Preliminary Data Sheet, Rev.1.1, Jan. 2009 BGA461 Silicon Germanium GPS Low Noise Amplifier RF & Protection Devices Edition 2009-01-22 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2009. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGA461 BGA461 Revision History: 2009-01-22, Rev.1.1 (Preliminary Data Sheet) Previous Version: 2008-06-27, Rev.1.0 (Target Data Sheet) Page Subjects (major changes since last revision) all Preliminary data sheet 5 Marking code defined: BU 5 Thermal resistance and maximum rating for total power dissipation corrected 6 Typical values for insertion power gain, noise figure and input return loss adjusted, IIP3 specified 7 Application information updated Preliminary Data Sheet 3 Rev.1.1, 2009-01-22 BGA461 Silicon Germanium GPS Low Noise Amplifier 1 Silicon Germanium GPS Low Noise Amplifier Features • Optimized for 1575 MHz Operation • High gain: 19.5 dB • Low Noise Figure: 1.1 dB • Supply voltage: 2.4 V to 3.2 V • 4mA current consumption • Power off function • 1 kV HBM ESD protection at all pins • B7HFM Silicon Germanium technology • RF output internally matched to 50 Ω • Low external component count • Tiny TSLP-7-4 leadless package • Moisture sensitivity level: MSL 1 • Pb-free (RoHS compliant) package 6 5 4 7 1 2 3 TSLP-7-4 Application • 1575 MHz GPS, Galileo, GPS phone VCC PON BIAS BIAS IN OUT ESD GND BGA461 _Blockdiagram .vsd Figure 1 Blockdiagram 2 Description The BGA461 is a front-end low noise amplifier for Global Positioning System (GPS) applications. The LNA provides 19.5 dB gain and 1.1 dB noise figure at a current consumption of 4 mA in the application configuration described in Chapter 4. The BGA461 is based upon Infineon Technologies‘ B7HFM Silicon Germanium technology. It operates over a 2.4 V to 3.2 V supply range. Preliminary Data Sheet 4 Rev.1.1, 2009-01-22 BGA461 Description Type Package Marking BGA461 TSLP-7-4 BU Pin Definition and Function Table 1 Pin Definition and Function Pin No. Symbol Function 1 IN LNA RF input 2 BIAS DC bias 3 n.c. not used 4 PON Power on control 5 VCC DC Supply 6 OUT LNA RF output 7 GND DC & RF ground Maximum Ratings Table 2 Maximum Ratings 1) Parameter Symbol Value Unit Voltage at pin VCC VCC VIN VBIAS VOUT VPON ICC PIN Ptot TJ TA TSTG VESD -0.3 ... 3.6 V -0.3 ... 0.9 V -0.3 ... 0.9 V -0.3 ... VCC+ 0.3 V -0.3 ... VCC+ 0.3 V 10 mA 10 dBm 90 mW 150 °C -30 ... 85 °C -65 ... 150 °C 1000 V Voltage at pin IN Voltage at pin BIAS Voltage at pin OUT Voltage at pin PON Current into pin VCC RF input power Total power dissipation, TS < 139 °C 2) Junction temperature Ambient temperature range Storage temperature range ESD capability all pins (HBM: JESD22A-114) 1) All voltages refer to GND-Node. 2) TS is measured on the ground lead at the soldering point Thermal resistance Table 3 Thermal resistance Parameter Symbol Value Unit Junction - soldering point RthJS 125 1) For calculation of RthJA please refer to Application Note Thermal Resistance K/W 1) Preliminary Data Sheet 5 Rev.1.1, 2009-01-22 BGA461 Electrical Characteristics 3 Electrical Characteristics Table 4 Electrical Characteristics1): TA = 25 °C, VCC = 2.8 V, VPON,ON = 2.8 V, VPON,OFF = 0 V, f = 1575 MHz Parameter Symbol Supply voltage VCC ICC Supply current Gain switch control voltage Gain switch control current Vpon Ipon 2 Values Unit Note / Test Condition Min. Typ. Max. 2.4 2.8 3.2 V - 4.0 - mA ON-mode - 0.2 3 μA OFF-mode 1.5 - 3.2 V ON-mode 0 - 0.5 V OFF-mode - 1.5 3 μA ON-mode - 0 1 μA OFF-mode Insertion power gain |S21| - 19.5 - dB High-gain Mode Noise figure2) NF RLin RLout 1/|S12|2 tS - 1.1 - dB ZS = 50 Ω - 11 - dB - >12 - dB - 35 - dB - 20 - μs OFF- to ON-mode - 50 - μs ON- to OFF-mode Inband input 3rd order intercept IIP3 point4) - -11 - dBm f1 = 1575 MHz f2 = f1 +/-1 MHz Inband input 1 dB compression IP1dB point - -14 - dBm - > 1.5 - Input return loss Output return loss Reverse isolation 3) Power gain settling time Stability 1) 2) 3) 4) k f = 20 MHz ... 10 GHz Measured on BGA461 application board described in Chapter 4, including PCB losses (unless noted otherwise) PCB tranmission line- and connector losses subtracted To within 1 dB of the final gain OFF- to ON-mode; to within 3 dB of the final gain ON- to OFF-mode Input Power = -40 dBm for each tone Preliminary Data Sheet 6 Rev.1.1, 2009-01-22 BGA461 Application Information 4 Application Information BGA461 C2 RFin L1 IN,1 OUT,6 BIAS,2 VCC,5 RFout L2 VCC C4 C1 R1 n.c.,3 C5, optional PON ,4 GND,7 PON C3, optional BGA 461 _Application_ Schematic.vsd Figure 2 Application Schematic BGA461 Table 5 Bill of Materials Name Value Package Manufacturer Function C1 10 nF 0402 Various LF trap C2 2.7 pF 0402 Various DC block and input matching C3 10 pF 0402 Various (optional) Control voltage filtering C4 100 pF 0402 Various Supply filtering C5 2.2 nF 0402 Various (optional) Supply filtering L1 2.2 nH LQG15H series 0402 Murata LF trap & input matching L2 33 nH LQG15H series 0402 Murata Biasing R1 4.7 kΩ 0402 Various Current adjustment N1 BGA461 TSLP-7-4 Infineon SiGe LNA A list of all application notes is available at http://www.infineon.com/cms/en/product. Preliminary Data Sheet 7 Rev.1.1, 2009-01-22 BGA461 Package Information Package Information Top view Bottom view 0.4 +0.1 1.5 ±0.05 0.05 MAX. 1.1±0.05 1.9 ±0.05 1.4 ±0.035 1) 7 3 2 1 6 x 0.3 ±0.035 1) Pin 1 marking 1) Dimension applies to plated terminal TSLP-7-4-PO V03 0.175 0.25 0.3 0.25 1.4 0.175 0.25 2.2 0.175 0.25 0.25 0.3 0.3 0.3 Copper Solder mask SMD 0.25 0.25 0.175 2.2 0.25 2.2 0.3 1.4 0.3 0.3 0.3 Copper Solder mask 0.25 Stencil apertures 0.25 0.25 1.4 0.3 NSMD 0.25 1.4 0.25 Package Dimensions for TSLP-7-4 (top, side and bottom view) 0.3 Figure 3 2.3 ±0.05 6 6 x 0.3 ±0.035 1) 5 1.1±0.035 1) 4 2.2 5 0.25 Stencil apertures TSLP-7-4-FP V01 Figure 4 Footprint TSLP-7-4 0.5 8 2.48 4 Pin 1 marking Figure 5 1.65 TSLP-7-4-TP V05 Tape & Reel Dimensions (Ø reel 330, pieces/reel 7500) Preliminary Data Sheet 8 Rev.1.1, 2009-01-22