LUGUANG ZTTCR4.19MG

http://www.luguang.cn
Email: [email protected]
1. SCOPE
This specification shall cover the characteristics of the ceramic
resonator with the type ZTTCR4.19MG.
2. PART NO.:
PART NUMBER
CUSTOMER PART NO SPECIFICATION NO
ZTTCR4.19MG
3. OUTLINE DRAWING AND DIMENSIONS:
Appearance: No visible damage and dirt.
Dimensions:
4.19
UINT:mm
NOTES:
1.All dimensions are in millimeters.
2.*: EIAJ Monthly Code.
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
1
http://www.luguang.cn
Email: [email protected]
3.4 STRUCTURE
3
1
4
2
NO:
5
Components
Materials
Top and Bottom Electrodes
1
Outer Electrodes
Ag+Ni(under plating)+Sn(over plating)
Side Electrodes
Ni+Cu+Ag(under plating)+Sn(over plating)
2
Ceramic Box
Insulation Box
3
Cover
Dielectric Material
4
Inner Electrodes
Ag
5
Glue
Epoxy Resin
6
Conductive Adhesive
Ag+Epoxy Resin
7
Ceramic Element
Piezoelectric Ceramics (PZT)
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
2
http://www.luguang.cn
Email: [email protected]
4 RATING AND ELECTRICAL SPECIFICATIONS:
4.1 RATING
Content
Items
Withstanding Voltage (V)
Insulation Resistance Ri,(MΩ)min.
Operating Temperature Range (℃)
Storage Temperature Range (℃)
50 (DC,1min)
500(100V,1min)
-25~+85
-55~+85
4.2 ELECTRICAL SPECIFICATIONS
Oscillation Frequency Fosc(MHz)
Frequency Accuracy (%)
Resonant Impedance Ro(Ω)max.
4.19
±0.5
40
Temperature Coefficient of Oscillation
±0.3
(Oscillation Frequency
drift,-25℃~+85℃)
Frequency (%) max.
Loop Gain (dB) min
Rating Voltage UR(V)max.
Aging Rate (%)max.
10.0
6V DC
15V p-p
±0.2 (For Ten Years)
5 MEASUREMENT:
5.1 Measurement Conditions: Parts shall be measured under a condition
( Temp. : 20±15 ℃ ,Humidity : 65±20% R.H.) unless the standard
condition(Temp. : 25±3 ℃ ,Humidity : 65±5% R.H.) is regulated to
measure.
5.2 Test Circuit:
IC: 1/6TC4069UBP×2
X: Ceramic Resonator
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
3
http://www.luguang.cn
Email: [email protected]
6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
No
Item
Performance
Requirements
Condition of Test
Humidity
Keep the resonator at 40 ℃ ±2 ℃ and
It shall fulfill
90-95% RH for 96h±4h. Then release the
The specifications
resonator into the room condition for 1h
In Table 1.
prior to the measurement.
6.2
Vibration
Subject the resonator to vibration for 2h
each in x、y and z axis with the amplitude It shall fulfill
of 1.5mm, the frequency shall be varied
The specifications
uniformly between the limits of
In Table 1.
10Hz—55Hz.
6.3
Mechanical
Shock
Drop the resonator randomly onto a
wooden floor from the height of 100cm 3
times.
6.1
6.4
Soldering
Test
It shall fulfill
The specifications
In Table 1.
Passed through the re-flow oven under the
following condition and left at room
temperature for 1h before measurement.
It shall fulfill
Temperature at the
The specifications
Time
surface of the substrate
In Table 1.
Preheat
150℃±5℃
60s±10s
Peak
240℃±5℃
10s±3s
6.5
Solder
Ability
Dipped in 230℃±5℃ solder bath for
3s±0.5s with rosin flux 25wt% ethanol
solution.
The terminals shall be
at least 95% covered
by solder.
6.6
High
Temperature
Exposure
Subject the resonator to 85℃±5℃ for
96h±4h. Then release the resonator into
the room conditions for 1h prior to the
measurement.
It shall fulfill
The specifications
In Table 1.
6.7
Low
Temperature
Exposure
Subject the resonator to –25℃±5℃ for
96h±4h. Then release the resonator into
the room conditions for 1h prior to the
measurement.
It shall fulfill
The specifications
In Table 1.
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
4
http://www.luguang.cn
Email: [email protected]
7. PHYSICAL AND ENVIRONMENAL CHARACTERISICS
(Continued from the preceding page)
No
6.8
Item
Performance
Requirements
Condition of Test
Temperature
Cycling
Subject the resonator to -40℃ for
30 min. followed by a high temperature of
It shall fulfill
85℃ for 30 min. cycling shall be
The specifications
repeated 5 times with a transfer time of
In Table 1.
15s. At the room temperature for 1h prior
to the measurement.
Mount a glass-epoxy board
(Width=40mm,thickness=1.6mm), then
bend it to 1mm displacement and keep It
for 5s. (See the following Figure)
PRESS
6.9
Board
Bending
PRESS HEAD
Mechanical damage
such as breaks shall
not occur.
D
SUPPORT BAR
TABLE 1
Item
Specification
Oscillation Frequency Change
△Fosc/Fosc (%) max
±0.3
Resonant Impedance (Ω) max
40
7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING
STANDARD CONDITIONS
7.1 Recommended land pattern
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
5
http://www.luguang.cn
Email: [email protected]
:Land Pattern
7.2 Recommended reflow soldering standard conditions
Temperature(℃)
within 10 sec
℃
Pre-heating
within
80-120sec.
within
20-40sec
8 PACKAGE
To protect the products in storage and transportation ,it is
necessary to pack them(outer and inner package).On paper pack, the
following requirements are requested.
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
6
http://www.luguang.cn
8.1 Dimensions and Mark
Email: [email protected]
At the end of package, the warning (moisture proof, upward put)
should be stick to it.
Dimensions and Mark (see below)
NO.
Name
Quantity
1
Package
1
2
Certificate of approval
1
3
Label
1
4
Tying
2
5
Adhesive tape
1.2m
6
Belt
2.9m
7
Inner Box
12
Notes
8.2 Section of package
Package is made of corrugated paper with thickness of
0.8cm.Package has 12 inner boxes, each box has 5 reels (each reel for
plastic bag).
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
7
http://www.luguang.cn
8.3 Quantity of package
Email: [email protected]
Per plastic reel
3000 pieces of piezoelectric ceramic part
Per inner box
5 reels
Per package
12 inner boxes(180000 pieces of
piezoelectric
ceramic part )
8.4 Inner Packing Dimensions
1.UNIT: mm
1
Label
2
QC Label
3
Inner Box
Pars shall be packaged in box with hold down tape upside. Part
No., quantity and lot No.
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
8
http://www.luguang.cn
Email: [email protected]
8.5 Reel
φ
max
8.6 Packing Method Sketch Map
Blank Pocket
20 Pitches
Loaded Pocket Blank Pocket
20 Pitches
Leader
200mm Max
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
9
http://www.luguang.cn
8.7 Test Condition Of Peeling Strength
T op T ape
Email: [email protected]
S tre n g
P e e lin g
th 2 0 - 7 0 g
10° Max
C a rrie r T a p e
9 EIAJ Monthly Code
2003 / 2005 / 2007 / 2009
MONTH
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
NOV
DEC
CODE
A
B
C
D
E
F
G
H
J
K
L
M
2004 / 2006 / 2008 / 2010
MONTH
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
NOV
DEC
CODE
N
P
Q
R
S
T
U
V
W
X
Y
Z
10 OTHER
10.1 Caution of use
10.1.1 Do not use this product with bend. Please don’t apply excess
mechanical stress to the component and terminals at soldering.
10.1.2 The component may be damaged when an excess stress will be
applied.
10.1.3 This specification mentions the quality of the component as a
single unit. Please insure the component is thoroughly evaluated in your
application circuit.
10.2 Notice
10.2.1 Please return one of this specification after your signature of
acceptance.
10.2.2 When something gets doubtful with this specifications, we shall
jointly work to get an agreement.
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
1
0