Power Management Switch ICs for PCs and Digital Consumer Products 2ch High Side Switch ICs for USB Devices and Memory Cards BD2062FJ,BD2066FJ No.11029EBT15 ●Description High side switch for USB is a high side switch having over-current protection used in power supply line of universal serial bus (USB). Its switch unit has two channels of N-channel power MOSFET. And, over-current detection circuit, thermal shutdown circuit, under-voltage lockout and soft-start circuit are built in. ●Features 1) Dual N-MOS High Side Switch 2) Current Limit Threshold 2.4A 3) Control Input Logic Active-Low : BD2062FJ Active-High : BD2066FJ 4) Soft-Start Circuit 5) Over-Current Detection 6) Thermal Shutdown 7) Under-Voltage Lockout 8) Open-Drain Error Flag Output 9) Reverse Current Protection When Switch Off 10) Flag Output Delay Filter Built In 11) Power Supply Voltage Range 2.7V~5.5V 12) TTL Enable Input 13) 0.8ms Typical Rise Time 14) 1μA Max Standby Current ●Applications PC, PC peripheral USB hub in consumer appliances, Car accessory, and so forth ●Line Up Matrix Parameter BD2062FJ BD2066FJ Current limit threshold (A) 2.4 2.4 Control input logic Low High Number of channels 2ch 2ch SOP-J8 SOP-J8 Package www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/16 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ ●Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Ratings Unit VIN -0.3 ~ 6.0 V Enable input voltage VEN -0.3 ~ 6.0 V /OC voltage V/OC -0.3 ~ 6.0 V Supply voltage /OC sink current IS/OC ~5 mA OUT voltage VOUT -0.3 ~ 6.0 V Storage temperature TSTG -55 ~ 150 ℃ Power dissipation *1 * *1 Pd 675 mW Mounted on 70mm * 70mm * 1.6mm glass-epoxy PCB. Derating : 5.4mW/ oC above Ta=25 oC This product is not designed for protection against radioactive rays. ●Operating Conditions Parameter Operating voltage Operating temperature www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Symbol Ratings Unit Min. Typ. Max. VIN 2.7 - 5.5 V TOPR -40 - 85 ℃ 2/16 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ ●Electrical Characteristics ○BD2062FJ (Unless otherwise specified VIN = 5.0V, Ta = 25℃) Limits Parameter Symbol Min. Typ. Max. Unit Conditions Operating current IDD - 130 180 μA V/EN = 0V , OUT=OPEN Standby current ISTB - 0.01 1 μA V/EN = 5V , OUT=OPEN V/EN 2.0 - - V High input V/EN - - 0.8 V Low input I/EN -1.0 0.01 1.0 μA V/EN = 0V or V/EN = 5V /OC output low voltage V/OCL - - 0.5 V I/OC = 1mA /OC output leak current IL/OC - 0.01 1 μA V/OC = 5V /OC delay time T/OC 10 15 20 ms On-resistance RON - 80 125 mΩ IOUT = 500mA Switch leak current ILSW - - 1.0 μA V/EN = 5V, VOUT = 0V Reverse leak current ILREV - 1.0 μA VOUT = 5.5V, VIN = 0V Current limit threshold ITH 1.5 2.4 3.0 A Short circuit current ISC 1.1 1.5 2.1 A Output rise time TON1 - 0.8 10 ms RL = 10Ω Output turn-on time TON2 - 1.1 20 ms RL = 10Ω Output fall time TOFF1 - 5 20 μs RL = 10Ω Output turn-off time TOFF2 - 10 40 μs RL = 10Ω VTUVH 2.1 2.3 2.5 V Increasing VIN VTUVL 2.0 2.2 2.4 V Decreasing VIN /EN input voltage /EN input current UVLO threshold www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. - 3/16 VOUT = 0V CL = 47μF (RMS) 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ (Unless otherwise specified VIN = 5.0V, Ta = 25 ℃) Limits Parameter Symbol Min. Typ. Max. ○BD2066FJ Unit Condition Operating current IDD - 130 180 μA VEN = 5V , OUT=OPEN Standby current ISTB - 0.01 1 μA VEN = 0V , OUT=OPEN VEN 2.0 - - V High input VEN - - 0.8 V Low input IEN -1.0 0.01 1.0 μA VEN = 0V or VEN = 5V /OC output low voltage V/OCL - - 0.5 V I/OC = 1mA /OC output leak current IL/OC - 0.01 1 μA V/OC = 5V /OC delay time T/OC 10 15 20 ms On-resistance RON - 80 125 mΩ IOUT = 500mA Switch leak current ILSW - - 1.0 μA VEN = 0V, VOUT = 0V Reverse leak current ILREV - - 1.0 μA VOUT = 5.5V, VIN = 0V Current limit threshold ITH 1.5 2.4 3.0 A Short circuit current ISC 1.1 1.5 2.1 A Output rise time TON1 - 0.8 10 ms RL = 10Ω Output turn-on time TON2 - 1.1 20 ms RL = 10Ω Output fall time TOFF1 - 5 20 μs RL = 10Ω Output turn-off time TOFF2 - 10 40 μs RL = 10Ω VTUVH 2.1 2.3 2.5 V Increasing VIN VTUVL 2.0 2.2 2.4 V Decreasing VIN EN input voltage EN input current UVLO threshold www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/16 VOUT = 0V CL = 47μF (RMS) 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ ●Measurement Circuit VIN VIN 1µF 1µF A GND /OC1 IN OUT1 VEN EN1 OUT2 VEN EN2 /OC2 GND /OC1 IN OUT1 VEN EN1 OUT2 VEN EN2 /OC2 RL RL Operating current VIN VIN IOUT IOUT GND OUT1 VEN EN1 OUT2 VEN EN2 /OC2 10k 1µF GND /OC1 IN CL EN, /EN input voltage, Output rise, fall time Inrush current VDD 1µF ●Timing Diagram ○BD2062FJ 10k /OC1 IN OUT1 VEN EN1 OUT2 VEN EN2 /OC2 On-resistance, Over-current detection Fig.1 Measurement circuit IOUT IOUT /OC output low voltage ○BD2066FJ TOFF1 TOFF1 TON1 TON1 90% VOUT 90% 10% 10% TON2 TOFF2 VEN Fig.2 Timing diagram www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 90% 10% 50% 50% 90% VOUT 10% TON2 V/EN CL 50% TOFF2 50% Fig.3 Timing diagram 5/16 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ ●Electrical Characteristic Curves (Reference Data) 180 140 120 100 80 60 40 20 VIN=5V 160 140 120 100 80 60 40 20 0 4 5 6 0.4 0.2 0 -50 1 0 50 2 100 Fig.5 Operating current EN, /EN enable 2 EN INPUT VOLTAGE: VEN (V) VIN=5V 0.8 0.6 0.4 0.2 2 Low to High High to Low 1 0.5 2 100 3 /OC OUTPUT VOLTAGE: V/OC (mV) TA=25℃ 80 60 40 20 0 2 3 4 5 6 0 80 60 40 20 0 100 AMBIENT TEMPERATURE: TA (℃) Fig.13 On-resistance www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 50 100 AMBIENT TEMPERATURE: TA (℃) 100 120 VIN=5V 80 60 40 20 TA=25℃ 100 80 60 40 20 0 0 -50 0 50 2 100 3 3 2.5 2 1.5 3 4 5 SUPPLY VOLTAGE: VIN (V) Fig.14 Current limit threshold 6/16 5 6 Fig.12 On-resistance TA=25℃ 2 4 SUPPLY VOLTAGE: VIN (V) Fig.11 /OC output low voltage CURRENT LIMT THRESHOLD: ITH (A) 100 50 0.5 AMBIENT TEMPERATURE: TA (℃) VIN=5V 0 High to Low 1 Fig.9 EN, /EN input voltage 6 Fig.10 /OC output low voltage -50 Low to High Fig.8 EN, /EN input voltage SUPPLY VOLTAGE: VIN (V) 120 5 ON RESISTANCE: RON (mΩ) Fig.7 Standby current EN, /EN disable 6 1.5 SUPPLY VOLTAGE: VIN (V) AMBIENT TEMPERATURE: TA (℃) 100 4 CURRENT LIMIT THRESHOLD: ITH (A) 50 5 VIN=5V 0 -50 0 0 4 Fig.6 Standby current EN, /EN disable TA=25℃ 1.5 0 -50 3 SUPPLY VOLTAGE: VIN (V) AMBIENT TEMPERATURE: TA (℃) Fig.4 Operating current EN, /EN enable STANDBY CURRENT: IDD (uA) 0.6 EN INPUT VOLTAGE: VEN (V) 3 SUPPLY VOLTAGE: VIN (V) /OC OUTPUT VOLTAGE: V/OC (mV) 0.8 0 2 ON RESISTANCE: RON (mΩ) TA=25℃ STANDBY CURRENT: IDD (uA) OPERATING CURRENT: IDD (uA) OPERATING CURRENT: IDD (uA) 1 180 TA=25℃ 160 6 3 VIN=5V 2.5 2 1.5 -50 0 50 100 AMBIENT TEMPERATURE: TA (℃) Fig.15 Current limit threshold 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ 2 0.8 0.6 0.4 0.2 0 2 3 4 5 1.5 1 0.5 -50 0.8 0.6 0.4 0.2 0.2 3 2 1 4 5 4 5 0.2 -50 4 3 2 1 0 50 TA=25℃ 8 6 4 2 100 2 2 100 20 TA=25℃ 15 10 5 AMBIENT TEMPERATURE: TA (℃) Fig.25 Output turn-off time www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2 3 4 5 SUPPLY VOLTAGE: VIN (V) Fig.26 /OC delay time 7/16 4 5 6 Fig.24 Output turn-off time 0 0 3 SUPPLY VOLTAGE: VIN (V) /OC DELAY TIME: T/OC (ms) /OC DELAY TIME: T/OC (ms) 4 100 0 20 6 50 10 VIN=5V Fig.23 Output fall time 8 0 AMBIENT TEMPERATURE: TA (℃) AMBIENT TEMPERATURE: TA (℃) VIN=5V 50 0.4 5 Fig.22 Output fall time 0 0.6 Fig.21 Output turn-on time SUPPLY VOLTAGE: VIN (V) -50 VIN=5V Fig.20 Output turn-on time -50 6 6 0.8 6 0 0 5 0 3 TURN OFF TIME: TOFF2 (us) FALL TIME: TOFF1 (us) FALL TIME: TOFF1 (us) 1 SUPPLY VOLTAGE: VIN (V) 4 4 Fig.18 Output rise time 0.4 2 TA=25℃ 3 3 SUPPLY VOLTAGE: VIN (V) 0.6 100 Fig.19 Output rise time 2 0.2 2 0 5 0.4 100 TA=25℃ AMBIENT TEMPERATURE: TA(℃) TURN OFF TIME: TOFF2 (us) 50 0.8 0 10 0 TURN ON TIME: TON2 (ms) TURN ON TIME: TON2 (ms) RISE TIME: TON1(ms) 1 50 0.6 Fig.17 Short circuit current VIN=5V 0 0.8 AMBIENT TEMPERATURE: TA (℃) Fig.16 Short circuit current -50 TA=25℃ 0 0 6 SUPPLY VOLTAGE: VIN (V) 1 1 VIN=5V RISE TIME: TON1 (ms) TA=25℃ SHORT CIRCUIT CURRENT:ISC (A) OUTPUT RISE TIME: TON1 (ms) 1 6 VIN=5V 15 10 5 0 -50 0 50 100 AMBIENT TEMPERATURE: TA ( ℃) Fig.27 /OC delay time 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ 0.2 UVLO HYSTERESIS: VHYS(V) UVLO THRESHOLD: VUVLO (V) 2.5 2.4 VUVLOH 2.3 2.2 VUVLOL 2.1 2 -50 0 50 100 0.15 0.1 0.05 0 -50 AMBIENT TEMPERATURE: TA(℃) Fig.28 UVLO threshold voltage 0 50 100 AMBIENT TEMPERATURE: TA(℃) Fig.29 UVLO hysteresis voltage ●Waveform Data(BD2062FJ) /EN 1V/div /EN 1V/div /EN 1V/div VOUT 1V/div VOUT 1V/div VOUT 1V/div V/OC 1V/div IIN 0.5A/div VIN=5V CL=100uF RL=5Ω V/OC 1V/div VIN=5V CL=100uF RL=5Ω IIN 0.5A/div TIME 200us/div TIME 1ms/div Fig.30 Output rise characteristics Fig.31 Output fall characteristics V/OC1 1V/div IOUT1 1.0A/div CL=220uF V/OC 1V/div CL=220uF IIN 0.5A/div CL=47uF TIME 200us/div Fig.32 Inrush current CL=47uF, 100uF, 147uF, 220uF V/OC1 1V/div VIN=5V CL=220uF C=10uF RL=5Ω VOUT2 1V/div Fig.33 Inrush current VIN=5V CL=47uF IOUT1 0.5A/div TIME 200us/div TIME 5ms/div Fig.34 Over-current response ramped load VIN=5V CL=47uF RL=1Ω VOUT1 1V/div /EN 1V/div V/OC1 1V/div VOUT 1V/div VOUT1 1V/div VOC 1V/div V/OC1 1V/div IOUT1 0.5A/div IOUT1 0.5A/div VOUT2 1V/div CL=47uF VOUT1 1V/div VOUT1 1V/div VOUT2 1V/div VIN=5V RL=5Ω VIN=5V CL=47uF IOUT1 1.0A/div TIME 2ms/div Fig.35 Over-current response 1Ωload connected at enable www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TIME 2ms/div Fig.36 Over-current response enable to short circuit 8/16 V/OC2 1V/div VIN=5V CL=47uF TIME 100ms/div Fig.37 Thermal shutdown response 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ ●Block Diagram TSD1 /EN1 EN1 /OC1 Gate Logic1 Delay Charge Pump1 OCD1 IN OUT1 UVLO GND 1 OUT2 /EN2 EN2 IN 2 Charge Pump2 OCD2 7 OUT1 Top View /EN1 3 (EN1) /EN2 4 (EN2) /OC2 Gate Logic2 8 /OC1 Delay GND 6 OUT2 5 /OC2 TSD2 Fig.38 Block diagram Fig.39 Pin configuration ●Pin Description ○BD2062FJ Pin No. Symbol I/O 1 GND - Ground. 2 IN - Power supply input. Input terminal to the switch and power supply input terminal of the internal circuit. 3, 4 /EN I Enable input. Switch on at Low level. High level input > 2.0V, Low level input < 0.8V. 5, 8 /OC O Error flag output. Low at over-current, thermal shutdown. Open drain output. 6, 7 OUT O Switch output. Symbol I/O 1 GND - Ground. 2 IN - Power supply input. Input terminal to the switch and power supply input terminal of the internal circuit. 3, 4 EN I Enable input. Switch on at High level. High level input > 2.0V, Low level input < 0.8V 5, 8 /OC O Error flag output. Low at over-current, thermal shutdown. Open drain output. 6, 7 OUT O Switch output. ○BD2066FJ Pin No. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Pin function Pin function 9/16 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ ●I/O Circuit Symbol EN1(/EN1) EN2(/EN2) Pin No Equivalent circuit /EN1(EN1) /EN2(EN2) 3, 4 /OC1 /OC2 /OC1 /OC2 OUT1 OUT2 5, 8 6, 7 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. OUT1 OUT2 10/16 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ ●Functional Description 1. Switch operation IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN terminal is used also as power source input to internal control circuit. When the switch is turned on from EN/EN control input, IN terminal and OUT terminal are connected by a 100mΩ switch. In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal, current flows from OUT terminal to IN terminal. Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to prevent current from flowing reversely from OUT to IN. 2. Thermal shutdown circuit (TSD) Thermal shut down circuit have dual thermal shutdown threshold. Since thermal shutdown works at a lower junction temperature when an over-current occurs, only the switch of an over-current state become off and error flag is output. Thermal shut down action has hysteresis. Therefore, when the junction temperature goes down, switch on and error flag output automatically recover. However, until cause of junction temperature increase such as output shortcircuit is removed or the switch is turned off, thermal shut down detection and recovery are repeated. The thermal shut down circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active). 3. Over-current detection (OCD) The over-current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection circuit works when the switch is on (EN,/EN signal is active). 3-1. When the switch is turned on while the output is in short-circuit status When the switch is turned on while the output is in short-circuit status or so, the switch gets in current limit status soon. 3-2. When the output short-circuits while the switch is on When the output short-circuits or large capacity is connected while the switch is on, very large current flows until the over-current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out. 3-3. When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over-current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under-voltage lockout (UVLO) UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while the switch turns on, then UVLO shuts off the switch. UVLO has hysteresis of a 100mV(Typ). Under-voltage lockout circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active). www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/16 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ 5. Error flag (/OC) output Error flag output is N-MOS open drain output. At detection of over-current, thermal shutdown, low level is output. Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at switch on, hot plug from being informed to outside. V/EN Output shortcircuit VOUT Thermal shut down IOUT V/OC delay Fig.40 Over-current detection, thermal shutdown timing (BD2062FJ) VEN Output shortcircuit VOUT Thermal shut down IOUT V/OC delay Fig.41 Over-current detection, thermal shutdown timing (BD2066FJ) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 12/16 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ ●Typical Application Circuit 5V(Typ.) 10k~100k 10k~100k VBUS IN OUT ON/OFF GND Ferrite Beads /OC1 CL D+ OC CIN DOC Regulator GND ON/OFF Data IN /EN1 (EN1) /EN2 (EN2) OUT1 OUT2 Data /OC2 CL BD2062FJ/66FJ USB Controller Data Fig.42 Typical application circuit ●Application Information When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and GND terminal of IC. 1uF or higher is recommended. Pull up /OC output by resistance 10kΩ ~ 100kΩ. Set up value which satisfies the application as CL and Ferrite Beads. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 13/16 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ ●Power Dissipation Character (SOP-J8) 600 POWER DISSIPATION: Pd[mW] 500 400 300 200 100 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [℃] Fig.43 Power dissipation curve (Pd-Ta Curve) ●Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 14/16 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit is aimed at isolating the LSI from thermal runaway as much as possible. Do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 15/16 2011.05 - Rev.B Technical Note BD2062FJ,BD2066FJ ●Ordering part number B D 2 Part No. 0 6 2 F Part No. 2062 2066 J - Package FJ: SOP-J8 E 2 Packaging and forming specification E2: Embossed tape and reel SOP-J8 <Tape and Reel information> 4.9±0.2 (MAX 5.25 include BURR) +6° 4° −4° 6 5 0.45MIN 7 3.9±0.2 6.0±0.3 8 1 2 3 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.545 0.2±0.1 0.175 1.375±0.1 S 1.27 0.42±0.1 0.1 S 1pin Reel (Unit : mm) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 16/16 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2011.05 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A