3 V, LVDS, Quad, CMOS Differential Line Driver ADN4665 ±15 kV ESD protection on output pins 400 Mbps (200 MHz) switching rates 100 ps typical differential skew 400 ps maximum differential skew 2 ns maximum propagation delay 3.3 V power supply ±350 mV differential signaling Low power dissipation (13 mW typical) Interoperable with existing 5 V LVDS receivers High impedance on LVDS outputs on power-down Conforms to TIA/EIA-644 LVDS standards Industrial operating temperature range: −40°C to +85°C Available in surface-mount SOIC package and low profile TSSOP package APPLICATIONS FUNCTIONAL BLOCK DIAGRAM ADN4665 VCC DIN4 DIN1 D1 D4 DOUT1+ DOUT4+ DOUT1– DOUT4– EN EN DOUT2– DOUT3– DOUT2+ DOUT3+ D2 D3 DIN2 DIN3 GND 08085-001 FEATURES Figure 1. Backplane data transmission Cable data transmission Clock distribution GENERAL DESCRIPTION The ADN4665 is a quad-channel, CMOS, low voltage differential signaling (LVDS) line driver offering data rates of over 400 Mbps (200 MHz) and ultralow power consumption. The device accepts low voltage TTL/CMOS logic signals and converts them to a differential current output of typically ±3.5 mA for driving a transmission medium such as a twisted pair cable. The transmitted signal develops a differential voltage of typically ±350 mV across a termination resistor at the receiving end. This voltage is converted back to a TTL/CMOS logic level by an LVDS receiver. The ADN4665 also offers active high and active low enable/ disable inputs (EN and EN). These inputs control all four drivers and turn off the current outputs in the disabled state to reduce the quiescent power consumption to typically 10 mW. The ADN4665 offers a new solution to high speed, point-to-point data transmission and offers a low power alternative to emittercoupled logic (ECL) or positive emitter-coupled logic (PECL). Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2009 Analog Devices, Inc. All rights reserved. ADN4665 TABLE OF CONTENTS Features .............................................................................................. 1 ESD Caution...................................................................................6 Applications ....................................................................................... 1 Pin Configuration and Function Descriptions..............................7 Functional Block Diagram .............................................................. 1 Typical Performance Characteristics ..............................................8 General Description ......................................................................... 1 Theory of Operation .........................................................................9 Revision History ............................................................................... 2 Enable Inputs .................................................................................9 Specifications..................................................................................... 3 Applications Information .............................................................9 Timing Characteristics ................................................................ 4 Outline Dimensions ....................................................................... 10 Absolute Maximum Ratings............................................................ 6 Ordering Guide .......................................................................... 10 REVISION HISTORY 5/09—Revision 0: Initial Version Rev. 0 | Page 2 of 12 ADN4665 SPECIFICATIONS VCC = 3.0 V to 3.6 V, RL = 100 Ω, CL = 15 pF to GND, all specifications TMIN to TMAX, unless otherwise noted. All typical values are given for VCC = 3.3 V, TA = 25°C. Table 1. Parameter LVDS OUTPUTS (DOUTx+, DOUTx−) Differential Output Voltage Change in Magnitude of VOD for Complementary Output States Offset Voltage Change in Magnitude of VOS for Complementary Output States Output High Voltage Output Low Voltage INPUTS (DINx, EN, EN) Input High Voltage Input Low Voltage Input High Current Input Low Current Input Clamp Voltage LVDS OUTPUT PROTECTION (DOUTx+, DOUTx−) Output Short-Circuit Current 3 Symbol Min Typ Max Unit Conditions/Comments 1, 2 VOD ΔVOD VOS ΔVOS VOH VOL 250 350 4 1.25 5 1.38 1.03 450 35 1.375 25 1.6 mV |mV| V |mV| V V See Figure 2 and Figure 4 See Figure 2 and Figure 4 See Figure 2 and Figure 4 See Figure 2 and Figure 4 See Figure 2 and Figure 4 See Figure 2 and Figure 4 VCC 0.8 +10 +10 V V μA μA V VIN = VCC or 2.5 V VIN = GND or 0.4 V ICL = −18 mA IOS −6.0 −9.0 mA Differential Output Short-Circuit Current3 LVDS OUTPUT LEAKAGE (DOUTx+, DOUTx−) Power-Off Leakage IOSD −6.0 −9.0 mA Output Three-State Current VIH VIL IIH IIL VCL 1.125 0.90 2.0 GND −10 −10 −1.5 +1 +1 −0.8 IOFF −20 ±1 +20 μA IOZ −10 ±1 +10 μA POWER SUPPLY No Load Supply Current, Drivers Enabled Loaded Supply Current, Drivers Enabled ICC ICCL 5.0 23 8.0 30 mA mA No Load Supply Current, Drivers Disabled ICCZ 2.6 6.0 mA ESD PROTECTION DOUTx+, DOUTx− Pins All Pins Except DOUTx+, DOUTx− ±15 ±4.5 1 kV kV Enabled, DINx = VCC, DOUTx+ = 0 V or DINx = GND, DOUTx− = 0 V Enabled, VOD = 0 V VOUT = 0 V or 3.6 V, VCC = 0 V or open EN = 0.8 V, EN = 2.0 V, VOUT = 0 V or VCC DINx = VCC or GND RL = 100 Ω all channels, DINx = VCC or GND (all inputs) DINx = VCC or GND, EN = GND, EN = VCC Human body model Human body model Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD, ΔVOD, and ΔVOS. The ADN4665 is a current-mode device and functions within data sheet specifications only when a resistive load is applied to the driver outputs. Typical range is 90 Ω to 110 Ω. 3 Output short-circuit current (IOS) is specified as magnitude only; minus sign indicates direction only. 2 Rev. 0 | Page 3 of 12 ADN4665 TIMING CHARACTERISTICS VCC = 3.0 V to 3.6 V, RL = 100 Ω, CL 1 = 15 pF to GND, all specifications TMIN to TMAX, unless otherwise noted. All typical values are given for VCC = 3.3 V, TA = 25°C. Table 2. Parameter 2 AC CHARACTERISTICS Differential Propagation Delay, High to Low Differential Propagation Delay, Low to High Differential Pulse Skew |tPHLD − tPLHD| Channel-to-Channel Skew Differential Part-to-Part Skew Differential Part-to-Part Skew Rise Time Fall Time Disable Time High to Inactive Disable Time Low to Inactive Enable Time Inactive to High Enable Time Inactive to Low Maximum Operating Frequency Symbol Min Typ Max Unit Conditions/Comments 3, 4 tPHLD tPLHD tSKD1 5 tSKD2 6 tSKD3 7 tSKD4 8 tTLH tTHL tPHZ tPLZ tPZH tPZL fMAX 9 0.8 0.8 0 0 0 0 1.18 1.25 0.07 0.1 2.0 2.0 0.4 0.5 1.0 1.2 1.5 1.5 5 5 7 7 ns ns ns ns ns ns ns ns ns ns ns ns MHz See Figure 3 and Figure 4 See Figure 3 and Figure 4 See Figure 3 and Figure 4 See Figure 3 and Figure 4 See Figure 3 and Figure 4 See Figure 3 and Figure 4 See Figure 3 and Figure 4 See Figure 3 and Figure 4 See Figure 5 and Figure 6 See Figure 5 and Figure 6 See Figure 5 and Figure 6 See Figure 5 and Figure 6 See Figure 5 and Figure 6 0.38 0.4 200 250 1 CL includes probe and jig capacitance. AC parameters are guaranteed by design and characterization. 3 Generator waveform for all tests, unless otherwise specified: f = 50 MHz, ZO = 50 Ω, tr ≤ 1 ns, and tf ≤ 1 ns. 4 All input voltages are for one channel, unless otherwise specified. Other inputs are set to GND. 5 tSKD1 = |tPHLD − tPLHD| is the magnitude difference in differential propagation delay time between the positive-going edge and the negative-going edge of the same channel. 6 tSKD2 is the differential channel-to-channel skew of any event on the same device. 7 tSKD3, differential part-to-part skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range. 8 tSKD4, part-to-part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over the recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |maximum − minimum| differential propagation delay. 9 fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, 0 V to 3 V. Output criteria: duty cycle = 45% to 55%, VOD > 250 mV, all channels switching. 2 Test Circuits and Timing Diagrams DOUTx+ VCC RL/2 DINx V VOS V VOD 08085-002 RL/2 DOUTx– NOTES 1. DRIVER IS ENABLED. Figure 2. Test Circuit for Driver VOD and VOS VCC DOUTx+ CL SIGNAL GENERATOR DINx DOUTx– 50Ω DRIVER IS ENABLED NOTES 1. CL INCLUDES PROBE AND JIG CAPACITANCE. 08085-003 CL Figure 3. Test Circuit for Driver Propagation Delay and Transition Time Rev. 0 | Page 4 of 12 ADN4665 3V DINx 1.5V 0V tPLHD tPHLD VOD DOUTx– VOH 0V (DIFFERENTIAL) VOL DOUTx+ 80% 0V VDIFF 20% tTLH 08085-004 VDIFF = DOUTx+ – DOUTx– tTHL Figure 4. Driver Propagation Delay and Transition Time Waveforms VCC DOUTx+ CL VCC 50Ω 1.2V DINx 50Ω S1 DOUTx– CL EN SIGNAL GENERATOR 50Ω EN 08085-005 NOTES 1. CL INCLUDES LOAD AND TEST JIG CAPACITANCE. 2. S1 CONNECTED TO VCC FOR tPHZ AND tPZH TEST. 3. S1 CONNECTED TO GND FOR tPLZ AND tPZL TEST. Figure 5. Test Circuit for Driver Three-State Delay 3V EN WITH EN = GND OR OPEN CIRCUIT 1.5V 0V 3V EN WITH EN = VCC 1.5V 0V tPHZ tPZH VOH DOUTx+ WITH DINx = VCC OR DOUTx– WITH DINx = GND 50% 1.2V 1.2V VOL tPLZ Figure 6. Driver Three-State Delay Waveforms Rev. 0 | Page 5 of 12 tPZL 08085-006 50% DOUTx+ WITH DINx = GND OR DOUTx– WITH DINx = VCC ADN4665 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 3. Parameter VCC to GND Input Voltage (DINx) to GND Enable Input Voltage (EN, EN) to GND Output Voltage (DOUTx+, DOUTx−) to GND Short-Circuit Duration (DOUTx+, DOUTx−) to GND Industrial Operating Temperature Range Storage Temperature Range Junction Temperature (TJ max) Power Dissipation θJA Thermal Impedance TSSOP Package SOIC Package Reflow Soldering Peak Temperature (10 sec) Rating −0.3 V to +4 V −0.3 V to VCC + 0.3 V −0.3 V to VCC + 0.3 V −0.3 V to VCC + 0.3 V Continuous −40°C to +85°C −65°C to +150°C 150°C (TJ max − TA)/θJA Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION 150.4°C/W 125°C/W 260°C max Rev. 0 | Page 6 of 12 ADN4665 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS DIN1 1 16 VCC DOUT1+ 2 15 DIN4 DOUT1– 3 14 DOUT4+ ADN4665 13 DOUT4– TOP VIEW DOUT2– 5 (Not to Scale) 12 EN DOUT2+ 6 11 DOUT3– DIN2 7 10 DOUT3+ GND 8 9 DIN3 08085-007 EN 4 Figure 7. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1 2 Mnemonic DIN1 DOUT1+ 3 DOUT1− 4 EN 5 DOUT2− 6 DOUT2+ 7 8 9 10 DIN2 GND DIN3 DOUT3+ 11 DOUT3− 12 EN 13 DOUT4− 14 DOUT4+ 15 16 DIN4 VCC Description Driver Channel 1 Logic Input. Channel 1 Noninverting Output Current Driver. When DIN1 is high, current flows out of DOUT1+. When DIN1 is low, current flows into DOUT1+. Channel 1 Inverting Output Current Driver. When DIN1 is high, current flows into DOUT1−. When DIN1 is low, current flows out of DOUT1−. Active High Enable and Power-Down Input (3 V TTL/CMOS). If EN is held low or open circuit, EN enables the drivers when high and disables the drivers when low. Channel 2 Inverting Output Current Driver. When DIN2 is high, current flows into DOUT2−. When DIN2 is low, current flows out of DOUT2−. Channel 2 Noninverting Output Current Driver. When DIN2 is high, current flows out of DOUT2+. When DIN2 is low, current flows into DOUT2+. Driver Channel 2 Logic Input. Ground Reference Point for All Circuitry on the Part. Driver Channel 3 Logic Input. Channel 3 Noninverting Output Current Driver. When DIN3 is high, current flows out of DOUT3+. When DIN3 is low, current flows into DOUT3+. Channel 3 Inverting Output Current Driver. When DIN3 is high, current flows into DOUT3−. When DIN3 is low, current flows out of DOUT3−. Active Low Enable and Power-Down Input with Pull-Down (3 V TTL/CMOS). If EN is held high, EN enables the drivers when low or open circuit and disables the drivers and powers down the device when high. Channel 4 Inverting Output Current Driver. When DIN4 is high, current flows into DOUT4−. When DIN4 is low, current flows out of DOUT4−. Channel 4 Noninverting Output Current Driver. When DIN4 is high, current flows out of DOUT4+. When DIN4 is low, current flows into DOUT4+. Driver Channel 4 Logic Input. Power Supply Input. This part can be operated from 3.0 V to 3.6 V. The supply should be decoupled with a 10 μF solid tantalum capacitor in parallel with a 0.1 μF capacitor to GND. Rev. 0 | Page 7 of 12 ADN4665 TYPICAL PERFORMANCE CHARACTERISTICS 3.0 2.0 VCC = 3.3V TA = 25°C VCC = 3.0V TO 3.6V TA = 25°C 1.8 DOUTx+ = +3.3V 2.5 1.6 DOUTx+ DOUT (V) DOUT (V) 2.0 1.5 DOUT = +3.0V DOUT = +3.3V DOUT = +3.6V DOUT = –3.0V DOUT = –3.3V DOUT = –3.6V 1.4 1.2 DOUTx– 1.0 1.0 0.5 0 1 2 3 4 5 6 7 RL (kΩ) 0.6 08085-008 0 0 Figure 8. Single-Ended Driver Output Voltage vs. Load Resistance 50 100 150 200 RL (Ω) 250 300 Figure 9. Driver Output vs. Load Resistance Rev. 0 | Page 8 of 12 350 400 08085-009 0.8 DOUTx– = –3.3V ADN4665 THEORY OF OPERATION The ADN4665 is a quad line driver for low voltage differential signaling. It takes a single-ended 3 V logic signal and converts it to a differential current output. The data can then be transmitted for considerable distances, over media such as a twisted pair cable or PCB backplane, to an LVDS receiver such as the ADN4666, where it develops a voltage across a termination resistor, RT. This resistor is chosen to match the characteristic impedance of the medium, typically around 100 Ω. The differential voltage is detected by the receiver and converted back into a single-ended logic signal. This is similar to emitter-coupled logic (ECL) and positive emitter-coupled logic (PECL), but without the high quiescent current of ECL and PECL. When DINx is high (Logic 1), current flows out of the DOUTx+ pin (current source) through RT and back into the DOUTx− pin (current sink). At the receiver, this current develops a positive differential voltage across RT (with respect to the inverting input) and results in a Logic 1 at the receiver output. When DINx is low, DOUTx+ sinks current and DOUTx− sources current; a negative differential voltage across RT results in a Logic 0 at the receiver output. Table 5. Enable Inputs Truth Table Current-mode drivers offer considerable advantages over voltagemode drivers such as RS-422 drivers. The operating current remains fairly constant with increased switching frequency, whereas the operating current of voltage-mode drivers increases exponentially in most cases. This is caused by the overlap current as internal gates switch between high and low, which causes currents to flow from the device power supply to ground. A current-mode device simply reverses a constant current between its two outputs, with no significant overlap currents. The active high and active low enable inputs deactivate all the current drivers when the drivers are in the disabled state. This also powers down the device and reduces the current consumption from typically 23 mA to typically 2.6 mA. A truth table for the enable inputs is shown in Table 5. Pin Logic Level DINx EN EN Low Low Low High High 1 1 High Low Low Low Low X Low High Low High DOUTx+ DOUTx− Inactive ISINK ISOURCE ISINK ISOURCE Inactive ISOURCE ISINK ISOURCE ISINK X = don’t care. APPLICATIONS INFORMATION Figure 10 shows a typical application for point-to-point data transmission using the ADN4665 as the driver. 1/4 ADN4665 RECEIVER EN EN EN EN DOUTx+ RT 100Ω DINx Rev. 0 | Page 9 of 12 RINy+ DOUTx– GND ROUTy RINy– GND Figure 10. Typical Application Circuit 08085-010 The output drive current is between ±2.5 mA and ±4.5 mA (typically ±3.5 mA), developing between ±250 mV and ±450 mV across a 100 Ω termination resistor. The received voltage is centered around the receiver offset of 1.25 V. Therefore, the noninverting receiver input is typically 1.375 V (that is, 1.2 V + [350 mV/2]) and the inverting receiver input is 1.025 V (that is, 1.2 V − [350 mV/2]) for Logic 1. For Logic 0, the inverting and noninverting output voltages are reversed. Note that because the differential voltage reverses polarity, the peak-to-peak voltage swing across RT is twice the differential voltage. ENABLE INPUTS ADN4665 OUTLINE DIMENSIONS 10.00 (0.3937) 9.80 (0.3858) 9 16 4.00 (0.1575) 3.80 (0.1496) 1 6.20 (0.2441) 5.80 (0.2283) 8 1.27 (0.0500) BSC 0.25 (0.0098) 0.10 (0.0039) COPLANARITY 0.10 0.50 (0.0197) 0.25 (0.0098) 1.75 (0.0689) 1.35 (0.0531) SEATING PLANE 0.51 (0.0201) 0.31 (0.0122) 45° 8° 0° 0.25 (0.0098) 0.17 (0.0067) 1.27 (0.0500) 0.40 (0.0157) 060606-A COMPLIANT TO JEDEC STANDARDS MS-012-AC CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. Figure 11. 16-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-16) Dimensions shown in millimeters and (inches) 5.10 5.00 4.90 16 9 4.50 4.40 4.30 6.40 BSC 1 8 PIN 1 1.20 MAX 0.15 0.05 0.20 0.09 0.30 0.19 0.65 BSC COPLANARITY 0.10 SEATING PLANE 8° 0° 0.75 0.60 0.45 COMPLIANT TO JEDEC STANDARDS MO-153-AB Figure 12. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters ORDERING GUIDE Model ADN4665ARZ 1 ADN4665ARZ-REEL71 ADN4665ARUZ1 ADN4665ARUZ-REEL71 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description 16-Lead Standard Small Outline Package [SOIC_N] 16-Lead Standard Small Outline Package [SOIC_N] 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] Z = RoHS Compliant Part. Rev. 0 | Page 10 of 12 Package Option R-16 R-16 RU-16 RU-16 ADN4665 NOTES Rev. 0 | Page 11 of 12 ADN4665 NOTES ©2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08085-0-5/09(0) Rev. 0 | Page 12 of 12