Marking Information - Diodes Incorporated

ZXMP6A13FQ
60V P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features
Description
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This MOSFET utilizes a unique structure that combines the benefits
of low on-resistance with fast switching speed, making it ideal for
high-efficiency power management applications.
Mechanical Data
V(BR)DSS
Max RDS(on)
-60V
400mΩ @ VGS = -10V
600mΩ @ VGS = -4.5V
Max ID
TA = +25°C
-1.1A
-0.9A
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Applications
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DC - DC converters
Power management functions
Relay and solenoid driving
Motor control

Fast switching speed
Low input capacitance
Low gate charge
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Available
Case: SOT23
Case Material: Molded Plastic, UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208
Weight: 0.008 grams (approximate)
SOT23
D
S
G
D
G
S
Equivalent Circuit
Top View
Pin Out
Top View
Ordering Information (Notes 4 & 5)
Product
ZXMP6A13FQTA
Notes:
Compliance
Automotive
Case
SOT23
Quantity per reel
3,000 Units
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally
the same, except where specified.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html
Marking Information
7P6
ZXMP6A13FQ
Document Number DS36684 Rev. 2 - 2
7P6 = Product Type Marking Code
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ZXMP6A13FQ
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
VGS = 10V
TA = +70°C
Pulsed Drain Current (Note 8)
Continuous Source Current (Body Diode) (Note 7)
Pulsed Source Current (Body Diode) (Note 8)
(Note 7)
(Note 7)
(Note 6)
ID
IDM
IS
ISM
Value
-60
±20
-1.1
-0.8
-0.9
-4.0
-1.2
-4.0
Units
V
V
Value
625
5
806
6.5
200
155
194
-55 to +150
Unit
mW
mW/°C
mW
mW/°C
°C/W
°C/W
°C/W
°C
A
A
A
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Power Dissipation (Note 6)
Linear Derating Factor
Power Dissipation (Note 7)
Linear Derating Factor
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Ambient (Note 7)
Thermal Resistance, Junction to Leads (Note 9)
Operating and Storage Temperature Range
Notes:
Symbol
PD
PD
RθJA
RθJA
RθJL
TJ, TSTG
6. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
7. For a device surface mounted on FR4 PCB measured at t ≤ 5 secs.
8. Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05 pulse width = 10μs - pulse current limited by maximum junction temperature.
9. Thermal resistance from junction to solder-point (at the end of the collector lead).
ZXMP6A13FQ
Document Number DS36684 Rev. 2 - 2
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ZXMP6A13FQ
Thermal Characteristics
10
-ID Drain Current (A)
Limited
1
DC
1s
100m
100ms
10ms
10m
Single Pulse
Tamb=25°C
1
1ms
100µs
10
-VDS Drain-Source Voltage (V)
100
Max Power Dissipation (W)
0.7
RDS(on)
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
20
200
T amb=25°C
150
D=0.5
100
50
Single Pulse
D=0.2
D=0.05
D=0.1
0
100µ
1m
10m 100m
1
Pulse Width (s)
10
Document Number DS36684 Rev. 2 - 2
80
100 120 140 160
100
1k
Single Pulse
T amb=25°C
10
1
100µ
Transient Thermal Impedance
ZXMP6A13FQ
60
Temperature (°C)
Derating Curve
Maximum Power (W)
Thermal Resistance (°C/W)
Safe Operating Area
40
1m
10m 100m
1
10
Pulse Width (s)
100
1k
Pulse Power Dissipation
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ZXMP6A13FQ
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
-60






-0.5
±100
V
μA
nA
ID = -250μA, VGS = 0V
VDS = -60V, VGS = 0V
VGS = 20V, VDS = 0V
VGS(th)
-1.0

V
Static Drain-Source On-Resistance (Note 10)
RDS (ON)


Forward Transconductance (Notes 10 and 12)
Diode Forward Voltage (Note 10)
Reverse Recovery Time (Note 12)
Reverse Recovery Charge (Note 12)
DYNAMIC CHARACTERISTICS (Note 12)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Delay Time (Note 11)
Turn-On Rise Time (Note 11)
Turn-Off Delay Time (Note 11)
Turn-Off Fall Time (Note 11)
gfs
VSD
trr
Qrr




1.8
-0.85
21.1
19.3
-3.0
0.4
0.6

-0.95


ID = -250μA, VDS = VGS
VGS = -10V, ID = -0.9A
VGS = -4.5V, ID = -0.8A
VDS = -15V, ID = -0.9A
TJ = +25°C, IS = -0.8A, VGS = 0V
Ciss
Coss
Crss
tD(on)
tr
tD(off)
tf







219
25.7
20.5
1.6
2.2
11.2
5.7

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Total Gate Charge (Note 11)
Qg

2.9
Total Gate Charge (Note 11)
Gate-Source Charge (Note 11)
Gate-Drain Charge (Note 11)
Qg
Qgs
Qgd



5.9
0.74
1.5
Notes:
Ω
S
V
ns
nC
Test Condition
TJ = +25°C, IF = -0.9A,
di/dt = 100A/μs
pF
VDS = -30V, VGS = 0V
f = 1.0MHz
ns
VDD = -30V, ID = -1A,
RG  6.0Ω VGS = -10V

nC
VDS = -30V, VGS = -4.5V,
ID = -0.9A



nC
VDS = -30V, VGS = -10V,
ID = -0.9A
10. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤ 2%.
11. Switching characteristics are independent of operating junction temperature.
12. For design aid only, not subject to production testing
ZXMP6A13FQ
Document Number DS36684 Rev. 2 - 2
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Typical Characteristics
T = 25°C
10V
10
4.5V
-ID Drain Current (A)
-ID Drain Current (A)
10
3.5V
3V
1
2.5V
2V
0.1
-VGS
10V
5V
T = 150°C
1
4.5V
3.5V
3V
2.5V
2V
0.1
1.5V
-VGS
0.01
0.1
1
10
0.1
-ID Drain Current (A)
-VDS = 10V
1
T = 150°C
T = 25°C
1
2
3
4
5
-VGS Gate-Source Voltage (V)
2.5V
2V
T = 25°C
3V
3.5V
4V 5V
1
7V
10V
0.1
1
-ID Drain Current (A)
10
On-Resistance v Drain Current
ZXMP6A13FQ
Document Number DS36684 Rev. 2 - 2
-ISD Reverse Drain Current (A)
RDS(on) Drain-Source On-Resistance 
-VGS
1.8
VGS = -10V
1.6
ID = -0.9A
RDS(on)
1.4
1.2
VGS = VDS
1.0
ID = -250uA
0.8
VGS(th)
0.6
-50
0
50
100
Tj Junction Temperature (°C)
150
Normalised Curves v Temperature
Typical Transfer Characteristics
1.5V
10
Output Characteristics
Normalised RDS(on) and VGS(th)
Output Characteristics
0.1
1
-VDS Drain-Source Voltage (V)
-VDS Drain-Source Voltage (V)
10
T = 150°C
T = 25°C
1
0.1
0.01
0.4
0.6
0.8
1.0
1.2
1.4
-VSD Source-Drain Voltage (V)
Source-Drain Diode Forward Voltage
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Typical Characteristics - continued
C Capacitance (pF)
VGS = 0V
f = 1MHz
CISS
200
COSS
100
CRSS
0
0.1
1
10
-VDS - Drain - Source Voltage (V)
Capacitance v Drain-Source Voltage
-VGS Gate-Source Voltage (V)
10
300
8
6
4
2
VDS = -30V
ID = -0.9A
0
0
1
2
3
4
5
6
Q - Charge (nC)
Gate-Source Voltage v Gate Charge
Test Circuits
ZXMP6A13FQ
Document Number DS36684 Rev. 2 - 2
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Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
°
7
l
l
A
H
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.890 1.00 0.975
K1
0.903 1.10 1.025
L
0.45
0.61
0.55
L1
0.25
0.55
0.40
M
0.085 0.150 0.110
a
8°
All Dimensions in mm
J
K
1
K
a
M
A
1
L
L
B
C
D
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
Y
Z
C
X
ZXMP6A13FQ
Document Number DS36684 Rev. 2 - 2
Dimensions Value (in mm)
Z
2.9
X
0.8
Y
0.9
C
2.0
E
1.35
E
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
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ZXMP6A13FQ
Document Number DS36684 Rev. 2 - 2
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