Datasheet

UNISONIC TECHNOLOGIES CO., LTD
1N50-CB
Preliminary
Power MOSFET
1.0A, 500V N-CHANNEL
POWER MOSFET

DESCRIPTION
The UTC 1N50-CB is a high voltage MOSFET and is
designed to have better characteristics, such as fast switching
time, low gate charge, low on-state resistance and have a high
rugged avalanche characteristics. This power MOSFET is usually
used at high speed switching applications in power supplies,
PWM motor controls, high efficient DC to DC converters and
bridge circuits.

FEATURES
* RDS(ON) < 6.0Ω @ VGS=10V, ID=0.5A
* Fast switching capability
* Avalanche energy specified
* Improved dv/dt capability, high ruggedness


SYMBOL
ORDERING INFORMATION
Ordering Number
Lead Free
Halogen Free
1N50G-AA3-R
1N50L-TM3-T
1N50G-TM3-T
1N50L-TMS-T
1N50G-TMS-T
1N50L-TMS2-T
1N50G-TMS2-T
1N50G-TN3-R
1N50L-TN3-R
1N50L-T92-B
1N50G-T92-B
1N50L-T92-K
1N50G-T92-K
Note: Pin Assignment: G: Gate
D: Drain
S: Source
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Copyright © 2016 Unisonic Technologies Co., Ltd
Package
SOT-223
TO-251
TO-251S
TO-251S2
TO-252
TO-92
TO-92
Pin Assignment
1
2
3
G
D
S
G
D
S
G
D
S
G
D
S
G
D
S
G
D
S
G
D
S
Packing
Tape Reel
Tube
Tube
Tube
Tape Reel
Tape Box
Bulk
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1N50-CB

Preliminary
Power MOSFET
MARKING
PACKAGE
MARKING
SOT-223
TO-251 / TO-251S
TO-251S2 / TO-252
TO-92
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1N50-CB
■
Preliminary
Power MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25°С, unless otherwise specified)
PARAMETER
SYMBOL
RATINGS
UNIT
Drain-Source Voltage
VDSS
500
V
Gate-Source Voltage
VGSS
±30
V
Avalanche Current (Note 2)
IAR
1.0
A
Continuous Drain Current
ID
1.0
A
Pulsed Drain Current (Note 2)
IDM
4.0
A
Single Pulsed (Note 3)
EAS
80
mJ
Avalanche Energy
4.0
mJ
Repetitive (Note 2)
EAR
Peak Diode Recovery dv/dt (Note 4)
dv/dt
5.6
V/ns
SOT-223
1
W
Power Dissipation
TO-251/TO-251S
25
W
(TC=25°C)
TO-251S2/TO-252
TO-92
1.56
W
PD
SOT-223
0.008
W/°C
TO-251/TO-251S
Derate above 25°C
0.2
W/°C
TO-251S2/TO-252
0.0125
W/°C
TO-92
Junction Temperature
TJ
+150
°С
Operating Temperature
TOPR
-55 ~ +150
°С
Storage Temperature
TSTG
-55 ~ +150
°С
Notes: 1. Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
2. Repetitive Rating: Pulse width limited by maximum junction temperature
3. L = 159mH, IAS = 1.0A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
4. ISD ≤ 1.0A, di/dt ≤ 200A/μs, VDD ≤ BVDSS, Starting TJ = 25°C

THERMAL DATA
PARAMETER
SOT-223
TO-251/TO-251S
Junction to Ambient
TO-251S2/TO-252
TO-92
SOT-223
TO-251/TO-251S
Junction to Case
TO-251S2/TO-252
TO-92
SYMBOL
RATINGS
150
UNIT
°С/W
θJA
110
°С/W
140
125
°С/W
°С/W
5
°С/W
80
°С/W
UNISONIC TECHNOLOGIES CO., LTD
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θJC
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
Preliminary
Power MOSFET
ELECTRICAL CHARACTERISTICS (TC=25℃, unless otherwise specified.)
PARAMETER
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
Drain-Source Leakage Current
SYMBOL
TEST CONDITIONS
BVDSS
IDSS
VGS=0V, ID=250μA
VDS=500V, VGS=0V
Forward
VGS=30V, VDS=0V
Gate-Source Leakage Current
IGSS
Reverse
VGS=-30V, VDS=0V
Breakdown Voltage Temperature Coefficient △BVDSS/△TJ ID=250μA
ON CHARACTERISTICS
Gate Threshold Voltage
VGS(TH)
VDS=VGS, ID=250μA
Static Drain-Source On-State Resistance
RDS(ON)
VGS=10V, ID=0.5A
DYNAMIC CHARACTERISTICS
Input Capacitance
CISS
VDS=25V, VGS=0V, f=1MHz
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
SWITCHING CHARACTERISTICS
Total Gate Charge
QG
VDS=50V, VGS=10V,
ID=1.3A, IG = 250μA
Gate-Source Charge
QGS
(Note 1, 2)
Gate-Drain Charge
QGD
Turn-On Delay Time
tD(ON)
Turn-On Rise Time
tR
VDD =30V, VGS=10V, ID =0.5A,
RG=25Ω (Note 1, 2)
Turn-Off Delay Time
tD(OFF)
Turn-Off Fall Time
tF
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Maximum Continuous Drain-Source Diode
IS
Forward Current
Maximum Pulsed Drain-Source Diode
ISM
Forward Current
Drain-Source Diode Forward Voltage
VSD
VGS=0V, IS =1.0A
Reverse Recovery Time
trr
VGS=0V, IS=1.0A
dIF/dt=100A/μs (Note 1)
Reverse Recovery Charge
QRR
Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. Pulse Test: Pulse Width ≤300μs, Duty Cycle≤2%
3. Essentially Independent of Operating Temperature
UNISONIC TECHNOLOGIES CO., LTD
www.unisonic.com.tw
MIN TYP MAX UNIT
500
0.4
2.0
V
10
μA
100 nA
-100 nA
V/℃
4.0
6.0
V
Ω
120
22
4.7
pF
pF
pF
10.1
1.2
0.5
24
18
56
27
nC
nC
nC
ns
ns
ns
ns
110
0.28
1.0
A
4.8
A
1.4
V
ns
μC
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Preliminary
Power MOSFET
TEST CIRCUITS AND WAVEFORMS
+
D.U.T.
VDS
+
-
L
RG
Driver
VGS
VGS
(Driver)
P.W.
* dv/dt controlled by RG
* ISD controlled by pulse period
* D.U.T.-Device Under Test
Same Type
as D.U.T.
Period
D=
VDD
P. W.
Period
VGS= 10V
IFM, Body Diode Forward Current
ISD
(D.U.T.)
di/dt
IRM
Body Diode Reverse Current
Body Diode Recovery dv/dt
VDS
(D.U.T.)
VDD
Body Diode
Forward Voltage Drop
Peak Diode Recovery dv/dt Waveforms
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1N50-CB

Preliminary
Power MOSFET
TEST CIRCUITS AND WAVEFORMS (Cont.)
Switching Test Circuit
Switching Waveforms
Gate Charge Test Circuit
Gate Charge Waveform
L
VDS
BVDSS
IAS
RD
10V
VDD
D.U.T.
ID(t)
VDS(t)
VDD
tp
tp
Unclamped Inductive Switching Test Circuit
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Time
Unclamped Inductive Switching Waveforms
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1N50-CB
Preliminary
Power MOSFET
UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
UNISONIC TECHNOLOGIES CO., LTD
www.unisonic.com.tw
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