VISHAY
Vishay Semiconductors
The Constituents of Semiconductor Components
Responsible electronic component and equipment
manufacturers are already preparing for the time
when the lifespan of their products comes to an end
by scrutinizing the materials incorporated and their
future recyclability. Recycling laws have already
come into force in Germany ("Kreislauf-Wirtschaftsgesetz") and guidelines for electronic scrap are in
preparation.
The aim is a suitable waste disposal program and, as
a preventative measure, a reduction in the content of
hazardous damaging materials in such components.
In order to conform to this procedure, detailed information about the materials and their quantities is
needed.
This present overview answers questions put forward
by customers as to the constituents and their function
in the most important of Vishay Semiconductors'
semiconductor products. Special significance is given
to so-called "Hazardous Substances". It demonstrates that Vishay Semiconductors’ products under
normal operating conditions do not expose the applier
or environment to any hazard. However, most products nevertheless contain small but necessary quantities of "Hazardous Substances" which can, if not
treated correctly or through accidents, be released on
a small scale into the environment.
The present information was produced with the greatest possible care. Any suggestions for improvement
of this brochure are welcome.
Definitions
Vishay Semiconductors offers a wide range of semiconductor components including transistors, diodes
and opto-electronic components. These have been
manufactured in various standard packages.
On the following pages, these packages are listed
together with their materials shown in weight percentages. In order to limit the number of tables, all components whose structure and composition are the same
have been compiled in families. In many cases, different lead frames together with chips of different sizes
may be used for the one package. This usually means
that there may be slight differences in the quantities
of the declared material. The weight percent is, however, valid for a representative sample of the relevant
family. In order to sensibly reduce the number and
quantities of materials contained in the respective
components, quantities smaller than 0.1% by weight
have been stated in the following list as traces. This
is the case unless lower limits are forced by law, e.g.
cadmium < 75 ppm and PCDD as well as PCDF
Document Number 84063
Rev. 7, 07-Jan-03
(known as dioxin) < 2 ppb. In the lists themselves,
details of content and composition are separated into
the individual parts of the semiconductor component.
The most important of these are:
Active element: The active element is either a silicon
chip or, for optoelectronic components, a chip containing combinations of Ga (Al) (As, P). These are
doped with very small amounts of boron, arsenic,
phosphorus, zinc and germanium etc. The metallisation consists of thin layers of aluminium, gold or titanium. The chips are generally bonded to the lead
frame with a silver epoxy and have gold or aluminium
wires bonded to the lead frame.
Lead frame: For electrical connection, a metal lead
frame made from alloys such as FeNi (42) or CuFe (2)
and partly or totally plated with silver is commonly
used. The metal alloys contain traces of silver, zinc
and phosphorus. Part of the lead frame is also coated
with tin/ lead.
Case: The semiconductor chip is protected from the
environment by a case of glass, plastic or metal.
The glass is composed of oxides of silicon and lead
together with boron and aluminium.
Plastic cases are composed of an epoxy resin filled
with up to 70% by weight of quartz particles. Antimony
trioxide and brominated epoxy resin (no TBA) are
added as flame retardents. Antimony and bromine
amount to about 1.6 and 1.0% respectively.
In use: In use, it is the content of hazardous substances which is of importance. In Germany, there are
a number of lists which give the materials which are
potentially hazardous to people and the environment,
for example:
Appendix II and IV of the "Hazardous Materials Regulations", the TRGS 900 ("MAK-Wert-Liste") and the
"Catalog of Materials Hazardous to the Water Supply". These lists, however, are only partially consistent.
The names used are often different for materials with
the same chemical composition. Furthermore, the
use of trivial and trade names often adds to the confusion.
Therefore, Vishay Semiconductors use for their
descriptions that proposed by the Zentralverband Elektrotechnik und Elektronikindustrie e.V. (ZVEI; Central Association of Electrical Engineering and
Electronic Industry) for the harmonization of the
nomenclature of hazardous substances.
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VISHAY
Vishay Semiconductors
Instructions are given on the safety precautions to be
used during storage and disposal by mechanical,
chemical and thermal means of the more important
chemicals (so-called "Leitchemikalien"). These are
listed in the tables in the order of their potential risk.
Their effect upon people and the environment are
also listed and any special precautions emphasized.
Notes:
The following information has been prepared to
be as exact and reliable as possible.
The manufacture of semiconductor components is, however, subject to regular change
without special notification.
The publication of this brochure excludes any
responsibility resulting from its use.
Explanation of Abbreviations
While the information on weight percent is believed
correct, discrepancies depending upon component
type may be possible.
1)
Material information etc. Material listed as
"Material Hazardous in Production"
2)
S: Trace material < 0.1% by weight;
Cd < 75 ppm; concerning Cd see ***)
PCDD and PCDF < 2 ppb
*)
Dioxin content - lies below agreed limits
**)
No. 85 "Rules for Hazardous Materials", to be
replaced as soon as a technically suitable alternative material is available
***) Traces of cadmium can only be found in lead
frames made of copper
CMT: Material containing carcinogens, mutagens or
terratogens
Tox: Material is toxic or very toxic
S
Material with allergy producing characteristics
HAL Halogen containing material
WKG Material hazardous to the water supply
L
Storage, suitable for disposal
D
Disposable
M
Mechanical disposal
N
Chemical disposal
T
Thermal disposal
H
Handling
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Ozone Depleting Substances
The use of Ozone Depleting Substances has been
totally eliminated by Vishay Semiconductors and by
doing so meets the legal requirements as defined in
the following documents.
1.
The "Montreal Protocol" together with the "London Amendments" Appendix A, B, and the "List
of Transitional Substances"
2.
"Clean Air Act", Amendments 1990, "Environmental Protection Agency" (EPA), USA, Class
I and II - Ozone Depleting Substances
3.
"European Council Resolution" number 88/
540/EEC and 91/690/eec Appendix A, B and C
(Transitional Substances)
Vishay Semiconductors guarantees that its components do not contain, and are manufactured without,
the use of Ozone Depleting Substances
Document Number 84063
Rev. 7, 07-Jan-03
VISHAY
Vishay Semiconductors
Contents of a Diode in Sintered Glass Package SOD57
mg
Leads, tinned
Total weight 370 mg
ppm
85,90 %
Copper
Cu
58,30 %
185,29
500,797
Iron
Fe
22,15 %
70,40
190,269
Molybdenum
Mo
18,55 %
58,96
159,345
Tin
Sn
0,50 %
1,59
4,295
Lead
Pb
0,20 %
0,64
1,718
Silver
Ag
0,10 %
0,32
0,859
Carbon
C
0,10 %
0,32
0,859
Oxygen
O2
0,10 %
0,32
0,859
Traces of Mn, P, S
Package, glass:
13,80 %
PbO
42,00 %
21,45
57,960
SiO2
38,00 %
19,40
52,440
B 2O 3
15,00 %
7,66
20,700
Al2O3
5,00 %
2,55
6,900
Silicon chip:
0,30 %
Silicon
Si
90,00 %
1,00
2,700
Aluminum
Al
10,00 %
0,11
0,300
Traces of P, Ga, Pt
(Dopant)
Contents of a Diode in Sintered Glass Package SOD64
mg
Leads, tinned
Total weight 860 mg
ppm
85,90 %
Copper
Cu
58,30 %
430,69
500,797
Iron
Fe
22,15 %
163,63
190,269
Molybdenum
Mo
18,55 %
137,04
159,345
Tin
Sn
0,50 %
3,69
4,295
Lead
Pb
0,20 %
1,48
1,718
Silver
Ag
0,10 %
0,74
0,859
Carbon
C
0,10 %
0,74
0,859
Oxygen
O2
0,10 %
0,74
0,859
Traces of Mn, P, S
Package, glass:
13,80 %
PbO
42,00 %
49,85
57,960
SiO2
38,00 %
45,10
52,440
B 2O 3
15,00 %
17,80
20,700
Al2O3
5,00 %
5,93
6,900
Silicon chip:
0,30 %
Silicon
Si
90,00 %
2,32
2,700
Aluminum
Al
10,00 %
0,26
0,300
Traces of P, Ga, Pt
(Dopant)
Document Number 84063
Rev. 7, 07-Jan-03
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VISHAY
Vishay Semiconductors
Contents of a Diode in Sintered Glass Package G1
mg
Leads, tinned
Total weight 560 mg
ppm
62,19 %
Copper
Cu
77,68 %
270,53
483,092
Molybdenum
Mo
20,64 %
71,88
128,360
Tin
Sn
1,31 %
4,56
8,147
Lead
Pb
0,23 %
0,80
1,430
Silver
Ag
0,08 %
0,28
0,498
Phosphorus
P
0,06 %
0,21
0,373
Traces of S, O2, C
Package, glass:
37,58 %
ZnO
62,70 %
131,95
235,627
B 2O 3
24,00 %
50,51
90,192
SiO2
10,00 %
21,04
37,580
PbO
2,80 %
5,89
10,522
Sb2O3
0,50 %
1,05
1,879
Traces of P, Pt
Silicon chip:
0,23 %
Silicon
Si
93,55 %
1,20
2,152
Aluminum
Al
6,45 %
0,08
0,148
Contents of a Diode in Sintered Glass Package G3
mg
Leads, tinned
Total weight 1100 mg
ppm
62,19 %
Copper
Cu
77,84 %
532,50
484,087
Molybdenum
Mo
21,06 %
144,07
130,972
Tin
Sn
0,83 %
5,68
5,162
Lead
Pb
0,15 %
1,03
0,933
Silver
Ag
0,07 %
0,48
0,435
Phosphorus
P
0,05 %
0,34
0,311
Traces of S, O2, C
Package, glass:
Zinc Oxide
37,58 %
ZnO
62,70 %
259,19
235,627
B 2O 3
24,00 %
99,21
90,192
SiO2
10,00 %
41,34
37,580
PbO
2,80 %
11,57
10,522
Sb2O3
0,50 %
2,07
1,879
Traces of P, Pt
Silicon chip:
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0,23 %
Silicon
Si
93,57 %
2,37
2,152
Aluminum
Al
6,43 %
0,16
0,148
Document Number 84063
Rev. 7, 07-Jan-03
VISHAY
Vishay Semiconductors
Contents of a Diode in Sintered Glass Package G4
mg
Leads, tinned
Total weight 1040 mg
ppm
62,19 %
Copper
Cu
69,09 %
446,86
429,671
Molybdenum
Mo
29,63 %
191,64
184,269
Tin
Sn
0,95 %
6,14
5,908
Lead
Pb
0,17 %
1,10
1,057
Silver
Ag
0,10 %
0,65
0,622
Phosphorus
P
0,06 %
0,39
0,373
Traces of S. O2, C
Package, glass:
Zinc Oxide
37,58 %
ZnO
62,70 %
245,05
235,627
B 2O 3
24,00 %
93,80
90,192
SiO2
10,00 %
39,08
37,580
PbO
2,80 %
10,94
10,522
Sb2O3
0,50 %
1,95
1,879
Traces of P, Pt
Silicon chip:
0,23 %
Silicon
Si
93,12 %
2,23
2,142
Aluminum
Al
6,88 %
0,16
0,158
Significant Materials for Disposal
No.
Material and/or Group 1)
C
M
T
T
1
Lead and compounds
²
2
Molybdenum and compounds
²
S
H
AL
W
G
K
Available
in the Compound
Used for
²
Package glass, lead
6.0
Lead
15.9
Part in 2)
Weight
Percent
L
D
M
N
T
²
²
²
H
²
Note: *), **), ***), 1), 2), CMT, T
Document Number 84063
Rev. 7, 07-Jan-03
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