BTA733A3

Spec. No. : C306A3
Issued Date : 2003.07.14
Revised Date : 2015.03.25
Page No. : 1 / 7
CYStech Electronics Corp.
General Purpose PNP Epitaxial Planar Transistor
BTA733A3
Description
• The BTA733A3 is designed for use in driver stage of AF amplifier and general purpose amplification.
• High HFE and excellent linearity
• Complementary to BTC945A3.
• Pb-free and halogen-free package
Symbol
Outline
BTA733A3
TO-92
B:Base
C:Collector
E:Emitter
ECB
Ordering Information
Device
BTA733A3-X-TB-G
BTA733A3-X-BK-G
Package
TO-92
(Pb-free lead plating and halogen-free package)
TO-92
(Pb-free lead plating and halogen-free package)
Shipping
2000 pcs / Tape & Box
1000 pcs/ bag, 10 bags/box,
10boxes/carton
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, TB :2000 pcs/tape & box; BK: 1000 pcs / bag, 10 bags/box, 10 boxes/carton
Product rank, zero for no rank products
Product name
BTA733A3
CYStek Product Specification
Spec. No. : C306A3
Issued Date : 2003.07.14
Revised Date : 2015.03.25
Page No. : 2 / 7
CYStech Electronics Corp.
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Peak Collector Current
Base Current
Power Dissipation
Thermal Resistance, Junction to Ambient
Junction Temperature
Storage Temperature
Symbol
Limits
Unit
VCBO
VCEO
VEBO
IC
ICP
IB
Pd
RθJA
Tj
Tstg
-60
-50
-5
-150
-500
-20
625
200
150
-55~+150
V
V
V
mA
mA
mA
mW
°C/W
°C
°C
Characteristics (Ta=25°C)
Symbol
BVCEO
ICBO
IEBO
*VCE(sat)
VBE
hFE
fT
Cob
Min.
-50
-0.58
135
100
-
Typ.
-
Max.
-0.1
-0.1
-0.3
-0.68
600
6
Unit
V
μA
μA
V
V
MHz
pF
Test Conditions
IC=-1mA
VCB=-60V
VEB=-5V
IC=-100mA, IB=-10mA
VCE=-6V, IC=-1mA
VCE=-6V, IC=-1mA
VCE=-6V, IC=-10mA
VCB=-10V, f=1MHz
*Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2%
Classification Of hFE
Rank
Range
BTA733A3
Q
135~270
P
200~400
K
300~600
CYStek Product Specification
Spec. No. : C306A3
Issued Date : 2003.07.14
Revised Date : 2015.03.25
Page No. : 3 / 7
CYStech Electronics Corp.
Typical Characteristics
Emitter Grounded Output Characteristics
Emitter Grounded Output Characteristics
0.25
0.16
5mA
1mA
-IC, Collector Current(A)
Collector Current---IC(A)
0.14
0.12
0.1
500uA
0.08
400uA
300uA
0.06
200uA
0.04
-IB=100uA
0.02
0.2
2.5mA
2mA
0.15
1.5mA
0.1
-IB=500uA
0.05
0
0
0
1
2
3
4
5
-VCE, Collector-to-Emitter Voltage(V)
6
0
Current Gain vs Collector Current
6
Saturation Voltage vs Collector Current
1000
1000
25°C
100
[email protected]=10IB
VCE=-6V
Saturation Voltage---(mV)
150°C
Current Gain---HFE
1
2
3
4
5
-VCE, Collector-to-Emitter Voltage(V)
-55°C
150°C
100
25°C
-55°C
10
10
1
10
100
-IC, Collector Current(mA)
1000
1
Saturation Voltage vs Collector Current
1000
On Voltage vs Collector Current
10000
1000
[email protected]=10IB
VCE=-6V
-IC, Collector Current(mA)
Saturation Voltage---(mV)
10
100
-IC, Collector Current(mA)
-55°C
1000
150°C
25°C
100
100
150°C
-55°C
10
25°C
1
0.1
1
BTA733A3
10
100
-IC, Collector Current(mA)
1000
100 200 300 400 500 600 700 800 900 1000
-VBE, Base to Emitter Voltage(mV)
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C306A3
Issued Date : 2003.07.14
Revised Date : 2015.03.25
Page No. : 4 / 7
Typical Characteristics
Capacitance Characteristics
Cutoff Frequency vs Collector Current
100
[email protected]=-12V
fT=1MHz
Capacitance---(pF)
Cutoff Frequency---FT(MHZ)
1000
100
Cib
10
Cob
10
1
0.1
1
10
-IC, Collector Current(mA)
100
0.1
1
10
Reverse-biased Voltage---(V)
100
Power Derating Curve
Power Dissipation---PD(mW)
700
600
500
400
300
200
100
0
0
BTA733A3
50
100
150
Ambient Temperature --- Ta(℃ )
200
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C306A3
Issued Date : 2003.07.14
Revised Date : 2015.03.25
Page No. : 5 / 7
TO-92 Taping Outline
H2
H2A H2A
H2
D2
A
L
H3
H4 H
L1
H1
D1
F1F2
T2
T
T1
DIM
A
D
D1
D2
F1,F2
F1,F2
H
H1
H2
H2A
H3
H4
L
L1
P
P1
P2
T
T1
T2
W
W1
BTA733A3
P1
P
Item
Component body height
Tape Feed Diameter
Lead Diameter
Component Body Diameter
Component Lead Pitch
F1-F2
Height Of Seating Plane
Feed Hole Location
Front To Rear Deflection
Deflection Left Or Right
Component Height
Feed Hole To Bottom Of Component
Lead Length After Component Removal
Lead Wire Enclosure
Feed Hole Pitch
Center Of Seating Plane Location
4 Feed Hole Pitch
Over All Tape Thickness
Total Taped Package Thickness
Carrier Tape Thickness
Tape Width
Adhesive Tape Width
20 pcs Pitch
W1
W
D
P2
Millimeters
Min.
4.33
3.80
0.36
4.33
2.40
15.50
8.50
2.50
12.50
5.95
50.30
0.36
17.50
5.00
253
Max.
4.83
4.20
0.53
4.83
2.90
±0.3
16.50
9.50
1
1
27
21
11
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
255
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C306A3
Issued Date : 2003.07.14
Revised Date : 2015.03.25
Page No. : 6 / 7
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
BTA733A3
CYStek Product Specification
Spec. No. : C306A3
Issued Date : 2003.07.14
Revised Date : 2015.03.25
Page No. : 7 / 7
CYStech Electronics Corp.
TO-92 Dimension
Marking:
α2
A
B
1
2
A733
3
Date Code
α3
C
□□
□
HFE rank
D
H
I
G
α1
Style: Pin 1.Emitter 2.Collector 3.Base
E
F
3-Lead TO-92 Plastic Package
CYStek Package Code: A3
*: Typical
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5°
*2°
*2°
Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5°
*2°
*2°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTA733A3
CYStek Product Specification