HCS373T Data Sheet July 1999 Radiation Hardened Octal Transparent Latch, Three-State Intersil’s Satellite Applications FlowTM (SAF) devices are fully tested and guaranteed to 100kRAD total dose. These QML Class T devices are processed to a standard flow intended to meet the cost and shorter lead-time needs of large volume satellite manufacturers, while maintaining a high level of reliability. The Intersil HCS373T is a Radiation Hardened Octal Transparent Three-State Latch with an active-low output enable. The HCS373T utilizes advanced CMOS/SOS technology. The outputs are transparent to the inputs when the Latch Enable (LE) is HIGH. When the Latch Enable (LE) goes LOW, the data is latched. The Output Enable (OE) controls the three-state outputs. When the Output Enable (OE) is HIGH, the outputs are in the high impedance state. The latch operation is independent of the state of the Output Enable. File Number 4617.1 Features • QML Class T, Per MIL-PRF-38535 • Radiation Performance - Gamma Dose (γ) 1 x 105 RAD(Si) - Latch-Up Free Under Any Conditions - SEP Effective LET No Upsets: >100 MEV-cm2/mg - Single Event Upset (SEU) Immunity < 2 x 10-9 Errors/Bit-Day (Typ) • 3 Micron Radiation Hardened CMOS SOS • Significant Power Reduction Compared to LSTTL ICs • DC Operating Voltage Range: 4.5V to 5.5V • Input Logic Levels - VIL = 0.3 VCC Max - VIH = 0.7 VCC Min • Input Current Levels Ii ≤ 5mA at VOL, VOH Pinouts Specifications HCS373DTR (SBDIP), CDIP2-T20 TOP VIEW Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. Detailed Electrical Specifications for the HCS373T are contained in SMD 5962-95792. A “hot-link” is provided from our website for downloading. www.intersil.com/spacedefense/newsafclasst.asp Intersil’s Quality Management Plan (QM Plan), listing all Class T screening operations, is also available on our website. www.intersil.com/quality/manuals.asp OE 1 Q0 2 19 Q7 D0 3 18 D7 D1 4 17 D6 Q1 5 16 Q6 Q2 6 15 Q5 D2 7 14 D5 D3 8 13 D4 Q3 9 12 Q4 GND 10 11 LE 20 VCC Ordering Information ORDERING NUMBER 5962R9579201TRC 5962R9579201TXC PART NUMBER HCS373DTR HCS373KTR TEMP. RANGE (oC) -55 to 125 -55 to 125 NOTE: Minimum order quantity for -T is 150 units through distribution, or 450 units direct. HCS373KTR (FLATPACK), CDFP4-F20 TOP VIEW OE 1 20 VCC Q0 2 19 Q7 D0 3 18 D7 D1 4 17 D6 Q1 5 16 Q6 Q2 6 15 Q5 D2 7 14 D5 D3 8 13 D4 Q3 9 12 Q4 10 11 LE GND 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999 Satellite Applications Flow™ (SAF) is a trademark of Intersil Corporation. HCS373T Functional Diagram 1 OF 8 (3, 4, 7, 8, 13, 14, 17, 18) D LATCH OE D Q Q (2, 5, 6, 9, 12, 15, 16, 19) LE COMMON CONTROLS LE (11) OE (1) TRUTH TABLE OE LE D Q L H H H L H L L L L I L L L h H H X X Z H = High Level, L = Low Level. X = Immaterial, Z = High Impedance. I = Low voltage level prior to the high-to-low latch enable transition. h = High voltage level prior to the high-to-low latch enable transition. 2 HCS373T Die Characteristics DIE DIMENSIONS: PASSIVATION: (2747µm x 2693µm x 533µm ±51.0µm) Type: Silox (SiO2) 108 x 106 x 21mils ±2mil Thickness: 13kÅ ±2.6kÅ METALLIZATION: WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 Type: Al Si Thickness: 11kÅ ±1kÅ TRANSISTOR COUNT: SUBSTRATE POTENTIAL: 376 Unbiased Silicon on Sapphire PROCESS: BACKSIDE FINISH: CMOS SOS Sapphire Metallization Mask Layout HCS373T Q0 (2) D0 (3) VCC (20) OE (1) Q7 (19) (18) D7 D1 (4) (17) D6 Q1 (5) (16) Q6 Q2 (6) (15) Q5 (14) D5 D2 (7) (8) NOTE: (9) Q3 (10) GND (11) (12) Q4 (13) D4 The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS373 is TA14303A. All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com 3