TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1001 Series SP1001 Series - 8pF 15kV Unidirectional TVS Array RoHS Pb GREEN Description Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout Features *SP1001-02 (SC70-3) *SP1001-04 (SC70-5) 1 1 5 2 3 3 2 4 SP1001-04 (SOT 553) 1 2 3 1 6 NC 2 5 2 3 4 NC SP1001-05 (SOT 563) 5 SP1001-05 (SOT 963) 1 6 1 2 5 2 5 4 3 4 3 4 SP1001-02 (SOT 553) *SP1001-05 (SC70-6) 6 *Note: AEC-Q101 qualified Functional Block Diagram SP1001-02 2 1 5 4 • Low capacitance of 8pF (TYP) per I/O • Low leakage current of 0.5μA (MAX) at 5V • ESD protection of ±15kV contact discharge, ±30kV air discharge, (Level 4, IEC61000-4-2) • Small package saves board space • EFT protection, IEC61000-4-4, 40A (5/50ns) • AEC-Q101 qualified (SC70-x packages) • Lightning protection, IEC61000-4-5, 2A (8/20µs) Applications • Computer Peripherals • LCD/PDP TVs • Mobile Phones • Set Top Boxes • Digital Cameras • DVD Players •Desktops/Notebooks •MP3/PMP SP1001-02 4 5 Application Example LCD module Controller Input 3 1 SP1001-05 4 2 3 6 1 5 2 4 Outside World SP1001-04 5 D1 D2 D3 D4 2 SP 1001-04JTG (SC70-5) SP 1001-04XTG (SOT553) Shield Ground 3 Signal Ground Additional Information Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16 Datasheet Resources Samples TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Absolute Maximum Ratings Symbol Thermal Information Parameter Value Units 2 A Storage Temperature Range Operating Temperature –40 to 125 °C Storage Temperature –55 to 150 °C IPP Peak Current (tp=8/20μs) TOP TSTOR Parameter CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Rating Units –55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20s-40s) 260 °C Thermal Resistance Junction to Ambient 124.21 °C/W Thermal Resistance Junction to Case 190.54 °C/W 1 W Power Dissipation Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Forward Voltage Drop VF Reverse Voltage Drop VR Reverse Standoff Voltage VRWM IR≤1µA 5.5 V Reverse Leakage Current ILEAK VR=5V 0.5 µA V Clamp Voltage1 VC Dynamic Resistance RDYN ESD Withstand Voltage1,2 VESD Diode Capacitance1 CD Min Typ IF=10mA 0.7 0.9 IR=1mA 6.0 Max 1.2 V 8.5 V IPP=1A, tp=8/20µs, Fwd 8.0 11.0 IPP=2A, tp=8/20µs, Fwd 9.7 13.0 (VC2 - VC1) / (IPP2 - IPP1) 1.7 IEC61000-4-2 (Contact) ±15 IEC61000-4-2 (Air) ±30 Units V Ω kV kV Reverse Bias=0V 12 pF Reverse Bias=2.5V 8 pF Reverse Bias=5V 7 pF Notes: 1 Parameter is guaranteed by device characterization 2 A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode Capacitance vs. Reverse Bias Design Consideration Because of the fast rise-time of the ESD transient, placement of ESD devices is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install the ESD suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. 14 12 Capacitance (pF) 10 8 6 4 2 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 DC Bias (V) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes max. Do not exceed 260°C Part Numbering System tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Time Product Characteristics SP1001-0* * T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Package Series Number of Channels J = SC70-3, SC70-5 or SC70-6 X = SOT553 or SOT563 V = SOT963 02 = 2 Channel 04 = 4 Channel 05 = 5 Channel Part Marking System Lead Plating Matte Tin (SC70-x) Pre-Plated Frame (SOT5x3, SOT963) Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters A* * A** Critical Zone TL to TP Ramp-up TL TS(max) 25 Peak Temperature (TP) tP TP Temperature Reflow Condition Product Series 2. Dimensions include solder plating. Number of Channels A = SP1001 series (varies) Assembly Site (varies) Ordering Information Part Number Package Marking Min. Order Qty. SP1001-02JTG SC70-3 A*2 3000 SP1001-02XTG SOT553 A*2 3000 SP1001-04JTG SC70-5 A*4 3000 SP1001-04XTG SOT553 A*4 3000 SP1001-05JTG SC70-6 A*5 3000 SP1001-05VTG SOT963 A*5 8000 SP1001-05XTG SOT563 A*5 3000 © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Package Dimensions — SC70 SC70-3 B Solder Pad Layout 3 Package SC70-3 Pins 3 JEDEC MO-203 Millimeters E HE 2 1 e e D A2 A A1 Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 0.66 BSC e C L 6 SC70-5 e e 5 not used Solder Pad Layout 4 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package SC70-5 Pins 5 JEDEC MO-203 Millimeters 3 2 1 B D A2 A A1 C L 6 SC70-6 B 5 4 Solder Pad Layout E 1 2 HE Min Max Min Max 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 0.65 BSC 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package SC70-6 Pins 6 JEDEC MO-203 Millimeters 3 D A2 A A1 C Max Inches Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 e L 0.026 BSC HE Min B Inches A e B 0.026 BSC HE HE E Inches Min 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Package Dimensions — SOT553 and SOT563 A 6 Package L D SOT 553 5 (not used) 4 E HE 5 Millimeters Solder Pad Layout e Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 c B 0.50 BSC e A D 6 5 2 4 E 3 e L SOT 563 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Package SOT 563 Pins 6 Millimeters Inches Min Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 HE A B 0.020 BSC L Solder Pad Layout c Inches Min A 3 2 SOT 553 Pins 0.50 BSC e 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Package Dimensions — SOT963 Package SOT 963 Pins 6 Millimeters Nom Max Min Nom Max 0.44 0.48 0.50 0.0173 0.0189 0.0197 B 0.10 0.15 0.20 0.004 0.006 0.008 c 0.05 0.10 0.15 0.002 0.004 0.006 A D 0.95 1.00 1.05 0.037 0.039 0.041 E 0.75 0.80 0.85 0.029 0.031 0.033 E1 0.95 1.00 1.05 0.037 0.039 0.041 0.35 BSC e Recommanded Solder Pad Layout © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16 Inches Min 0.014 BSC L 0.05 0.10 0.15 0.002 0.004 0.006 L1 0.125 0.15 0.175 0.005 0.006 0.007 ø 3º 5º 7º 3º 5º 7º TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Embossed Carrier Tape & Reel Specification — SC70-3 Dimensions Millimetres Min Inches Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0 ± 0.20 1.574 ± 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.30 2.50 0.090 0.098 1.00 Ref A1 B0 2.30 2.50 0.090 1.90 Ref B1 K0 0.039 Ref 0.098 0.074 1.10 1.30 0.043 0.051 K1 0.60 Ref 0.023 Ref t 0.27 max 0.010 Millimetres Inches Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6 Dimensions Min Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0 ± 0.20 W 7.70 1.574 ± 0.008 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1.12 1.32 0.044 0.052 t 0.27 max 0.010 max © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Embossed Carrier Tape & Reel Specification — SOT553 and SOT563 Dimensions Millimetres Min Inches Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.1 0.154 0.161 10P0 40.0 ± 0.20 1.574 ± 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 1.73 1.83 0.068 0.072 B0 1.73 1.83 0.068 0.072 K0 0.64 0.74 0.025 0.029 0.22 max t .009 max Embossed Carrier Tape & Reel Specification – SOT963 t W KO AO © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16 BO Inches Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.136 0.140 D1 0.45 0.55 0.018 0.022 P0 P Millimetres Min 1.50 min D F oD1 / Dimensions Symbol E P2 o/ D PO 10P0 3.90 0.059 min 4.10 40.0 ± 0.20 0.154 0.161 1.575 ± 0.008 P 1.95 2.05 0.077 0.081 P2 1.95 2.05 0.077 0.081 W 7.90 8.20 0.311 0.323 A0 1.11 1.21 0.044 0.048 B0 1.11 1.21 0.044 0.048 K0 0.58 0.68 0.023 0.027 t 0.22 max 0.009 max