深圳市南方芯源科技有限公司 深圳市天安数码时代广场 A 座 2005 总机:0755-83981818 传真::0755-83476838 E-mail: [email protected] http://www.samwinsemi.com/ CECC 90.000 1,027 JEDECJESD 22 1,005 IEC MIL STD 750 TEST MIL STD 883 MOSFET 可靠性实验标准对比及常规实验条件 TYPICAL CONDITIONS LIFE TESTS High temperature life test Low temperature life test High temp. retention bake Write/erase plus retention bake 147.4 A108A 4.8 1,005 1,005 Thermal fatigue 1,037 Tj = 125 - 150℃ 500/1000 hours 10℃to -40℃ 500/1000 hours 150/250℃ 500/1000 hours 10K to 1M cycles, bake 168 hours Tc= 70 to 100℃ 5K to 10K temp cycles ENVIRONMENTAL TESTS Temperature cycles 1,010 1,051 68.2.14 A104 4.6.8. -65/-40℃to 125/150°C, 1000 cycles Thermal shocks Temperature humidity bias Highly accelerated stress test 1,011 1,052 68.2.14 A106A A101B A110B 4.6.8. 4.6.3. 4.6.3. -65/-40℃to 125/150°C, 500 shocks 85℃ 85% RH 1000 hours 130℃ 85% RH 96 to 168 hours Pressure cooker (autoclave) 121℃ 2atm./133℃ 3atm. 96 to 240 hrs A102B Moisture resistance 1,004 1,021 Salt atmosphere 1,009 1,041 68.2.11 A107A Mechanical shock Vibration variable frequency Constant acceleration 2,002 2,007 2,001 2,016 2,056 2,006 68.2.27 68.2.6 68.2.7 B104A 4.6.4. 4.6.5. 4.6.7. 1500 G 0.5 msec. 20 Hz to 20 kHz 20G 30.000 G 1 minute, Y1 direction Lead integrity 2,004 2,036 68.2.21 B105 4.6.12. Tensile tests, package dependant 4.6.10. 215 to 245℃3 to 5 seconds SMD devices, with preconditioning 4.4 3 Immersion conditions 10 cycles 25 to 65℃ RH = 90 to 98% 10 to 50 gr of NaCl/metres 2 @ 35℃ MECHANICAL TESTS BOARD ASSEMBLY RELATED TESTS Solderability Resistance to solder heat 2,003 Resistance to solvents 2,015 2,023 68.2.20 B102B J-Std-020 68.2.45 B107A