Spec. No. : C306A3 Issued Date : 2003.07.14 Revised Date : 2015.03.25 Page No. : 1 / 7 CYStech Electronics Corp. General Purpose PNP Epitaxial Planar Transistor BTA733A3 Description • The BTA733A3 is designed for use in driver stage of AF amplifier and general purpose amplification. • High HFE and excellent linearity • Complementary to BTC945A3. • Pb-free and halogen-free package Symbol Outline BTA733A3 TO-92 B：Base C：Collector E：Emitter ECB Ordering Information Device BTA733A3-X-TB-G BTA733A3-X-BK-G Package TO-92 (Pb-free lead plating and halogen-free package) TO-92 (Pb-free lead plating and halogen-free package) Shipping 2000 pcs / Tape & Box 1000 pcs/ bag, 10 bags/box, 10boxes/carton Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, TB :2000 pcs/tape & box; BK: 1000 pcs / bag, 10 bags/box, 10 boxes/carton Product rank, zero for no rank products Product name BTA733A3 CYStek Product Specification Spec. No. : C306A3 Issued Date : 2003.07.14 Revised Date : 2015.03.25 Page No. : 2 / 7 CYStech Electronics Corp. Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Peak Collector Current Base Current Power Dissipation Thermal Resistance, Junction to Ambient Junction Temperature Storage Temperature Symbol Limits Unit VCBO VCEO VEBO IC ICP IB Pd RθJA Tj Tstg -60 -50 -5 -150 -500 -20 625 200 150 -55~+150 V V V mA mA mA mW °C/W °C °C Characteristics (Ta=25°C) Symbol BVCEO ICBO IEBO *VCE(sat) VBE hFE fT Cob Min. -50 -0.58 135 100 - Typ. - Max. -0.1 -0.1 -0.3 -0.68 600 6 Unit V μA μA V V MHz pF Test Conditions IC=-1mA VCB=-60V VEB=-5V IC=-100mA, IB=-10mA VCE=-6V, IC=-1mA VCE=-6V, IC=-1mA VCE=-6V, IC=-10mA VCB=-10V, f=1MHz *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2% Classification Of hFE Rank Range BTA733A3 Q 135~270 P 200~400 K 300~600 CYStek Product Specification Spec. No. : C306A3 Issued Date : 2003.07.14 Revised Date : 2015.03.25 Page No. : 3 / 7 CYStech Electronics Corp. Typical Characteristics Emitter Grounded Output Characteristics Emitter Grounded Output Characteristics 0.25 0.16 5mA 1mA -IC, Collector Current(A) Collector Current---IC(A) 0.14 0.12 0.1 500uA 0.08 400uA 300uA 0.06 200uA 0.04 -IB=100uA 0.02 0.2 2.5mA 2mA 0.15 1.5mA 0.1 -IB=500uA 0.05 0 0 0 1 2 3 4 5 -VCE, Collector-to-Emitter Voltage(V) 6 0 Current Gain vs Collector Current 6 Saturation Voltage vs Collector Current 1000 1000 25°C 100 VCESAT@IC=10IB VCE=-6V Saturation Voltage---(mV) 150°C Current Gain---HFE 1 2 3 4 5 -VCE, Collector-to-Emitter Voltage(V) -55°C 150°C 100 25°C -55°C 10 10 1 10 100 -IC, Collector Current(mA) 1000 1 Saturation Voltage vs Collector Current 1000 On Voltage vs Collector Current 10000 1000 VBESAT@IC=10IB VCE=-6V -IC, Collector Current(mA) Saturation Voltage---(mV) 10 100 -IC, Collector Current(mA) -55°C 1000 150°C 25°C 100 100 150°C -55°C 10 25°C 1 0.1 1 BTA733A3 10 100 -IC, Collector Current(mA) 1000 100 200 300 400 500 600 700 800 900 1000 -VBE, Base to Emitter Voltage(mV) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C306A3 Issued Date : 2003.07.14 Revised Date : 2015.03.25 Page No. : 4 / 7 Typical Characteristics Capacitance Characteristics Cutoff Frequency vs Collector Current 100 FT@VCE=-12V fT=1MHz Capacitance---(pF) Cutoff Frequency---FT(MHZ) 1000 100 Cib 10 Cob 10 1 0.1 1 10 -IC, Collector Current(mA) 100 0.1 1 10 Reverse-biased Voltage---(V) 100 Power Derating Curve Power Dissipation---PD(mW) 700 600 500 400 300 200 100 0 0 BTA733A3 50 100 150 Ambient Temperature --- Ta(℃ ) 200 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C306A3 Issued Date : 2003.07.14 Revised Date : 2015.03.25 Page No. : 5 / 7 TO-92 Taping Outline H2 H2A H2A H2 D2 A L H3 H4 H L1 H1 D1 F1F2 T2 T T1 DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 BTA733A3 P1 P Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch W1 W D P2 Millimeters Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.90 ±0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C306A3 Issued Date : 2003.07.14 Revised Date : 2015.03.25 Page No. : 6 / 7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTA733A3 CYStek Product Specification Spec. No. : C306A3 Issued Date : 2003.07.14 Revised Date : 2015.03.25 Page No. : 7 / 7 CYStech Electronics Corp. TO-92 Dimension Marking: α2 A B 1 2 A733 3 Date Code α3 C □□ □ HFE rank D H I G α1 Style: Pin 1.Emitter 2.Collector 3.Base E F 3-Lead TO-92 Plastic Package CYStek Package Code: A3 *: Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTA733A3 CYStek Product Specification