INTERSIL ACTS240DTR

ACTS240T
Data Sheet
July 1999
High Reliability, Radiation Hardened Octal
Buffer/Line Driver, Three-State, Inverting
Intersil‘s Satellite Applications FlowTM (SAF) devices are
fully tested and guaranteed to 100kRAD total dose. These
QML Class T devices are processed to a standard flow
intended to meet the cost and shorter lead-time needs of
large volume satellite manufacturers, while maintaining a
high level of reliability.
The Intersil ACTS240T is a Radiation Hardened High
Reliability, High-Speed CMOS/SOS Octal Buffer/Line Driver
with three-state outputs having two active low enable inputs.
Each enable input controls a set of four inverting buffer/line
drivers. A HIGH on the enable input places the outputs in a
high impedance state.
Specifications
Specifications for Rad Hard QML devices are controlled by
the Defense Supply Center in Columbus (DSCC). The SMD
numbers listed below must be used when ordering.
• QML Class T, Per MIL-PRF-38535
• Radiation Performance
- Gamma Dose (γ) 1 x 105 RAD(Si)
- Latch-Up Free Under Any Conditions
- Single Event Upset (SEU) Immunity: <1 x 10-10
Errors/Bit/Day (Typ)
- SEU LET Threshold . . . . . . . . . . . . .>100 MEV-cm2/mg
• 1.25 Micron Radiation Hardened SOS CMOS
• Significant Power Reduction Compared to ALSTTL Logic
• DC Operating Voltage Range . . . . . . . . . . . . 4.5V to 5.5V
• Input Logic Levels
- VIL = 0.8V Max
- VIH = VCC/2 Min
• Fast Propagation Delay . . . . . . . 17.5ns (Max), 12ns (Typ)
Pinouts
ACTS240T (SBDIP), CDIP2-T20
TOP VIEW
Intersil‘s Quality Management Plan (QM Plan), listing all
Class T screening operations, is also available on our
website.
www.intersil.com/quality/manuals.asp
Ordering Information
PART
NUMBER
TEMP.
RANGE
(oC)
5962R9671701TRC
ACTS240DTR
-55 to 125
5962R9671701TXC
ACTS240KTR
-55 to 125
NOTE: Minimum order quantity for -T is 150 units through
distribution, or 450 units direct.
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4610.1
Features
Detailed Electrical Specifications for the ACTS240T are
contained in SMD 5962-96717. A “hot-link” is provided from
our website for downloading.
www.intersil.com/spacedefense/newsafclasst.asp
ORDERING
NUMBER
File Number
AEN
1
AI1
2
19 BEN
BO4
3
18 AO1
AI2
4
17 BI4
BO3
5
16 AO2
AI3
6
15 BI3
BO2
7
14 AO3
AI4
8
13 BI2
BO1
9
12 AO4
20 VCC
GND 10
11 BI1
ACTS240T (FLATPACK), CDFP4-F20
TOP VIEW
AEN
1
20
VCC
AI1
2
19
BEN
BO4
3
18
AO1
AI2
4
17
BI4
BO3
5
16
AO2
AI3
6
15
BI3
BO2
7
14
AO3
AI4
8
13
BI2
BO1
9
12
AO4
GND
10
11
BI1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
ACTS240T
Functional Diagram
NOTE: (1 of 2)
AE
1(19)
P
AO1
N 18(9)
AI1
2(11)
P
AO2
N 16(7)
AI2
4(13)
P
AO3
N 14(5)
AI3
6(15)
P
AO4
N 12(3)
AI4
8(17)
TRUTH TABLE
INPUTS
OUTPUT
AE, BE
AIn, BIn
AOn, BOn
L
L
H
L
H
L
H
X
Z
NOTE: H = High Voltage Level, L = Low Voltage Level,
X = Immaterial, Z = High Impedance
2
ACTS240T
Die Characteristics
BACKSIDE FINISH:
DIE DIMENSIONS:
(2540µm x 2540µm x 533µm ±51µm)
100 x 100 x 21mils ±2mil
Sapphire
PASSIVATION:
METALLIZATION:
Type: Silox (SiO2)
Thickness: 8.0kÅ ±1.0kÅ
Type: Al Si Cu
Thickness: 10.0kÅ ±2kÅ
WORST CASE CURRENT DENSITY:
SUBSTRATE POTENTIAL:
< 2.0e5 A/cm2
Unbiased (Silicon on Sapphire)
Bond Pad #20 (VCC) First
Bond Pad #10 (Gnd) Uses Two Bond Wires
Bond Pad #20 (VCC) Uses Two Bond Wires
TRANSISTOR COUNT:
164
PROCESS:
CMOS SOS
Metallization Mask Layout
ACTS240T
AI1
(2)
VCC
(20)
AEN
(1)
VCC
(20)
BEN
(19)
(18) AO1
BO4 (3)
(17) BI4
AI2 (4)
(16) AO2
BO3 (5)
(15) BI3
AI3 (6)
(14) AO3
BO2 (7)
(13) BI2
AI4 (8)
BO1 (9)
AO4 (12)
(10) (10)
GND GND
(11)
BI1
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Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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