DISCRETE SEMICONDUCTORS DATA SHEET BGB100 0 dBm TrueBlue radio module Preliminary specification 2002 Jan 03 Philips Semiconductors Preliminary specification 0 dBm TrueBlue radio module BGB100 FEATURES APPLICATIONS • Plug-and-play Bluetooth class 2 radio module, needs only external antenna and reference clock Bluetooth transceivers in: • Small dimensions (12.25 x 9.8 x 1.9 mm) • Laptop computers • Cellular phones • Fully compliant to Bluetooth Radio Specification v1.1 • Personal digital assistants • High sensitivity (typical −80 dBm) • Consumer applications. • Advanced DC offset compensation for improved reception quality • RSSI with high dynamic range • Simple interfacing to baseband controller, control by 3-wire serial bus • Internal shielding for better EMI (Electro Magnetic Interference) immunity. The interfacing to the baseband processor is very simple, which leads to a low-power solution. Control of the module operating mode is done through a 3-wire serial bus and one additional control signal. TX and RX data I/O lines are analogue-mode interfaces. A high-dynamic range RSSI output allows near-instantaneous assessment of radio link quality. Frequency selection is done internally by a conventional synthesizer. It is controlled by the same serial 3-wire bus. The synthesizer accepts reference frequencies of 12, 13, 16 and 26 MHz. This reference frequency should be supplied by an external source. This can be a dedicated (temperature compensated) crystal oscillator or be part of the baseband controller. The circuit is designed to operate from 3.0 V nominal supplies. Separate ground connections are provided for reduced parasitic coupling between different stages of the circuit. There is a basic amount of RF supply decoupling incorporated into the circuit. The envelope is a leadless SOT649A package with a plastic cap. DESCRIPTION The BGB100 TrueBlue Bluetooth radio module is a short-range radio transceiver for wireless links operating in the globally available ISM band, between 2402 and 2480 MHz. It is composed of a fully integrated, state-of-the-art near-zero-IF transceiver chip, an antenna filter for out-of-band blocking performance, a TX/RX switch, TX and RX baluns, the VCO resonator and a basic amount of supply decoupling. The device is a “Plug-and Play” module that needs no external components for proper operation. Robust design allows for untrimmed components, giving a cost-optimized solution. Demodulation is done in open-loop mode to reduce the effects of reference frequency breakthrough on reception quality. An advanced offset compensation circuit compensates for VCO drift and RF frequency errors during open-loop demodulation, under control by the baseband processor. The circuit is integrated on a ceramic substrate. It is connected to the main PCB through a LGA (Land Grid Array). The RF port has a normalized 50 Ω impedance and can be connected directly to an external antenna, with a 50 Ω transmission line. CAUTION This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B. 2002 Jan 03 2 Philips Semiconductors Preliminary specification 0 dBm TrueBlue radio module BGB100 PINNING PIN NAME 1,4,7,9, 12,17,18, 19,20,22, 23 GND 2 VS1 DESCRIPTION ground 1 supply (for VCO, buffer and synthesizer) 3 2 4 5 6 7 22 8 3 T_GFSK transmit data input 21 9 5 R_DATA received data output 20 10 6 RSSI received signal strength indicator 19 11 8 REFCLK reference clock input 10 S_DATA 11 S_EN 3-wire bus enable input 13 S_CLK 3-wire bus clock input 14 15 VS2 3-wire bus data input 18 17 16 15 14 13 12 supply (for RX part, TX part) DCXCTR DC extractor control signal 16 NC not connected 21 ANT antenna input/output Pin 23 represents the inner 5 x 4 = 20 LGA pads Fig.1 Simplified outline BLOCK DIAGRAM BGB100 PLL loop filter VCO tank Regulator T_GFSK REFCLK X2 Control logic Synthesizer S_EN Tx balun + filter Demod S_CLK DC extractor S_DATA RF IC Vs1 Vs2 Band Supply decoupling Rx balun + filter GND pass filter R_DATA DCXCTR RSSI Fig.2 Block diagram. 2002 Jan 03 Tx/Rx switch 3 ANT Philips Semiconductors Preliminary specification 0 dBm TrueBlue radio module BGB100 QUICK REFERENCE DATA VS = 3.0 V; Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER VS nominal supply voltage IS1 + IS2 total supply current CONDITIONS MIN. TYP. MAX. UNIT 2.8 3 3.6 V during RX guard space − 25 − mA during demodulation − 60 72 mA during TX guard space − 36 − mA during transmission − 34 40 mA in power-down mode − 10 60 µA Sens receiver sensitivity BER = 0.1 % under standard conditions − −80 −73 dBm Pout output power at nominal settings −4 −1.5 +4 dBm f0 RF frequency 2402 − 2480 MHz fref reference input frequency 12 − 26 MHz Tamb operating ambient temperature(1) −10 − 55 °C Note 1. In combination with the adaptive temperature-compensation scheme provided by the baseband processor FUNCTIONAL DESCRIPTION Control The BGB100 TrueBlue Bluetooth Radio Module is controlled by a baseband processor via the serial 3-wire bus. These 3 wires are data (S_DATA), clock (S_CLK) and enable (S_EN). Data sent to the device is loaded in bursts framed by S_EN. Data and clock (S_DATA and S_CLK) signals are ignored until S_EN goes low. The programmed information is read directly into the internal registers when S_EN goes high. S_DATA and S_EN should be stable around the rising edges of S_CLK. There are internal pull-down resistors on all these three pins. Only the last 32 bits serially clocked into the device are retained within the register. Additional (leading) bits are ignored, and no check is made on the number of bits received. The data format is shown in table 1. The first data bit entered is b31, the last one b0. The S_EN high-to-low transition also controls the opening of the PLL. A short S_EN high pulse at the end of a time slot, either TX or RX, serves to reset and power-down the IC. This can be omitted, at the cost of extra power consumption. In addition to the 3-wire serial bus, there is one control signal used for accurate timing of functions within the IC, under control by the baseband processor. This is the DCXCTR signal, to control (in RX mode) the three subsequent operating modes of the DC compensation circuit: coarse offset estimation during the early part of the Access Code, accurate offset estimation during the Barker sequence and the trailer, retention of the offset information during the payload. Transmit mode The BGB100 TrueBlue Bluetooth Radio Module contains a fully integrated transmitter function. The RF channel frequency is selected in a conventional synthesizer, which is controlled via the serial 3-wire bus. The VCO is directly modulated by the signal present on the T_GFSK connection. The Gaussian filtering should therefore be performed externally. The DC bias voltage for this pin should already be present during the S_EN programming pulse, so that the PLL can correct for possible frequency errors that might otherwise occur. Also in RX mode, this pin should be connected to a well-defined and stable DC voltage. The robust design of the VCO makes it unnecessary to trim its freerunning frequency. This leads to a lower component cost. A carefully designed PLL loop filter keeps frequency drift during open-loop modulation down to a very low value. 2002 Jan 03 4 Philips Semiconductors Preliminary specification 0 dBm TrueBlue radio module BGB100 The output stage of the transmit chain active part is balanced, for reduced spurious emissions (EMC). It is connected through a balun (balanced-to-unbalanced) circuit to the TX/RX switch. This switch is controlled by internal logic circuits in the active die. The balun circuit has built-in selectivity, to further reduce out-of-band spurious emissions. Receive mode Also the receiver functionality is fully integrated. It is a near-zero-IF (1 MHz) architecture with active image rejection. The sensitive RX input of the active die is a balanced configuration, in order to reduce unwanted (spurious) responses. The balun structure to convert from unbalanced to balanced signals has built-in selectivity. This suppresses GSM-900 frequencies by more than 40 dB. For better immunity to DCS, DECT, GSM-1800 and W_CDMA signals, an extra band-pass filter has been included. The synthesizer PLL may be switched off during demodulation. This reduces the effects that reference frequency breakthrough may have on receiver sensitivity and adjacent channel selectivity, and also reduces the power consumption. The demodulator contains an advanced DC offset compensation circuit. This reduces the effects of frequency mismatch between (remote) transmitter and receiver. These may be caused by differences in reference frequency, but also by frequency drift during open-loop modulation and demodulation. Because the VCO is directly modulated by the signal present at the T_GFSK pin, this pin should be connected to a well-defined and stable DC bias voltage, also when in RX mode. Moreover, this bias voltage should already be present during the S_EN programming pulse. In this way, the PLL can correct for possible frequency offsets that might otherwise occur. The demodulated RF signal is compared against a reference (slicer) value and then output. This reference voltage is derived from the demodulated output signal itself, by the DC extractor circuit. It operates in three subsequent phases, controlled by the DCXCTR signal: • In the first phase, during the preamble and the early part of the Acess Code, a Min/Max detector provides a crude but fast estimate of the required DC voltage. The DCXCTR line should be low during this phase. • When the DCXCTR line is pulled high, this crude estimate is used as an initial estimate for an integrator circuit that provides an accurate estimate of the required DC voltage. This is the second phase. The DC value obtained is derived from the Barker sequence and the trailer, which together make up the final 10 bits of the Acess Code. The DCXCTR line should be pulled high 20 µs before the trailer sequence is expected to end (there is a ±10 µs timing uncertainty between the expected and the actual end of the trailer sequence). • Exactly at the end of the trailer, the DCXCTR line must be pulled low again. The device now enters the third phase, during which the estimate of the offset voltage that was obtained during phases one and two is retained. A small and slow variation to compensate carrier frequency drift can still be tracked. An RSSI output with a high dynamic range of more than 50 dB provides near-instantaneous information on the quality of the signal received. Due to the IF frequency at 1 MHz, in RX mode the VCO frequency should be 1 MHz higher than the channel frequency. This should be taken care of by the baseband controller. Power-down mode In Power-down mode, current consumption is reduced to below 60 µA. The 3-wire bus inputs present a high-ohmic resistance to ground. 2002 Jan 03 5 Philips Semiconductors Preliminary specification 0 dBm TrueBlue radio module Table 1 BGB100 Bit allocation REGISTER BIT ALLOCATION(1) Data field FIRST IN b31 b30 b29 b28 b20 b26 b25 (2) 0 0 b24 (2) b23 (2) b22 b21 b20 b19 b18 b17 b16 0 0 0 1 1 0 (2) 0 0 0 1 0 1 0 1 b14 b13 b12 b11 b10 b9 b8 b7 to b0 (7) 0 ref1 ref0 pwr1 pwr0 pll see below LAST IN see b15 above 0 (3) (3) (4) (4) main divider programming (8) trx (5) (6) Notes 1. In normal operation, 32 bits are programmed into the register. 2. bits b26 to b23 can be used for adaptive temperature compensation by the baseband. 3. ref: bits ‘ref1’ and ‘ref0’ define the reference frequency (see Table 3). 4. pwr: bits ‘pwr1’ and ‘pwr0’ define the the typical output power (see Table 4). 5. trx: bit ‘trx’ = 1 forces the IC into RX mode. 6. pll: bit ‘pll’ = 1 forces the synthesizer PLL to remain on during the entire (TX or RX) slot. 7. Bit b7 is the MSB of the frequency control word composed of (b7, b6, b5, b4, b3, b2, b1 and b0). 8. The VCO frequency is equal to 2304 + d[b7:b0] (see Table 2). Table 2 b7 Channel frequency programming examples b6 b5 b4 b3 b2 b1 b0 Binary equivalent of n MAIN DIVIDER RATIO SYNTHESIZED FREQUENCY (MHz) 2304 + n 1.0 × (2304 +n) CHANNEL FREQUENCY 0 1 1 0 0 0 1 0 2402 2402 TX channel 1 0 1 1 0 0 0 1 1 2403 2403 RX channel 1 TX channel 2 1 0 1 1 0 0 0 0 2480 2480 RX channel 78 TX channel 79 1 0 1 1 0 0 0 1 2481 2481 RX channel 79 Table 3 Reference frequency programming 2002 Jan 03 b13 b12 REFERENCE DIVIDER RATIO REFERENCE INPUT FREQUENCY 0 0 12 12 MHz 0 1 16 16 MHz 1 0 13 13 MHz 1 1 26 26 MHz 6 Philips Semiconductors Preliminary specification 0 dBm TrueBlue radio module Table 4 BGB100 Typical output programming b11 b10 TYPICAL OUTPUT POWER 0 0 −4.5 dBm 0 1 −1.5 dBm (nominal value) 1 0 1.5 dBm 1 1 3.5 dBm LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. −0.3 VS1, VS2 supply voltage input control pin voltage ∆GND difference in ground supply voltage between ground pins Ptot total power dissipation − PD drive power at receiver input Tstg storage temperature Tj junction temperature MAX. UNIT 3.6 V −0.3 VS V − 0.01 V tbd W − 0 dBm −55 85 °C − 150 °C THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient VALUE UNIT tbd K/W SPURIOUS EMISSIONS The conducted and radiated out-of-band spurious emissions in all operating modes are fully compliant with the Regulatory Requirement FCC Part 15.247,C and ETS 300 328 (subclause 5.2.4.). ESD PRECAUTIONS Inputs and outputs are protected against electrostatic discharge (ESD) during handling and mounting. A human-body model (HBM) and a machine model (MM) are used for ESD susceptibility testing. All pins withstands the following threshold voltages: PARAMETER ESD threshold voltage 2002 Jan 03 METHOD VALUE CLASS HBM (JESD22-A114-B) ≥3500 V 2 MM (JESD22-A115-A) ≥300 V 2 7 Philips Semiconductors Preliminary specification 0 dBm TrueBlue radio module BGB100 CHARACTERISTICS VCC = 3.0 V;Tamb = 25 °C; fdev = 160 kHz; unless otherwise specified. Characteristics for which only a typical value is given are not tested. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VS1, VS2 nominal supply voltage IS1 + IS2 total supply current 2.8 3.0 3.6 V during RX guard space − 25 − mA during RX (PLL off) − 60 72 mA during TX guard space − 36 − mA during TX (PLL off) − 34 40 mA power-down mode − 10 60 µA Frequency selection fref reference input frequency ∆fref reference frequency inaccuracy Vref(min) sinusoidal input signal level RMS value 250 − 500 mV Ri input resistance (real part of the input impedance) at 13MHz − 2 − kΩ Ci input capacitance (imaginary part of the input impedance) at 13MHz − 2.5 − pF ∆f1 slot carrier drift over 1 TX slot −25 0 25 kHz over 3, 5 TX slots (DM3, DH3, DM5, DH5 packets) −40 0 40 kHz −75 0 75 kHz across entire band − 150 200 µs ∆f3, 5 slots ICFT Initial Carrier Frequency Tolerance tPLL PLL settling time 12,13, 16,26 tbd − MHz tbd ppm Transmitter performance fRF RF frequency over full temperature and supply range 2402 − 2480 MHz kMOD VCO modulation gain from T_GFSK (pad 3) to antenna (pad 21): note 2 − 400 − kHz/V Po output power wanted channel; bits b11, b10 = 0, 1 −4 −1.5 4 dBm Po 1 MHz adjacent channel output power at 1 MHz offset; measured in 100 kHz bandwidth; referred to wanted channel − − −20 dBc VSWR voltage standing wave ratio normalized to Zo = 50 Ω − 1.5 − H1, VCO VCO frequency feedtrough referred to wanted output level; fRF = 2450 MHz; fVCO = 1225 MHz − tbd tbd dBc − tbd tbd dBc − tbd tbd dBc − tbd tbd dBc 3rd H3, VCO VCO H4, VCO VCO 4th harmonic H6, VCO 2002 Jan 03 VCO 6th harmonic harmonic 8 Philips Semiconductors Preliminary specification 0 dBm TrueBlue radio module SYMBOL PARAMETER out of band spurious emissions (conducted) BGB100 CONDITIONS 30 MHz to 1 GHz MIN. − TYP. tbd MAX. −36 UNIT dBm 1 GHz to 12.75 GHz − tbd −30 dBm 1.8 GHz to 1.9 GHz − tbd −47 dBm 5.15 GHz to 5.3 GHz − tbd −47 dBm without carrier offset − −80 −73 dBm with carrier offset up to ±55 kHz under extreme test conditions − − −70 dBm dBm Receiver performance SENS sensitivity for BER = 0.1 % Pi max maximum input power in one channel BER < 0.1 % −20 − − VSWR voltage standing wave ratio normalized to Zo = 50 Ω − 1.5 − fRF RF input frequency over full temperature and supply range 2402 − 2480 MHz VRSSI RSSI voltage (monotonic over range −86 dBm to −36 dBm) Pin = −86 dBm − 0.5 − V Pin = −36 dBm − 1.3 − V Ton wake up time from the power up signal to correct RSSI output No external capacitor on the RSSI pin; Rload > tbf kΩ − tbd 50 µs IM3 intermodulation rejection wanted signal −64 dBm; Interferers 5 and 10 channels away; BER < 0.1 % − 25 − dBc RCO co-channel rejection wanted signal −60dBm; BER < 0.1 % −14 −11 − dBc RC/I 1MHz adjacent channel rejection (± 1 MHz) wanted signal −60dBm; BER < 0.1 % −4 0 − dBc RC/I −2MHz bi-adjacent channel rejection (N-2) wanted signal −60dBm; BER < 0.1 % 30 35 − dBc RC/I Image rejection at image frequency (N+2) wanted signal −60dBm; BER < 0.1 % 6 10 − dBc RC/I Image rejection at image-adjacent frequency (N+3) wanted signal −67dBm; BER < 0.1 % 16 20 − dBc RC/I ≥3MHz in-band interference rejection ratio, three or more channels away, except (N+3) and spurious response frequencies wanted signal −67dBm; BER < 0.1 % 40 − − dBc RC/I spurious rejection at five spurious response frequencies in the range [2400 MHz to (N−3) or (N+4) to 2480 MHz] wanted signal −67dBm; BER < 0.1 % 37 40 − dBc 1MHz 2002 Jan 03 9 Philips Semiconductors Preliminary specification 0 dBm TrueBlue radio module SYMBOL PARAMETER out of band blocking spurious emissions FTLOrf BGB100 LO to RF feedthrough CONDITIONS MIN. TYP. MAX. UNIT wanted signal −67dBm; CW interferer level range 30 MHz to 2 GHz −10 − − dBm range 2 GHz to 2400 MHz −27 − − dBm range 2500 MHz to 3 GHz −27 − − dBm range 3 GHz to 12.75 GHz −10 − − dBm wanted signal −67dBm; GSM − modulated signal between 880 and 915 MHz (GSM−900 uplink) tbd − dBm wanted signal −67dBm; GSM modulated signal between 1800 and 1785 MHz (GSM−1800 uplink) tbd − dBm − 30 MHz to 1 GHz − tbd −36 dBc 1 GHz to 12.75 GHz − tbd −30 dBc measured at 2450MHz − tbd −47 dBc V Interface (logic) inputs and outputs; pins S_DATA, S_CLK, S_EN, DCXCTR, R_DATA, T_GFSK 1.4 − VS − − 0.4 V −5 − 5 µA note 4 − 10 − MHz minimum S_EN pulse duration to switch off the module: note 3 − 1 − µs VOH HIGH-level output voltage for R_DATA output 2.1 − 2.4 V VOL LOW-level output voltage for R_DATA output −0.3 − 0.4 V RR_DATA, load real part of the R_DATA load admittance at 500 kHz − tbd − Ω CR_DATA, load imaginary part of the R_DATA load admittance at 500 kHz − 10 30 pF VT_GFSK,DC T_GFSK DC voltage note 2 − 1 − V RT_GFSK,in real part of the T_GFSK input admittance at 500 kHz − tbd − Ω CT_GSFK, in imaginary part of the T_GFSK input admittance at 500 kHz − tbd − pF VIH HIGH-level input voltage VIL LOW-level input voltage Ibias input bias current HIGH or LOW level fS_CLKmax maximum 3-wire bus frequency tS_ENmin note 3 Notes 1. The actual VCO frequency is one-half the programmed frequency. It is doubled internally. 2. T_GFSK is DC coupled. The DC voltage must be supplied by the baseband processor. 3. VIH should never exceed 3.6V. 4. See detailed timing information. 2002 Jan 03 10 Philips Semiconductors Preliminary specification 0 dBm TrueBlue radio module BGB100 TIMING DIAGRAMS S_DATA 31 30 29 2 1 0 S_CLK S_EN t3 32 clock cycles 3-wire serial bus timing TX packet RX packet S_CLK/DATA REFCLK t1 t1 t2 t2 S_EN t3 t4 T_GFSK t8 t5 t7 t3 t4 t6 t9 R_DATA t10 DCXCTR t11 Fig.3 Timing diagram. 2002 Jan 03 11 t12 t7 Philips Semiconductors Preliminary specification 0 dBm TrueBlue radio module BGB100 Timing Parameters PARAMETER DESCRIPTION CONDITIONS MIN. TYP. UNIT t1 S_DATA last bit to REFCLK enable 0.1 − µs t2 S_EN falling edge to REFCLK disable − 2 µs t3 S_DATA last bit to S_EN rising edge 0.1 − µs t4 S_EN width 180 185 µs t5 T_GFSK last bit to S_EN pulse start − 2 µs t6 R_DATA last bit to S_EN pulse start − 2 µs t7 S_EN pulse width note 2 − 2 µs note 3 note 1 t8 S_DATA last bit to T_GFSK DC bias 0.1 − µs t9 S_EN falling edge to T_GFSK first data bit − 2 µs t10 S_EN falling edge to R_DATA earliest data bit 15 20 µs t11 S_EN falling edge to DCXCTR high note 4 − 64 µs t12 DCXCTR width note 5 − 20 µs Notes 1. The S_EN signal going high switches the synthesiser on if preceded by S_DATA / S_CLK activity; the S_EN signal going low disables the synthesizer in order to perform open-loop modulation or demodulation. Simultaneously, it enables the receiver chain in RX mode. The length of the S_EN signal should be long enough for the synthesizer loop to settle. 2. A single short S_EN pulse (without preceding S_DATA / S_CLK activity) serves to power-down the IC. It may be omitted at the cost of increased power consumption. Any subsequent S_EN pulse without preceding S_DATA / S_CLK activity toggles between power-up and power-down states, but brings the module into an undefined power-up state. This mode should be avoided. 3. Because the VCO is directly modulated by the T_GFSK signal, the DC level on this pin should be present early on during the synthesizer settling phase. Also in RX mode, there should be a well-defined and stable DC voltage on this pin. 4. The DCXCTR signal should go high 20 µs before the expected end of the trailer sequence. 5. The DCXCTR signal should go low at the actual end of the trailer sequence. The timing for this transition should be directly derived from the Acess Code detection algorithm inside the baseband processor. 2002 Jan 03 12 Philips Semiconductors Preliminary specification 0 dBm TrueBlue radio module BGB100 SOLDERING The indicated temperatures are those at the solder interfaces. MGM159 300 Advised solder types are types with a liquidus less than or equal to 210 °C. handbook, halfpage T (°C) Solder dots or solder prints must be large enough to wet the contact areas. 200 Soldering can be carried out using a conveyor oven, a hot air oven, an infrared oven or a combination of these ovens. A double reflow process is permitted. Hand soldering is not recommended because of the nature of the contacts. 100 The maximum allowed temperature is 250 °C for a maximum of 5 seconds. The maximum ramp-up is 10 °C per second. 0 0 The maximum cool-down is 5 °C per second. 1 2 3 4 t (min) 5 Fig.5 Recommended reflow temperature profile. Cleaning The following fluids may be used for cleaning: • Alcohol • Bio-Act (Terpene Hydrocarbon) Packing • Acetone. An extended packing / SMD specification can be found in document RNR-T49D-2183. Ultrasonic cleaning should not be used since this can cause serious damage to the product. 2002 Jan 03 13 Philips Semiconductors Preliminary specification 0 dBm TrueBlue radio module BGB100 PACKAGE OUTLINE 1 SOT649A 2 3 4 5 6 7 22 8 21 9 20 10 19 11 Fig.6 18 2002 Jan 03 17 16 15 14 13 12 14 Philips Semiconductors Preliminary specification 0 dBm TrueBlue radio module BGB100 DATA SHEET STATUS DATA SHEET STATUS(1) PRODUCT STATUS(2) DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2002 Jan 03 15 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. © Koninklijke Philips Electronics N.V. 2001 SCA73 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands budgetnum/ed/pp16 Date of release: 2002 Jan 03 Document order number: 9397 750 09278