54F/74F365 Hex Buffer/Driver with TRI-STATEÉ Outputs General Description Features The ’F365 is a hex buffer and line driver designed to be employed as a memory and address driver, clock driver and bus-oriented transmitter/receiver. Y Commercial Y Y TRI-STATE buffer outputs Outputs sink 64 mA Bus-oriented Package Number Military 74F365PC 54F365DM (Note 2) Package Description N16E 16-Lead (0.300× Wide) Molded Dual-In-Line J16A 16-Lead Ceramic Dual-In-Line M16A 16-Lead (0.150× Wide) Molded Small Outline, JEDEC 54F365FM (Note 2) W16A 16-Lead Cerpack 54F365LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C 74F365SC (Note 1) Note 1: Devices also available in 13× reel. Use suffix e SCX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Logic Symbol Connection Diagrams IEEE/IEC Pin Assignment for DIP, SOIC and Flatpak TL/F/9522 – 1 Pin Assignment for LCC TL/F/9522 – 2 TL/F/9522–4 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/9522 RRD-B30M105/Printed in U. S. A. 54F/74F365 Hex Buffer/Driver with TRI-STATE Outputs January 1995 Unit Loading/Fan Out 54F/74F Pin Names OE1, OE2 In On Description U.L. HIGH/LOW Input IIH/IIL Output IOH/IOL Output Enable Input (Active LOW) Inputs Outputs 1.0/0.033 20 mA/20 mA 1.0/0.033 600/106.6 (80) b 12 mA/64 mA (48 mA) 20 mA/20 mA Function Table Inputs Output OE1 OE2 I O L L X H L L H X L H X X L H Z Z L e LOW Voltage Level H e HIGH Voltage Level X e Immaterial Z e High Impedance 2 Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b 65§ C to a 150§ C Ambient Temperature under Bias Junction Temperature under Bias Plastic b 55§ C to a 125§ C Free Air Ambient Temperature Military Commercial b 55§ C to a 125§ C 0§ C to a 70§ C Supply Voltage Military Commercial b 55§ C to a 175§ C b 55§ C to a 150§ C a 4.5V to a 5.5V a 4.5V to a 5.5V VCC Pin Potential to Ground Pin b 0.5V to a 7.0V b 0.5V to a 7.0V Input Voltage (Note 2) b 30 mA to a 5.0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0.5V to VCC Standard Output b 0.5V to a 5.5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. DC Electrical Characteristics Symbol 54F/74F Parameter Min VIH Input HIGH Voltage VIL Input LOW Voltage VCD Input Clamp Diode Voltage VOH Output HIGH Voltage 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC Typ Units 2.0 Conditions V Recognized as a HIGH Signal 0.8 V Recognized as a LOW Signal b 1.2 V Min IIN e b18 mA V Min IOH IOH IOH IOH IOH 0.55 0.55 V Min IOL e 48 mA IOL e 64 mA 2.4 2.0 2.4 2.0 2.7 54F 10% VCC 74F 10% VCC VCC Max e e e e e b 3 mA b 12 mA b 3 mA b 15 mA b 3 mA VOL Output LOW Voltage IIH Input HIGH Current 20 mA Max VIN e 2.7V IBVI Input HIGH Current Breakdown Test 100 mA 0.0 VIN e 7.0V IIL Input LOW Current b 20 mA Max VIN e 0.5V IOZH Output Leakage Current 50 mA Max VOUT e 2.7V IOZL Output Leakage Current b 100 b 50 mA Max VOUT e 0.5V b 225 mA Max VOUT e 0V IOS Output Short-Circuit Current ICEX Output HIGH Leakage Current 250 mA Max VOUT e VCC IZZ Bus Drainage Test 500 mA 0.0V VOUT e 5.25V ICCH Power Supply Current 25 35 mA Max VO e HIGH ICCL Power Supply Current 44 62 mA Max VO e LOW ICCZ Power Supply Current 35 48 mA Max VO e HIGH Z 3 AC Electrical Characteristics Symbol Parameter 74F 54F 74F TA e a 25§ C VCC e a 5.0V CL e 50 pF TA, VCC e Mil CL e 50 pF TA, VCC e Com CL e 50 pF Units Min Typ Max Min Max Min Max tPLH tPHL Propagation Delay In to On 2.5 2.5 4.6 4.9 6.5 7.0 2.0 2.0 7.0 7.0 2.0 2.0 7.0 7.5 ns tPZH tPZL Enable Time 2.5 2.5 5.1 5.7 9.5 9.0 2.0 2.0 8.5 8.5 2.5 2.5 10.0 9.5 ns tPHZ tPLZ Disable Time 2.0 2.0 3.6 4.4 6.5 6.5 1.5 1.5 6.5 9.0 2.0 2.0 7.0 7.0 ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 365 S Temperature Range Family 74F e Commercial 54F e Military C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13× reels Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline (SOIC) Temperature Range C e Commercial (0§ C to a 70§ C) M e Military (b55§ C to a 125§ C) 4 5 Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 16-Lead Ceramic Dual-In-Line Package (D) NS Package Number J16A 6 Physical Dimensions inches (millimeters) (Continued) 16-Lead (0.150× Wide) Molded Small Outline Package, JEDEC (S) NS Package Number M16A 16-Lead (0.300× Wide) Molded Dual-In-Line Package (P) NS Package Number N16E 7 54F/74F365 Hex Buffer/Driver with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) 16-Lead Ceramic Flatpak (F) NS Package Number W16A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation 1111 West Bardin Road Arlington, TX 76017 Tel: 1(800) 272-9959 Fax: 1(800) 737-7018 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 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