VISHAY SI7495DP

Si7495DP
Vishay Siliconix
New Product
P-Channel 12-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
rDS(on) (W)
ID (A)
0.0065 @ VGS = - 4.5 V
- 21
D TrenchFETr Power MOSFET
D New Low Thermal Resistance PowerPAKr
Package with Low 1.07-mm Profile
0.008 @ VGS = - 2.5 V
- 19
APPLICATIONS
0.011 @ VGS = - 1.8 V
- 16
D Load Switch
VDS (V)
- 12
PowerPAK SO-8
S
S
6.15 mm
1
2
5.15 mm
S
3
G
S
4
G
D
8
7
D
6
D
5
D
D
P-Channel MOSFET
Bottom View
Ordering Information: Si7495DP-T1
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
- 12
Gate-Source Voltage
VGS
"8
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 70_C
Pulsed Drain Current
ID
continuous Source Current (Diode Conduction)a
IS
TA = 25_C
Maximum Power Dissipationa
TA = 70_C
Operating Junction and Storage Temperature Range
PD
V
- 13
- 21
- 17
IDM
- 10
- 50
- 4.5
- 1.6
5
1.8
3.2
1.1
TJ, Tstg
Unit
- 55 to 150
A
W
_C
THERMAL RESISTANCE RATINGS
Parameter
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Case (Drain)
Symbol
t v 10 sec
Steady State
Steady State
RthJA
RthJC
Typical
Maximum
20
25
54
68
1.7
2.2
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 72277
S-31417—Rev. A, 07-Jul-03
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Si7495DP
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = - 1 mA
- 0.4
Typ
Max
Unit
- 0.9
V
"100
nA
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
VDS = - 9.6 V, VGS = 0 V
-1
VDS = - 9.6 V, VGS = 0 V, TJ = 70_C
- 10
VDS v - 5 V, VGS = - 4.5 V
Voltagea
mA
- 40
A
VGS = - 4.5 V, ID = - 21 A
0.0054
0.0065
VGS = - 2.5 V, ID = - 19 A
0.0065
0.008
VGS = - 1.8 V, ID = - 16 A
0.0088
0.011
gfs
VDS = - 15 V, ID = - 21 A
80
VSD
IS = - 4.5 A, VGS = 0 V
- 0.65
- 1.1
93
140
rDS(on)
Forward Transconductancea
Diode Forward
VDS = 0 V, VGS = "8 V
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate-Resistance
Turn-On Delay Time
Rise Time
VDS = - 6 V, VGS = - 5 V, ID = - 21 A
nC
22
RG
2.7
td(on)
100
150
200
300
350
530
230
350
110
165
tr
Turn-Off Delay Time
10.5
VDD = - 6 V, RL = 6 W
ID ^ - 1 A, VGEN = - 4.5 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
IF = - 2.9 A, di/dt = 100 A/ms
W
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
50
50
VGS = 5 thru 2 V
40
I D - Drain Current (A)
I D - Drain Current (A)
40
30
1.5 V
20
10
30
20
TC = 125_C
10
25_C
- 55_C
0
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
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2
5
0
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
VGS - Gate-to-Source Voltage (V)
Document Number: 72277
S-31417—Rev. A, 07-Jul-03
Si7495DP
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Capacitance
11000
0.016
8800
Ciss
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
On-Resistance vs. Drain Current
0.020
0.012
VGS = 1.8 V
0.008
VGS = 2.5 V
0.004
VGS = 4.5 V
6600
4400
Coss
2200
0.000
Crss
0
0
8
16
24
32
40
0
2
4
ID - Drain Current (A)
Gate Charge
10
12
On-Resistance vs. Junction Temperature
1.6
VDS = 6 V
ID = 21 A
5
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
8
VDS - Drain-to-Source Voltage (V)
6
4
3
2
VGS = 4.5 V
ID = 21 A
1.4
1.2
1.0
0.8
1
0
0
22
44
66
88
0.6
- 50
110
- 25
0
Qg - Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.030
r DS(on) - On-Resistance ( W )
TJ = 150_C
10
TJ = 25_C
1
0.1
0.0
25
TJ - Junction Temperature (_C)
50
I S - Source Current (A)
6
ID = 21 A
0.024
0.018
0.012
0.006
0.000
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
Document Number: 72277
S-31417—Rev. A, 07-Jul-03
1.2
0
1
2
3
4
5
VGS - Gate-to-Source Voltage (V)
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Si7495DP
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power, Juncion-To-Ambient
0.4
100
80
ID = 1 mA
0.2
Power (W)
V GS(th) Variance (V)
0.3
0.1
60
40
0.0
20
- 0.1
- 0.2
- 50
0
- 25
0
25
50
75
100
125
150
0.001
0.01
TJ - Temperature (_C)
1
10
Safe Operating Area, Junction-to-Case
100
Limited by rDS(on)
1 ms
10
I D - Drain Current (A)
0.1
Time (sec)
10 ms
100 ms
1
1s
10 s
dc
0.1
TC = 25_C
Single Pulse
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 65_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 -4
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10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 72277
S-31417—Rev. A, 07-Jul-03
Si7495DP
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Case
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
Document Number: 72277
S-31417—Rev. A, 07-Jul-03
10 -3
10 -2
10 -1
Square Wave Pulse Duration (sec)
1
10
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