QJP-2L

CYStech Electronics Corp.
Spec. No. : C179A2
Issued Date : 2014.09.29
Revised Date : 2014.09.30
Page No. : 1/6
1A Snubber Damping Rectifier
QJP-2L
Features
 High current capability
 Smoothly soft reverse recovery time (trr)
 Low profile surface mounted package in order to minimize board space
 Pb-free lead plating and halogen-free package
Mechanical data
Case : Molded plastic, TO-92-2L.
Epoxy : UL94-V0 rated flame retardant
Terminals : Plated terminals, solderable per MIL-STD-202 method 208
Polarity : Indicated by cathode band
Mounting position : Any
Weight : approx. 0.2 gram
Ordering Information
Device
QJP-2L-0-BK-G
QJP-2L-0-TB-G
Package
TO-92-2L
(Pb-free lead plating and halogen-free package)
TO-92-2L
(Pb-free lead plating and halogen-free package)
Shipping
1000 pcs / bag, 10 bags/box,
10 boxes/carton
2000 pcs / Tape & Box
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, TB :2000 pcs/tape & box; BK: 1000 pcs / bag, 10 bags/box, 10 boxes/carton
Product rank, zero for no rank products
Product name
QJP-2L
CYStek Product Specification
Spec. No. : C179A2
Issued Date : 2014.09.29
Revised Date : 2014.09.30
Page No. : 2/6
CYStech Electronics Corp.
Symbol
Outline
QJP-2L
TO-92-2L
A K
Absolute Maximum Ratings (TA=25℃, unless otherwise noted)
Parameters
Repetitive peak reverse voltage
RMS voltage
Continuous reverse voltage
Forward rectified current
Forward surge current
Maximum reverse recovery time
Conditions
Single phase half wave,
60Hz @TJ=25°C
8.3ms single half sine-wave
superimposed on rated load
(JEDEC method)
IF=0.5A, IR=1.0A,
IRR=0.25A
Storage temperature range
Operating junction temperature range
Symbol
Value
Units
VRRM
600
V
VRMS
420
V
VR
600
V
IF(AV)
1
A
IFSM
9
A
trr
300
ns
Tstg
-55~+150
C
Tj
-55~+150
C
Thermal Data
Parameter
Thermal Resistance, Junction-to-case, max
Thermal Resistance, Junction-to-ambient, max
QJP-2L
Symbol
Rth,j-c
Rth,j-a
Value
55
200
Unit
C/W
CYStek Product Specification
Spec. No. : C179A2
Issued Date : 2014.09.29
Revised Date : 2014.09.30
Page No. : 3/6
CYStech Electronics Corp.
Characteristics (TA=25C, unless otherwise noted)
Characteristic
Symbol
IR=100μA
VR
VF 1
VF 2
IR
IR
CJ
Forward Voltage
Reverse Leakage Current
Junction Capacitance
Condition
IF=100mA
IF=500mA
VR=540V
VR=540V, TA=125C
VR=1V, f=1MHz
Min.
Typ
Max.
Unit
600
-
-
V
-
11.6
0.95
1.2
100
10
-
V
nA
μA
pF
Typical Characteristics
Power Derating Curve
Forward Current vs Forward Voltage
0.7
Instantaneous Forward Current---IF(mA)
10000
Power Dissipation(W)
0.6
0.5
0.4
0.3
0.2
0.1
0
25°C
75°C
10
Pulse width=300μs,
1% Duty cycle
Ambient Temperature---TA(℃)
0.8
1.2
1.6
2
Forward Voltage---VF(V)
Reverse Leakage Current vs Reverse Voltage
Junction Capacitance vs Reverse Voltage
25
50
75
100
125
150
175
0
200
0.4
2.4
2.8
100
10000
Tj=125℃
1000
100
Junction Capacitance---C J(pF)
Reverse Leakage Current---I R(nA)
125℃
100
1
0
Tj=75℃
10
Tj=25℃
1
0.1
10
Tj=25℃, f=1.0MHz
1
0.01
0
100
200
300
400
500
Reverse Voltage---VR(V)
QJP-2L
1000
600
700
0.1
1
10
100
Reverse Voltage---VR (V)
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C179A2
Issued Date : 2014.09.29
Revised Date : 2014.09.30
Page No. : 4/6
TO-92-2L Taping Outline
DIM
A
D
D1
D2
F1,F2
F1,F2
H
H1
H2
H2A
H3
H4
L
L1
P
P1
P2
T
T1
T2
W
W1
-
QJP-2L
Item
Component body height
Tape Feed Diameter
Lead Diameter
Component Body Diameter
Component Lead Pitch
F1-F2
Height Of Seating Plane
Feed Hole Location
Front To Rear Deflection
Deflection Left Or Right
Component Height
Feed Hole To Bottom Of Component
Lead Length After Component Removal
Lead Wire Enclosure
Feed Hole Pitch
Center Of Seating Plane Location
4 Feed Hole Pitch
Over All Tape Thickness
Total Taped Package Thickness
Carrier Tape Thickness
Tape Width
Adhesive Tape Width
20 pcs Pitch
Millimeters
Min.
4.33
3.80
0.36
4.33
2.40
15.50
8.50
2.50
12.50
5.95
50.30
0.36
17.50
5.00
253
Max.
4.83
4.20
0.53
4.83
2.90
0.3
16.50
9.50
1
1
27
21
11
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
255
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C179A2
Issued Date : 2014.09.29
Revised Date : 2014.09.30
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5C of actual peak
temperature(tp)
Ramp down rate
Time 25 C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3C/second max.
3C/second max.
100C
150C
60-120 seconds
150C
200C
60-180 seconds
183C
60-150 seconds
240 +0/-5 C
217C
60-150 seconds
260 +0/-5 C
10-30 seconds
20-40 seconds
6C/second max.
6 minutes max.
6C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
QJP-2L
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C179A2
Issued Date : 2014.09.29
Revised Date : 2014.09.30
Page No. : 6/6
TO-92-2L Dimension
Marking:
Style: Pin 1.Anode 2.Not Connected
3.Cathode
2-Lead TO-92-2L Plastic
Surface Mounted Package
CYStek Package Code: A2
Millimeters
Min.
Max.
3.300
3.700
1.100
1.400
0.380
0.550
0.360
0.510
4.400
4.700
3.430
4.300
4.700
DIM
A
A1
b
c
D
D1
E
Inches
Min.
Max.
0.130
0.146
0.043
0.055
0.015
0.022
0.014
0.020
0.173
0.185
0.135
0.169
0.185
DIM
e
e1
L
L1
Φ
h
Millimeters
Min.
Max.
1.270 TYP
2.440
2.640
14.100 14.500
2.000
2.650
1.600
0.000
0.380
Inches
Min.
Max.
0.050 TYP
0.096
0.104
0.555
0.571
0.079
0.104
0.063
0.000
0.015
Notes: 1.Controlling dimension : millimeters.
2.Lead thickness specified per L/F drawing with solder plating.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
 Lead: Pure tin plated.
 Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
 CYStek reserves the right to make changes to its products without notice.
 CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
 CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
QJP-2L
CYStek Product Specification