DMN3032LE NEW PROD UC T Product Summary Description

DMN3032LE
30V N-CHANNEL ENHANCEMENT MODE MOSFET
NEW PRODUCT
Product Summary
V(BR)DSS
RDS(on) max
30V
29mΩ @ VGS = 10V
35mΩ @ VGS = 4.5V
Features and Benefits
ID
TA = +25°C
5.6A
4.8A
Description
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(ON)) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
•
Low On-Resistance
•
Low Input Capacitance
•
Fast Switching Speed
•
Low Input/Output Leakage
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
•
Halogen and Antimony Free. “Green” Device (Note 3)
•
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
•
Case: SOT223
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0 (Note 1)
Applications
•
Moisture Sensitivity: Level 1 per J-STD-020
•
DC Motor Control
•
Terminals Connections: See diagram below
•
DC-AC Inverters
•
Terminals: Finish - Matte Tin annealed over Copper lead frame.
Solderable per MIL-STD-202, Method 208
•
Weight: 0.112 grams (approximate)
D
SOT223
G
S
Top View
Equivalent Circuit
Pin Out - Top View
Ordering Information (Note 4)
Part Number
DMN3032LE-13
Notes:
Qualification
Standard
Case
SOT223
Packaging
2,500 / Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
YWW
N3032L
DMN3032LE
Document number: DS36695 Rev. 2 - 2
YWW
N3032L
= Manufacturer’s Marking
N3032L = Marking Code
YWW = Date Code Marking for SAT (Shanghai Assembly/ Test site)
YWW = Date Code Marking for CAT (Chengdu Assembly/ Test site)
Y or Y= Year (ex: 3 = 2013)
WW = Week (01 - 53)
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DMN3032LE
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
NEW PRODUCT
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
30
V
Gate-Source Voltage
VGSS
±20
V
TA = +25°C
TA = +70°C
ID
5.6
4.1
A
TC = +25°C
TC = +70°C
ID
15.4
12.1
A
IS
1.5
A
IDM
25
A
Continuous Drain Current (Note 5) VGS = 10V
Maximum Continuous Body Diode Forward Current (Note 5)
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
TA = +25°C
TA = +70°C
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Case (Note 5)
Operating and Storage Temperature Range
Value
1.8
1.1
Units
RθJA
69
°C/W
PD
14
W
RθJC
8.7
°C/W
TJ, TSTG
-55 to +150
°C
PD
W
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 6)
Symbol
Min
Typ
Max
Unit
Test Condition
Drain-Source Breakdown Voltage
BVDSS
30
—
—
V
VGS = 0V, ID = 250µA
Zero Gate Voltage Drain Current
IDSS
—
—
1
µA
VDS = 30V, VGS = 0V
Gate-Source Leakage
IGSS
—
—
±100
nA
VGS = ±20V, VDS = 0V
V
VDS = VGS, ID = 250µA
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
VGS(th)
RDS (ON)
1
—
2
—
22
29
—
27
35
mΩ
VGS = 10V, ID = 3.2A
VGS = 4.5V, ID = 2.8A
Forward Transfer Admittance
|Yfs|
—
7
—
S
VDS = 5V, ID = 5.8A
Diode Forward Voltage
VSD
—
0.7
1.5
V
VGS = 0V, IS = 1A
Input Capacitance
Ciss
—
498
—
Output Capacitance
Coss
—
52
—
pF
Reverse Transfer Capacitance
Crss
—
45
—
VDS = 15V, VGS = 0V
f = 1MHz
Gate Resistnace
Rg
—
2.2
—
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge
Qg
—
11.3
—
Gate-Source Charge
Qgs
—
1.4
—
nC
VDS = 15V, VGS = 10V, ID = 5.8A
Gate-Drain Charge
Qgd
—
2.1
—
Turn-On Delay Time
tD(on)
—
2.3
—
Turn-On Rise Time
tr
—
3.9
—
Turn-Off Delay Time
tD(off)
—
10
—
ns
VDS = 15V, VGS = 10V,
RL = 2.6Ω, RG = 3Ω
tf
—
1.9
—
DYNAMIC CHARACTERISTICS (Note 7)
Turn-Off Fall Time
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate
6 .Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing.
DMN3032LE
Document number: DS36695 Rev. 2 - 2
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DMN3032LE
20.0
20
VGS = 8V
VDS = 5.0V
VGS = 4.0V
VGS = 3.0V
15
ID , DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS = 2.5V
5.0
VGS = 1.8V
T A = 85°C
TA = 25°C
0.5
1
1.5 2 2.5 3 3.5 4 4.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristic
5
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.18
0.16
VGS = 2.5V
0.14
0.12
0.1
0.08
0.06
0.04
VGS = 4.5V
0.02
VGS = 8V
0
2
TA = -55°C
5
0
0
0.2
0
TA = 125°C
VGS = 2.0V
4
6
8 10 12 14 16 18
ID, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
0
0.5
1 1.5 2 2.5 3 3.5 4 4.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
5
0.2
0.18
ID = 5.8A
0.16
0.14
0.12
0.1
ID = 4.8A
0.08
0.06
0.04
0.02
20
0
2
4
6
8
10 12 14 16 18
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4 Typical Transfer Characteristic
20
2
0.080
VGS = 4.5V
0.070
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.0
TA = 150°C
10
10.0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
NEW PRODUCT
15.0
0.060
T A = 150°C
0.050
T A = 125°C
0.040
TA = 85°C
0.030
TA = 25°C
0.020
TA = -55°C
0.010
0.000
0
2
4
6
8 10 12 14 16 18
ID, DRAIN CURRENT (A)
Figure 5 Typical On-Resistance vs.
Drain Current and Temperature
DMN3032LE
Document number: DS36695 Rev. 2 - 2
20
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VGS = 10V
ID = 10A
1.5
VGS = 4.5V
ID = 5A
1
0.5
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
May 2014
© Diodes Incorporated
DMN3032LE
2
VGS = 4.5V
ID = 5A
0.04
1.8
VGS(th), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.05
0.03
VGS = 10 V
ID = 10A
0.02
0.01
1.6
1.4
ID = 250µA
1
0.8
0.6
0.4
0.2
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 7 On-Resistance Variation with Temperature
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 8 Gate Threshold Variation vs. Ambient Temperature
1000
20
16
14
TA = 150°C
12
TA = 125°C
T A = 85°C
10
100
T A = 25°C
8
TA = -55°C
6
Ciss
CT, JUNCTION CAPACITANCE (pF)
18
IS, SOURCE CURRENT (A)
ID = 1mA
1.2
0
-50
4
Coss
Crss
2
f = 1MHz
0
0
0.3
0.6
0.9
1.2
1.5
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9 Diode Forward Voltage vs. Current
10
0
5
10
15
20
25
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10 Typical Junction Capacitance
30
10
VGS GATE THRESHOLD VOLTAGE (V)
NEW PRODUCT
0.06
VDS = 15V
ID = 5.8A
8
6
4
2
0
0
2
4
6
8
10
Qg, TOTAL GATE CHARGE (nC)
Figure 11 Gate Charge
DMN3032LE
Document number: DS36695 Rev. 2 - 2
12
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DMN3032LE
NEW PRODUCT
r(t), TRANSIENT THERMAL RESISTANCE
1
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
D = 0.005
RθJA(t) = r(t) * RθJA
RθJA = 99°C/W
Duty Cycle, D = t1/ t2
D = Single Pulse
0.001
0.0001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 12 Transient Thermal Resistance
100
1000
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
D
Q
b1
C
E
SOT223
Dim Min Max Typ
A
1.55 1.65 1.60
A1 0.010 0.15 0.05
b
0.60 0.80 0.70
b1
2.90 3.10 3.00
C
0.20 0.30 0.25
D
6.45 6.55 6.50
E
3.45 3.55 3.50
E1
6.90 7.10 7.00
e
4.60
e1
2.30
L
0.85 1.05 0.95
Q
0.84 0.94 0.89
All Dimensions in mm
E1
Gauge
Plane
0.25
Seating
Plane
e1
L
b
0°
e
A1
7°
7°
A
°
10
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X1
Y1
C1
Y2
X2
DMN3032LE
Document number: DS36695 Rev. 2 - 2
Dimensions
X1
X2
Y1
Y2
C1
C2
Value (in mm)
3.3
1.2
1.6
1.6
6.4
2.3
C2
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DMN3032LE
IMPORTANT NOTICE
NEW PRODUCT
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
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DMN3032LE
Document number: DS36695 Rev. 2 - 2
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