EPCOS B69813N2327A414

Microwave Ceramics and Modules
3-Pole Filter for SIRIUS
Filter
B69813N2327A414
Data Sheet
Features
z SMD filter consisting of coupled resonators with stepped impedances
z (NdBa)TiO3 (εr = 88 / TCf =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm)
z Excellent reflow solderability, no migration effect due to copper/tin metallization
Index
Page 2
• Component drawing
• Recommended footprint
Page 3
• Characteristics
• Maximum ratings
• Typical passband characteristic
Page 4
• Processing information
• Soldering requirements
• Delivery mode
ISSUE DATE
12.03.04
ISSUE
B
PUBLISHER
SAW MWC PD
PAGE
1/4
Microwave Ceramics and Modules
3-Pole Filter for SIRIUS
Filter
B69813N2327A414
Data Sheet
Component drawing
View from below onto the solder terminals and view from beside
Recommended footprint
2.4
1.5
1
I/O
G
I/O
1.35
0.9
0.45
4.1
1.45
1
1
G
G
G
1.7
0.3
0.3
1.2
1.4
0.5
4.8
ISSUE DATE
12.03.04
ISSUE
B
PUBLISHER
SAW MWC PD
PAGE
2/4
Microwave Ceramics and Modules
3-Pole Filter for SIRIUS
Filter
B69813N2327A414
Data Sheet
Characteristics
min.
Center frequency
fc αIL
Insertion loss
Passband
typ.
max.
2326
-
MHz
2.7
3.0
dB
B 14
∆α
Amplitude ripple (peak - peak)
Standing wave ratio
0.3
Z
α
at DC to 2175 MHz
at 2227 MHz
at 2400 MHz
at 2426 MHz
at 2500 MHz
at 2526 to 2700 MHz
0.5
dB
2.0
SWR
Impedance
Attenuation
MHz
40
30
15
20
30
35
50
Ω
43
37
dB
dB
dB
dB
dB
dB
23
37
Maximum ratings
IEC climatic category (IEC 68-1)
- 40/+ 90/56
Operating temperature
Top -40 / +85
°C
1.95
1.99
2.03
2.06
2.1
2.14
2.18
2.21
2.25
2.29
2.33
2.36
2.4
2.44
2.48
2.51
2.55
2.59
2.63
2.66
2.7
Typical passband characteristic
0
attenuation [dB]
-10
-20
-30
DB[S11]
DB[S21]
-40
-50
-60
-70
frequency [GHz]
ISSUE DATE
12.03.04
ISSUE
B
PUBLISHER
SAW MWC PD
PAGE
3/4
Microwave Ceramics and Modules
3-Pole Filter for SIRIUS
Filter
B69813N2327A414
Data Sheet
Processing information
z Wettability acc. to IEC 68-2-58: ≥ 75% (after aging)
Soldering Requirements
Profile for eutectic
SnPb solder paste
Profile for leadfree
solder paste
Soldering type
reflow
Maximum soldering temperature
235 (max. 2 sec.)
(measuring point on top surface of the component) 225 (max. 10 sec.)
reflow
260 (max. 2 sec.) °C
250 (max. 10 sec.) °C
Recommended soldering conditions (infrared):
within 10 sec.
Temp. [°C]
within 10 sec.
Temp. [°C]
245°C±5°C
215°C±10°C
20-40 sec.
30 sec.
Time [sec.]
2.5 °C/s
40-80 sec.
2-3 min.
Time [sec.]
> - 5 °C/s
Delivery mode
z Blister tape acc. to IEC 286-3, polyester, grey
z Pieces/tape: 3000
 EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry
recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed.
ISSUE DATE
12.03.04
ISSUE
B
PUBLISHER
SAW MWC PD
PAGE
4/4