BTD1768A3

CYStech Electronics Corp.
Spec. No. : C304A3
Issued Date : 2003.07.28
Revised Date :2012.12.27
Page No. : 1/6
General Purpose NPN Epitaxial Planar Transistor
BTD1768A3
Description
The BTD1768A3 is designed for use in driver and output stages of AF amplifier and general purpose
application.
Features
• Low collector saturation voltage
• High breakdown voltage, VCEO=80V (min.)
• High collector current, IC(max)=1A (DC)
• Pb-free lead plating and halogen-free package
Symbol
Outline
BTD1768A3
TO-92
B:Base
C:Collector
E:Emitter
ECB
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Power Dissipation
Thermal Resistance, Junction to Ambient
Operating Junction Temperature Range
Storage Temperature Range
Symbol
VCBO
VCEO
VEBO
IC
ICP
PD
RθJA
Tj
Tstg
Limits
150
80
7
1
2 (Note)
750
167
-55~+150
-55~+150
Unit
V
V
V
A
A
mW
°C/W
°C
°C
Note : Pulse test, PW ≤ 10ms, Duty ≤ 50%.
BTD1768A3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C304A3
Issued Date : 2003.07.28
Revised Date :2012.12.27
Page No. : 2/6
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(SAT)
*VCE(SAT)
*VBE(SAT)
*hFE 1
*hFE 2
fT
Cob
Min.
150
80
5
120
60
-
Typ.
0.15
100
20
Max.
100
100
0.3
0.5
1.2
560
-
Unit
V
V
V
nA
nA
V
V
V
MHz
pF
Test Conditions
IC=50μA
IC=1mA
IE=50μA
VCB=150V, IE=0
VEB=7V, IC=0
IC=500mA, IB=20mA
IC=1A, IB=50mA
IC=1A, IB=50mA
VCE=3V, IC=100mA
VCE=3V, IC=500mA
VCE=10V, IC=50mA, f=100MHz
VCB=10V, IE=0A, f=1MHz
*Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2%
Classification Of hFE 1
Rank
Q
R
S
Range
120~270
200~400
270~560
Ordering Information
Device
HFE rank
Package
Shipping
BTD1768A3-Q-TB-G
Q
TO-92
(Pb-free lead plating and halogen-free)
2000 pcs / Tape & Box
BTD1768A3-R-TB-G
R
TO-92
(Pb-free lead plating and halogen-free)
2000 pcs / Tape & Box
BTD1768A3-S-TB-G
S
TO-92
(Pb-free lead plating and halogen-free)
2000 pcs / Tape & Box
BTD1768A3-Q-BK-G
Q
TO-92
(Pb-free lead plating and halogen-free)
1000 pcs/ bag, 10 bags/box, 10boxes/carton
BTD1768A3-Q-BK-G
R
TO-92
(Pb-free lead plating and halogen-free)
1000 pcs/ bag, 10 bags/box, 10boxes/carton
BTD1768A3-Q-BK-G
S
TO-92
(Pb-free lead plating and halogen-free)
1000 pcs/ bag, 10 bags/box, 10boxes/carton
BTD1768A3
CYStek Product Specification
Spec. No. : C304A3
Issued Date : 2003.07.28
Revised Date :2012.12.27
Page No. : 3/6
CYStech Electronics Corp.
Characteristic Curves
Current Gain vs Collector Current
Saturation Voltage vs Collector Current
1000
1000
Saturation Voltage---(mV)
Current Gain---HFE
[email protected]=3V
100
[email protected]=2V
10
[email protected]=20IB
100
[email protected]=20IB
10
1
10
100
1000
1
Collector Current---IC(mA)
On Voltage vs Collector Current
100
1000
Power Derating Curve
800
Power Dissipation---PD(mW)
On Voltage---(mV)
1000
VBE(on)@VCE=2V
100
700
600
500
400
300
200
100
0
1
10
100
Collector Current---IC(mA)
BTD1768A3
10
Collector Current---IC(mA)
1000
0
50
100
150
200
Ambient Temperature---TA(℃)
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C304A3
Issued Date : 2003.07.28
Revised Date :2012.12.27
Page No. : 4/6
TO-92 Taping Outline
H2
H2A H2A
H2
D2
A
L
H3
H4 H
L1
H1
D1
F1F2
T2
T
T1
DIM
A
D
D1
D2
F1,F2
F1,F2
H
H1
H2
H2A
H3
H4
L
L1
P
P1
P2
T
T1
T2
W
W1
-
BTD1768A3
P1
P
Item
Component body height
Tape Feed Diameter
Lead Diameter
Component Body Diameter
Component Lead Pitch
F1-F2
Height Of Seating Plane
Feed Hole Location
Front To Rear Deflection
Deflection Left Or Right
Component Height
Feed Hole To Bottom Of Component
Lead Length After Component Removal
Lead Wire Enclosure
Feed Hole Pitch
Center Of Seating Plane Location
4 Feed Hole Pitch
Over All Tape Thickness
Total Taped Package Thickness
Carrier Tape Thickness
Tape Width
Adhesive Tape Width
20 pcs Pitch
W1
W
D
P2
Millimeters
Min.
4.33
3.80
0.36
4.33
2.40
15.50
8.50
2.50
12.50
5.95
50.30
0.36
17.50
5.00
253
Max.
4.83
4.20
0.53
4.83
2.90
±0.3
16.50
9.50
1
1
27
21
11
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
255
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C304A3
Issued Date : 2003.07.28
Revised Date :2012.12.27
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
BTD1768A3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C304A3
Issued Date : 2003.07.28
Revised Date :2012.12.27
Page No. : 6/6
TO-92 Dimension
α2
A
Marking:
B
1
2
D1768 □
3
Date Code
HFE Rank
□□
α3
C
D
H
I
G
α1
E
Style: Pin 1.Emitter 2.Collector 3.Base
F
3-Lead TO-92 Plastic Package
CYStek Package Code: A3
*: Typical
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5°
*2°
*2°
Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5°
*2°
*2°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTD1768A3
CYStek Product Specification