CYStech Electronics Corp. Spec. No. : C304A3 Issued Date : 2003.07.28 Revised Date :2012.12.27 Page No. : 1/6 General Purpose NPN Epitaxial Planar Transistor BTD1768A3 Description The BTD1768A3 is designed for use in driver and output stages of AF amplifier and general purpose application. Features • Low collector saturation voltage • High breakdown voltage, VCEO=80V (min.) • High collector current, IC(max)=1A (DC) • Pb-free lead plating and halogen-free package Symbol Outline BTD1768A3 TO-92 B：Base C：Collector E：Emitter ECB Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation Thermal Resistance, Junction to Ambient Operating Junction Temperature Range Storage Temperature Range Symbol VCBO VCEO VEBO IC ICP PD RθJA Tj Tstg Limits 150 80 7 1 2 (Note) 750 167 -55~+150 -55~+150 Unit V V V A A mW °C/W °C °C Note : Pulse test, PW ≤ 10ms, Duty ≤ 50%. BTD1768A3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C304A3 Issued Date : 2003.07.28 Revised Date :2012.12.27 Page No. : 2/6 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(SAT) *VCE(SAT) *VBE(SAT) *hFE 1 *hFE 2 fT Cob Min. 150 80 5 120 60 - Typ. 0.15 100 20 Max. 100 100 0.3 0.5 1.2 560 - Unit V V V nA nA V V V MHz pF Test Conditions IC=50μA IC=1mA IE=50μA VCB=150V, IE=0 VEB=7V, IC=0 IC=500mA, IB=20mA IC=1A, IB=50mA IC=1A, IB=50mA VCE=3V, IC=100mA VCE=3V, IC=500mA VCE=10V, IC=50mA, f=100MHz VCB=10V, IE=0A, f=1MHz *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2% Classification Of hFE 1 Rank Q R S Range 120~270 200~400 270~560 Ordering Information Device HFE rank Package Shipping BTD1768A3-Q-TB-G Q TO-92 (Pb-free lead plating and halogen-free) 2000 pcs / Tape & Box BTD1768A3-R-TB-G R TO-92 (Pb-free lead plating and halogen-free) 2000 pcs / Tape & Box BTD1768A3-S-TB-G S TO-92 (Pb-free lead plating and halogen-free) 2000 pcs / Tape & Box BTD1768A3-Q-BK-G Q TO-92 (Pb-free lead plating and halogen-free) 1000 pcs/ bag, 10 bags/box, 10boxes/carton BTD1768A3-Q-BK-G R TO-92 (Pb-free lead plating and halogen-free) 1000 pcs/ bag, 10 bags/box, 10boxes/carton BTD1768A3-Q-BK-G S TO-92 (Pb-free lead plating and halogen-free) 1000 pcs/ bag, 10 bags/box, 10boxes/carton BTD1768A3 CYStek Product Specification Spec. No. : C304A3 Issued Date : 2003.07.28 Revised Date :2012.12.27 Page No. : 3/6 CYStech Electronics Corp. Characteristic Curves Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 1000 Saturation Voltage---(mV) Current Gain---HFE HFE@VCE=3V 100 HFE@VCE=2V 10 VBESAT@IC=20IB 100 VCESAT@IC=20IB 10 1 10 100 1000 1 Collector Current---IC(mA) On Voltage vs Collector Current 100 1000 Power Derating Curve 800 Power Dissipation---PD(mW) On Voltage---(mV) 1000 VBE(on)@VCE=2V 100 700 600 500 400 300 200 100 0 1 10 100 Collector Current---IC(mA) BTD1768A3 10 Collector Current---IC(mA) 1000 0 50 100 150 200 Ambient Temperature---TA(℃) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C304A3 Issued Date : 2003.07.28 Revised Date :2012.12.27 Page No. : 4/6 TO-92 Taping Outline H2 H2A H2A H2 D2 A L H3 H4 H L1 H1 D1 F1F2 T2 T T1 DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 - BTD1768A3 P1 P Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch W1 W D P2 Millimeters Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.90 ±0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C304A3 Issued Date : 2003.07.28 Revised Date :2012.12.27 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTD1768A3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C304A3 Issued Date : 2003.07.28 Revised Date :2012.12.27 Page No. : 6/6 TO-92 Dimension α2 A Marking: B 1 2 D1768 □ 3 Date Code HFE Rank □□ α3 C D H I G α1 E Style: Pin 1.Emitter 2.Collector 3.Base F 3-Lead TO-92 Plastic Package CYStek Package Code: A3 *: Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTD1768A3 CYStek Product Specification