ-2.7 (Note 2)
X9315W ZF
0 to 70
8 Ld SOIC (Pb-free)
M8.15
X9315WSZ-2.7T1 (Notes 1, 2)
X9315W ZF
0 to 70
8 Ld SOIC (Pb-free)
M8.15
X9315WSI-2.7T1 (Note 1)
X9315W G
-40 to 85
8 Ld SOIC
M8.15E
X9315WSIZ-2.7 (Note 2)
X9315W ZG
-40 to 85
8 Ld SOIC (Pb-free)
M8.15
X9315WSIZ-2.7T1 (Notes 1, 2)
X9315W ZG
-40 to 85
8 Ld SOIC (Pb-free)
M8.15
X9315UMZ-2.7 (Note 2)
AKU
X9315UMZ-2.7T1 (Notes 1, 2)
50
0 to 70
8 Ld MSOP (Pb-free) M8.118
AKU
0 to 70
8 Ld MSOP (Pb-free) M8.118
X9315UMIZ-2.7 (Note 2)
AJG
-40 to 85
8 Ld MSOP (Pb-free) M8.118
X9315UMIZ-2.7T1 (Notes 1, 2)
AJG
-40 to 85
8 Ld MSOP (Pb-free) M8.118
X9315US-2.7T2 (Note 1)
X9315U F
0 to 70
8 Ld SOIC
M8.15E
X9315USZ-2.7 (Note 2)
X9315U ZF
0 to 70
8 Ld SOIC (Pb-free)
M8.15
X9315USZ-2.7T1 (Notes 1, 2)
X9315U ZF
0 to 70
8 Ld SOIC (Pb-free)
M8.15
X9315USI-2.7
X9315U G
-40 to 85
8 Ld SOIC
M8.15E
X9315USIZ-2.7 (Note 2)
X9315U ZG
-40 to 85
8 Ld SOIC (Pb-free)
M8.15
X9315USIZ-2.7T1 (Notes 1, 2)
X9315U ZG
-40 to 85
8 Ld SOIC (Pb-free)
M8.15
X9315TMZ-2.7 (Note 2)
DDP
X9315TMZ-2.7T1 (Notes 1, 2)
100
0 to 70
8 Ld MSOP (Pb-free) M8.118
DDP
0 to 70
8 Ld MSOP (Pb-free) M8.118
X9315TMI-2.7T1 (Note 1)
ADY
-40 to 85
8 Ld MSOP
X9315TMIZ-2.7 (Note 2)
DDM
-40 to 85
8 Ld MSOP (Pb-free) M8.118
X9315TMIZ-2.7T1 (Notes 1, 2)
DDM
-40 to 85
8 Ld MSOP (Pb-free) M8.118
X9315TSZ-2.7 (Note 2)
X9315T ZF
0 to 70
8 Ld SOIC (Pb-free)
M8.15
X9315TSZ-2.7T1 (Notes 1, 2)
X9315T ZF
0 to 70
8 Ld SOIC (Pb-free)
M8.15
X9315TSIZ-2.7 (Note 2)
X9315T ZG
-40 to 85
8 Ld SOIC (Pb-free)
M8.15
X9315TSIZ-2.7T1 (Notes 1, 2)
X9315T ZG
-40 to 85
8 Ld SOIC (Pb-free)
M8.15
M8.118
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD020.
3
FN8179.2
December 21, 2009
X9315
Pin Configuration
Chip Select (CS)
X9315
(8 LD MSOP, SOIC, PDIP)
TOP VIEW
INC
1
8
VCC
U/D
2
7
CS
X9315
RH/VH
3
6
RL/VL
VSS
4
5
RW/VW
Pin Names
SYMBOL
DESCRIPTION
RH/VH
High terminal
RW/VW
Wiper terminal
RL/VL
Low terminal
VSS
Ground
VCC
Supply voltage
U/D
Up/Down control input
INC
Increment control input
CS
Chip Select control input
Pin Description
RH/VH and RL/VL
The high (RH/VH) and low (RL/VL) terminals of the X9315
are equivalent to the fixed terminals of a mechanical
potentiometer. The minimum voltage is VSS and the
maximum is VCC. The terminology of RL/VL and RH/VH
references the relative position of the terminal in relation to
wiper movement direction selected by the U/D input, and not
the voltage potential on the terminal.
RW/VW
RW/Vw is the wiper terminal and is equivalent to the movable
terminal of a mechanical potentiometer. The position of the
wiper within the array is determined by the control inputs.
The wiper terminal series resistance is typically 200Ω at
VCC = 5V.
Up/Down (U/D)
The U/D input controls the direction of the wiper movement
and whether the counter is incremented or decremented.
Increment (INC)
The INC input is negative-edge triggered. Toggling INC will
move the wiper and either increment or decrement the
counter in the direction indicated by the logic level on the
U/D input.
4
The device is selected when the CS input is LOW. The
current counter value is stored in nonvolatile memory when
CS is returned HIGH while the INC input is also HIGH. After
the store operation is complete the X9315 will be placed in
the low power standby mode until the device is selected
once again.
Principles of Operation
There are three sections of the X9315: the input control,
counter and decode section; the nonvolatile memory; and
the resistor array. The input control section operates just like
an up/down counter. The output of this counter is decoded to
turn on a single electronic switch connecting a point on the
resistor array to the wiper output. Under the proper
conditions the contents of the counter can be stored in
nonvolatile memory and retained for future use. The resistor
array is comprised of 31 individual resistors connected in
series. At either end of the array and between each resistor
is an electronic switch that transfers the connection at that
point to the wiper.
The wiper, when at either fixed terminal, acts like its
mechanical equivalent and does not move beyond the last
position. That is, the counter does not wrap around when
clocked to either extreme.
The electronic switches on the device operate in a “make
before break” mode when the wiper changes tap positions. If
the wiper is moved several positions, multiple taps are
connected to the wiper for tIW (INC to VW change). The
RTOTAL value for the device can temporarily be reduced by
a significant amount if the wiper is moved several positions.
When the device is powered-down, the last wiper position
stored will be maintained in the nonvolatile memory. When
power is restored, the contents of the memory are recalled
and the wiper is set to the value last stored.
Instructions and Programming
The INC, U/D and CS inputs control the movement of the
wiper along the resistor array. With CS set LOW the device
is selected and enabled to respond to the U/D and INC
inputs. HIGH to LOW transitions on INC will increment or
decrement (depending on the state of the U/D input) a five
bit counter. The output of this counter is decoded to select
one of thirty two wiper positions along the resistive array.
The value of the counter is stored in nonvolatile memory
whenever CS transitions HIGH while the INC input is also
HIGH.
The system may select the X9315, move the wiper and
deselect the device without having to store the latest wiper
position in nonvolatile memory. After the wiper movement is
performed as described above and once the new position is
reached, the system must keep INC LOW while taking CS
HIGH. The new wiper position will be maintained until
FN8179.2
December 21, 2009
X9315
changed by the system or until a power-up/down cycle
recalled the previously stored data.
This procedure allows the system to always power-up to a
preset value stored in nonvolatile memory; then during
system operation minor adjustments could be made. The
adjustments might be based on user preference, system
parameter changes due to temperature drift, etc...
Power-up and Down Requirements
There are no restrictions on the power-up or power-down
conditions of VCC and the voltages applied to the
potentiometer pins provided that VCC is always more
positive than or equal to VH, VL, and VW, i.e., VCC ≥ VH, VL,
VW. The VCC ramp rate spec is always in effect.
The state of U/D may be changed while CS remains LOW.
This allows the host system to enable the device and then
move the wiper up and down until the proper trim is attained.
Mode Selection
CS
INC
U/D
MODE
L
H
Wiper up
L
L
Wiper down
H
X
Store wiper position to nonvolatile
memory
X
X
Standby
L
X
No store, return to standby
L
H
Wiper Up (not recommended)
L
L
Wiper Down (not recommended)
H
5
FN8179.2
December 21, 2009
X9315
Absolute Maximum Ratings
Thermal Information
Temperature under bias . . . . . . . . . . . . . . . . . . . . . .-65°C to +135°C
Storage temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage on CS, INC, U/D, VH, VL and
VCC with respect to VSS . . . . . . . . . . . . . . . . . . . . . . . -1V to +7V
ΔV = |VH–VL| . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5V
IW (10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±7.5mA
Thermal Resistance (Typical, Notes 3, 4) θJA (°C/W) θJC (°C/W)
8 Ld SOIC . . . . . . . . . . . . . . . . . . . . . .
105
68
8 Ld MSOP. . . . . . . . . . . . . . . . . . . . . .
154
58
8 Ld PDIP. . . . . . . . . . . . . . . . . . . . . . .
85
57
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Temperature (Commercial) . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Temperature (Industrial). . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Supply Voltage (VCC) (Note 8) Limits
X9315. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ± 10%
X9315-2.7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
Max Wiper Current, IW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3.75mA
Max Power Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10mW
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
3. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
4. For θJC, the “case temp” location is taken at the package top center.
Potentiometer Characteristics
(Over recommended operating conditions unless otherwise stated.)
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS/NOTES
MIN
TYP
MAX
(Note 9) (Note 8) (Note 9)
End to end resistance tolerance
UNIT
-20
+20
%
VVH
VH terminal voltage
0
VCC
V
VVL
VL terminal voltage
0
VCC
V
RW
Wiper resistance
IW = [V(RH) - V(RL)]/ RTOTAL, VCC = 5V
200
400
Ω
RW
Wiper resistance
IW = [V(RH) - V(RL)]/ RTOTAL, VCC = 2.7V
400
1000
Ω
Noise
Ref: 1kHz
-120
dBV
3
%
Resolution
CH/CL/CW
Absolute linearity (Note 5)
Vw(n)(actual) - Vw(n)(expected)
Relative linearity (Note 6)
Vw(n + 1) - [Vw(n) + MI]
±1
MI
(Note 7)
±0.2
MI
(Note 7)
RTOTAL temperature coefficient
±300
ppm/°C
Ratiometric temperature coefficient
±20
ppm/°C
10/10/25
pF
Potentiometer capacitances
See circuit #3 on page 7
NOTES:
5. Absolute linearity is utilized to determine actual wiper voltage versus expected voltage = (Vw(n)(actual) - Vw(n)(expected)) = ±1 Ml Maximum.
6. Relative linearity is a measure of the error in step size between taps = RW(n+1) - [Rw(n) + Ml] = ±0.2 Ml.
7. 1 Ml = Minimum Increment = RTOT/31.
8. Typical values are for TA = +25°C and nominal supply voltage.
9. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
6
FN8179.2
December 21, 2009
X9315
DC Electrical Specifications
(Over recommended operating conditions unless otherwise specified.
LIMITS
SYMBOL
VCC
PARAMETER
TEST CONDITIONS
Supply Voltage
MIN
(Note 9)
TYP
(Note 8)
MAX
(Note 9)
UNIT
X9315
4.5
5.5
V
X9315-2.7
2.7
5.5
V
ICC1
VCC active current (Increment)
CS = VIL, U/D = VIL or VIH and INC = 0.4V
@ max. tCYC
80
µA
ICC2
VCC active current (Store) (EEPROM
Store)
CS = VIH, U/D = VIL or VIH and INC = VIH @
max. tWR
400
µA
ISB
Standby supply current
CS = VCC - 0.3V, U/D and INC = VSS or VCC
- 0.3V
5
µA
ILI
CS, INC, U/D input leakage current
VIN = VSS to VCC
-10
+10
µA
VIH
CS, INC, U/D input HIGH voltage
VCC x 0.7
VCC + 0.5
V
VIL
CS, INC, U/D input LOW voltage
-0.5
VCC x 0.1
V
CIN
CS, INC, U/D input capacitance
VCC = 5V, VIN = VSS, TA = +25°C, f = 1MHz
10
pF
Endurance and Data Retention
PARAMETER
MIN
UNIT
Minimum endurance
100,000
Data changes per bit
Data retention
100
Years
Test Circuit #1
Test Circuit #2
Circuit #3 SPICE Macro Model
VH/RH
VH/RH
Test Point
VS
Test Point
VW/RW
RTOTAL
RH
CH
VW/RW
VW
V
VL
L/RL
VL/RL
CW
CL
RL
10pF
25pF
Force
Current
10pF
RW
AC Conditions of Test
Input pulse levels
0V to 3V
Input rise and fall times
10ns
Input reference levels
1.5V
AC Electrical Specifications
(Over recommended operating conditions unless otherwise specified)
LIMITS
SYMBOL
PARAMETER
MIN
(Note 9)
TYP
(Note 8)
MAX
(Note 9)
UNIT
tCl
CS to INC setup
100
ns
tlD
INC HIGH to U/D change
100
ns
tDI
U/D to INC setup
2.9
µs
tlL
INC LOW period
1
µs
tlH
INC HIGH period
1
µs
7
FN8179.2
December 21, 2009
X9315
AC Electrical Specifications
(Over recommended operating conditions unless otherwise specified) (Continued)
LIMITS
SYMBOL
tlC
MIN
(Note 9)
PARAMETER
INC Inactive to CS inactive
TYP
(Note 8)
MAX
(Note 9)
UNIT
1
µs
tCPH
CS Deselect time (NO STORE)
100
ns
tCPH
CS Deselect time (STORE)
10
ms
tIW
tCYC
INC to Vw change
1
INC cycle time
µs
4
tR, tF
(Note 10)
INC input rise and fall time
tPU
(Note 10)
Power-up to wiper stable
tR VCC
(Note 10)
VCC power-up rate
tWR
5
µs
0.2
Store cycle
5
500
µs
5
µs
50
V/ms
10
ms
NOTE:
10. This parameter is not 100% tested.
AC Timing
CS
tCYC
tCI
tIL
(Store)
tCPH
tIC
tIH
90%
90%
10%
INC
tID
tF
DI
tR
U/D
tIW
MI
VW
(Note 9)
NOTE:
11. MI in the A.C. timing diagram refers to the minimum incremental change in the VW output due to a change in the wiper position.
8
FN8179.2
December 21, 2009
X9315
Symbol Table
WAVEFORM
INPUTS
OUTPUTS
Must be
steady
Will be
steady
May change
from Low to
High
Will change
from Low to
High
May change
from High to
Low
Will change
from High to
Low
Don’t Care:
Changes
Allowed
Changing:
State Not
Known
N/A
Center Line
is High
Impedance
Performance Characteristics (Typical)
Typical Noise
0
-10
-20
-30
Noise (dB)
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
9
0
10
20
30
40
50
60
70
80
90
100
110 120
130 140
Frequency (kHz)
150 160
170 180
190 200
FN8179.2
December 21, 2009
X9315
Typical Rtotal vs. Temperature
10000
9800
9600
9400
Rtotal
9200
9000
8800
8600
8400
8200
8000
-55
-45
-35
-25
-15
-5
5
15
25
35
45
25
35
45
55
65
Temperature
75
85
105 115 125 C°
95
Typical Total Resistance Temperature Coefficient
0
-50
-100
-150
PPM
-200
-250
-300
-350
-55
-45
-35
-25
-15
-5
5
15
12
14
55
Temperature
65
75
85
95
105
26
28
30
115
125
°C
Typical Wiper Resistance
800
700
600
Rw (Ω)
500
400
300
200
100
0
0
10
2
4
6
8
10
16
Tap
18
20
22
24
32
VCC = 2.7V
FN8179.2
December 21, 2009
X9315
Typical Absolute% Error per Tap Position
40.0%
Absolute% Error
30.0%
20.0%
10.0%
0.0%
-10.0%
-20.0%
-30.0%
-40.0%
0
3
6
9
12
15
18
21
18
21
24
27
30
Tap
Typical Relative% Error per Tap Position
20.0%
Relative% Error
15.0%
10.0%
5.0%
0.0%
-5.0%
-10.0%
-15.0%
-20.0%
0
3
6
9
12
15
24
27
30
Tap
Applications Information
Electronic digitally controlled (XDCP) potentiometers provide
three powerful application advantages; (1) the variability and
reliability of a solid-state potentiometer, (2) the flexibility of
computer-based digital controls, and (3) the retentivity of
nonvolatile memory used for the storage of multiple
potentiometer settings or data.
11
FN8179.2
December 21, 2009
X9315
Basic Configurations of Electronic Potentiometers
VR
VR
VH
VW/RW
VL
I
Three terminal potentiometer;
variable voltage divider
Two terminal variable resistor;
variable current
Basic Circuits
Buffered Reference Voltage
R1
+V
+V
Noninverting Amplifier
Cascading Techniques
+5V
+V
VS
+5V
VW
VREF
VOUT
–
-5V
X
RW/VW
R2
+V
-5V
R1
RW/VW
VOUT = VW/RW
(a)
Voltage Regulator
VIN
VO
–
OP-07
+
LM308A
+
(b)
VO = (1 + R2/R1)VS
Comparator with Hysteresis
VO (REG)
317
VS
LT311A
R1
–
+
VO
Iadj
R1
}
VO (REG) = 1.25V (1 + R2/R1) + Iadj R2
}
R2
R2
VUL = {R1/(R1 + R2)} VO(max)
VLL = {R1/(R1 + R2)} VO(min)
(for additional circuits see AN115)
12
FN8179.2
December 21, 2009
X9315
Mini Small Outline Plastic Packages (MSOP)
N
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
E1
INCHES
E
-B-
INDEX
AREA
1 2
0.20 (0.008)
A B C
TOP VIEW
4X θ
0.25
(0.010)
R1
R
GAUGE
PLANE
A
SEATING
PLANE -C-
A2
A1
b
-He
D
0.10 (0.004)
4X θ
L1
SEATING
PLANE
C
0.20 (0.008)
C
a
CL
E1
C D
MAX
MIN
MAX
NOTES
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.010
0.014
0.25
0.36
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
0.026 BSC
-B-
0.65 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
0.037 REF
N
C
0.20 (0.008)
MIN
A
L1
-A-
SIDE VIEW
SYMBOL
e
L
MILLIMETERS
0.95 REF
8
R
0.003
R1
0
α
-
8
-
0.07
0.003
-
5o
15o
0o
6o
7
-
-
0.07
-
-
5o
15o
-
0o
6o
Rev. 2 01/03
END VIEW
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. - H - Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums -A -H- .
and - B - to be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only.
13
FN8179.2
December 21, 2009
X9315
Package Outline Drawing
M8.15E
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 0, 08/09
4
4.90 ± 0.10
A
DETAIL "A"
0.22 ± 0.03
B
6.0 ± 0.20
3.90 ± 0.10
4
PIN NO.1
ID MARK
5
(0.35) x 45°
4° ± 4°
0.43 ± 0.076
1.27
0.25 M C A B
SIDE VIEW “B”
TOP VIEW
1.75 MAX
1.45 ± 0.1
0.25
GAUGE PLANE
C
SEATING PLANE
0.10 C
0.175 ± 0.075
SIDE VIEW “A
0.63 ±0.23
DETAIL "A"
(0.60)
(1.27)
NOTES:
(1.50)
(5.40)
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension does not include interlead flash or protrusions.
Interlead flash or protrusions shall not exceed 0.25mm per side.
5.
The pin #1 identifier may be either a mold or mark feature.
6.
Reference to JEDEC MS-012.
TYPICAL RECOMMENDED LAND PATTERN
14
FN8179.2
December 21, 2009
X9315
Plastic Dual-In-Line Packages (PDIP)
E
D
A2
SEATING
PLANE
L
N
A
PIN #1
INDEX
E1
c
e
b
A1
NOTE 5
1
eA
eB
2
N/2
b2
MDP0031
PLASTIC DUAL-IN-LINE PACKAGE
SYMBOL
PDIP8
PDIP14
PDIP16
PDIP18
PDIP20
TOLERANCE
A
0.210
0.210
0.210
0.210
0.210
MAX
A1
0.015
0.015
0.015
0.015
0.015
MIN
A2
0.130
0.130
0.130
0.130
0.130
±0.005
b
0.018
0.018
0.018
0.018
0.018
±0.002
b2
0.060
0.060
0.060
0.060
0.060
+0.010/-0.015
c
0.010
0.010
0.010
0.010
0.010
+0.004/-0.002
D
0.375
0.750
0.750
0.890
1.020
±0.010
E
0.310
0.310
0.310
0.310
0.310
+0.015/-0.010
E1
0.250
0.250
0.250
0.250
0.250
±0.005
e
0.100
0.100
0.100
0.100
0.100
Basic
eA
0.300
0.300
0.300
0.300
0.300
Basic
eB
0.345
0.345
0.345
0.345
0.345
±0.025
L
0.125
0.125
0.125
0.125
0.125
±0.010
N
8
14
16
18
20
Reference
NOTES
1
2
Rev. B 2/99
NOTES:
1. Plastic or metal protrusions of 0.010” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions E and eA are measured with the leads constrained perpendicular to the seating plane.
4. Dimension eB is measured with the lead tips unconstrained.
5. 8 and 16 lead packages have half end-leads as shown.
15
FN8179.2
December 21, 2009
X9315
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
N
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
H
0.25(0.010) M
B M
INCHES
E
SYMBOL
-B-
1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
α
B S
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
α
NOTES:
MILLIMETERS
8
0°
8
8°
0°
7
8°
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 1 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
16
FN8179.2
December 21, 2009