FM4001-S THRU FM4007

Chip General Purpose Rectifiers
Formosa MS
FM4001-S THRU FM4007-S
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 1
DS-121121
Issued Date
2008/02/10
Revised Date
2010/04/28
Revision
E
Page.
7
Chip General Purpose Rectifiers
Formosa MS
FM4001-S THRU FM4007-S
1.0A Surface Mount General Purpose
Rectifiers - 50V-1000V
Package outline
Features
• Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
SMA-S
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
T iny plastic SMD package.
High current capability.
High surge capability.
Glass passivated chip junction.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Suffix "-H" indicates Halogen-free parts, ex. FM4001-S-H.
0.216(5.4)
0.200(5.0)
0.063(1.6)
0.012(0.3) Typ.
0.106(2.7)
0.091(2.3)
0.055(1.4)
Mechanical data
0.071(1.8)
0.060(1.5)
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AC / SMA-S
• Terminals : Solder plated, solderable per
0.040(1.0) Typ.
0.040 (1.0) Typ.
Dimensions in inches and (millimeters)
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.05 gram
Maximum ratings and Electrical Characteristics (AT
PARAMETER
o
T A=25 C unless otherwise noted)
Symbol
CONDITIONS
Forward rectified current
See Fig.1
Forward surge current
8.3ms single half sine-wave (JEDEC methode)
MIN.
TYP.
O
V R = V RRM T J = 125 C
Thermal resistance
Diode junction capacitance
1.0
A
I FSM
30
A
R θJA
65
R θJC
35
CJ
15
*1
V RRM
(V)
T STG
V RMS*2
(V)
*3
VR
(V)
FM4001-S
50
35
50
FM4002-S
100
70
100
FM4003-S
200
140
200
FM4004-S
400
280
400
FM4005-S
600
420
600
FM4006-S
800
560
800
FM4007-S
1000
700
1000
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
*4
VF
(V)
μA
50
Junction to case
Storage temperature
SYMBOLS
5.0
IR
Junction to ambient
f=1MHz and applied 4V DC reverse voltage
UNIT
IO
O
V R = V RRM T J = 25 C
Reverse current
MAX.
O
pF
O
+175
-65
C/W
C
Operating
temperature
T J, ( OC)
*1 Repetitive peak reverse voltage
*2 RMS voltage
1.10
-55 to +150
*3 Continuous reverse voltage
*4 Maximum forward [email protected] F=1.0A
Document ID
Page 2
DS-121121
Issued Date
2008/02/10
Revised Date
2010/04/28
Revision
E
Page.
7
Rating and characteristic curves (FM4001-S THRU FM4007-S)
FIG.1-TYPICAL FORWARD
FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT,(A)
CHARACTERISTICS
10
3.0
1.0
1.2
1.0
0.8
0.6
P.C.B. Mounted on
0.2 " x 0.2 " (5 mm x 5 mm)
Copper Pad Areas
0.4
0.2
0
0
20
40
TJ=25 C
60
80
100
120
140
160
180
200
LEAD TEMPERATURE ( C)
Pulse Width 300us
1% Duty Cycle
0.1
FIG.4-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
.01
.6
.7
.8
.9
1.0
1.1
1.2
1.3
FORWARD VOLTAGE,(V)
FIG.3 - TYPICAL REVERSE
CHARACTERISTICS
PEAK FORWAARD SURGE CURRENT,(A)
INSTANTANEOUS FORWARD CURRENT,(A)
50
50
40
30
8.3ms Single Half
TJ=25 C
JEDEC method
10
0
1
100
Sine Wave
20
5
50
10
100
NUMBER OF CYCLES AT 60Hz
FIG.5-TYPICAL JUNCTION CAPACITANCE
35
TJ=125 C
JUNCTION CAPACITANCE,(pF)
REVERSE LEAKAGE CURRENT, (mA)
10
1.0
TJ=25 C
.1
30
25
20
15
10
5
.01
0
0
20
40
60
80
.01
.1
.5
1
5
10
50
100
Revision
Page.
REVERSE VOLTAGE,(V)
PERCENTAGE RATED PEAK REVERSE VOLTAGE
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
.05
100 120 140
Document ID
Page 3
DS-121121
Issued Date
2008/02/10
Revised Date
2010/04/28
E
7
Chip General Purpose Rectifiers
Formosa MS
FM4001-S THRU FM4007-S
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Marking
Type number
Marking code
FM4001-S
FM4002-S
FM4003-S
FM4004-S
FM4005-S
FM4006-S
FM4007-S
A1
A2
A3
A4
A5
A6
A7
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SMA-S
0.063 (1.60)
0.059 (1.50)
0.110 (2.80)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 4
DS-121121
Issued Date
2008/02/10
Revised Date
2010/04/28
Revision
E
Page.
7
Chip General Purpose Rectifiers
Formosa MS
FM4001-S THRU FM4007-S
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SMA-S
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.90
5.50
2.10
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
4.00
4.00
2.00
0.23
12.00
18.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 5
DS-121121
Issued Date
2008/02/10
Revised Date
2010/04/28
Revision
E
Page.
7
Chip General Purpose Rectifiers
Formosa MS
FM4001-S THRU FM4007-S
Reel packing
PACKAGE
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
7"
2,000
4.0
20,000
183*155*183
178
382*356*392
160,000
15.5
13"
7,500
4.0
15,000
337*337*37
330
350*330*360
120,000
14.2
REEL SIZE
CARTON
SIZE
(m/m)
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
SMA-S
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
o
150 C
o
200 C
60~120sec
Tsmax to T L
-Ramp-upRate
o
<3 C /sec
Time maintained above:
-Temperature(T L )
-Time(t L )
o
217 C
60~260sec
o
o
255 C- 0/ + 5 C
Peak Temperature(T P )
o
Time within 5 C of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 C /sec
o
o
Time 25 C to Peak Temperature
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
<6minutes
Document ID
Page 6
DS-121121
Issued Date
2008/02/10
Revised Date
2010/04/28
Revision
E
Page.
7
Chip General Purpose Rectifiers
Formosa MS
FM4001-S THRU FM4007-S
High reliability test capabilities
Item Test
Conditions
Reference
O
MIL-STD-750D
METHOD-2031
O
MIL-STD-202F
METHOD-208
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16" ± 1/32"
2. Solderability
at 245 ± 5 C for 5 sec.
3. High Temperature Reverse Bias
V R=80% rate at T J=150 C for 168 hrs.
4. Forward Operation Life
Rated average rectifier current at T A=25 C for 500hrs.
MIL-STD-750D
METHOD-1038
O
MIL-STD-750D
METHOD-1027
O
O
5. Intermittent Operation Life
6. Pressure Cooker
T A = 25 C, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
JESD22-A102
O
15P SIG at T A=121 C for 4 hrs.
O
MIL-STD-750D
METHOD-1051
O
7. Temperature Cycling
-55 C to +125 C dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Forward Surge
8.3ms single half sine-wave , one surge.
9. Humidity
at T A=85 C , RH=85% for 1000hrs.
10. High Temperature Storage Life
at 175 C for 1000 hrs.
MIL-STD-750D
METHOD-4066-2
MIL-STD-750D
METHOD-1021
O
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
MIL-STD-750D
METHOD-1031
O
Document ID
Page 7
DS-121121
Issued Date
2008/02/10
Revised Date
2010/04/28
Revision
E
Page.
7