A Product Line of Diodes Incorporated ZXTP26020DMF 2 0 V LOW V C E ( S A T ) PN P SURFACE MOUNTED TR ANSISTOR Features Mechanical Data • • • • • • • • • • • • Epitaxial Planar Die Construction Complementary NPN Type Available (ZXTN26020DMF) Low Collector-Emitter Saturation Voltage, VCE(SAT) High Current Gain (hFE) at High IC Surface Mount Package Suited for Automated Assembly Ultra-Small Surface Mount Package Qualified to AEC-Q101 Standards for High Reliability Lead, Halogen and Antimony Free, RoHS Compliant (Note 1) “Green” Device (Note 2) ESD rating: 400V-MM, 8KV-HBM Case: DFN1411-3 Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish – NiPdAu over Copper lead frame. Solderable per MIL-STD-202, Method 208 Weight: 0.003 grams (approximate) • • • Applications • • • • MOSFET and IGBT gate driving DC-DC conversion Interface between low voltage IC and Load Load disconnect switch E C B Top view Bottom view Device Symbol Pin-Out Top view Ordering Information Product ZXTP26020DMFTA Notes: Reel size (inches) 7 Tape width (mm) 8 Quantity per reel 3000 1. No purposefully added lead. Halogen and Antimony Free. 2. Diodes Inc’s “Green” Policy can be found on our website at http://www.diodes.com YM Marking Information Z2 Date Code Key Year Code Month Code 2009 W Jan 1 2010 X Feb 2 ZXTP26020DMF Document number: DS32101 Rev. 1 - 2 Mar 3 Z2= Product Type Marking Code YM = Date Code Marking Y = Year (ex: W = 2009) M = Month (ex: 9 = September) 2011 Y Apr 4 2012 Z May 5 Jun 6 1 of 6 www.diodes.com 2013 A Jul 7 2014 B Aug 8 Sep 9 2015 C Oct O 2016 D Nov N Dec D May 2010 © Diodes Incorporated A Product Line of Diodes Incorporated ZXTP26020DMF Maximum Ratings Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Pulse Current Base Current(DC) Peak Base Current Symbol VCBO VCEO VEBO IC ICM IB IBM Value -20 -20 -7 -1.25 -4 -0.3 -0.6 Unit V V V A A A A Symbol PD PD RθJA RθJA TJ, TSTG Value 1 380 125 330 -55 to +150 Unit W mW °C/W °C/W °C Thermal Characteristics Characteristic Power Dissipation (Note 3) Power Dissipation (Note 4) Thermal Resistance, Junction to Ambient (Note 3) @ TA = 25°C Thermal Resistance, Junction to Ambient (Note 4) @ TA = 25°C Operating and Storage Temperature Range Notes: 3. Device mounted on FR-4 PCB with 1inch square pads. 4. Device mounted on FR-4 PCB with minimum recommended pad layout ZXTP26020DMF Document number: DS32101 Rev. 1 - 2 2 of 6 www.diodes.com May 2010 © Diodes Incorporated A Product Line of Diodes Incorporated ZXTP26020DMF Electrical Characteristics (at TA = 25°C unless otherwise specified) Characteristic Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage (Note 5) Emitter-Base Breakdown Voltage Symbol V(BR)CBO V(BR)CEO V(BR)EBO Min -20 -20 -7 Typ ⎯ ⎯ ⎯ Collector Cutoff Current Icbo ⎯ ⎯ Emitter Cutoff Current Base Cutoff Current Ices Iebo ⎯ ⎯ DC Current Gain (Note 5) hFE 300 235 175 140 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Collector-Emitter Saturation Voltage (Note 5) VCE(SAT) ⎯ ⎯ ⎯ ⎯ Equivalent On-Resistance Base-Emitter Turn-On Voltage Base-Emitter Saturation Voltage Output Capacitance (Note 5) RCE(SAT) VBE(ON) VBE(SAT) Cobo Current Gain-Bandwidth Product Turn-On Time Delay Time Rise Time Turn-Off Time Storage Time Fall Time Notes: Max ⎯ ⎯ ⎯ -100 -0.5 -100 -50 Unit V V V nA μA nA nA ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ -80 -100 -155 -235 mV mV mV mV IC = -100mA, IB = -1mA IC = -500mA, IB = -50mA IC = -1A, IB = -50mA IC = -1.25A, IB = -62.5mA ⎯ ⎯ ⎯ ⎯ 125 ⎯ ⎯ ⎯ ⎯ -1.1 20 mΩ V V pF fT 200 ⎯ ⎯ MHz IC = -1A, IB = -50mA VCE = -5V, IC = -1A IC = -1A, IB = -50mA VCB = -10V, f = 1.0MHz VCE = -10V, IC = -50mA, f = 100MHz ton td tr toff ts tf ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 60 20 40 167 140 27 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ns ns ns ns ns ns -1.15 Test Condition IC = -100μA, IE = 0A IC = -10mA, IB = 0A IE = -100μA, IC = 0A VCB = -20V, IE = 0A VCB = -20V, IE = 0A,TA = 125°C VCE = -20V, VBE = 0V VBE = -6V, IC = 0A VCE = -2V, IC = -100mA VCE = -2V, IC = -0.5A VCE = -2V, IC = -1A VCE = -2V, IC = -1.5A VCC = -10V, IC = -1A IB2 = -IB1 = -50mA 5. Short duration pulse test used to minimize self-heating effect. ZXTP26020DMF Document number: DS32101 Rev. 1 - 2 3 of 6 www.diodes.com May 2010 © Diodes Incorporated A Product Line of Diodes Incorporated ZXTP26020DMF 1,000 1 TA = 150°C hFE, DC CURRENT GAIN 800 -VCE(SAT), COLLECTOR-EMITTER SATURATION VOLTAGE (V) IC/IB = 10 VCE = -2V TA = 85°C 600 T A = 25°C 400 TA = -55°C 200 0 1.0 0.8 TA = -55°C 0.6 T A = 25°C 0.4 T A = 85°C TA = 150°C 0.2 0 1 10 100 1,000 10,000 -IC, COLLECTOR CURRENT (mA) Fig. 3 Typical Base-Emitter Turn-On Voltage vs. Collector Current T A = 85°C T A = 25°C T A = -55°C 0.01 1 10 100 1,000 10,000 -IC, COLLECTOR CURRENT (mA) Fig. 2 Typical Collector-Emitter Saturation Voltage vs. Collector Current -VBE(SAT), BASE-EMITTER SATURATION VOLTAGE (V) -VBE(ON), BASE-EMITTER TURN-ON VOLTAGE (V) VCE = -5V TA = 150°C 0.001 0.1 1,000 10,000 10 100 -IC, COLLECTOR CURRENT (mA) Fig. 1 Typical DC Current Gain vs. Collector Current 1 1.2 0.1 1.2 IC/IB = 10 1.0 0.8 T A = -55°C 0.6 TA = 25°C 0.4 TA = 85°C 0.2 TA = 150°C 0 0.1 1,000 1 10 100 10,000 -IC, COLLECTOR CURRENT (mA) Fig. 4 Typical Base-Emitter Saturation Voltage vs. Collector Current 1,000 CAPACITANCE (pF) f = 1MHz 100 Cibo Cobo 10 1 0.1 1 10 100 VR, REVERSE VOLTAGE (V) Fig. 5 Typical Capacitance Characteristics ZXTP26020DMF Document number: DS32101 Rev. 1 - 2 4 of 6 www.diodes.com May 2010 © Diodes Incorporated A Product Line of Diodes Incorporated ZXTP26020DMF Package Outline Dimensions DFN1411-3 Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.02 b 0.25 0.35 0.30 D 1.35 1.475 1.40 D2 0.65 0.85 0.75 E 1.05 1.18 1.10 E2 0.65 0.85 0.75 e ⎯ ⎯ 0.55 L 0.225 0.325 0.275 L1 ⎯ ⎯ 0.20 All Dimensions in mm A A1 D b E E2 e D2 L1 L Suggested Pad Layout C X2 X1 G2 X Y Dimensions Z G1 G2 X X1 X2 Y C Value (in mm) 1.38 0.15 0.15 0.95 0.75 0.40 0.75 0.76 G1 Z ZXTP26020DMF Document number: DS32101 Rev. 1 - 2 5 of 6 www.diodes.com May 2010 © Diodes Incorporated A Product Line of Diodes Incorporated ZXTP26020DMF IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. 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Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2010, Diodes Incorporated www.diodes.com ZXTP26020DMF Document number: DS32101 Rev. 1 - 2 6 of 6 www.diodes.com May 2010 © Diodes Incorporated