Formosa MS SMD Bridge Rectifier ABS2 THRU ABS10 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing .................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-241168 2010/06/10 Revised Date Revision Page. 2012/11/08 F 7 Formosa MS SMD Bridge Rectifier ABS2 THRU ABS10 1.0A Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers-200-1000V Package outline LMDS Features • Glass passivated junction • Ideal for printed circuit board • Reliable low cost construction utilizing molded plastic technique • High temperature soldering guaranteed: 260°C / 10 seconds / 0.375” ( 9.5mm ) lead length at 5 lbs., ( 2.3 kg ) tension • High surge current capability • Suffix "-H" indicates Halogen-free part, ex.ABS2-H. 9 5 Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, LMDS • Terminals : Solder plated, solderable per MIL-STD-202, Method 208 Dimensions in inches and (millimeters) • Polarity : marked on body • Mounting Position : Any • Weight : Approximated 0.0992 gram Maximum ratings and Electrical Characteristics (AT PARAMETER CONDITIONS Forward rectified current On glass-epoxy P.C.B. On aluminum substrate Forward surge current 8.3ms single half sine-wave (JEDEC methode) Reverse current V R = V RRM T J = 25 C O V R = V RRM T J = 125 C Typical Thermal resistance Junction to case Junction to lead Junction to ambient on aluminum substrate Junction to ambient on glass-epoxy substrate O t < 8 . 3 ms Rating for fusing Symbol V RMS*2 (V) ABS2 200 140 200 ABS4 400 280 400 ABS6 600 420 600 *3 VR (V) ABS8 800 560 800 ABS10 1000 700 1000 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 TYP. Operating temperature T J, ( OC) UNIT A 1.0 I FSM 30 A IR 10 500 μA R θJC R θJL R θJA R θJA 30 25 62.5 80 2 *4 VF (V) MAX. 0.8 IO T STG *1 V RRM (V) MIN. O 3.7 It Storage temperature SYMBOLS o T A=25 C unless otherwise noted) +150 -55 C/W A 2s O C *1 Repetitive peak reverse voltage *2 RMS voltage 0.95 -55 to +150 *3 Continuous reverse voltage *4 Maximum forward voltage@I F=0.4A Page 2 Document ID Issued Date DS-241168 2010/06/10 Revised Date Revision Page. 2012/11/08 F 7 Rating and characteristic curves (ABS2 THRU ABS10) FIG.2-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT AVERAGE FORWARD CURRENT,(A) PEAK FORWARD SURGE CURRENT,(A) FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE 35 FIG.4-TYPICAL REVERSE CHARACTERISTICS REVERSE LEAKAGE CURRENT, (mA) INSTANTANEOUS FORWARD CURRENT,(A) FIG.3-TYPICAL FORWARD CHARACTERISTICS FIG.5- TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE (pF) 1000 100 Tj=25 ℃ f=1MHz 10 0.1 1 10 100 1000 REVERSE VOLTAGE (V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-241168 2010/06/10 Revised Date Revision Page. 2012/11/08 F 7 Formosa MS SMD Bridge Rectifier ABS2 THRU ABS10 Pinning information Simplified outline Symbol + ~ ~ - Marking Type number Marking code ABS2 ABS4 ABS6 ABS8 ABS10 Example 2 . For Halogen-free Device 1 . For Halogen Device ABS2 ABS4 ABS6 ABS8 ABS10 Marking code 1st line: Marking code ABS8 ― ABS8 2nd line: ― indicate Halogen-Free. Suggested solder pad layout A D B C Dimensions in inches and (millimeters) PACKAGE A B C D LMDS 0.024 (0.60) 0.024 (0.60) 0.132 (3.35) 0.193 (4.90) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-241168 2010/06/10 Revised Date Revision Page. 2012/11/08 F 7 Formosa MS SMD Bridge Rectifier ABS2 THRU ABS10 Packing information C D D1 D2 W1 unit:mm Item Symbol Tolerance Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 t W W1 0.1 0.1 0.1 0.05 2.0 min 2.0 min 0.5 0.1 0.05 0.1 0.1 0.05 0.1 0.3 1.0 LMDS 5.31 6.68 1.60 1.55 330.00 50.00 13.00 1.75 5.50 8.00 4.00 2.00 0.30 12.00 12~14.4 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-241168 2010/06/10 Revised Date Revision Page. 2012/11/08 F 7 Formosa MS SMD Bridge Rectifier ABS2 THRU ABS10 Reel packing PACKAGE REEL SIZE 13" LMDS REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 5,000 8.0 10,000 337*337*37 330 CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) 80,000 19.0 350*330*360 Suggested thermal profiles for soldering processes o o 1.Storage environment: Temperature=5 C ~40 C Humidity=55%± 25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC /sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC- 0/ + 5 oC Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate o <6 C /sec o Time 25 C to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-241168 2010/06/10 Revised Date Revision Page. 2012/11/08 F 7 Formosa MS SMD Bridge Rectifier ABS2 THRU ABS10 High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=150 C for 168 hrs. 4. Forward Operation Life Rated average rectifier current at T A=25 C for 500hrs. MIL-STD-750D METHOD-1038 O MIL-STD-750D METHOD-1027 O O 5. Intermittent Operation Life 6. Pressure Cooker T A = 25 C, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. 8. Forward Surge JESD22-A102 O 15P SIG at T A=121 C for 4 hrs. O 7. Temperature Cycling MIL-STD-750D METHOD-1036 O -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1051 8.3ms single half sine-wave , one surge. MIL-STD-750D METHOD-4066-2 O 9. Humidity at T A=85 C , RH=85% for 1000hrs. 10. High Temperature Storage Life at 175 C for 1000 hrs. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1021 O Page 7 MIL-STD-750D METHOD-1031 Document ID Issued Date DS-241168 2010/06/10 Revised Date Revision Page. 2012/11/08 F 7