EXAR XRD8799

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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
FEBRUARY 2001
REV. 1.00
FEATURES
• 10-Bit Resolution
APPLICATIONS
• µP/DSP Interface and Control Application
• 8-Channel Mux
• High Resolution Imaging - Scanners & Copiers
• Sampling Rate - < 1kHz - 2MHz
• Wireless Digital Communications
• Low Power CMOS - 35 mW (typ)
• Multiplexed Data Acquisition
• Power Down; Lower Consumption - 0.8 mW (typ)
• Input Range between GND and VDD
BENEFITS
• Reduced Board Space (Small Package)
• No S/H Required for Analog Signals less than
100kHz
• Reduced External Parts, No Sample/Hold Needed
• No S/H Required for CCD Signals less than 2MHz
• Suitable for Battery & Power Critical Applications
• Single Power Supply (4.5 to 5.5V)
• Designer can Adapt Input Range & Scaling
• Latch-Up Free
• ESD Protection: 2000 Volts Minimum
GENERAL DESCRIPTION
The XRD8799 is a flexible, easy to use, precision 10bit analog-to-digital converter with 8-channel mux that
operates over a wide range of input and sampling
conditions. The XRD8799 can operate with pulsed
"on demand" conversion operation or continuous
"pipeline" operation for sampling rates up to 2MHz.
The elimination of the S/H requirements, very low
power, and small package size offer the designer a
low cost solution. No sample and hold is required for
CCD applications up to 2MHz, or multiplexed input
applications when the signal source bandwidth is limited to 100kHz. The input architecture of the
XRD8799 allows direct interface to any analog input
range between AGND and AVDD (0 to 1V, 1 to 4V, 0 to
5V, etc.). The user simply sets VREF(+) and VREF(-) to
encompass the desired input range.
Scaled reference resistor taps @ 1/4 R, 1/2 R and 3/4
R allow for customizing the transfer curve as well as
providing a 1/2 span reference voltage. Digital outputs are CMOS and TTL compatible.
The XRD8799 uses a two-step flash technique. The
first segment converts the 5 MSBs and consists of
autobalanced comparators, latches, an encoder, and
buffer storage registers. The second segment converts the remaining 5 LSBs.
When the power down input is "high", the data outputs DB9 to DB0 hold the current values and VREF(-) is
disconnected from VREF1(-). The power consumption
during the power down mode is 0.1mW.
ORDERING INFORMATION
PART NUMBER
PACKAGE
O PERATING TEMPERATURE R ANGE
XRD8799AIQ
PQFP
-40°C to +85°C
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • FAX (510) 668-7017 • www.exar.com
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
FIGURE 1. SIMPLIFIED B LOCK D IAGRAM AND TIMING
AVDD
Coarse
Comparators
Adder
5
AV DD
DVDD
φS
6
φB
CLK
OFW
VREF(+)
R3
Fine
Resolution
Comparators
R2
R1
VREF(-)
DB9-DB0
DB9-DB0
DFF
5
OFW
OE
Ladder
VREF1(-)
CLK
φS
CLR
WR
1 or 8
MUX
AIN8
Latch
8
N-1
N
N-1
N
10
PD
AIN1
φB
N
A2
3 to 8
Decoder
A1
A0
AGND
DGND
FIGURE 2. PIN OUT OF THE XRD8799
33
PIN CONFIGURATIONS
23
See Packaging Section for
Package Dimensions
22
34
Index
12
44
1
11
44-Pin PQFP (10mm x 10mm)
2
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
PIN DESCRIPTIONS
PIN #
NAME
DESCRIPTION
PIN #
NAME
1
DB6
2
DB7
3
Data Output Bit 6
23
R3
Reference Ladder Tap
Data Output Bit 7
24
N/C
No Connect
DGND
Digital Ground
25
AIN1
Analog Signal Input 1
4
DGND
Digital Ground
26
AIN2
Analog Signal Input 2
5
DVDD
Digital V DD
27
AIN3
Analog Signal Input 3
6
CLR
Clear (Active Low)
28
AIN4
Analog Signal Input 4
7
WR
Write (Active Low)
29
AIN5
Analog Signal Input 5
8
A2
Address 2
30
AGND
Analog Ground
9
A1
Address 1
31
AVDD
Analog VDD
10
A0
Address 0
32
AVDD
Analog VDD
11
CLK
Clock Input
12
OE
Output Enable (Active Low)
33
AIN6
Analog Signal Input 6
13
N/C
No Connect
34
AGND
14
DB8
Data Output Bit 8
35
PD
Power Down
15
DB9
Data Output Bit 9 (MSB)
36
AIN7
Analog Signal Input 7
16
OFW
Overflow Output
37
DB0
Data Output Bit 0 (LSB)
17
VREF(+)
Upper Reference Voltage
38
DB1
Data Output Bit 1
VREF(-)
39
DB2
Data Output Bit 2
18
Lower Reference Voltage
40
DB3
Data Output Bit 3
19
VREF1(-)
Lower Reference Voltage
41
DB4
Data Output Bit 4
20
R1
Reference Ladder Tap
42
DB5
Data Output Bit 5
21
R2
Reference Ladder Tap
43
N/C
No Connect
22
AIN8
Analog Signal Input 8
44
N/C
No Connect
3
DESCRIPTION
Analog Ground
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
TABLE 1: TRUTH TABLE FOR INPUT CHANNEL SELECTION
CLR
WR
A2
A1
A0
SELECTED ANALOG INPUT
L
X
X
X
X
AIN1
H
L
L
L
L
AIN1
H
L
L
L
H
AIN2
H
L
L
H
L
AIN3
H
L
L
H
H
AIN4
H
L
H
L
L
AIN5
H
L
H
L
H
AIN6
H
L
H
H
L
AIN7
H
L
H
H
H
AIN8
H
H
X
X
X
Previous
Selection
NOTE: CLR, WR, A2, A1, A0 are internally connected to ground through 500kΩ resistance.
4
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
ELECTRICAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS AVDD = DVDD = 5 V, FS = 2 MHZ (50% DUTY CYCLE), VREF(+) = 4.6, VREF(-) = AGND,
TA = 25°C, UNLESS OTHERWISE SPECIFIED
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
TEST CONDITIONS/COMMENTS
KEY FEATURES
Resolution
Sampling Rate
10
Bits
2.0
MHz
+0.3
1
LSB
1
2
LSB
FS
.001
Differential Non-Linearity
DNL
-1
Integral Non-Linearity
INL
Zero Scale Error
EZS
0
50
100
mV
Full Scale Error
EFS
0
30
60
mV
Positive Ref. Voltage5
VREF(+)
1.0
4.0
AVDD
V
Negative Ref. Voltage5
VREF(-)
AGND
1.0
AVDD -1
V
VREF
1.0
3.0
AVDD
V
RL
500
1200
2000
W
For Rated Performance
ACCURACY (A GRADE)2
Best Fit Line (Max INL - Min
INL)/2
REFERENCE VOLTAGES
Differential Ref. Voltage5
Ladder Resistance
ANALOG INPUT1
Input Bandwidth (-1dB)
1.0
4.0
MHz
1-Channel
Input Bandwidth (-1dB)
.125
0.5
MHz
8-Channel
VREF(-)
VREF(+)
V
Input Voltage Range7
VIN
Input Capacitance3
CIN
20
pF
Aperture Delay1
tAP
8
ns
D IGITAL INPUTS
Logical "1" Voltage
VIH
Logical "0" Voltage
VIL
Leakage Currents
IIN
2.0
V
0.8
V
VIN = DGND to DVDD
CLK
-1
1
µA
CLR, WR, A2, A1, A0, PD, OE
-5
30
µA
Input Capacitance
5
5
pF
These input pins have 500kΩ
internal resistors to GND
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
ELECTRICAL CHARACTERISTICS AVDD = DVDD = 5 V, FS = 2 MHZ (50% DUTY CYCLE), VREF(+) = 4.6, VREF(-) = AGND,
TA = 25°C, UNLESS OTHERWISE SPECIFIED
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
TEST CONDITIONS/COMMENTS
Clock Timing
Clock Period
Rise & Fall Time4
TS
500
tR, t F
1,000,000
ns
10
ns
"High" Time
tB
125
250
500,000
ns
"Low" Time
tS
125
250
500,000
ns
DIGITAL OUTPUTS
COUT=15 PF
DVDD-0.5
V
ILOAD = 4 mA
0.4
V
ILOAD = 4 mA
1
µA
VOUT = 0 to DVDD
Logical "1" Voltage
VOH
Logical "0" Voltage
VOL
Tristate Leakage
IOZ
Data Hold Time1
tHLD
12
Data Valid Delay1
tDL
30
Write Pulse Width1
tWR
40
ns
Multiplexer Address Setup
tAS
80
ns
tAH
0
ns
-1
ns
35
ns
Time1
Multiplexer Address Hold Time1
Delay from WR to Multiplexer1
Enable
tMUXEN1
80
ns
Clock to PD Setup Time
tCLKS1
400
ns
Clock to UR Setup Time
tCLKS2
Clock to PD Hold Time
tCLKH1
0
ns
600
6
ns
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
ELECTRICAL CHARACTERISTICS AVDD = DVDD = 5 V, FS = 2 MHZ (50% DUTY CYCLE), VREF(+) = 4.6, VREF(-) = AGND,
TA = 25°C, UNLESS OTHERWISE SPECIFIED
PARAMETER
SYMBOL
Clock to WR Hold Time
tCLKH2
MIN
TYP
MAX
0
UNITS
ns
Power Down Time1
tPD
300
ns
Power Up Time1
tPU
200
ns
Data Enable Delay
tDEN
14
16
ns
Data High Z Delay
tDHZ
4
6
ns
Pipeline Delay (Latency)
TEST CONDITIONS/COMMENTS
1.5
cycles
POWER S UPPLIES 8
Power Down (IDD)
IPD-DD
Operating Voltage (AVDD, DVDD)
VDD
Current (AVDD + DVDD)
IDD
4.5
0.01
0.10
mA
5.0
5.5
V
7
10
mA
PD=High, CLK High or Low
PD=Low (Normal Mode)
NOTES:
1 Guaranteed. Not tested.
2 Tester measures code transition voltages by dithering the voltage of the analog input (VIN). The difference between
the measured code width and the ideal value (VREF/1024) is the DNL error. The INL error is the maximum distance
(in LSBs) from the best fit line to any transition voltage.
3 See VIN input equivalent circuit.
4 Clock specification to meet aperture specification (tAP). Actual rise/fall time can be less stringent with no loss of
accuracy.
5 Specified values guarantee functional device. Refer to other parameters for accuracy.
6 System can clock the XRD8799 with any duty cycle as long as all timing conditions are met.
7 Input range where input is converted correctly into binary code. Input voltage outside specified range converts to
zero or full scale output.
8 DVDD and AVDD are connected through the silicon substrate. Connect together at the package.
SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
7
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
ABSOLUTE MAXIMUM RATINGS: (TA = +25°C UNLESS OTHERWISE NOTED)1, 2, 3
VDD (to GND)
+7 V
VREF(+), VREF(-), VREF(-)
GND -0.5 to VDD +0.5 V
All AINs
GND -0.5 to VDD +0.5 V
All Inputs
GND -0.5 to VDD +0.5 V
All Outputs
GND -0.5 to VDD +0.5 V
Storage Temperature
-65 to +150 °C
Lead Temperature (Soldering 10 seconds)
+300 °C
Package Power Dissipation Rating to 75°C
PQFP
450mW
Derates above 75°C
14mW/ °C
NOTE:
1 Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This
is a stress rating only and functional operation at or above this specification is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode
clamps(HP5082-2835) from input pin to the supplies. All inputs have protection diodes which will protect the device
from short transients outside the supplies of less than 100mA for less than 100µs.
3 VDD refers to AVDD and DVDD. GND refers to AGND and DGND.
8
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
disconnects the latches from the comparators. This
delay is called aperture delay (tAP).
FIGURE 3. XRD8799 T IMING DIAGRAM
The coarse comparators make the first pass conversion and selects a ladder range for the fine comparators. The fine comparators are connected to the selected range during the next φB phase.
tAP
tS
tR
tB
tF
FIGURE 4. XRD8799 COMPARATORS
VIH
CLOCK
VIL
Sample
N-1
Auto
Balance
Sample
N
Auto
Balance
Sample
N+1
φS
TS
Analog
Input
φB
φS
VIN
Latch
VTAP
VOH
Data
Ref
Ladder
N-1
VOL
φB
φS
tDL
tHLD
COARSE COMPARATOR
φS
φB
VIN
Latch
VTAP
THEORY OF OPERATION
Selected
Range
1.0 ANALOG-TO-DIGITAL CONVERSION
The XRD8799 converts analog voltages into 1024
digital codes by encoding the outputs of coarse and
fine comparators. Digital logic is used to generate the
overflow bit. The conversion is synchronous with the
clock and it is accomplished in 2 clock periods.
φB
FINE COMPARATOR
AIN Sampling, Ladder Sampling, and Conversion
Timing
Figure 3 shows this relationship as a timing chart. AIN
sampling, ladder sampling and output data relationships are shown for the general case where the levels
which drive the ladder need to change for each sampled AIN time point. The ladder is referenced for both
last AIN sample and next AIN sample at the same
time. If the ladder's levels change by more than 1
LSB, one of the samples must be discarded. Also
note that the clock low period for the discarded AIN
can be reduced to the minimum t S time.
The reference resistance ladder is a series of resistors. The fine comparators use a patented interpolation circuit to generate the equivalent of 1024 evenly
spaced reference voltages between VREF(-) and
VREF(+).
The clock signal generates the two internal phases,
φB (CLK high) and φS (CLK low = sample) (See Figure 1). The rising edge of the CLK input marks the
end of the sampling phase (φS). Internal delay of the
clock circuitry will delay the actual instant when φS
9
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
FIGURE 5. XRD8799 C OMPARATORS
Hold Reference Value Past
Clock Change for tAP Time
Short Cycle Sample will be discarded
tS
External
Settle by Clock Update Time
Reference Stable Time - For Sample A
Update
References
Reference Stable Time - For Sample A
Clock
AINX1
Sample A IN1
Internal
AIN Sample
Window
ΦB
ΦS
A INX0
Ladder Sample
Window (MSB Bank)
Ladder Compare
(LSB Bank)
IN2
IN1
ΦB
Not Used
Sample A IN1
Sample A IN2
ΦS
ΦB
ΦS
AINX1
Sample A IN2
Sample Ladder
for A IN1
Sample Ladder
for A INX1
Sample Ladder
for AIN2
Sample Ladder
for A INX2
Compare Ladder
V/S A INX0
Compare Ladder
V/S A IN1
Compare Ladder
V/S A INX1
Compare Ladder
V/S A IN2
External
DATA
DATA A IN0
DATA A INX0
DATA A IN1
Not Used
1.1 A CCURACY OF CONVERSION: DNL AND INL
The transfer function for an ideal A/D converter is
shown in Figure 6.
DATA A INX1
Not Used
The overflow transition (VOFW) takes place at:
VIN = VOFW = VREF(+)
The first and the last transitions for the data bits take
place at:
FIGURE 6. IDEAL A/D TRANSFER FUNCTION
VIN = V001 = VREF(-) + 1.0 * LSB
VIN = V3FF = VREF(-) - 1.0 * LSB
VREF = VREF(+) - VREF(-)
DIGITAL
CODES
LSB = VREF / 1024 = (V3FF - V001) / 1022
N OTE: The overflow transition is a flag and has no impact
on the data bits.
OFW=0
1 LSB
In a "real" converter the code-to-code transitions don't
fall exactly every VREF/1024 volts.
OFW=1
3FF
3FE
002
A positive DNL (Differential Non-Linearity) error
means that the real width of a particular code is larger
than 1 LSB. This error is measured in fractions of
LSBs.
3FD
001
000
LSB
V
VREF(-)
V001
V002
V3FE
V3FF
V0FW = VREF(+)
A Max DNL specification guarantees that ALL code
widths (DNL errors) are within the stated value. A
specification of Max DNL = + 0.5 LSB means that all
code widths are within 0.5 and 1.5 LSB. If VREF =
4.608 V then 1 LSB = 4.5 mV and every code width is
within 2.25 and 6.75 mV.
10
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
FIGURE 7. DNL MEASUREMENT ON PRODUCTION
TESTER
DNL
Figure 8 shows the zero scale and full scale error
terms.
Figure 9 gives a visual definition of the INL error. The
chart shows a 3-bit converter transfer curve with
greatly exaggerated DNL errors to show the deviation
of the real transfer curve from the ideal one.
LSB
V(N+1)
After a tester has measured all the transition voltages, the computer draws a line parallel to the ideal
transfer line. By definition the best fit line makes
equal the positive and the negative INL errors. For example, an INL error of -1 to +2 LSB's relative to the
Ideal Line would be +1.5 LSB's relative to the best fit
line.
Analog
Input
V(N)
N+1
Output
Codes
N
N-1
(N) Code Width = V(N+1) - V(N)
LSB = [ VREF(+) - VREF(-) ] / 1024
FIGURE 9. INL ERROR CALCULATION
DNL(N) = [ V(N+1) - V(N) ] - LSB
Output
Codes
The formulas for Differential Non-Linearity (DNL), Integral Non-Linearity (INL) and zero and full scale errors (EZS, EFS) are:
Best Fit Line
7
Real Transfer Line
6
DNL (001) = V002 - V001 - LSB
:::
5
EFS
DNL (3FE) = V3FF - V3FE - LSB
INL
4
EFS (full scale error) = V3FF - [VREF(+) -1.5 * LSB]
EZS (zero scale error) = V001 - [VREF(-) + 0.5 * LSB]
3
Ideal Transfer Line
2
FIGURE 8. REAL A/D TRANSFER CURVE
1
EZS
DIGITAL
CODES
0.5 ∗ LSB
1.2 CLOCK AND CONVERSION TIMING
A system will clock the XRD8799 continuously or it
will give clock pulses intermittently when a conversion
is desired. The timing of Figure 10a shows normal
operation, while the timing of Figure 10b keeps the
XRD8799 in balance and ready to sample the analog
input.
EFS
3FF
3FE
002
001
000
V
V001
Analog Input (Volt)
1.5 ∗ LSB
EZS
VREF(-)
LSB
V002
V3FE
V3FF
VREF(+)
11
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
FIGURE 10. R ELATIONSHIP OF DATA TO CLOCK
CLOCK
N
1.3 ANALOG INPUT
The XRD8799 has very flexible input range characteristics. The user may set VREF(+) and VREF(-) to two
fixed voltages and then vary the input DC and AC levels to match the VREF range. Another method is to
first design the analog input circuitry and then adjust
the reference voltages for the analog input range.
N+1
DATA
N
N+1
a. Continuous sampling
CLOCK
N
One advantage is that this approach may eliminate
the need for external gain and offset adjust circuitry
which may be required by fixed input range A/Ds.
BALANCE
The XRD8799's performance is optimized by using
analog input circuitry that is capable of driving the A IN
input. Figure 11 shows the equivalent circuit for AIN.
N
DATA
b. Single sampling
FIGURE 11. A NALOG INPUT EQUIVALENT CIRCUIT
80 Ω
10 pF
AVDD
φS
R MUX
200 Ω
R Series
200 Ω
160 Ω
4
AIN
1 pF
10 pF
φS
10 pF
φB
+
8
50 Ω
1/2 [ VREF(+)
1 pF
Channel
Selection
Control
+ VREF(-) ]
FIGURE 13. ANALOG MUX TIMING
1.4 A NALOG INPUT MULTIPLEXER
The XRD8799 includes a 8-Channel analog input
multiplexer. The relationship between the clock, the
multiplexer address, the WR and the output data is
shown in Figure 12.
tAS
tAH
A2, A1, A0
FIGURE 12. MUX ADDRESS TIMING
WR
tWR
tMUXEN1
MUXEN
(Internal Signal)
Clock
Sample N
Old Address
tCLKS2
Sample M
New Address
tWR
Sample
M+1
tCLKH2
1.5 REFERENCE VOLTAGES
The input/output relationship is a function of VREF:
WR
tAS
tAH
AIN = VIN - VREF(-)
VREF = VREF(+) - VREF(-)
Address
DB0-DB9
DATA = 1024 * (AIN/VREF)
N-2 Valid
N-1 Valid
Old Address
N Valid
Old Address
A system can increase total gain by reducing VREF.
M Valid
New Address
Note: tCLKS2 = tCLKH2 = 0
12
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
FIGURE 14. XRD8799 F UNCTIONAL EQUIVALENT CIRTIMING
1.6 D IGITAL INTERFACES
The logic encodes the outputs of the comparators into a binary code and latches the data in a D-type flipflop for output.
CUIT AND INTERFACE
The functional equivalent of the XRD8799 (Figure 14)
is composed of:
φS
D
A/D
VIN
1. Delay stage (tAP) from the clock to the sampling
phase (fS).
Q
D
tAP
2. An ideal analog switch which samples VIN.
CLK
XRD8799
3. An ideal A/D which tracks and converts VIN with
no delay.
4. A series of two DFF's with specified hold (tHLD)
and delay (tDL) times.
N
CLK
N+1
tHLD
VIN
tAP, tHLD and tDL are specified in the Electrical Characteristics table.
tDL
DB9-DB0
N-1
1.7 POWER DOWN
Figure 15 shows the relationship between the clock,
sampled VIN to output data relationship and the effect
of power down.
FIGURE 15. POWER DOWN TIMING DIAGRAM
CLK
SAMPLE
N
SAMPLE
M
SAMPLE
M+1
VIN
DB0-DB9
N-2 Valid
N-1 Valid
N Valid
M Valid
tCLKH1
tCLKS1
PD
DB9-DB0
Q
tPD
tPU
IDD, IVREF(+)
13
N
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
2.0 APPLICATION NOTES
FIGURE 16. TYPICAL CIRCUIT CONNECTIONS
+5 V
C1 = 4.7 or 10µF Tantalum
C2 = 0.1µ F Chip Cap or low inductance cap
RT = Clock Transmission Line Termination
C1A, C2A
AVDD
1 of 8
C1D, C2D
DVDD
Z < 100Ω
OFW
AIN1 (Substrate)
AIN
Buffer
DB9 - DB0
AIN8
Resistive
Isolation of
50 to 100Ω
OE
XRD8799
WR
CLK
VREF(+)
+
Reference
Voltage
Source
C1
C2
C1
CLK
3/4 R
C2
RT
1/4 R
C1
C2
-
VREF(-)
A2
A1
VREF1(-)
AGND
DGND
A0
ground plane should act as a shield for parasitics
and not a return path for signals. To reduce noise
levels, use separate low impedance ground
paths. DGND should not be shared with other
digital circuitry. If separate low impedance paths
cannot be provided, DGND should be connected
to AGND next to the XRD8799.
7. DVDD should not be shared with other digital circuitry to avoid conversion errors caused by digital
supply transients. DVDD for the XRD8799 should
be connected to AVDD next to the XRD8799.
The following information will be useful in maximizing
the performance of the XRD8799.
1. All signals should not exceed AVDD +0.5 V or
AGND -0.5 V or DVDD +0.5 V or DGND -0.5 V.
2. Any input pin which can see a value outside the
absolute maximum ratings (AVDD or DVDD+0.5 V
or AGND -0.5 V) should be protected by diode
clamps (HP5082-2835) from input pin to the supplies. All XRD8799 inputs have input protection
diodes which will protect the device from short
transients outside the supply ranges.
3. The design of a PC board will affect the accuracy
of XRD8799. Use of wire wrap is not recommended.
4. The analog input signal (VIN) is quite sensitive
and should be properly routed and terminated. It
should be shielded from the clock and digital outputs so as to minimize cross coupling and noise
pickup.
5. The analog input should be driven by a low
impedance (less than 50 Ω).
8. DVDD and AVDD are connected inside the
XRD8799. DGND and AGND are connected
internally.
9. Each power supply and reference voltage pin
should be decoupled with a ceramic (0.1µF) and
a tantalum (10µF) capacitor as close to the
device as possible.
10. The digital output should not drive long wires.
The capacitive coupling and reflection will contribute noise to the conversion. When driving distant loads, buffers should be used. 100Ω resistors in series with the digital outputs in some
applications reduces the digital output disruption
of AIN.
6. Analog and digital ground planes should be substantial and common at one point only. The
14
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
FIGURE 17. EXAMPLE OF A REFERENCE VOLTAGE SOURCE
+5V
5k
0.1µ F
+
MP5010
100k
+
-
-
FIGURE 18.
±5V ANALOG INPUT
+5V
1 of 8
+5V
R
+5V
R
VREF(+)
AVDD
+
VIN
DB0
AIN1
-
AIN8
VREF(-)
AGND
For R = 5k use Beckman Instruments #694-3-R10k resistor array or equivalent.
NOTE: High R values affect the input BW of ADC due to the (R * CIN of ADC) time constant. Therefore, for different applications the R value needs to be selected as a trade-off between AIN settling time and power dissipation.
15
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
FIGURE 19.
±10V ANALOG INPUT
+5V
1 of 8
+10V
2R
+5V
R
VREF(+)
AVDD
+
VIN
DB0
AIN1
2R
AIN8
VREF(-)
AGND
For R = 5k use Beckman Instruments #694-3-R10k resistor array or equivalent.
NOTE: High R values affect the input BW of ADC due to the (R * CIN of ADC) time constant. Therefore, for different applications the R value needs to be selected as a trade-off between AIN settling time and power dissipation.
FIGURE 20. A/D LADDER AND AIN WITH PROGRAMMED C ONTROL (OF VREF(+), VREF(-), 1/4 AND 3/4 TAP.)
XRD8799
MP7641
-
VIN
+
DAC0
AIN1
-
VIN
+
DAC7
AIN8
MP7226
DAC4
VREF(+)
DAC3
3/4
DAC2
1/4
VREF(+)
DAC1
VREF1(-)
@ Power Down write values to DAC 3, 2, 1 = DAC 4 to minimize power consumption.
Only AIN and Ladder detail shown.
16
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
FIGURE 21. DNL VS. SAMPLING FREQUENCY
2.0
V DD = 5V
1.5
V REF(+) = 4.6V
DNL(LSB)
1.0
V REF(-) = 0V
POS. DNL
0.5
0.0
-0.5
NEG. DNL
-1.0
-1.5
-2.0
0.1
1.0
10.0
FS(MHz)
FIGURE 22. INL VS. SAMPLING FREQUENCY
4
3
INL(LSB)
2
V DD = 5V
V REF(+) = 4.6V
V REF(-) = 0V
POS. INL
1
0
-1
NEG. INL
-2
-3
-4
0.10
1.00
FS(MHz)
17
10.00
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
FIGURE 23. SUPPLY CURRENT VS. SAMPLING FREQUENCY
9.5
9.0
8.5
IDD (mA)
8.0
VDD = 5V
VREF(+) = 4.6V
VREF(-) = 0V
7.5
7.0
6.5
6.0
5.5
5.0
0.0
2.0
4.0
6.0
8.0
10.0
Fs(MHZ)
INL(LSB)
FIGURE 24. B EST FIT INL VS. REFERENCE VOLTAGE
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
VDD = 5V
Fs = 2MHz
0.5
1.0
1.5
2.0
2.5
3.0
V REF(V)
18
3.5
4.0
4.5
5.0
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
FIGURE 25. DNL VS. REFERENCE VOLTAGE
1.0
VDD = 5V
0.8
Fs = 2MHz
0.6
DNL(LSB)
0.4
POS. DNL
0.2
0.0
-0.2
NEG. DNL
-0.4
-0.6
-0.8
-1.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
V REF(V)
FIGURE 26. SUPPLY CURRENT VS. TEMPERATURE
10
V DD = 5V
V REF(+) = 4.6V
8
V REF(-) = 0V
F S = 2MHz
I DD (mA)
6
4
2
0
-60
-40
-20
0
20
Temperature(C)
19
40
60
80
100
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
FIGURE 27. DNL VS. TEMPERATURE
1.0
V DD = 5V
DNL(LSB)
0.8
V REF(+) = 4.6V
0.6
V REF(-) = 0V
0.4
FS = 2MHz
POS. DNL
0.2
0.0
-0.2
NEG. DNL
-0.4
-0.6
-0.8
-1.0
-60
-40
-20
0
20
40
60
80
100
Temperature(C)
FIGURE 28. R EFERENCE RESISTANCE VS.TEMPERATURE
2.00
V DD = 5V
1.75
V REF(+) = 4.6V
Ref. Resistance(Kohm)
V REF(-) = 0V
1.50
FS = 2MHz
1.25
1.00
0.75
0.50
0.25
0.00
-60
-40
-20
0
20
Temperature(C)
20
40
60
80
100
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
FIGURE 29. INL @ 2MSPS
4.0
V DD = 5V
V REF (+) = 4.6V
3.0
V REF(-) = 0V
2.0
LSB
1.0
0.0
-1.0
-2.0
-3.0
-4.0
0
128
256
384
512
Code
21
640
768
896
1024
xr
XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
44 LEAD PLASTIC QUAD FLAT PACK
(10 mm x 10 mm QFP, 1.60 mm Form)
REV. 2.00
D
D1
33
23
22
34
D1
D
12
44
1
11
B
e
A2
C
A
α
Seating Plane
A1
L
Note: The control dimension is the millimeter column
INCHES
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
A
0.072
0.093
1.82
2.45
A1
0.001
0.010
0.02
0.25
A2
0.071
0.087
1.80
2.20
B
0.011
0.018
0.29
0.45
C
0.004
0.009
0.11
0.23
D
0.510
0.530
12.95
13.45
D1
0.390
0.398
9.90
10.10
e
0.0315 BSC
0.80 BSC
L
0.029
0.040
0.73
1.03
α
0°
7°
0°
7°
22
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XRD8799
LOW POWER, 2 MSPS, 10-BIT, A/D CONVERTER WITH 8-CHANNEL MUX
REV. 1.00
NOTICE
EXAR Corporation reserves the right to make changes to the products contained in this publication in order to
improve design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that
the circuits are free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a user’s specific application. While the information in this publication has
been carefully checked; no responsibility, however, is assumed for in accuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the
failure or malfunction of the product can reasonably be expected to cause failure of the life support system or
to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless
EXAR Corporation receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has
been minimized; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately
protected under the circumstances.
Copyright 2001 EXAR Corporation
Datasheet February 2001
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
23