TND6201/D MatrixCamt Video Development Kit Reference Design Documentation Package www.onsemi.com Overview MatrixCam Video Development Kit is a low power, smart 1080P video camera that streams video over Wi-Fi® and Ethernet, and is targeted towards the Internet of Things (IoT) market. MatrixCamt VDK revolutionizes IoT by providing vision and connectivity based on an open source platform solution, and enables fast time-to-market for IoT developers. To make it an intelligent streaming device, a PIR sensor is integrated to detect movement and to wake up the system to start video streaming. The system has the additional option for wake up through Bluetooth® Low Energy (BLE). On wake up, a push notification is sent to a mobile device alerting the user. The product will have different resolution selection options for video streaming. The product supports micro SD card slot and cloud service option for storage and playback of images/video clips. The camera connects to a cloud service with support for both video on demand (VOD) and live streaming. Additionally, the user will be able to configure the IoT device using a GUI or mobile application. To receive the requests from this GUI, an embedded HTTP server is provided in the IoT device. The following features will be controlled by the GUI: • Network Configuration • Video Configuration • View Live Stream • Cloud Storage SD-Card Recording and File List • Firmware Upgrade TECHNICAL NOTE Figure 1. MatrixCam VDK Camera Key Features Application Processor: • 1080p @ 30 fps Video Streaming over Ethernet & Wi-Fi • Resolution Options for Video and Still Images • Built-In Image Signal Processor • Live Streaming and Recording on Wake Up from Standby • Bluetooth Low Energy (BLE) and PIR Wake Up from Standby Wireless Connectivity: • Wi-Fi: ♦ Single Band (2.4 GHz) Wi-Fi Module Capable of 802.11b/g/n ♦ Wi-Fi Runs in Client Mode ♦ Low Power in Standby Mode • Bluetooth Low Energy (BLE): ♦ Ability to Connect Camera to other BLE 4.0 Devices in a House ♦ Ability to Wake Up from Standby © Semiconductor Components Industries, LLC, 2015 October, 2015 − Rev. 2 1 Publication Order Number: TND6201/D TND6201/D Image Sensor Specification: • Resolution: 1920 × 1080 @ 30 fps • Pixel Size: 3 mm • CFA: RGB Bayer • Shutter Type: Electronic Rolling Shutter(ERR), Global Rolling Shutter • Input Clock Range: 6−48 MHz • Output: Serial, Parallel • Output Clock Max: 148.5 Mp/s (4-lane HiSpi), 74.25 Mp/s (Parallel) • Frame Rate: 30 fps • Responsivity: 4.0 V/lux-sec • SNRMAX: 41 dB • Supply Voltage: ♦ I/O: 1.8 or 2.8 V ♦ Digital: 1.8 V ♦ Analog: 2.8 V ♦ HiSpi: 0.3 V−0.6 V (SLVS), 1.7 V−1.9 V (HiVcm) Major Components Description ON Semiconductor AR0230 2 MP/1080p CMOS Image Sensor with Superior Low Light Performance Gainspan Wi-Fi Module GS2011M Module Streams Data over Wi-Fi Bluetooth Module Noridc BLE nRF51822 TI DM368 ARM9® Core, High Performance Digital Media System on Chip PIR Motion Sensor Triggers Camera Functions on Motion Detection Microphone Omnidirectional Microphones LEDs For Power, Video Streaming USB Port Provides Power to Board, Firmware Upgrades Battery 4200 mAH Lithium-ion Battery Storage microSD Card Slot Specifications Board Lens Specification: • HFOV (Horizontal Field of View): 105° • VFOV (Vertical Field of View): 80° Audio: • Microphones: Omni-directional Microphones • Audio Encoding: 16 kHz, 32/64 kbps AAC−LC • Speaker: NXP (Cellphone Speaker) 0.5 W Ethernet: • IEEE 802.3u 10/100mbps Figure 2. MatrixCam VDK Camera Block Diagram Sensors: • Passive Infra-Red • Ability to Detect People at 10−15 Feet • Detection Angle of at Least 140° • • Storage: • microSDt Card Slot • LED: • Multi-Color LED to Show Status MatrixCam VDK has an embedded web server & an embedded streaming server. It can interact with the world via: • Application Programming Interfaces (API) • Cloud Integration Real Time Clock: • RTC of GS2011MIES will be used USB Connector (Micro-USB): • For Debugging • For Firmware Upgrade • Recording and Playing Back Pictures and Video to and • There are 3 Main Functions of the Camera: Configuration (Frame per Second, Resolution, Recording Video Configurations) Control (Record, Take Snapshot, Change Image Quality) View Live Stream Additionally, an Open Source Automated Test Suite is available that provides validation of the APIs. from SD Card There will be a Slide Switch to Turn ON/OFF the Board Power: • Micro-USB • Single Cell Lithium ion Battery Charger www.onsemi.com 2 TND6201/D Application Programming Interface Architecture BOA Web Server http Ethernet or Wi-Fi rtsp Streaming Server MatrixCam Video Development Kit Figure 3. Application Programming Interface Architecture • • • There are enablers in the Camera to support 3 types of Cloud Integration Use Cases. Push Notification: ♦ From Camera to mobile device. ♦ Google® Cloud Messaging Push Notification Live Streaming from Camera to Cloud (Amazon® Web Services + Media Streaming Server) ♦ Hooks Inside the Camera ♦ Demo Cloud Platform Cloud Recording – Record Video on the Cloud for Playback at a Later Time www.onsemi.com 3 TND6201/D Push Notification Google Cloud Messaging PIR Sensor Ethernet or Wi-Fi Coming Soon Push Notification MatrixCam Video Development Kit Figure 4. Push Notifications 1. When the MatrixCam VDK’s PIR sensor detects motion, a push notification is sent to your mobile device. 2. Push Server credentials can be customized and entered via the Web GUI. 3. Instructions on how to setup a sample Push Server on Google Cloud is part of Appendix A. Streaming Server PIR Sensor Remote Viewing of Camera’s Live Stream • This Section has instructions on how to setup Amazon Web Services (EC2) with Wowza® Streaming Media Engine to pull the rtsp from the Camera. IMPORTANT! The Camera must have a publicly accessible IP Address • How to Configure the Web GUI credentials to setup Cloud Recording. • If enabled by user, PIR motion will trigger recording on the cloud for a short customizable period of time. Ethernet or Wi-Fi Pull rtsp http http − Start Recording on Cloud http − Stop Recording on Cloud Video Streaming MatrixCam Video Development Kit Figure 5. Live Streaming www.onsemi.com 4 Media Streaming Server on the Cloud TND6201/D Google Cloud Messaging Server Architecture and Technology For the purpose of demonstration we use the following architecture provided by Google − Google Cloud Messaging. The PIR sensor on the Matrix board detects motion and starts SD Card Recording of the Video Stream. It also initiates a push notification from a custom instance of the Google Cloud Messaging System to all registered mobile devices. As of Version 1.0, only Androidt Devices are supported. In future this support will be extended to web apps and iOS®. Client App 3rd Party App Server GCM Connection Servers Figure 6. Google Cloud Messaging The GCM is a 3-tiered architecture: 3rd Party App Server: This is a dedicated app server that users of the Matrix Board set up to send messages from the camera via the GCM Connection Servers to a dedicated application on mobile devices. We will walk through the steps to set this up in Section. GCM Connection Servers: Provided by Google. In this setup, we only http as the communication protocol (not XMPP) and push notifications are sent from camera to device. There is no communication from device to the camera in the current version. www.onsemi.com 5 MatrixCam VDK Overall Block Diagram TND6201/D Figure 7. MatrixCam VDK Interconnection Diagram 6 www.onsemi.com TND6201/D DM368 Main Architecture Figure 8. DM368 Main Architecture www.onsemi.com 7 TND6201/D Bill of Materials (BOM) Table 1. BILL OF MATERIALS Manufacturer Manufacturer Part Number Item EN Description Qty. Reference Design 1 501-1-00198 BPCB, 6L, 95 × 60 mm, OSMU_ICDK 1 2 204-1-00023 Battery, Li-ion, 3.7 V, 4.2 Ah, 20 × 41 × 50 mm, Holder Mount 1 UFO SOURCE ENERGY BATTERY TECHNOLOGY CO., LIMITED U954048−2P BT1 3 102-1-01803 Cap, Cer-X5R, 10 mF, 10 V, 20%, 0402 34 SAMSUNG ELECTRO−MECHANICS AMERICA, INC CL05A106MP5NUNC C3, C4, C31, C86, C152, C153, C154, C171, C172, C173, C190, C191, C192, C257, C264, C267, C269, C271, C273, C275, C293, C302, C305, C308, C309, C326, C327, C340, C343, C344, C365, C417, C418, C475 4 102-1-01641 Cap, Cer-X5R, 1 mF, 10 V, 10%, 0402 13 MURATA MANUFACTURING CO,LTD WALSIN TECHNOLOGY CORP. AVX CORPORATION GRM155R61A105KE15D 0402X105K100 0402ZD105KAT2A C5, C6, C104, C107, C111, C114, C117, C124, C128, C132, C367, C438, C463 5 102-1-01604 Cap, Cer-X5R, 0.1 mF, 10 V, 10%, 0402 113 AVX CORPORATION WALSIN TECHNOLOGY CORP. WALSIN TECHNOLOGY CORP. 0402ZD104KAT2A 0402X104K100 0402X104K100CT C8, C9, C10, C11, C12, C13, C14, C15, C16, C17, C18, C19, C20, C21, C22, C26, C42, C106, C109, C110, C113, C119, C126, C130, C134, C136, C137, C138, C139, C140, C141, C142, C143, C155, C156, C157, C158, C159, C160, C161, C162, C174, C175, C176, C177, C178, C179, C180, C181, C253, C265, C266, C272, C276, C277, C278, C279, C281, C282, C283, C294, C295, C296, C297, C303, C306, C307, C310, C311, C312, C324, C325, C328, C329, C341, C342, C346, C348, C350, C353, C354, C355, C370, C371, C372, C373, C375, C376, C377, C380, C381, C419, C420, C421, C429, C436, C440, C442, C448, C449, C450, C462, C464, C465, C466, C469, C472, C474, C476, C477, C506, C509, C510 6 102-1-00001 Cap, Cer-X7R, 0.01 mF, 10 V, 10%, 0402 34 AVX CORPORATION KEMET 0402ZC103KAT2A C0402C103K8RAC C24, C25, C27, C28, C29, C30, C120, C127, C131, C135, C248, C249, C252, C259, C298, C299, C300, C301, C304, C318, C319, C334, C335, C345, C347, C349, C361, C362, C439, C461, C467, C470, C471, C473 7 102-1-01791 Cap, Cer-X5R, 22 mF, 10 V, 20%, 0603 4 TDK CORPORATION WALSIN TECHNOLOGY CORP. C1608X5R1A226M080AC 0603X226M100 C89, C251, C268, C274 8 102-1-00047 Cap, Cer-X7R, 560 pF, 25 V, 10%, 0402 24 AVX CORPORATION KEMET 04023C561KAT2A C0402C561K3RAC C144, C145, C146, C147, C148, C149, C150, C151, C163, C164, C165, C166, C167, C168, C169, C170, C182, C183, C184, C185, C186, C187, C188, C189 9 102-1-01647 Cap, Cer-X5R, 10 mF, 16 V, 10%, 0805 1 AVX CORPORATION WALSIN TECHNOLOGY CORP. 0805YD106KAT2A 0805X106K160 C250 10 102-1-00208 Cap, Cer-X5R, 2.2 mF, 10 V, 10%, 0402 2 TDK CORPORATION AVX CORPORATION WALSIN TECHNOLOGY CORP. C1005X5R1A225K 0402ZD225KAT*A 0402X225K100 C256, C468 11 102-1-00819 Cap, Cer-NPO, 27 pF, 25 V, 1%, 0603 2 AVX CORPORATION 06033A270FAT2A C263, C270 12 102-1-00027 Cap, Cer-X7R, 0.01 mF, 25 V, 10%, 0402 1 AVX CORPORATION KEMET WALSIN TECHNOLOGY CORP. 04023C103KAT2A C0402C103K3RAC 0402B103K250 C280 13 102-1-00017 Cap, Cer-X7R, 270 pF, 10 V, 10%, 0402 2 AVX CORPORATION KEMET 0402ZC271KAT2A C0402C271K8RAC C351, C352 14 102-1-00103 Cap, Cer-X7R, 1800 pF, 10 V, 10%, 0603 2 AVX CORPORATION KEMET 0603ZC182KAT2A C0603C182K8RAC C356, C359 15 102-1-00464 Cap, Cer-X7R, 1.5 mF, 10 V, 10%, 1206 1 AVX CORPORATION KEMET 1206ZC155KAT2A C1206C155K8RAC C357 BPCB1 www.onsemi.com 8 TND6201/D Table 1. BILL OF MATERIALS (continued) Item EN Description Qty. Manufacturer Manufacturer Part Number 16 102-1-00117 Cap, Cer-X7R, 8200 pF, 10 V, 10%, 0603 1 AVX CORPORATION KEMET 0603ZC822KAT2A C0603C822K8RAC C358 17 102-1-00091 Cap, Cer-X5R, 4.7 mF, 16 V, 10%, 0603 1 TAIYO YUDEN TDK CORPORATION EMK107ABJ475KA−T C1608X5R1C475K C360 18 102-1-00862 Cap, Cer-NPO, 36 pF, 50 V, 1%, 0603 2 AVX CORPORATION 06035A360FAT2A C363, C364 19 102-1-00210 Cap, Cer-X5R, 0.22 mF, 10 V, 10%, 0402 3 MURATA MANUFACTURING CO,LTD WALSIN TECHNOLOGY CORP. GRM155R61A224KE19D 0402X224K100 C366, C446, C507 20 102-1-01640 Cap, Cer-X5R, 10 mF, 10 V, 20%, 0603 3 TAIYO YUDEN LMK107BJ106MALTD C368, C369, C374 21 102-1-01639 Cap, Cer-NPO, 24 pF, 50 V, 5%, 0402 2 AVX CORPORATION 04025A240JAT2A C378, C379 22 102-1-01612 Cap, Cer-X7R, 1000 pF, 2 kV, 10%, 1210 2 AVX CORPORATION WALSIN TECHNOLOGY CORP. PROSPERITY DIELECTRICS CO. 1210GC102KAT1A 1210B102K202 MA1210XR−102K−202ER C382, C383 23 102-1-00011 Cap, Cer-X7R, 1000 pF, 10 V, 10%, 0402 2 AVX CORPORATION KEMET 0402ZC102KAT2A C0402C102K8RAC C422, C441 24 102-1-01677 Cap, Cer-NPO, 2.2 pF, 50 V, ±0.1 pF, 0402 1 AVX CORPORATION 04025A2R2BAT2A C423 25 102-4-00009 Cap, RF, Cer-NPO, 5 pF, 50 V, 0.25 pF, 0402 1 MURATA MANUFACTURING CO,LTD GJM1555C1H5R0CB01D C424 26 102-4-00004 Cap, RF, Cer-NPO, 1 pF, 50 V, ±0.1 pF, Low ESR, 0402 1 AVX CORPORATION MURATA MANUFACTURING CO,LTD 04025U1R0BAT** GJM1555C1H1R0BB01* C425 27 102-1-00626 Cap, Cer-NPO, 1.5 pF, 50 V, 0.25 pF, 0402 1 AVX CORPORATION 04025A1R5CAT2A C426 28 102-1-00016 Cap, Cer-X7R, 2200 pF, 10 V, 10%, 0402 1 AVX CORPORATION KEMET 0402ZC222KAT2A C0402C222K8RAC C427 29 102-1-01672 Cap, Cer-NPO, 2.7 pF, 50 V, ±0.1 pF, 0402 1 AVX CORPORATION 04025A2R7BAT2A C428 30 102-1-00009 Cap, Cer-X7R, 0.047 mF, 10 V, 10%, 0402 1 AVX CORPORATION KEMET 0402ZC473KAT2A C0402C473K8RAC C430 31 102-1-00744 Cap, Cer-NPO, 18 pF, 25 V, 1%, 0402 2 AVX CORPORATION 04023A180FAT2A C431, C433 32 102-1-00758 Cap, Cer-NPO, 12 pF, 50 V, 1%, 0402 2 AVX CORPORATION 04025A120FAT2A C432, C434 33 102-2-00491 Cap, Low ESR, 33 mF, 10 V, 10%, 700 mE, Size A 1 AVX CORPORATION TPSA336K010R0700 C443 34 102-1-00003 Cap, Cer-X7R, 0.015 mF, 10 V, 10%, 0402 1 AVX CORPORATION KEMET 0402ZC153KAT2A C0402C153K8RAC C444 35 102-1-01735 Cap, Cer-X5R, 100 mF, 10 V, 20%, 1206 1 TDK CORPORATION WALSIN TECHNOLOGY CORP. C3216X5R1A107M 1206X107M100CT C445 36 102-1-00209 Cap, Cer-X5R, 0.47 mF, 10 V, 10%, 0402 2 MURATA MANUFACTURING CO,LTD WALSIN TECHNOLOGY CORP. GRM155R61A474KE15D 0402X474K100 C447, C508 37 102-1-01646 Cap, Cer-X7R, 1000 pF, 2 kV, 10%, 1206 1 AVX CORPORATION JOHANSON DIELECTRICS INC 1206GC102KAT1A 202R18W102KV4E C455 38 106-4-00071 LED, Single, Red, 0603 3 DIALIGHT 598−8010−107F D1, D2, D4 39 106-4-00070 LED, Single, Yellow-Green, 0603 2 DIALIGHT 598−8060−107F D3, D5 40 104-1-00002 F-Bead, 30 E, 1 A, SMD0603 18 MURATA MANUFACTURING CO,LTD BLM18PG300SN1 FB9, FB10, FB11, FB12, FB13, FB14, FB16, FB17, FB19, FB21, FB22, FB23, FB24, FB26, FB31, FB32, FB33, FB34 41 104-1-00003 F-Bead, 600 E, 0.5 A, SMD0603 1 MURATA MANUFACTURING CO,LTD TDK CORPORATION BLM18AG601SN1D MMZ1608B601C FB25 www.onsemi.com 9 Reference Design TND6201/D Table 1. BILL OF MATERIALS (continued) Item EN Description Qty. Manufacturer Manufacturer Part Number Reference Design 42 104-1-00004 F-Bead, 120 E, 0.5 A, SMD0603 3 TAIYO YUDEN BK1608HS121−T FB27, FB28, FB29 43 303-1-00005 Filter, BPF, 1 ch, 2.45 GHz, WLAN/BT, SMD0805 1 MURATA MANUFACTURING CO,LTD LFB212G45CG1B982 FL2 44 201-1-00264 Conn, Berg strip, 1 × 2, 1.27 mm, 1 A, ST, TH 13 SULLINS CONNECTOR SOLUTIONS GRPB021VWVN−RC H1, H2, H3, H4, H5, H6, H7, H8, H9, H10, H11, H12, H16 45 201-2-00165 Conn, USB Micro B Receptacle, 1 × 1, Shielded, RA, SMD 1 MOLEX 473460001 J2 46 201-1-00153 Conn, USB Micro B Receptacle, 1 × 1, Shielded, ST, TH 1 MOLEX 105133−0011 J3 47 201-1-00107 Conn, Coaxial, Receptacle, 50 E, 6 GHz, ST, SMD 1 HRS (HIROSE ELECTRIC CO LTD) U.FL−R−SMT−1 J6 48 201-1-00362 Conn, RJ45 Jack, 1 × 1, Shield, LED (G, Y), ST, TH 1 AMPHENOL RJHSE−3381−A1 J7 49 201-2-00176 Conn, microSD Card Socket, 1 × 1, Push-Push, RA, SMD 1 HRS (HIROSE ELECTRIC CO LTD) DM3AT−SF−PEJM5 J9010 50 103-1-00252 Ind, Power, 2.2 mH, 20%, 2.2 A, 115 mE, Shielded, SMD 1 TDK CORPORATION SPM3012T−2R2M L1 51 103-1-00250 Ind, Power, 2.2 mH, 25%, 2.9 A, 35.9 E, Shielded, SMD 1 SUMIDA AMERICA COMPONENTS INC CDRH5D16NP−2R2NC L2 52 103-1-00205 Ind, Power, 1 mH, 30%, 2.45 A, 36 mE, Shielded, 90 MHz, SMD 2 MURATA MANUFACTURING CO,LTD LQH44PN1R0NP0L L3, L4 53 103-1-00032 Ind, Chip, 3.3 mH, 10%, 30 mA, 1.3 E, Shielded, 65 MHz, SMD0603 1 TDK CORPORATION MLF1608A3R3KT L5 54 103-2-00002 Ind, RF, Air Core, 3.3 nH, ±0.3 nH, 0.3 A, 0.17 E, Shielded, 6 GHz, SMD0402 1 MURATA MANUFACTURING CO,LTD LQG15HS3N3S02 L10 55 103-2-00003 Ind, RF, Air Core, 4.7 nH, ±0.3 nH, 0.3 A, 0.18 E, Shielded, 6 GHz, SMD0403 1 MURATA MANUFACTURING CO,LTD LQG15HS4N7S02 L11 56 103-2-00004 Ind, RF, Air Core, 10 nH, 5%, 0.3 A, 0.26 E, Unshielded, 3.4 GHz, SMD0402 1 MURATA MANUFACTURING CO,LTD LQG15HS10NJ02 L12 57 103-1-00033 Ind, Chip, 2.7 nH, 2%, 1.5 A, 56 mE, Unshielded, 13 GHz, SMD0402 1 COILCRAFT 0402HP−2N7XGLW L13 58 401-2-00042 Lens Holder, S-mount, M12 × 0.5 1 XIAMEN LEADING OPTICS CO., LTD A02−002 MIS1 59 401-2-00040 Lens, Megapixel, M12 × 0.5-6g, 1/2.7″ 1 XIAMEN LEADING OPTICS CO., LTD M127B02820WR2 MIS2 60 401-2-00027 Lens-PIR, PD55-14006, 5.5 mm, 140° 1 FRESNELFACTORY PD55−14006 MIS3 61 401-1-00115 MIC, Condenser, −44 dB, ±3dB, 100−20 KHz, Omnidirectional 1 CUI INC CMC−5044TF−A MK1 62 305-1-00001 ESD suppressor, Bidir, 24 VDC, Polymer, SMD0603 1 LITTELFUSE PGB1010603MR P1 63 305-1-00033 Diode, ESD-Bidir, 9.5 V, 90 W, SMD 1 TEXAS INSTRUMENTS TPD1E10B09DPYR P6 64 107-2-00105 Transistor, P-MOSFET, 20 V, 5.1 A, VGS = 8 V, 0.7 W, UDFN-6 3 ON SEMICONDUCTOR NTLUS3A18PZTCG Q1, Q2, Q4 65 107-1-00006 Transistor, BJT, Dual NPN, 50 V, 0.1 A, 0.15 W, SOT363−6 2 PANASONIC DMC564040 Q6, Q7 www.onsemi.com 10 TND6201/D Table 1. BILL OF MATERIALS (continued) Item EN Description Qty. Manufacturer Manufacturer Part Number Reference Design 66 107-2-00106 Transistor, N-MOSFET, 20 V, 0.75 A, VGS = 6 V, 0.31 W, SOT-723-3 2 ON SEMICONDUCTOR NTK3134NT1G Q8, Q9 67 101-3-00038 Res, I-Sense, 33 mE, 1/4 W, 1%, 1200 ppm/°C, 0805 1 YAGEO RL0805FR-7W0R033L R1 68 101-1-00001 Res, Chip, 0 E, 1.5 A, 0402 59 VISHAY CRCW04020000Z0 R2, R3, R4, R5, R7, R19, R26, R28, R29, R32, R36, R42, R55, R56, R58, R59, R74, R75, R76, R77, R78, R84, R99, R102, R103, R105, R106, R107, R109, R116, R131, R132, R142, R145, R150, R217, R218, R220, R230, R238, R239, R240, R241, R248, R249, R253, R259, R267, R268, R269, R270, R271, R272, R580, R585, R594, R595, R597, R598 69 101-1-03415 Res, Chip, 220 E, 1/10 W, 1%, 0603 5 KOA SPEER ELECTRONICS, INC. RK73H1JTTD2200F R9, R205, R206, R207, R208 70 101-1-02793 Res, Chip, 10 kW, 1/16 W, 5%, 0402 60 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. RK73B1ETTP103J CRCW040210K0JNED WR04X103JTL R10, R25, R30, R34, R39, R40, R52, R53, R60, R62, R64, R65, R66, R68, R71, R73, R81, R82, R83, R88, R89, R93, R100, R110, R111, R112, R113, R114, R115, R117, R133, R134, R135, R136, R137, R138, R139, R140, R141, R143, R148, R231, R235, R236, R237, R246, R250, R251, R252, R260, R261, R264, R265, R588, R589, R590, R591, R592, R593, R607 71 101-1-03611 Res, Chip, 220 kW, 1/10 W, 1%, 0603 2 PANASONIC ERJ-3EKF2203V R24, R31 72 101-1-01181 Res, Chip, 174 kW, 1/10 W, 1%, 0603 1 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. EVER OHMS TECHNOLOGY RK73H1JTTD1743F CRCW0603174KFK WR06X1743F CR0603F174K R27 73 101-1-01162 Res, Chip, 110 kW, 1/10 W, 1%, 0603 1 KOA SPEER ELECTRONICS, INC. VISHAY RK73H1JTTD1103F CRCW0603110KFK R35 74 101-1-00389 Res, Chip, 10 kW, 1/16 W, 1%, 0402 38 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. RK73H1ETTP1002F CRCW040210K0FK WR04X1002F R37, R41, R125, R126, R127, R129, R130, R151, R152, R153, R154, R155, R157, R158, R159, R160, R161, R186, R189, R195, R196, R199, R200, R209, R242, R582, R583, R584, R586, R587, R599, R600, R601, R602, R603, R604, R605, R606 75 101-1-02782 Res, Chip, 3.6 kW, 1/16 W, 5%, 0402 1 KOA SPEER ELECTRONICS, INC. VISHAY RK73B1ETTP362J CRCW04023K60JNED R38 76 101-1-00485 Res, Chip, 100 kW, 1/16 W, 1%, 0402 6 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. RK73H1ETTP1003F CRCW0402100KFK WR04X1003F R43, R193, R204, R229, R232, R245 77 101-1-00293 Res, Chip, 1 kW, 1/16 W, 1%, 0402 6 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. YAGEO RALEC WALSIN TECHNOLOGY CORP. RK73H1ETTP1001F CRCW04021K00FK WR04X1001F RC0402FR-071KL RTT021001F WR04X1001FTL R44, R49, R50, R194, R262, R263 78 101-1-00101 Res, Chip, 10 E, 1/16 W, 1%, 0402 9 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. RK73H1ETTP10R0F CRCW040210R0FK WR04X10R0F R45, R46, R47, R85, R104, R108, R273, R274, R275 79 101-1-00168 Res, Chip, 49.9 E, 1/16 W, 1%, 0402 5 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. RK73H1ETTP49R9F CRCW040249R9FK WR04X49R9F R48, R162, R163, R164, R165 www.onsemi.com 11 TND6201/D Table 1. BILL OF MATERIALS (continued) Manufacturer Part Number Item EN Description Qty. Manufacturer 80 101-1-02797 Res, Chip, 15 kW, 1/16 W, 5%, 0402 6 KOA SPEER ELECTRONICS, INC. VISHAY RK73B1ETTP153J CRCW040215K0JNED R51, R54, R57, R79, R80, R124 81 101-1-02769 Res, Chip, 1 kW, 1/16 W, 5%, 0402 10 KOA SPEER ELECTRONICS, INC. VISHAY ROHM WALSIN TECHNOLOGY CORP. RK73B1ETTP102J CRCW04021K00JNED MCR01MRTJ102 WR04X102JTL R61, R63, R67, R69, R70, R72, R144, R146, R147, R149 82 101-1-00002 Res, Chip, 0 E, 1 A, 0603 1 KOA SPEER ELECTRONICS, INC. PANASONIC WALSIN TECHNOLOGY CORP. RK73Z1JTTD ERJ-3GEY0R00V WR06X000PTL R87 83 101-1-02773 Res, Chip, 1.5 kW, 1/16 W, 5%, 0402 5 KOA SPEER ELECTRONICS, INC. VISHAY RK73B1ETTP152J CRCW04021K50JNED R96, R97, R118, R119, R596 84 101-1-00817 Res, Chip, 28 E, 1/10 W, 1%, 0603 1 KOA SPEER ELECTRONICS, INC. VISHAY RK73H1JTTD28R0F CRCW060328R0FK R98 85 101-1-00310 Res, Chip, 1.5 kW, 1/16 W, 1%, 0402 1 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. RK73H1ETTP1501F CRCW04021K50FK WR04X1501FTLV R101 86 101-1-03433 Res, Chip, 2.4 kW, 1/16 W, 0.5%, 25 ppm/°C, 0402 1 PANASONIC SUSUMU ERA-2AED242 RR0510P-242-D R120 87 101-1-00324 Res, Chip, 2.1 kW, 1/16 W, 1%, 0402 1 KOA SPEER ELECTRONICS, INC. VISHAY RK73H1ETTP2101F CRCW04022K10FK R121 88 101-1-00325 Res, Chip, 2.15 kW, 1/16 W, 1%, 0402 1 KOA SPEER ELECTRONICS, INC. VISHAY RK73H1ETTP2151F CRCW04022K15FK R122 89 101-1-00185 Res, Chip, 75 E, 1/16 W, 1%, 0402 5 KOA SPEER ELECTRONICS, INC. VISHAY RK73H1ETTP75R0F CRCW040275R0FK R123, R167, R168, R169, R171 90 101-1-02785 Res, Chip, 4.7 kW, 1/16 W, 5%, 0402 1 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. RK73B1ETTP472J CRCW04024K70JNED WR04X472JTL R128 91 101-1-02776 Res, Chip, 2 kW, 1/16 W, 5%, 0402 1 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. RK73B1ETTP202J CRCW04022K00JNED WR04X202JTL R156 92 101-1-02931 Res, Chip, 510 E, 1/10 W, 5%, 0603 2 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. RK73B1JTTD511J CRCW0603510RJNEA WR06X511JTL R166, R170 93 101-1-03393 Res, Chip, 33 E, 1/10 W, 1%, 0402 1 PANASONIC ERJ2RKF33R0X R172 94 101-1-02809 Res, Chip, 47 kW, 1/16 W, 5%, 0402 1 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. RK73B1ETTP473J CRCW040247K0JNED WR04X473JTL R197 95 101-1-03398 Res, Chip, 620 kW, 1/16 W, 1%, 0402 1 WALSIN TECHNOLOGY CORP. WR04X6203F R198 96 101-1-02795 Res, Chip, 12 kW, 1/16 W, 5%, 0402 1 KOA SPEER ELECTRONICS, INC. VISHAY RK73B1ETTP123J CRCW040212K0JNED R201 97 101-1-03432 Res, Chip, 3.3 kW, 1/16 W, 0.1%, 0402 1 PANASONIC ERA−2AEB332 R202 98 101-1-02825 Res, Chip, 220 kW, 1/16 W, 5%, 0402 1 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. RK73B1ETTP224J CRCW0402220KJNED WR04X224JTL R203 99 101-1-03203 Res, Chip, 10 MW, 1/8 W, 5%, 0805 1 KOA SPEER ELECTRONICS, INC. VISHAY RK73B2ATTD106J CRCW080510M0JNEA R215 www.onsemi.com 12 Reference Design TND6201/D Table 1. BILL OF MATERIALS (continued) Manufacturer Part Number Item EN Description Qty. Manufacturer 100 101-1-02777 Res, Chip, 2.2 kW, 1/16 W, 5%, 0402 1 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. RK73B1ETTP222J CRCW04022K20JNED WR04X222J R219 101 101-1-00197 Res, Chip, 100 E, 1/16 W, 1%, 0402 2 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. RK73H1ETTP1000F CRCW0402100RFK WR04X1000FTL R233, R234 102 101-1-02786 Res, Chip, 5.1 kW, 1/16 W, 5%, 0402 1 KOA SPEER ELECTRONICS, INC. VISHAY WALSIN TECHNOLOGY CORP. RK73B1ETTP512J CRCW04025K10JNED WR04X512JTL R266 103 401-1-00145 Speaker, 1 W, 8 E, 16 × 16 × 4.7 mm 1 SOBERTON INC SP-1605 SP1 104 205-1-00035 Switch, Tactile, SPST-NO, 32 V, 50 mA, Vertical, SMD 3 C&K COMPONENTS KMR231NG LFS SW2, SW7, SW9 105 205-1-00041 Switch, DIP, 2 Position, 25 mA, Vertical, SMD 4 C&K COMPONENTS TDA02H0SB1 SW3, SW4, SW5, SW8 106 205-1-00016 Switch, Tactile, SPST-NO, Vertical, SMD 1 OMRON ELECTRONIC COMPONENTS PTE LTD. B3FS-1050 SW10 107 105-1-00024 Xmr, ETH, 10/100M, Single, (CMC-1CT:1CT-CMC), (1CT:1CT-CMC), SMD 1 WÜRTH ELECTRONICS, INC 749013011 T1 108 301-1-00044 IC, SoC, TMS320DM368, Digital Media, 432 MHz, PBGA-338 1 TEXAS INSTRUMENTS TMS320DM368ZCED U1 109 301-2-00008 IC, DDR2, 256 MB, ×16 bit, 400 MHz, BGA-84 1 MICRON MT47H128M16RT-25E U2 110 301-2-00152 IC, NOR Flash, 16 MB, ×16 bit, 70 ns, FBGA-64 1 MICRON M29W128GL70ZS6F U3 111 301-2-00121 IC, NAND Flash, 128 MB, ×8 bit, 20 ns, VFBGA-63 1 MICRON MT29F1G08ABADAH4-IT:D U4 112 301-4-00281 IC, Switcher, 2.3−5.5 VIN, 0.6−5.5 VOUT/1.2 A, 3 MHz, Sync Buck Conv, WDFN-8 2 ON SEMICONDUCTOR NCP6332BMTAATBG U6, U9 113 301-4-00284 IC, LDO, 1.9−5.5 VIN, 2.8 VOUT/0.25 A, WLCSP-4 2 ON SEMICONDUCTOR NCP160AFCS280T2G U7, U10 114 301-0-00713 IC, NL27WZ08, Dual 2-Input AND Gate, VFSOP-8 1 ON SEMICONDUCTOR NL27WZ08USG U11 115 301-0-00701 IC, MAX708, mP Supervisory Circuit, SOIC-8 1 ON SEMICONDUCTOR MAX708TESA-TG U12 116 301-0-00707 IC, NCP1855, Single Cell Li-ion Battery Charger, CSP-25 1 ON SEMICONDUCTOR NCP1855FCCT1G U13 117 301-4-00230 IC, Switcher, 2.5−5.5 VIN, (2.8/3.3) VOUT/1 A, WSON-12 1 TEXAS INSTRUMENTS LM3668SD-2833/NOPB U15 118 304-1-00048 Image sensor, CMOS, 1928(H) × 1088(V), 1/2.7″, iBGA-80 1 ON SEMICONDUCTOR AR023ZMCSC00SUEA0-D RBR U17 119 301-0-00703 IC, PCA9306, Dual Bidir I2C & SM Bus Voltage-Level Translator, UDFN-8 1 ON SEMICONDUCTOR PCA9306FMUTCG U19 120 301-0-00704 IC, EMI6316, 4-Line EMI Filter With ESD, WLCSP-15 1 ON SEMICONDUCTOR EMI6316FCTBG U20 121 301-0-00705 IC, EMI2121, Single Pair, Common Mode EMI Filter with ESD, WDFN-8 2 ON SEMICONDUCTOR EMI2121MTTAG U21, U23 122 301-0-00387 IC, FT230, USB to UART Interface, QFN-16 2 FTDI CHIP FT230XQ U22, U49 www.onsemi.com 13 Reference Design TND6201/D Table 1. BILL OF MATERIALS (continued) Item EN Description Qty. Manufacturer Manufacturer Part Number Reference Design 123 301-4-00145 IC, LDO, 2−18 VIN, 0.5−1 VOUT/4 mA, TSOT-6 1 ANALOG DEVICES ADR130BUJZ U24 124 301-0-00634 IC, OPA2322, Dual Op-Amp, CMOS, 20 MHz, SON-8 1 TEXAS INSTRUMENTS OPA2322AIDRG* U25 125 301-0-00709 IC, NCP2824, Class D Audio Power Amplifier, 2.4 W, WCSP-9 1 ON SEMICONDUCTOR NCP2824FCT2G U26 126 301-5-00003 IC, RTL8201CP, Single Port Fast Ethernet PHY, LQFP-48 1 REALTEK RTL8201CP-LF U27 127 301-1-00094 IC, SoC, NRF51822, 32-Bit ARM Cortex® M0, BT (LE-4.0), 2.4 GHz, QFN-48 1 NORDIC SEMICONDUCTOR NRF51822-QFAC U30 128 301-0-00561 IC, NCS36000, Passive Infrared (PIR) Detector Controller, Integrated LDO, SOIC-14 1 ON SEMICONDUCTOR NCS36000D*G U32 129 301-0-00706 IC, CAT5137, 128-Position Digital Potentiometer, I2C, SC70-6 1 ON SEMICONDUCTOR CAT5137SDI 00GT3 U33 130 301-0-00570 IC, 74LVC2G17, Dual Schmitt Trigger Buffer, SC70-6 1 TEXAS INSTRUMENTS SN74LVC2G17DCKR U34 131 301-0-00712 IC, NL27WZ32, Dual 2-Input OR Gate, VFSOP-8 2 ON SEMICONDUCTOR NL27WZ32USG U43, U45 132 301-0-00708 IC, LC709202, Single Cell Li-ion Battery Fuel Gauge, I2C, WFQFN-16 1 ON SEMICONDUCTOR LC709202FRD-01 U44 133 301-0-00722 IC, PCA9538, 8-Bit I/O Expander, I2C, HVQFN-16 1 NXP SEMICONDUCTORS PCA9538BS U46 134 301-0-00719 IC, LM3881, Power Supply Sequencer, VSSOP-8 1 TEXAS INSTRUMENTS LM3881MM/NOPB U47 135 510-4-00030 Module, Wi-Fi, SPI+UART+SDIO+I2C, 802.11b/g/n, Low Power SoC, Dual ARM Cortex M3, SMD 1 GAINSPAN GS2011MIES U48 136 301-0-00344 IC, LTC2950-1, Pushbutton On/Off Controller, TSOT23-8 1 LINEAR TECHNOLOGY CORPORATION LTC2950CTS8-1 U50 137 301-0-00560 IC, PCA9541A, 2-Channel I2C-Master Selector, HVQFN-16 1 NXP SEMICONDUCTORS PCA9541ABS/01 U51 138 304-1-00035 PIR Motion Sensor, 2−15 VIN, 4.6 mVpp, Angle(Hori−90°, Vert−90°), TH 1 MURATA MANUFACTURING CO,LTD IRA-S210ST01 XDCR1 139 108-1-00078 XTAL, 24 MHz, 18 pF, ±10 ppm, 60 E, 2.5 × 3.2 mm, SMD 1 ABRACON CORPORATION ABM8-24.000MHZ-R60-D-1 -W-T X1 140 108-1-00003 XTAL, 25 MHz, 18 pF, ±30 ppm, 60 E, 2.5 × 3.2 mm, SMD 1 CTS 403C35D25M00000 X2 141 108-1-00009 XTAL, 32.768 KHz, 12.5 pF, ±20 ppm, 70K, 1.5 × 3.2 mm, SMD 1 MICRO CRYSTAL CTS MICRO CRYSTAL ABRACON CORPORATION CC7V-T1A-32.768KHZ-12.5 PF-20PPM-TA-QC TF322P32K7680 CM7V-T1A-32.768KHZ-12.5 PF-20PPM-TA-QC ABS07-32.768KHZ-T X5 142 108-1-00080 XTAL, 16 MHz, 8 pF, ±15 ppm, 80E, 2 × 2.5 mm, SMD 1 AVX CORPORATION NDK CX2520DB16000D0GEJCC NX2520SA-16MHZ-STD-CS W-4 X6 143 302-1-00074 Osc, MEMS, 27 MHz, ±50 ppm, 1.8−3.3 V, CMOS, 15 pF, SMD 1 ABRACON CORPORATION ASEMB-27.000MHZ-LC-T Y1 www.onsemi.com 14 TND6201/D Table 1. BILL OF MATERIALS (continued) Manufacturer Part Number Item EN Description Qty. Manufacturer Reference Design 144 401-1-00090 Jumper, 2Pin, 1 × 1, 1.27 mm, 1 A, Closed Top 16 SULLINS CONNECTOR SOLUTIONS NPB02SVAN-RC Z1, Z2, Z3, Z4, Z5, Z6, Z7, Z8, Z9, Z10, Z11, Z15, Z16, Z17, Z18, Z22 145 510-3-00006 Module, microSD Card, 16 GB 1 TOSHIBA CORPORATION SD-C16GJ(BL5 Z12 146 401-1-00122 Antenna, FXP73.07.0100A, Wi-Fi+BT+Zigbee+ISM band, 2.4 GHz, Linear, 50E, 5 W, Patch 2 TAOGLAS ANTENNA SOLUTIONS FXP73.07.0100A Z13, Z14 147 401-2-00041 Light Pipe, Rigid Lens, Dia = 3 mm, Height = 10 mm, Vertical, TH 3 BIVAR VLP-500-F Z19, Z20, Z21 Amazon is a registered trademark of Amazon.com, Inc. ARM, and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. Bluetooth is a registered trademark of Bluetooth SIG. Google is a registered trademarks of Google Inc. iOS is a registered trademarks of Apple Inc. Wi-Fi is a registered trademark of the Wi-Fi Alliance. Wowza is a registered trademark of Wowza Media Systems, LLC in the United States and/or other countries. Android is a trademark of Google Inc. MatrixCam is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. microSD and SDHC are trademarks of SD−3C, LLC in the United States, other countries or both. All other brand names and product names appearing in this document are registered trademarks or trademarks of their respective holders. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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