ROHM BD11600NUX

USB Switch ICs
DPDT Type
(Double Pole Double Throw)
BD11600NUX
No.11103EAT03
●Description
BD11600NUX is DPDT analog switches handling with USB2.0 high-speed that have both a low resistance and a low
capacitance. Moreover, this is widely guaranteed from 2.5V to 5.5V as for the range of the power-supply voltage.
This has a low consumption mode by making OE “H” and the multi-selector by making the combination of OE “L” and S.
The electrostatic discharge protection circuit is built-in in all terminals.
●Features
1) VCC Operation from 2.5V to 5.5V.
2) 3Ω switches between the input to the output.
3) Low Capacity 2ch Analog SW.
4) 10-Pin SON Package. (3.0mm x 2.0mm, Height=0.6mm, 0.5mm pitch)
●Applications
Digital Still Cameras, Digital Video Camcorders, Portable Navigation Devices, TV, Portable DVD Players,
Portable Game Systems, Personal computers, PDA, Mobile phones
●Line up matrix
BD11600NUX
Parameter
Supply Quiescent Current
BD11601NUX
18 µA
Input voltage range
2.5~5.5 V
Switch ON Resistance ( VIN=0 V )
3 Ω
Switch ON Capacitance
2.5 Ω
6 pF
Configuration
Package
DPDT
DPST
VSON010X3020
VSON008X2020
●Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Conditions
Input supply voltage
Vmax
-0.5~7.0
V
D+,D-,1D+,1D-,2D+,2D- Pins
Input supply voltage
Vmax
-0.3~7.0
V
Other Pins
Pd
1.925
W
*1
Operating temperature range
Topr
-40~+85
℃
Storage temperature range
Tstr
-55~+150
℃
Power dissipation
*1 When using more than at Ta=25℃, it is reduced 15.4 mW per 1℃. ROHM specification board 70mm×70mm mounting.
●Operating conditions (Ta=-40~+85℃)
Parameter
Input voltage range (VCC)
Symbol
Ratings
Unit
VCC
2.5~5.5
V
Conditions
* This product does not especially designed to be protected from radioactivity.
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© 2011 ROHM Co., Ltd. All rights reserved.
1/10
2011.08 - Rev.A
Technical Note
BD11600NUX
●Electrical characteristics (Unless otherwise noted, Ta = 25C, VCC=5.0V)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Supply Quiescent Current 1
ICC1
-
1
3
µA
SW1, 2=OFF
Supply Quiescent Current 2
ICC2
-
18
40
µA
SW1=ON
Supply Quiescent Current 3
ICC3
-
19
40
µA
SW2=ON
Ron1
-
3
6
Ω
VIN=0V
Ron2
-
3.5
6
Ω
VIN=2.4V
Off-Leakage Current
Ioff
-2
0
2
µA
SW1, 2=OFF
On-Leakage Current
Ion
-2
0
2
µA
VCC>VIN, SW1, 2=ON
Switch Input Range
VIN
-0.5
-
5.5
V
SW1, 2=ON
Coff
-
4
-
pF
Con
-
6
-
pF
Input “L” level (S, OE )
VIL
-
-
0.5
V
Input “H” level (S, OE )
VIH
1.1
-
-
V
Switch ON Resistance 1
(SW1, 2)
Switch ON Resistance 2
(SW1, 2)
Switch OFF Capacitance
(SW1, 2)
Switch ON Capacitance
(SW1, 2)
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2/10
2011.08 - Rev.A
Technical Note
BD11600NUX
●Electrical characteristic curves (Reference data)
Fig.2
Eye Pattern High Speed
Fig.1
Eye Pattern Full Speed
40
3
35
2.5
30
25
ICC2 (uA)
ICC1 (uA)
2
1.5
20
15
Ta=105°C
1
Ta=25°C
Ta=105°
10
Ta=-60°
Ta=25°
0.5
Ta=-60°C
5
VCC=0V~7V
S=L, OE=H
0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
VCC (V)
4.5
5
5.5
6
6.5
VCC=0V~7V
S=L, OE=L
0
7
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
6.5
7
VCC (V)
Fig.4
ICC vs Input Voltage (SW ON)
Fig.3
ICC vs Input Voltage (SW OFF)
5
7
6
4
5
I_1D+ (uA)
RON [Ω]
3
4
Ta=105℃
3
2
Ta=25℃
2
Ta=-60℃
1
Ta=25°C
Ta=-60°C
Ta=105°C
1
VCC=5V,IO(D+)=-10mA,
VIN=0~7V,S=L,OE=L
0
0
0
0
1
2
3
4
5
6
7
1
2
3
4
5
6
7
1D+ (V)
1D+ [V]
Fig.5
Ron vs Input Voltage
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© 2011 ROHM Co., Ltd. All rights reserved.
Fig.6
Leak current vs Input Voltage(SW OFF)
3/10
2011.08 - Rev.A
Technical Note
BD11600NUX
●Block diagram and pin configuration
1D+ 1
10 VCC
1D- 2
9 S
2D+ 3
8 D+
2D- 4
7 D-
GND 5
6 OE
Fig.8
Pin configuration
Fig.7
Block diagram
●Package Dimensions
B D 1 1
6 0 0 N
LOT No.
Fig.9
Package Dimensions
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© 2011 ROHM Co., Ltd. All rights reserved.
4/10
2011.08 - Rev.A
Technical Note
BD11600NUX
●Pin Description
Pin NO.
Terminal
circuit
Pin Name
I/O
1
A
1D+
O
2
B
1D-
O
3
C
2D+
O
4
D
2D-
O
5
-
GND
-
Ground Pin.
6
E
OE
I
Bus-Switch Analog Pin.
7
F
D-
I
8
G
D+
I
9
H
S
I
Select Input Pin.
10
-
VCC
-
Power Supply.
OE
S
SW1
SW2
Signal Pass
H
L
OFF
OFF
ALL OFF
H
H
OFF
OFF
ALL OFF
L
L
ON
OFF
1D+⇔D+, 1D-⇔D-
L
H
OFF
ON
2D+⇔D+, 2D-⇔D-
Function
Analog SW terminal.
Analog SW terminal.
●Truth Table
●Equivalent Circuit
A,B,C,D
F,G
PIN
PIN
E,H
VCC
PIN
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© 2011 ROHM Co., Ltd. All rights reserved.
5/10
2011.08 - Rev.A
Technical Note
BD11600NUX
●How to select parts of application
VCC
SW1
High Speed
USB
TRANSCEIVER
1D+
D+
1D-
D-
USB
Connector
SW2
High Speed
USB
TRANSCEIVER
2D+
2D-
Control
OE
S
GND
Fig.10
Application circuit of multi-USB TRANSCEIVER
VCC
SW1
High Speed
USB
TRANSCEIVER
D+
1D+
D-
1D-
USB
HOST1
SW2
2D+
2D-
OE
S
USB
HOST2
Control
GND
Fig.11
Application circuit of two communicating with two USB HOST
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© 2011 ROHM Co., Ltd. All rights reserved.
6/10
2011.08 - Rev.A
Technical Note
BD11600NUX
●Parameter Measurement Information
VCC
1D+
D+
2D+
VIN
IIN
Control
OE
S
GND
Fig.12
SW1 ON-State ICC
Fig.13
ON-State Resistance (Ron)
Fig.14
OFF-State Leakage current
Fig.15
ON-State Leakage current
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© 2011 ROHM Co., Ltd. All rights reserved.
7/10
2011.08 - Rev.A
Technical Note
BD11600NUX
●Notes for use
(1) Absolute maximum ratings
If applied voltage (VCC), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there
is a risk of damage. Since it is not possible to identify short, open, or other damage modes, if special modes in which
absolute maximum ratings are exceeded are assumed, consider applying fuses or other physical safety measures.
(2) Recommended operating range
This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics,
it is those that are guaranteed under the conditions for each parameter. Even when these are within the
recommended operating range, voltage and temperature characteristics are indicated.
(3) Reverse connection of power supply connector
There is a risk of damaging the LSI by reverse connection of the power supply connector. For protection from reverse
connection, take measures such as externally placing a diode between the power supply and the power supply pin of
the LSI.
(4) Power supply lines
In the design of the board pattern, make power supply and GND line wiring low impedance.
When doing so, although the digital power supply and analog power supply are the same potential, separate the digital
power supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due
to the common impedance of the wiring patterns. Similarly take pattern design into account for GND lines as well.
Furthermore, for all power supply pins of the LSI, in conjunction with inserting capacitors between power supply and
GND pins, when using electrolytic capacitors, determine constants upon adequately confirming that capacitance loss
occurring at low temperatures is not a problem for various characteristics of the capacitors used.
(5) GND voltage
Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition,
confirm that there are no pins for which the potential becomes less than a GND by actually including transition
phenomena.
(6) Shorts between pins and misinstallation
When installing in the set board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is
installed erroneously, there is a risk of LSI damage. There also is a risk of damage if it is shorted by a foreign
substance getting between pins or between a pin and a power supply or GND.
(7) Operation in strong magnetic fields
Be careful when using the LSI in a strong magnetic field, since it may malfunction.
(8) Inspection in set board
When inspecting the LSI in the set board, since there is a risk of stress to the LSI when capacitors are connected to
low impedance LSI pins, be sure to discharge for each process. Moreover, when getting it on and off of a jig in the
inspection process, always connect it after turning off the power supply, perform the inspection, and remove it after
turning off the power supply. Furthermore, as countermeasures against static electricity, use grounding in the
assembly process and take appropriate care in transport and storage.
(9) Input pins
Parasitic elements inevitably are formed on an LSI structure due to potential relationships. Because parasitic
elements operate, they give rise to interference with circuit operation and may be the cause of malfunctions as well as
damage. Accordingly, take care not to apply a lower voltage than GND to an input pin or use the LSI in other ways
such that parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage
is not being applied to the LSI. Furthermore, when the power supply voltage is being applied, make each input pin a
voltage less than the power supply voltage as well as within the guaranteed values of electrical characteristics.
(10) Ground wiring pattern
When there is a small signal GND and a large current GND, it is recommended that you separate the large current
GND pattern and small signal GND pattern and provide single point grounding at the reference point of the set so that
voltage variation due to resistance components of the pattern wiring and large currents do not cause the small signal
GND voltage to change. Take care that the GND wiring pattern of externally attached components also does not
change.
(11) Externally attached capacitors
When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a
lowering of the rated capacitance due to DC bias and capacitance change due to factors such as temperature.
(12) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
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8/10
2011.08 - Rev.A
Technical Note
BD11600NUX
●Power Dissipation
2.4
2.2
Pd=1.925W
Power dissipation :Pd [W]
2
1.8
1.6
-15.4mW/℃
1.4
1.2
1
0.8
0.6
0.4
0.2
Ta_max=85℃
0
0
10
20
30
40
50 60 70 80 90 100 110 120 130 140 150
Ambient temperature :Ta [℃]
Fig.16
Power dissipation
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© 2011 ROHM Co., Ltd. All rights reserved.
9/10
2011.08 - Rev.A
Technical Note
BD11600NUX
●Ordering part number
B
D
1
Part No.
1
6
0
0
N
Part No.
U
X
-
Package
NUX:VSON010X3020
E
2
Packaging and forming specification
E2: Embossed tape and reel
VSON010X3020
<Tape and Reel information>
2.0±0.1
3.0±0.1
0.6MAX
0.4±0.1
0.5±0.1
1
5
6
10
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
(0.12)
+0.03
0.02 −0.02
S
2.0±0.1
4000pcs
0.64±0.1
C0.2
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.05 S
Tape
+0.05
0.25 −0.04
2.39±0.1
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© 2011 ROHM Co., Ltd. All rights reserved.
1pin
(Unit : mm)
Reel
10/10
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2011.08 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
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The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
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R1120A